KR101223198B1 - 표면 건조방법 - Google Patents

표면 건조방법 Download PDF

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Publication number
KR101223198B1
KR101223198B1 KR1020077026378A KR20077026378A KR101223198B1 KR 101223198 B1 KR101223198 B1 KR 101223198B1 KR 1020077026378 A KR1020077026378 A KR 1020077026378A KR 20077026378 A KR20077026378 A KR 20077026378A KR 101223198 B1 KR101223198 B1 KR 101223198B1
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KR
South Korea
Prior art keywords
gas
rinse liquid
rinse
liquid
shaped article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077026378A
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English (en)
Korean (ko)
Other versions
KR20080005553A (ko
Inventor
케이 키노시타
필립 엥게쎄르
Original Assignee
램 리서치 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 램 리서치 아게 filed Critical 램 리서치 아게
Publication of KR20080005553A publication Critical patent/KR20080005553A/ko
Application granted granted Critical
Publication of KR101223198B1 publication Critical patent/KR101223198B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
  • Detergent Compositions (AREA)
KR1020077026378A 2005-05-13 2006-04-11 표면 건조방법 Expired - Fee Related KR101223198B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
AT8312005 2005-05-13
ATA831/2005 2005-05-13
PCT/EP2006/061522 WO2007054377A1 (en) 2005-05-13 2006-04-11 Method for drying a surface

Publications (2)

Publication Number Publication Date
KR20080005553A KR20080005553A (ko) 2008-01-14
KR101223198B1 true KR101223198B1 (ko) 2013-01-17

Family

ID=37890725

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077026378A Expired - Fee Related KR101223198B1 (ko) 2005-05-13 2006-04-11 표면 건조방법

Country Status (7)

Country Link
US (1) US8038804B2 (enExample)
EP (1) EP1888263A1 (enExample)
JP (1) JP2008540994A (enExample)
KR (1) KR101223198B1 (enExample)
CN (1) CN101175579B (enExample)
TW (1) TWI364524B (enExample)
WO (1) WO2007054377A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5096849B2 (ja) * 2007-09-13 2012-12-12 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5390873B2 (ja) * 2009-01-28 2014-01-15 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
JP5538102B2 (ja) * 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置
JP5615650B2 (ja) 2010-09-28 2014-10-29 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
CN108176640A (zh) * 2017-11-17 2018-06-19 天津津航技术物理研究所 一种提高激光陀螺腔体清洗洁净度的干燥方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0938595A (ja) * 1995-05-23 1997-02-10 Tokyo Electron Ltd 洗浄方法及びその装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8900480A (nl) * 1989-02-27 1990-09-17 Philips Nv Werkwijze en inrichting voor het drogen van substraten na behandeling in een vloeistof.
US5271774A (en) * 1990-03-01 1993-12-21 U.S. Philips Corporation Method for removing in a centrifuge a liquid from a surface of a substrate
JPH05326392A (ja) * 1992-05-14 1993-12-10 Fujitsu Ltd 半導体装置の製造方法
TW386235B (en) * 1995-05-23 2000-04-01 Tokyo Electron Ltd Method for spin rinsing
JPH1041267A (ja) * 1996-07-19 1998-02-13 Kaijo Corp 基板の洗浄・乾燥装置
TW357406B (en) * 1996-10-07 1999-05-01 Tokyo Electron Ltd Method and apparatus for cleaning and drying a substrate
US6729040B2 (en) * 1999-05-27 2004-05-04 Oliver Design, Inc. Apparatus and method for drying a substrate using hydrophobic and polar organic compounds
US7021319B2 (en) * 2000-06-26 2006-04-04 Applied Materials Inc. Assisted rinsing in a single wafer cleaning process
US20020121286A1 (en) 2001-01-04 2002-09-05 Applied Materials, Inc. Rinsing solution and rinsing and drying methods for the prevention of watermark formation on a surface
CN2460229Y (zh) * 2001-01-16 2001-11-21 集贤实业有限公司 干燥气化装置
TW200303581A (en) * 2002-02-28 2003-09-01 Tech Ltd A Method and apparatus for cleaning and drying semiconductor wafer
TW556255B (en) 2002-06-04 2003-10-01 Semiconductor Mfg Int Shanghai Drying method of post-cleaned semiconductor wafer
JP4030832B2 (ja) * 2002-08-20 2008-01-09 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4421611B2 (ja) * 2003-08-07 2010-02-24 株式会社荏原製作所 基板処理装置
TWI236061B (en) 2003-08-21 2005-07-11 Grand Plastic Technology Corp Method for wafer drying
JP4324527B2 (ja) * 2004-09-09 2009-09-02 東京エレクトロン株式会社 基板洗浄方法及び現像装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0938595A (ja) * 1995-05-23 1997-02-10 Tokyo Electron Ltd 洗浄方法及びその装置

Also Published As

Publication number Publication date
EP1888263A1 (en) 2008-02-20
CN101175579A (zh) 2008-05-07
WO2007054377A1 (en) 2007-05-18
TWI364524B (en) 2012-05-21
US8038804B2 (en) 2011-10-18
JP2008540994A (ja) 2008-11-20
TW200639361A (en) 2006-11-16
KR20080005553A (ko) 2008-01-14
CN101175579B (zh) 2012-06-27
US20080190455A1 (en) 2008-08-14

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