TWI348080B - Method of fault detection in manufacturing equipment having sensors and computer readable recording medium containing program instructions - Google Patents
Method of fault detection in manufacturing equipment having sensors and computer readable recording medium containing program instructionsInfo
- Publication number
- TWI348080B TWI348080B TW093115311A TW93115311A TWI348080B TW I348080 B TWI348080 B TW I348080B TW 093115311 A TW093115311 A TW 093115311A TW 93115311 A TW93115311 A TW 93115311A TW I348080 B TWI348080 B TW I348080B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensors
- recording medium
- computer readable
- program instructions
- medium containing
- Prior art date
Links
- 238000001514 detection method Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Automation & Control Theory (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Drying Of Semiconductors (AREA)
- General Factory Administration (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IE20030437A IE20030437A1 (en) | 2003-06-11 | 2003-06-11 | A method for process control of semiconductor manufacturing equipment |
| IE2003/0730A IE83920B1 (en) | 2003-10-03 | A method of fault detection in manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200506560A TW200506560A (en) | 2005-02-16 |
| TWI348080B true TWI348080B (en) | 2011-09-01 |
Family
ID=33512711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093115311A TWI348080B (en) | 2003-06-11 | 2004-05-28 | Method of fault detection in manufacturing equipment having sensors and computer readable recording medium containing program instructions |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7062411B2 (enExample) |
| EP (1) | EP1636832A1 (enExample) |
| JP (1) | JP5102488B2 (enExample) |
| KR (1) | KR101224705B1 (enExample) |
| TW (1) | TWI348080B (enExample) |
| WO (1) | WO2004112118A1 (enExample) |
Families Citing this family (82)
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| US7532999B2 (en) * | 2005-02-25 | 2009-05-12 | International Business Machines Corporation | Determining root cause of matching problem and/or fleet measurement precision problem for measurement system |
| US7620516B2 (en) * | 2005-05-02 | 2009-11-17 | Mks Instruments, Inc. | Versatile semiconductor manufacturing controller with statistically repeatable response times |
| JP4712462B2 (ja) * | 2005-07-11 | 2011-06-29 | 東京エレクトロン株式会社 | 基板処理監視装置、基板処理監視システム、基板処理監視プログラム及び記録媒体 |
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| US8515567B2 (en) * | 2005-12-21 | 2013-08-20 | Globalfoundries Inc. | Enhanced state estimation based upon information credibility |
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| US8725667B2 (en) * | 2008-03-08 | 2014-05-13 | Tokyo Electron Limited | Method and system for detection of tool performance degradation and mismatch |
| US8396582B2 (en) | 2008-03-08 | 2013-03-12 | Tokyo Electron Limited | Method and apparatus for self-learning and self-improving a semiconductor manufacturing tool |
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| US8369976B2 (en) * | 2008-06-23 | 2013-02-05 | International Business Machines Corporation | Method for compensating for tool processing variation in the routing of wafers/lots |
| US8095230B2 (en) | 2008-06-24 | 2012-01-10 | International Business Machines Corporation | Method for optimizing the routing of wafers/lots based on yield |
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| TWI389050B (zh) * | 2009-03-11 | 2013-03-11 | Inotera Memories Inc | 尋找產品良率與預防維護兩者間之關聯性的方法 |
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| US10152879B2 (en) | 2015-11-10 | 2018-12-11 | Industrial Technology Research Institute | Method, apparatus, and system for monitoring manufacturing equipment |
| US10853534B2 (en) * | 2015-12-03 | 2020-12-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fault related FDC feature extraction |
| EP3387448B1 (en) * | 2015-12-08 | 2023-11-29 | Sight Machine, Inc. | System and method for monitoring manufacturing |
| WO2017153005A1 (en) * | 2016-03-09 | 2017-09-14 | Siemens Aktiengesellschaft | Smart embedded control system for a field device of an automation system |
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| JP7009438B2 (ja) * | 2016-07-07 | 2022-01-25 | アスペン テクノロジー インコーポレイテッド | 時系列パターンモデルを用いて主要パフォーマンス指標(kpi)を監視するコンピュータシステム及び方法 |
| US10495334B2 (en) | 2016-09-28 | 2019-12-03 | Johnson Controls Techology Company | Systems and methods for steady state detection |
| US20180087790A1 (en) * | 2016-09-28 | 2018-03-29 | Johnson Controls Technology Company | Systems and methods for automatically creating and using adaptive pca models to control building equipment |
| US10768076B1 (en) | 2016-09-30 | 2020-09-08 | Sight Machine, Inc. | System and method for monitoring manufacturing |
| US10283320B2 (en) * | 2016-11-11 | 2019-05-07 | Applied Materials, Inc. | Processing chamber hardware fault detection using spectral radio frequency analysis |
| EP3396458A1 (en) | 2017-04-28 | 2018-10-31 | ASML Netherlands B.V. | Method and apparatus for optimization of lithographic process |
| WO2019025030A1 (en) * | 2017-08-04 | 2019-02-07 | RACYICS GmbH | METHOD FOR CHARACTERIZING ADAPTIVE POLARIZED PREDEFINED CELLS APPLIED TO THE SUBSTRATE |
| US10867877B2 (en) * | 2018-03-20 | 2020-12-15 | Kla Corporation | Targeted recall of semiconductor devices based on manufacturing data |
| JP6740277B2 (ja) * | 2018-04-13 | 2020-08-12 | ファナック株式会社 | 機械学習装置、制御装置、及び機械学習方法 |
| CN110909968B (zh) * | 2018-09-17 | 2022-04-08 | 长鑫存储技术有限公司 | 半导体产品良率分析方法、分析系统及计算机存储介质 |
| US10930531B2 (en) * | 2018-10-09 | 2021-02-23 | Applied Materials, Inc. | Adaptive control of wafer-to-wafer variability in device performance in advanced semiconductor processes |
| TWI829807B (zh) * | 2018-11-30 | 2024-01-21 | 日商東京威力科創股份有限公司 | 製造製程之假想測定裝置、假想測定方法及假想測定程式 |
| US11133204B2 (en) * | 2019-01-29 | 2021-09-28 | Applied Materials, Inc. | Chamber matching with neural networks in semiconductor equipment tools |
| DE102019107295A1 (de) * | 2019-03-21 | 2020-09-24 | Aixtron Se | Verfahren zur Erfassung eines Zustandes eines CVD-Reaktors unter Produktionsbedingungen |
| US20220336196A1 (en) * | 2019-09-30 | 2022-10-20 | Panasonic Intellectual Property Management Co., Ltd. | Abnormality determination system and abnormality determination method for plasma treatment |
| EP4153533B1 (en) * | 2020-05-22 | 2025-02-05 | Fraunhofer USA, Inc. | Systems and methods for synthesizing a diamond using machine learning |
| US11735447B2 (en) * | 2020-10-20 | 2023-08-22 | Applied Materials, Inc. | Enhanced process and hardware architecture to detect and correct realtime product substrates |
| CN112397409A (zh) * | 2020-11-24 | 2021-02-23 | 安测半导体技术(江苏)有限公司 | 一种芯片晶圆测试数据分析方法及系统 |
| US20220284342A1 (en) * | 2021-03-04 | 2022-09-08 | Applied Materials, Inc. | Systems and methods for process chamber health monitoring and diagnostics using virtual model |
| EP4194951A1 (en) * | 2021-12-13 | 2023-06-14 | ASML Netherlands B.V. | Identifying deviating modules from a reference population for machine diagnostics |
| KR102712551B1 (ko) * | 2021-12-30 | 2024-10-04 | 주식회사 에이아이비즈 | 웨이퍼 제조 공정 챔버의 이상 탐지 방법 및 이를 위한 장치 |
| CN117490809B (zh) * | 2023-12-19 | 2024-03-26 | 成都秦川物联网科技股份有限公司 | 用于智慧生产的超声波燃气表测试方法及工业物联网系统 |
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-
2004
- 2004-03-02 US US10/791,132 patent/US7062411B2/en not_active Expired - Lifetime
- 2004-05-03 EP EP04730872A patent/EP1636832A1/en not_active Ceased
- 2004-05-03 WO PCT/EP2004/005708 patent/WO2004112118A1/en not_active Ceased
- 2004-05-03 JP JP2006515797A patent/JP5102488B2/ja not_active Expired - Fee Related
- 2004-05-03 KR KR1020057019876A patent/KR101224705B1/ko not_active Expired - Fee Related
- 2004-05-28 TW TW093115311A patent/TWI348080B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006527488A (ja) | 2006-11-30 |
| KR20060007388A (ko) | 2006-01-24 |
| IE20030730A1 (en) | 2004-12-15 |
| US20040254762A1 (en) | 2004-12-16 |
| TW200506560A (en) | 2005-02-16 |
| WO2004112118A1 (en) | 2004-12-23 |
| JP5102488B2 (ja) | 2012-12-19 |
| US7062411B2 (en) | 2006-06-13 |
| KR101224705B1 (ko) | 2013-01-21 |
| EP1636832A1 (en) | 2006-03-22 |
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