KR101224705B1 - 제조장비에서 결함 검출방법 - Google Patents

제조장비에서 결함 검출방법 Download PDF

Info

Publication number
KR101224705B1
KR101224705B1 KR1020057019876A KR20057019876A KR101224705B1 KR 101224705 B1 KR101224705 B1 KR 101224705B1 KR 1020057019876 A KR1020057019876 A KR 1020057019876A KR 20057019876 A KR20057019876 A KR 20057019876A KR 101224705 B1 KR101224705 B1 KR 101224705B1
Authority
KR
South Korea
Prior art keywords
defect
sensor
fingerprint
instrument
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057019876A
Other languages
English (en)
Korean (ko)
Other versions
KR20060007388A (ko
Inventor
미하엘 홉킨스
죤 스칸랜
케빈 오리어리
마커스 카베리
Original Assignee
램 리서치 인터내셔날 에스에이알엘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from IE20030437A external-priority patent/IE20030437A1/en
Priority claimed from IE2003/0730A external-priority patent/IE83920B1/en
Application filed by 램 리서치 인터내셔날 에스에이알엘 filed Critical 램 리서치 인터내셔날 에스에이알엘
Publication of KR20060007388A publication Critical patent/KR20060007388A/ko
Application granted granted Critical
Publication of KR101224705B1 publication Critical patent/KR101224705B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Drying Of Semiconductors (AREA)
  • General Factory Administration (AREA)
KR1020057019876A 2003-06-11 2004-05-03 제조장비에서 결함 검출방법 Expired - Fee Related KR101224705B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
IE20030437A IE20030437A1 (en) 2003-06-11 2003-06-11 A method for process control of semiconductor manufacturing equipment
IE2003/0437 2003-06-11
IE2003/0730A IE83920B1 (en) 2003-10-03 A method of fault detection in manufacturing equipment
IE2003/0730 2003-10-03
PCT/EP2004/005708 WO2004112118A1 (en) 2003-06-11 2004-05-03 A method of fault detection in manufaturing equipment

Publications (2)

Publication Number Publication Date
KR20060007388A KR20060007388A (ko) 2006-01-24
KR101224705B1 true KR101224705B1 (ko) 2013-01-21

Family

ID=33512711

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057019876A Expired - Fee Related KR101224705B1 (ko) 2003-06-11 2004-05-03 제조장비에서 결함 검출방법

Country Status (6)

Country Link
US (1) US7062411B2 (enExample)
EP (1) EP1636832A1 (enExample)
JP (1) JP5102488B2 (enExample)
KR (1) KR101224705B1 (enExample)
TW (1) TWI348080B (enExample)
WO (1) WO2004112118A1 (enExample)

Families Citing this family (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7340374B2 (en) * 2005-02-25 2008-03-04 International Business Machines Corporation Determining fleet matching problem and root cause issue for measurement system
US7532999B2 (en) * 2005-02-25 2009-05-12 International Business Machines Corporation Determining root cause of matching problem and/or fleet measurement precision problem for measurement system
US7620516B2 (en) * 2005-05-02 2009-11-17 Mks Instruments, Inc. Versatile semiconductor manufacturing controller with statistically repeatable response times
JP4712462B2 (ja) * 2005-07-11 2011-06-29 東京エレクトロン株式会社 基板処理監視装置、基板処理監視システム、基板処理監視プログラム及び記録媒体
US7337034B1 (en) * 2005-09-07 2008-02-26 Advanced Micro Devices, Inc. Method and apparatus for determining a root cause of a statistical process control failure
US7502702B1 (en) * 2005-09-07 2009-03-10 Advanced Micro Devices, Inc. Method and apparatus for dynamic adjustment of sensor and/or metrology sensitivities
US8515567B2 (en) * 2005-12-21 2013-08-20 Globalfoundries Inc. Enhanced state estimation based upon information credibility
US20070177788A1 (en) * 2006-01-31 2007-08-02 David Liu System and method for detecting wafer failure in wet bench applications
US20070239305A1 (en) * 2006-03-28 2007-10-11 Haoren Zhuang Process control systems and methods
US7587296B2 (en) * 2006-05-07 2009-09-08 Applied Materials, Inc. Adaptive multivariate fault detection
US7596718B2 (en) * 2006-05-07 2009-09-29 Applied Materials, Inc. Ranged fault signatures for fault diagnosis
US7829468B2 (en) * 2006-06-07 2010-11-09 Lam Research Corporation Method and apparatus to detect fault conditions of plasma processing reactor
US20080010531A1 (en) * 2006-06-12 2008-01-10 Mks Instruments, Inc. Classifying faults associated with a manufacturing process
US7774082B2 (en) * 2006-10-05 2010-08-10 Tokyo Electron Limited Substrate processing method and storage medium having program stored therein
JP5213322B2 (ja) * 2006-10-05 2013-06-19 東京エレクトロン株式会社 基板処理方法及び基板処理装置並びにプログラムを記憶する記憶媒体
CN101536002B (zh) 2006-11-03 2015-02-04 气体产品与化学公司 用于工艺监控的系统和方法
US8271103B2 (en) 2007-05-02 2012-09-18 Mks Instruments, Inc. Automated model building and model updating
US8010321B2 (en) * 2007-05-04 2011-08-30 Applied Materials, Inc. Metrics independent and recipe independent fault classes
US7765020B2 (en) * 2007-05-04 2010-07-27 Applied Materials, Inc. Graphical user interface for presenting multivariate fault contributions
KR100980603B1 (ko) * 2008-01-28 2010-09-07 재단법인서울대학교산학협력재단 순차적 사슬형태의 단일클래스 분류기를 이용한 공정이상검출 방법
US8190543B2 (en) 2008-03-08 2012-05-29 Tokyo Electron Limited Autonomous biologically based learning tool
US8396582B2 (en) * 2008-03-08 2013-03-12 Tokyo Electron Limited Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool
US8725667B2 (en) * 2008-03-08 2014-05-13 Tokyo Electron Limited Method and system for detection of tool performance degradation and mismatch
US8078552B2 (en) * 2008-03-08 2011-12-13 Tokyo Electron Limited Autonomous adaptive system and method for improving semiconductor manufacturing quality
US20090282296A1 (en) * 2008-05-08 2009-11-12 Applied Materials, Inc. Multivariate fault detection improvement for electronic device manufacturing
US8335582B2 (en) * 2008-05-19 2012-12-18 Applied Materials, Inc. Software application to analyze event log and chart tool fail rate as function of chamber and recipe
US8369976B2 (en) * 2008-06-23 2013-02-05 International Business Machines Corporation Method for compensating for tool processing variation in the routing of wafers/lots
US8095230B2 (en) 2008-06-24 2012-01-10 International Business Machines Corporation Method for optimizing the routing of wafers/lots based on yield
US20100017009A1 (en) * 2008-06-30 2010-01-21 International Business Machines Corporation System for monitoring multi-orderable measurement data
US8494798B2 (en) * 2008-09-02 2013-07-23 Mks Instruments, Inc. Automated model building and batch model building for a manufacturing process, process monitoring, and fault detection
US8527080B2 (en) * 2008-10-02 2013-09-03 Applied Materials, Inc. Method and system for managing process jobs in a semiconductor fabrication facility
US9069345B2 (en) 2009-01-23 2015-06-30 Mks Instruments, Inc. Controlling a manufacturing process with a multivariate model
US8989887B2 (en) 2009-02-11 2015-03-24 Applied Materials, Inc. Use of prediction data in monitoring actual production targets
TWI389050B (zh) * 2009-03-11 2013-03-11 Inotera Memories Inc 尋找產品良率與預防維護兩者間之關聯性的方法
WO2010137063A1 (ja) * 2009-05-26 2010-12-02 株式会社日立製作所 管理サーバ及び管理システム
US8271121B2 (en) * 2009-06-30 2012-09-18 Lam Research Corporation Methods and arrangements for in-situ process monitoring and control for plasma processing tools
US8618807B2 (en) 2009-06-30 2013-12-31 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8983631B2 (en) * 2009-06-30 2015-03-17 Lam Research Corporation Arrangement for identifying uncontrolled events at the process module level and methods thereof
US8538572B2 (en) 2009-06-30 2013-09-17 Lam Research Corporation Methods for constructing an optimal endpoint algorithm
US8473089B2 (en) 2009-06-30 2013-06-25 Lam Research Corporation Methods and apparatus for predictive preventive maintenance of processing chambers
JP5363213B2 (ja) * 2009-06-30 2013-12-11 東京エレクトロン株式会社 異常検出システム、異常検出方法、記憶媒体及び基板処理装置
CN102473631B (zh) * 2009-06-30 2014-11-26 朗姆研究公司 用于等离子体处理工具原位工艺监控和控制的方法和装置
US8295966B2 (en) * 2009-06-30 2012-10-23 Lam Research Corporation Methods and apparatus to predict etch rate uniformity for qualification of a plasma chamber
US9442833B1 (en) * 2010-07-20 2016-09-13 Qualcomm Incorporated Managing device identity
US8855804B2 (en) 2010-11-16 2014-10-07 Mks Instruments, Inc. Controlling a discrete-type manufacturing process with a multivariate model
US8723869B2 (en) * 2011-03-21 2014-05-13 Tokyo Electron Limited Biologically based chamber matching
US9915940B2 (en) * 2011-10-31 2018-03-13 Applied Materials, Llc Bi-directional association and graphical acquisition of time-based equipment sensor data and material-based metrology statistical process control data
US9429939B2 (en) 2012-04-06 2016-08-30 Mks Instruments, Inc. Multivariate monitoring of a batch manufacturing process
US9541471B2 (en) 2012-04-06 2017-01-10 Mks Instruments, Inc. Multivariate prediction of a batch manufacturing process
US20150253762A1 (en) * 2012-09-26 2015-09-10 Hitachi Kokusai Electric Inc. Integrated management system, management device, method of displaying information for substrate processing apparatus, and recording medium
US20140100806A1 (en) * 2012-10-04 2014-04-10 Globalfoundries Inc. Method and apparatus for matching tools based on time trace data
US20140149296A1 (en) * 2012-11-29 2014-05-29 Applied Materials, Inc. Enhanced preventative maintenance utilizing direct part marking
US9373551B2 (en) 2013-03-12 2016-06-21 Taiwan Semiconductor Manufacturing Co., Ltd. Moveable and adjustable gas injectors for an etching chamber
WO2014204470A1 (en) 2013-06-20 2014-12-24 Hewlett Packard Development Company, L.P. Generating a fingerprint representing a response of an application to a simulation of a fault of an external service
WO2016018717A1 (en) * 2014-07-29 2016-02-04 Plethora Corporation System and method for automated object measurement
US10152879B2 (en) 2015-11-10 2018-12-11 Industrial Technology Research Institute Method, apparatus, and system for monitoring manufacturing equipment
US10853534B2 (en) * 2015-12-03 2020-12-01 Taiwan Semiconductor Manufacturing Co., Ltd. Fault related FDC feature extraction
CN116300561A (zh) 2015-12-08 2023-06-23 赛特玛逊有限公司 用于监测制造的系统,计算机可读存储介质和方法
CN108700873B (zh) * 2016-03-09 2022-02-11 西门子股份公司 用于自动化系统的现场设备的智能嵌入式控制系统
US20170277142A1 (en) * 2016-03-24 2017-09-28 Honeywell International Inc. Process control system performance analysis using scenario data
JP7009438B2 (ja) * 2016-07-07 2022-01-25 アスペン テクノロジー インコーポレイテッド 時系列パターンモデルを用いて主要パフォーマンス指標（ｋｐｉ）を監視するコンピュータシステム及び方法
US20180087790A1 (en) * 2016-09-28 2018-03-29 Johnson Controls Technology Company Systems and methods for automatically creating and using adaptive pca models to control building equipment
US10495334B2 (en) 2016-09-28 2019-12-03 Johnson Controls Techology Company Systems and methods for steady state detection
US10768076B1 (en) 2016-09-30 2020-09-08 Sight Machine, Inc. System and method for monitoring manufacturing
US10283320B2 (en) * 2016-11-11 2019-05-07 Applied Materials, Inc. Processing chamber hardware fault detection using spectral radio frequency analysis
EP3396458A1 (en) 2017-04-28 2018-10-31 ASML Netherlands B.V. Method and apparatus for optimization of lithographic process
US11361800B2 (en) * 2017-08-04 2022-06-14 RACYICS GmbH Method for characterization of standard cells with adaptive body biasing
US10867877B2 (en) * 2018-03-20 2020-12-15 Kla Corporation Targeted recall of semiconductor devices based on manufacturing data
JP6740277B2 (ja) * 2018-04-13 2020-08-12 ファナック株式会社 機械学習装置、制御装置、及び機械学習方法
CN110909968B (zh) * 2018-09-17 2022-04-08 长鑫存储技术有限公司 半导体产品良率分析方法、分析系统及计算机存储介质
US10930531B2 (en) * 2018-10-09 2021-02-23 Applied Materials, Inc. Adaptive control of wafer-to-wafer variability in device performance in advanced semiconductor processes
TWI829807B (zh) * 2018-11-30 2024-01-21 日商東京威力科創股份有限公司 製造製程之假想測定裝置、假想測定方法及假想測定程式
US11133204B2 (en) * 2019-01-29 2021-09-28 Applied Materials, Inc. Chamber matching with neural networks in semiconductor equipment tools
DE102019107295A1 (de) * 2019-03-21 2020-09-24 Aixtron Se Verfahren zur Erfassung eines Zustandes eines CVD-Reaktors unter Produktionsbedingungen
WO2021065295A1 (ja) * 2019-09-30 2021-04-08 パナソニックＩｐマネジメント株式会社 プラズマ処理の異常判定システムおよび異常判定方法
CN116568858B (zh) * 2020-05-22 2024-05-24 弗劳恩霍夫美国有限公司 用于使用机器学习合成金刚石的系统和方法
US11735447B2 (en) * 2020-10-20 2023-08-22 Applied Materials, Inc. Enhanced process and hardware architecture to detect and correct realtime product substrates
CN112397409A (zh) * 2020-11-24 2021-02-23 安测半导体技术(江苏)有限公司 一种芯片晶圆测试数据分析方法及系统
US20220284342A1 (en) * 2021-03-04 2022-09-08 Applied Materials, Inc. Systems and methods for process chamber health monitoring and diagnostics using virtual model
EP4194951A1 (en) * 2021-12-13 2023-06-14 ASML Netherlands B.V. Identifying deviating modules from a reference population for machine diagnostics
KR102712551B1 (ko) * 2021-12-30 2024-10-04 주식회사 에이아이비즈 웨이퍼 제조 공정 챔버의 이상 탐지 방법 및 이를 위한 장치
CN117490809B (zh) * 2023-12-19 2024-03-26 成都秦川物联网科技股份有限公司 用于智慧生产的超声波燃气表测试方法及工业物联网系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0878842A1 (en) * 1997-05-12 1998-11-18 Applied Materials, Inc. Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system
US6192287B1 (en) 1997-09-23 2001-02-20 On-Line Technologies, Inc. Method and apparatus for fault detection and control
US6441620B1 (en) * 2000-06-20 2002-08-27 John Scanlan Method for fault identification in a plasma process
US20020166182A1 (en) 2001-03-07 2002-11-14 Unilever Home & Personal Care Usa, Division Of Conopco, Inc. Hair colouring compositions

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5479340A (en) * 1993-09-20 1995-12-26 Sematech, Inc. Real time control of plasma etch utilizing multivariate statistical analysis
US6014598A (en) * 1996-06-28 2000-01-11 Arcelik A.S. Model-based fault detection system for electric motors
JPH10170596A (ja) * 1996-12-09 1998-06-26 Hitachi Ltd 絶縁機器診断システム及び部分放電検出法
US6174450B1 (en) * 1997-04-16 2001-01-16 Lam Research Corporation Methods and apparatus for controlling ion energy and plasma density in a plasma processing system
US5926690A (en) * 1997-05-28 1999-07-20 Advanced Micro Devices, Inc. Run-to-run control process for controlling critical dimensions
US6586256B1 (en) * 1999-05-04 2003-07-01 The Penn State Research Foundation Chemical sensors and method of use
US6368975B1 (en) * 1999-07-07 2002-04-09 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis
US6671818B1 (en) * 1999-11-22 2003-12-30 Accenture Llp Problem isolation through translating and filtering events into a standard object format in a network based supply chain
US6262550B1 (en) * 1999-12-17 2001-07-17 General Electric Company Electrical motor monitoring system and method
US6774601B2 (en) * 2001-06-11 2004-08-10 Predictive Systems Engineering, Ltd. System and method for predicting mechanical failures in machinery driven by an induction motor
US6586265B2 (en) 2001-07-26 2003-07-01 Promos Technologies Inc. Method and apparatus of tool matching for a semiconductor manufacturing process
JP3732768B2 (ja) * 2001-08-28 2006-01-11 株式会社日立製作所 半導体処理装置
US6772633B2 (en) * 2002-12-11 2004-08-10 Hewlett-Packard Development Company, L.P. Acoustics-based diagnostics

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0878842A1 (en) * 1997-05-12 1998-11-18 Applied Materials, Inc. Method and apparatus for monitoring processes using multiple parameters of a semiconductor wafer processing system
US6192287B1 (en) 1997-09-23 2001-02-20 On-Line Technologies, Inc. Method and apparatus for fault detection and control
US6441620B1 (en) * 2000-06-20 2002-08-27 John Scanlan Method for fault identification in a plasma process
US20020166182A1 (en) 2001-03-07 2002-11-14 Unilever Home & Personal Care Usa, Division Of Conopco, Inc. Hair colouring compositions

Also Published As

Publication number Publication date
WO2004112118A1 (en) 2004-12-23
TW200506560A (en) 2005-02-16
IE20030730A1 (en) 2004-12-15
JP2006527488A (ja) 2006-11-30
JP5102488B2 (ja) 2012-12-19
US7062411B2 (en) 2006-06-13
EP1636832A1 (en) 2006-03-22
KR20060007388A (ko) 2006-01-24
TWI348080B (en) 2011-09-01
US20040254762A1 (en) 2004-12-16

Similar Documents

Publication Publication Date Title
KR101224705B1 (ko) 제조장비에서 결함 검출방법
US7343217B2 (en) System for monitoring and controlling a semiconductor manufacturing apparatus using prediction model equation
US8271121B2 (en) Methods and arrangements for in-situ process monitoring and control for plasma processing tools
US8849615B2 (en) Method and system for semiconductor process control and monitoring by using a data quality metric
KR101166209B1 (ko) 모델 예측을 위한 동적인 샘플링 레이트 적응
US7580767B2 (en) Methods of and apparatuses for maintenance, diagnosis, and optimization of processes
US6647309B1 (en) Method and apparatus for automated generation of test semiconductor wafers
US20050198609A1 (en) Method and system for mask fabrication process control
JP2008519464A (ja) 重み付けされた主成分分析に基づく異常検出システムおよび方法
WO2011002800A2 (en) Methods and arrangements for in-situ process monitoring and control for plasma processing tools
CN101238421A (zh) 用于监控工艺环境中的动态参数的自校正多变量分析
JP2007527612A (ja) 異常検知に基づき計測ディスパッチを実行するための方法および装置
US6563300B1 (en) Method and apparatus for fault detection using multiple tool error signals
JP2008177534A (ja) 半導体製造装置の管理方法、および半導体製造装置の管理システム
CN100533677C (zh) 制造设备中的差错检测方法
US6697696B1 (en) Fault detection control system using dual bus architecture, and methods of using same
JP4344674B2 (ja) プラズマ処理装置
KR100446926B1 (ko) 반도체제조장치의 감시 및 제어방법과 그 실시장치
US6766258B1 (en) Method and apparatus for dynamically enabling trace data collection
IE83920B1 (en) A method of fault detection in manufacturing equipment
US6689521B1 (en) Method and apparatus for control of photoresist plasma removal
US7337091B1 (en) Method and apparatus for coordinating fault detection settings and process control changes
Collins et al. Model-based equipment diagnosis
US6792389B1 (en) Method of dynamically enabling additional sensors based upon initial sensor data, and system for accomplishing same
Sofge Virtual Sensor Based Fault Detection and Classification on a Plasma Etch Reactor

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20151228

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20170104

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20171229

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20181226

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20200116

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20200116

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000