JP5102488B2 - 製造装置における障害検出の方法 - Google Patents

製造装置における障害検出の方法 Download PDF

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JP5102488B2
JP5102488B2 JP2006515797A JP2006515797A JP5102488B2 JP 5102488 B2 JP5102488 B2 JP 5102488B2 JP 2006515797 A JP2006515797 A JP 2006515797A JP 2006515797 A JP2006515797 A JP 2006515797A JP 5102488 B2 JP5102488 B2 JP 5102488B2
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fingerprint
sensor
fault
chamber
failure
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JP2006527488A (ja
JP2006527488A5 (enExample
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マイケル ホプキンズ
ジョン スカンラン
ケヴィン オリアリー
マーカス カーベリー
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ラム リサーチ アンテルナシオナル ソシエタ ア レスポンサビリタ リミタータ
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Priority claimed from IE20030437A external-priority patent/IE20030437A1/en
Priority claimed from IE2003/0730A external-priority patent/IE83920B1/en
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Automation & Control Theory (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Drying Of Semiconductors (AREA)
  • General Factory Administration (AREA)
JP2006515797A 2003-06-11 2004-05-03 製造装置における障害検出の方法 Expired - Fee Related JP5102488B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
IE20030437A IE20030437A1 (en) 2003-06-11 2003-06-11 A method for process control of semiconductor manufacturing equipment
IE2003/0437 2003-06-11
IE2003/0730 2003-10-03
IE2003/0730A IE83920B1 (en) 2003-10-03 A method of fault detection in manufacturing equipment
PCT/EP2004/005708 WO2004112118A1 (en) 2003-06-11 2004-05-03 A method of fault detection in manufaturing equipment

Publications (3)

Publication Number Publication Date
JP2006527488A JP2006527488A (ja) 2006-11-30
JP2006527488A5 JP2006527488A5 (enExample) 2007-05-10
JP5102488B2 true JP5102488B2 (ja) 2012-12-19

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JP2006515797A Expired - Fee Related JP5102488B2 (ja) 2003-06-11 2004-05-03 製造装置における障害検出の方法

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US (1) US7062411B2 (enExample)
EP (1) EP1636832A1 (enExample)
JP (1) JP5102488B2 (enExample)
KR (1) KR101224705B1 (enExample)
TW (1) TWI348080B (enExample)
WO (1) WO2004112118A1 (enExample)

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Also Published As

Publication number Publication date
JP2006527488A (ja) 2006-11-30
KR20060007388A (ko) 2006-01-24
IE20030730A1 (en) 2004-12-15
TWI348080B (en) 2011-09-01
US20040254762A1 (en) 2004-12-16
TW200506560A (en) 2005-02-16
WO2004112118A1 (en) 2004-12-23
US7062411B2 (en) 2006-06-13
KR101224705B1 (ko) 2013-01-21
EP1636832A1 (en) 2006-03-22

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