KR101179838B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR101179838B1
KR101179838B1 KR1020100083367A KR20100083367A KR101179838B1 KR 101179838 B1 KR101179838 B1 KR 101179838B1 KR 1020100083367 A KR1020100083367 A KR 1020100083367A KR 20100083367 A KR20100083367 A KR 20100083367A KR 101179838 B1 KR101179838 B1 KR 101179838B1
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South Korea
Prior art keywords
nozzle
droplet
substrate
droplets
substrate processing
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KR1020100083367A
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Korean (ko)
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KR20110025096A (ko
Inventor
츠토무 기쿠치
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시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20110025096A publication Critical patent/KR20110025096A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020100083367A 2009-09-03 2010-08-27 기판 처리 장치 및 기판 처리 방법 Active KR101179838B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-203402 2009-09-03
JP2009203402A JP5650896B2 (ja) 2009-09-03 2009-09-03 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
KR20110025096A KR20110025096A (ko) 2011-03-09
KR101179838B1 true KR101179838B1 (ko) 2012-09-04

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ID=43623023

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KR1020100083367A Active KR101179838B1 (ko) 2009-09-03 2010-08-27 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
US (1) US20110048471A1 (https=)
JP (1) JP5650896B2 (https=)
KR (1) KR101179838B1 (https=)
CN (1) CN102013389A (https=)
TW (1) TWI443722B (https=)

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* Cited by examiner, † Cited by third party
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CN102354662A (zh) * 2011-08-10 2012-02-15 长春理工大学 半导体激光器芯片p面清洗和n面抛光方法
US9349405B1 (en) * 2013-05-22 2016-05-24 Western Digital Technologies, Inc. Methods, devices and systems for dispensing material on an electronic device
TWI462148B (zh) * 2013-07-10 2014-11-21 億力鑫系統科技股份有限公司 Fluid nozzle and fluid nozzle device
CN104415930B (zh) * 2013-09-03 2016-06-29 亿力鑫系统科技股份有限公司 应用清洗基板方法的流体喷头及流体喷头装置
JP6600470B2 (ja) 2014-04-01 2019-10-30 株式会社荏原製作所 洗浄装置及び洗浄方法
CN104971916B (zh) * 2014-04-01 2020-07-07 株式会社荏原制作所 清洗装置及清洗方法
JP6496186B2 (ja) * 2015-05-26 2019-04-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR101964204B1 (ko) * 2016-11-09 2019-04-02 무진전자 주식회사 유체 혼합 노즐
US20200306931A1 (en) * 2019-03-25 2020-10-01 Applied Materials, Inc. Methods and apparatus for removing abrasive particles
JP2021048336A (ja) * 2019-09-20 2021-03-25 三菱電機株式会社 処理液生成方法、処理液生成機構、半導体製造装置及び半導体製造方法
JP7407574B2 (ja) * 2019-11-29 2024-01-04 東京エレクトロン株式会社 基板処理装置、及び基板処理方法
CN112735984B (zh) * 2020-12-30 2023-01-06 上海至纯洁净系统科技股份有限公司 一种晶圆表面清洗组件
CN112735987B (zh) * 2020-12-31 2022-12-20 至微半导体(上海)有限公司 一种可将供酸效率化的单晶圆清洗设备
CN112735986B (zh) * 2020-12-31 2022-12-20 至微半导体(上海)有限公司 一种晶圆复合清洗方法
CN112750688B (zh) * 2020-12-31 2022-12-20 至微半导体(上海)有限公司 一种晶圆清洗方法
CN112792036B (zh) * 2020-12-31 2022-12-20 至微半导体(上海)有限公司 一种半导体湿法工艺中晶圆清洗液循环利用系统及方法
CN112768378B (zh) * 2020-12-31 2023-02-10 上海至纯洁净系统科技股份有限公司 一种交错式晶圆表面湿法清洗系统及清洗方法
KR102914749B1 (ko) * 2021-10-15 2026-01-16 세메스 주식회사 기판 처리 장치
US12138745B2 (en) 2023-03-22 2024-11-12 Yield Engineering Systems, Inc. Apparatus and method for coating removal

Citations (2)

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Publication number Priority date Publication date Assignee Title
EP0618611A2 (en) 1993-03-31 1994-10-05 Sony Corporation Method and apparatus for washing substrates
JP2008159989A (ja) * 2006-12-26 2008-07-10 Dainippon Screen Mfg Co Ltd ノズル、基板処理装置および基板処理方法

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JP3519118B2 (ja) * 1994-04-07 2004-04-12 島田理化工業株式会社 洗浄装置
CN1180447A (zh) * 1996-03-05 1998-04-29 塞姆特里克斯公司 使用底层涂料的材料沉积方法及装置
JP3315611B2 (ja) * 1996-12-02 2002-08-19 三菱電機株式会社 洗浄用２流体ジェットノズル及び洗浄装置ならびに半導体装置
JP3865602B2 (ja) * 2001-06-18 2007-01-10 大日本スクリーン製造株式会社 基板洗浄装置
JP2003051478A (ja) * 2001-08-07 2003-02-21 Sumitomo Heavy Ind Ltd 微細粒子洗浄方法及び装置
JP3892792B2 (ja) * 2001-11-02 2007-03-14 大日本スクリーン製造株式会社 基板処理装置および基板洗浄装置
JP2004223378A (ja) * 2003-01-22 2004-08-12 Shimada Phys & Chem Ind Co Ltd 液滴噴射装置
JP2006128332A (ja) * 2004-10-28 2006-05-18 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2007173277A (ja) * 2005-12-19 2007-07-05 Fujitsu Ltd スピン洗浄装置およびウエハ洗浄方法
CN100541709C (zh) * 2006-01-26 2009-09-16 大日本网目版制造株式会社 基板处理装置以及基板处理方法
CN101209450A (zh) * 2006-12-29 2008-07-02 财团法人金属工业研究发展中心 一种以高密相流体去除基板表面污染物的方法
JP2009054755A (ja) * 2007-08-27 2009-03-12 Dainippon Screen Mfg Co Ltd 基板処理装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618611A2 (en) 1993-03-31 1994-10-05 Sony Corporation Method and apparatus for washing substrates
JP2008159989A (ja) * 2006-12-26 2008-07-10 Dainippon Screen Mfg Co Ltd ノズル、基板処理装置および基板処理方法

Also Published As

Publication number Publication date
TWI443722B (zh) 2014-07-01
JP2011054819A (ja) 2011-03-17
KR20110025096A (ko) 2011-03-09
TW201133582A (en) 2011-10-01
JP5650896B2 (ja) 2015-01-07
CN102013389A (zh) 2011-04-13
US20110048471A1 (en) 2011-03-03

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