KR101206209B1 - 회로 스트립을 구비한 조명 조립체 - Google Patents

회로 스트립을 구비한 조명 조립체 Download PDF

Info

Publication number
KR101206209B1
KR101206209B1 KR1020077012559A KR20077012559A KR101206209B1 KR 101206209 B1 KR101206209 B1 KR 101206209B1 KR 1020077012559 A KR1020077012559 A KR 1020077012559A KR 20077012559 A KR20077012559 A KR 20077012559A KR 101206209 B1 KR101206209 B1 KR 101206209B1
Authority
KR
South Korea
Prior art keywords
substrate
circuit
led
electrically
delete delete
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020077012559A
Other languages
English (en)
Korean (ko)
Other versions
KR20070074658A (ko
Inventor
앤드류 제이. 오더커크
데니 지. 애슐리맨
헝 티. 트란
케네쓰 에이. 엡스테인
마이클 에이. 메이스
존 씨. 슐츠
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20070074658A publication Critical patent/KR20070074658A/ko
Application granted granted Critical
Publication of KR101206209B1 publication Critical patent/KR101206209B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
KR1020077012559A 2004-11-05 2005-09-27 회로 스트립을 구비한 조명 조립체 Expired - Fee Related KR101206209B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/982,651 2004-11-05
US10/982,651 US7303315B2 (en) 2004-11-05 2004-11-05 Illumination assembly using circuitized strips
PCT/US2005/034501 WO2006052330A2 (en) 2004-11-05 2005-09-27 Illumination assembly with circuitized strips

Publications (2)

Publication Number Publication Date
KR20070074658A KR20070074658A (ko) 2007-07-12
KR101206209B1 true KR101206209B1 (ko) 2012-11-28

Family

ID=36118083

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077012559A Expired - Fee Related KR101206209B1 (ko) 2004-11-05 2005-09-27 회로 스트립을 구비한 조명 조립체

Country Status (6)

Country Link
US (1) US7303315B2 (enExample)
JP (1) JP4763709B2 (enExample)
KR (1) KR101206209B1 (enExample)
CN (1) CN100517779C (enExample)
TW (1) TW200628725A (enExample)
WO (1) WO2006052330A2 (enExample)

Families Citing this family (125)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10340424B2 (en) 2002-08-30 2019-07-02 GE Lighting Solutions, LLC Light emitting diode component
US7521667B2 (en) 2003-06-23 2009-04-21 Advanced Optical Technologies, Llc Intelligent solid state lighting
US7145125B2 (en) 2003-06-23 2006-12-05 Advanced Optical Technologies, Llc Integrating chamber cone light using LED sources
US7341199B2 (en) * 2003-11-12 2008-03-11 Siemens Energy & Automation, Inc. Material handling system with dynamic source tagging
EP2572932B1 (en) * 2003-12-11 2015-04-22 Philips Solid-State Lighting Solutions, Inc. Thermal management for lighting devices
CN100483024C (zh) * 2004-11-09 2009-04-29 李学霖 发光二极管灯散热结构
US7285802B2 (en) * 2004-12-21 2007-10-23 3M Innovative Properties Company Illumination assembly and method of making same
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
GB2422249A (en) * 2005-01-15 2006-07-19 Robert John Morse Power substrate
US7121687B2 (en) * 2005-01-25 2006-10-17 Osram Sylvania Inc. Automotive LED bulb
JP4241658B2 (ja) * 2005-04-14 2009-03-18 シチズン電子株式会社 発光ダイオード光源ユニット及びそれを用いて形成した発光ダイオード光源
JP4410721B2 (ja) * 2005-05-02 2010-02-03 シチズン電子株式会社 バルブ型ｌｅｄ光源
KR101343562B1 (ko) * 2005-05-23 2013-12-23 필립스 솔리드-스테이트 라이팅 솔루션스, 인크. 소켓 체결용 모듈형 ｌｅｄ 기반 조명 장치, 이를 포함하는조명 기구, 및 이를 조립, 설치 및 분리하는 방법
USD562494S1 (en) 2005-05-23 2008-02-19 Philips Solid-State Lighting Solutions Optical component
US7766518B2 (en) * 2005-05-23 2010-08-03 Philips Solid-State Lighting Solutions, Inc. LED-based light-generating modules for socket engagement, and methods of assembling, installing and removing same
US7703951B2 (en) * 2005-05-23 2010-04-27 Philips Solid-State Lighting Solutions, Inc. Modular LED-based lighting fixtures having socket engagement features
KR100764380B1 (ko) * 2005-12-16 2007-10-08 삼성전기주식회사 슬림형 백라이트유닛
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP4997584B2 (ja) * 2006-01-26 2012-08-08 Ｎｌｔテクノロジー株式会社 液晶表示装置
KR101347486B1 (ko) * 2006-01-31 2014-01-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 유연성 포일 구조를 구비한 ｌｅｄ 조명 조립체
WO2007097281A1 (ja) * 2006-02-22 2007-08-30 Stanley Electric Co., Ltd. 照明装置
US20070211492A1 (en) * 2006-03-09 2007-09-13 Gigno Technology Co., Ltd. Backlight module and driving circuit board of light emitting diodes
TWI289947B (en) * 2006-03-17 2007-11-11 Ind Tech Res Inst Bendable solid state planar light source, a flexible substrate therefor, and a manufacturing method therewith
US7710045B2 (en) * 2006-03-17 2010-05-04 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US20070252161A1 (en) * 2006-03-31 2007-11-01 3M Innovative Properties Company Led mounting structures
US7806574B2 (en) * 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
US20070247851A1 (en) * 2006-04-21 2007-10-25 Villard Russel G Light Emitting Diode Lighting Package With Improved Heat Sink
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
WO2007130536A2 (en) * 2006-05-05 2007-11-15 Cree Led Lighting Solutions, Inc. Lighting device
USD566323S1 (en) 2006-05-23 2008-04-08 Philips Solid State Lighting Solutions, Inc. Lighting apparatus frame
US20080012035A1 (en) * 2006-07-11 2008-01-17 Bily Wang LED chip package structure and method for manufacturing the same
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
KR101318372B1 (ko) * 2006-08-03 2013-10-16 삼성디스플레이 주식회사 발광 유닛, 이를 갖는 백라이트 어셈블리 및 표시장치
DE102007004303A1 (de) * 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
TWI340010B (en) * 2006-08-04 2011-04-01 Everlight Electronics Co Ltd Circuit board with cooling functionality
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP2008053380A (ja) * 2006-08-23 2008-03-06 Hamamatsu Photonics Kk レーザ装置
US8362603B2 (en) * 2006-09-14 2013-01-29 Luminus Devices, Inc. Flexible circuit light-emitting structures
US8581393B2 (en) * 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
US20080074881A1 (en) * 2006-09-25 2008-03-27 Been-Yu Liaw Backlight module
US7794114B2 (en) * 2006-10-11 2010-09-14 Cree, Inc. Methods and apparatus for improved heat spreading in solid state lighting systems
US20080112162A1 (en) * 2006-11-09 2008-05-15 Topson Optoelectronics Semi-Conductor Co., Ltd. Backlight Structure Having Embedded LEDs and Fabrication Method Thereof
CN100423257C (zh) * 2006-12-20 2008-10-01 黄虎钧 具有发光二极管晶片的发光棒
DE102007004304A1 (de) 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
US7806560B2 (en) * 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
WO2008104908A1 (en) * 2007-02-26 2008-09-04 Philips Intellectual Property & Standards Gmbh Driving a lighting device
US7841741B2 (en) * 2007-04-02 2010-11-30 Endicott Interconnect Technologies, Inc. LED lighting assembly and lamp utilizing same
US7898811B2 (en) * 2007-04-10 2011-03-01 Raled, Inc. Thermal management of LEDs on a printed circuit board and associated methods
US7535030B2 (en) * 2007-05-22 2009-05-19 Hsiang-Chou Lin LED lamp with exposed heat-conductive fins
EP1998101B2 (en) * 2007-05-30 2019-09-25 OSRAM GmbH Lighting device
WO2009000282A1 (en) * 2007-06-22 2008-12-31 Lioris B.V. High voltage led lighting system
JP5431688B2 (ja) * 2007-06-29 2014-03-05 ソウル セミコンダクター カンパニー リミテッド マルチｌｅｄパッケージ
US7922354B2 (en) * 2007-08-13 2011-04-12 Everhart Robert L Solid-state lighting fixtures
US20090096347A1 (en) * 2007-10-11 2009-04-16 Xu Chao-Feng LED Flat Light and A Manufacturing Method Thereof
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
DE102007055133A1 (de) * 2007-11-19 2009-05-20 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung mit einem Kühlkörper
KR101015818B1 (ko) * 2007-11-21 2011-02-22 크루셜텍 (주) 카메라 플래시 모듈 및 카메라 플래시 모듈이 구비된 휴대 단말기
WO2009075753A2 (en) * 2007-12-06 2009-06-18 Paul Panaccione Chip-scale packaged light-emitting devices
CN101451696A (zh) * 2007-12-07 2009-06-10 富准精密工业(深圳)有限公司 发光二极管灯具
CN101556032B (zh) * 2008-04-09 2010-09-29 富准精密工业(深圳)有限公司 发光二极管灯具
CN101572990B (zh) * 2008-04-28 2012-12-19 鸿富锦精密工业（深圳）有限公司 电路板原板
US7845829B2 (en) * 2008-05-20 2010-12-07 Abl Ip Holding Llc Enclosures for LED circuit boards
US8177392B2 (en) * 2008-05-29 2012-05-15 Norm Tarko Light strip including a core layer of insulating material receiving spaced apart light emitting diodes
JP5236366B2 (ja) * 2008-07-01 2013-07-17 ミネベア株式会社 線状光源装置、および面状照明装置
US9022612B2 (en) * 2008-08-07 2015-05-05 Mag Instrument, Inc. LED module
US20100038670A1 (en) * 2008-08-18 2010-02-18 Luminus Devices, Inc. Illumination assembly including chip-scale packaged light-emitting device
US8981629B2 (en) 2008-08-26 2015-03-17 Albeo Technologies, Inc. Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
US8058659B2 (en) * 2008-08-26 2011-11-15 Albeo Technologies, Inc. LED chip-based lighting products and methods of building
US9076951B2 (en) 2008-08-26 2015-07-07 Albeo Technologies, Inc. Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
GB2464668A (en) * 2008-10-20 2010-04-28 Sensitive Electronic Co Ltd Thin light emitting diode circuit substrate and lamp strip
KR100902631B1 (ko) * 2008-10-24 2009-06-12 현대통신 주식회사 나노스프레더를 이용한 원형구조의 ｌｅｄ 발광 조명등
US8791471B2 (en) * 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
DE102008056923A1 (de) * 2008-11-12 2010-05-27 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsvorrichtung mit zwei Leiterplatten
US20100149805A1 (en) * 2008-12-17 2010-06-17 Fridy Joseph Led lighting laminate with integrated cooling
TW201025675A (en) * 2008-12-31 2010-07-01 Jess Link Products Co Ltd Light emitting diode light strip and method of making the same
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20100188860A1 (en) * 2009-01-28 2010-07-29 Been-Yu Liaw Lotus blossom heat dissipating device
JP2011009298A (ja) * 2009-06-23 2011-01-13 Citizen Electronics Co Ltd 発光ダイオード光源装置
KR20110003792A (ko) * 2009-07-06 2011-01-13 주식회사 디지아이 칼라 인쇄회로기판의 제조방법
TW201103170A (en) * 2009-07-08 2011-01-16 Paragon Sc Lighting Tech Co LED package structure with concave area for positioning heat-conducting substance and method for manufacturing the same
JP4746692B2 (ja) * 2009-07-29 2011-08-10 株式会社タムラ製作所 可視光通信用ｌｅｄ照明装置
US20110054263A1 (en) * 2009-08-28 2011-03-03 Jim-Son Chou Replaceable LED illumination assembly for medical instruments
US8593040B2 (en) 2009-10-02 2013-11-26 Ge Lighting Solutions Llc LED lamp with surface area enhancing fins
TWM379006U (en) * 2009-10-22 2010-04-21 Jia-hao ZHANG LED light bar
US8408627B2 (en) * 2009-12-15 2013-04-02 3M Innovative Properties Company Pick up truck, rail cap assembly with lighting system and method of use
US10240772B2 (en) * 2010-04-02 2019-03-26 GE Lighting Solutions, LLC Lightweight heat sinks and LED lamps employing same
CN102939671A (zh) * 2010-04-13 2013-02-20 宇部兴产株式会社 Led散热基板
WO2011133813A2 (en) * 2010-04-21 2011-10-27 Cooper Technologies Company Expandable led board architecture
JP5537295B2 (ja) * 2010-07-05 2014-07-02 パナソニック株式会社 発光素子実装用配線パターン、発光素子実装用配線パターンを有する発光素子実装用配線基板および発光素子実装用配線基板を用いた発光モジュールならびに発光モジュールを装備した照明器具
US9548286B2 (en) * 2010-08-09 2017-01-17 Micron Technology, Inc. Solid state lights with thermal control elements
US9035329B2 (en) * 2010-09-13 2015-05-19 Epistar Corporation Light-emitting device
AT12736U1 (de) * 2010-09-15 2012-10-15 Austria Tech & System Tech Leiterplatte sowie verfahren zur herstellung einer leiterplatte
US20120268928A1 (en) * 2010-10-26 2012-10-25 Sargent Robert L Large single chip led device for high intensity packing
WO2012061183A2 (en) 2010-11-03 2012-05-10 3M Innovative Properties Company Flexible led device for thermal management and method of making
WO2012091971A1 (en) 2010-12-29 2012-07-05 3M Innovative Properties Company Remote phosphor led constructions
US9151463B2 (en) 2010-12-29 2015-10-06 3M Innovative Properties Company LED color combiner
JP5740981B2 (ja) * 2011-01-05 2015-07-01 ソニー株式会社 発光装置、照明装置および表示装置
TWI589021B (zh) * 2011-02-07 2017-06-21 晶元光電股份有限公司 發光元件及其製法
US8314566B2 (en) 2011-02-22 2012-11-20 Quarkstar Llc Solid state lamp using light emitting strips
CN102130283B (zh) * 2011-02-22 2012-07-18 史杰 Led芯片封装支架
US8888331B2 (en) * 2011-05-09 2014-11-18 Microsoft Corporation Low inductance light source module
US20140326495A1 (en) * 2011-08-25 2014-11-06 Amphenol Corporation High performance printed circuit board
CN102983244A (zh) * 2011-09-05 2013-03-20 欧司朗股份有限公司 Led发光组件以及具有该led发光组件的照明装置
WO2013102823A1 (en) * 2012-01-03 2013-07-11 Koninklijke Philips Electronics N.V. A lighting assembly, a light source and a luminaire
TWI481071B (zh) * 2012-01-12 2015-04-11 Light-emitting device LED 3D surface lead frame
TWI496323B (zh) * 2012-04-09 2015-08-11 台達電子工業股份有限公司 發光模組
US9500355B2 (en) 2012-05-04 2016-11-22 GE Lighting Solutions, LLC Lamp with light emitting elements surrounding active cooling device
CN103426993A (zh) * 2012-05-16 2013-12-04 欧司朗股份有限公司 电子模块、照明装置和制造该电子模块的方法
TWI437727B (zh) * 2012-05-31 2014-05-11 玉晶光電股份有限公司 LED lighting
DE102013201327A1 (de) * 2013-01-28 2014-07-31 Osram Gmbh Leiterplatte, optoelektronisches Bauteil und Anordnung optoelektronischer Bauteile
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
US9989223B1 (en) * 2015-03-09 2018-06-05 Automated Assembly Corporation LED lighting apparatus with LEDs and wires attached to metal sheet member by adhesive
US10337717B2 (en) * 2015-03-31 2019-07-02 Koito Manufacturing Co., Ltd. Light source unit, method of manufacturing the same, and vehicle lamp
US10257932B2 (en) * 2016-02-16 2019-04-09 Microsoft Technology Licensing, Llc. Laser diode chip on printed circuit board
DE102016115224A1 (de) * 2016-08-17 2018-02-22 Osram Opto Semiconductors Gmbh Elektronische Vorrichtung
KR102006188B1 (ko) * 2017-12-29 2019-08-01 엘지전자 주식회사 반도체 발광 소자를 이용한 차량용 램프 및 그 제어방법
JP7260734B2 (ja) * 2018-09-28 2023-04-19 日亜化学工業株式会社 発光装置及びその製造方法
CN110864268A (zh) * 2019-11-19 2020-03-06 深圳市库莱特光电科技有限公司 一种cob灯条及其制作方法
US11047561B1 (en) * 2019-12-31 2021-06-29 Excellence Optoelectronics Inc. Heat sink structure and flexible light-emitting device having heat sink structure
CN111477649A (zh) * 2020-04-15 2020-07-31 深圳市华星光电半导体显示技术有限公司 Micro-LED显示面板及其制备方法与邦定材料

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (ja) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd 照明装置
JP2004252339A (ja) * 2003-02-21 2004-09-09 Toshiba Matsushita Display Technology Co Ltd 平面表示装置および液晶表示装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882774A (en) 1993-12-21 1999-03-16 Minnesota Mining And Manufacturing Company Optical film
US5808794A (en) 1996-07-31 1998-09-15 Weber; Michael F. Reflective polarizers having extended red band edge for controlled off axis color
US6412971B1 (en) 1998-01-02 2002-07-02 General Electric Company Light source including an array of light emitting semiconductor devices and control method
DE19922176C2 (de) 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
DE60137972D1 (de) * 2001-04-12 2009-04-23 Matsushita Electric Works Ltd Lichtquellenbauelement mit led und verfahren zu seiner herstellung
KR20040029385A (ko) 2001-08-01 2004-04-06 남 영 김 화상표시장치
CN1479384A (zh) * 2002-08-26 2004-03-03 光鼎电子股份有限公司 发光二极管外加散热结构的制造方法
US7105931B2 (en) * 2003-01-07 2006-09-12 Abbas Ismail Attarwala Electronic package and method
JP2005056653A (ja) 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd 光源装置
US20050116235A1 (en) * 2003-12-02 2005-06-02 Schultz John C. Illumination assembly
EP1700344B1 (en) 2003-12-24 2016-03-02 Panasonic Intellectual Property Management Co., Ltd. Semiconductor light emitting device and lighting module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (ja) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd 照明装置
JP2004252339A (ja) * 2003-02-21 2004-09-09 Toshiba Matsushita Display Technology Co Ltd 平面表示装置および液晶表示装置

Also Published As

Publication number Publication date
CN100517779C (zh) 2009-07-22
JP2008519419A (ja) 2008-06-05
CN101073158A (zh) 2007-11-14
KR20070074658A (ko) 2007-07-12
JP4763709B2 (ja) 2011-08-31
US20060098438A1 (en) 2006-05-11
WO2006052330A3 (en) 2006-11-02
US7303315B2 (en) 2007-12-04
WO2006052330A2 (en) 2006-05-18
TW200628725A (en) 2006-08-16

Similar Documents

Publication Publication Date Title
KR101206209B1 (ko) 회로 스트립을 구비한 조명 조립체
CN100530717C (zh) 照明组件及其制造方法
US7675755B2 (en) LED module
KR101160037B1 (ko) 파워 표면 마운트 발광 다이 패키지
CN100530716C (zh) 照明组件及其制造方法
US8610146B2 (en) Light emitting diode package and method of manufacturing the same
KR102742940B1 (ko) Led 어레이 패키지 및 그 제조방법
US8017964B2 (en) Light emitting device
US20050116235A1 (en) Illumination assembly
US8487339B2 (en) Light-emitting diode chip package body and method for manufacturing same
US7740376B2 (en) Flexible light emitting module
JP2019067903A (ja) 発光装置およびその製造方法
KR101051488B1 (ko) 발광 다이오드 유닛의 제조 방법과, 이 방법에 의하여 제조된 발광 다이오드 유닛
US8198646B2 (en) Light emitting device and method of manufacturing a light emitting device
US20220231198A1 (en) Substrate structure and electronic device
US8030753B2 (en) Semiconductor device and method for making the same
KR100616680B1 (ko) 발광 다이오드 패키지 및 그 제조 방법
US20190165232A1 (en) Light emitting device
JP5912471B2 (ja) 半導体デバイス
KR20090087436A (ko) 광전 소자
KR101732813B1 (ko) 발광다이오드 어레이의 제조방법
TWI355539B (en) Light source module, illuminating apparatus and li
EP2713396B1 (en) Overlay circuit structure for interconnecting semiconductor light emitting devices and method of manufacturing the same
WO2021182585A1 (ja) 発光装置、及びその製造方法、並びに面状発光装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20151016

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20161019

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20171018

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20191123

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20191123

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000