KR101170301B1 - Method for Fabricating Metal Base Substrate using Sanding process - Google Patents

Abstract

It provides a metal base disc manufacturing method using a sanding method.

The present invention provides a method for manufacturing a metal base substrate by bonding a metal plate and a copper foil structure, comprising: providing a metal plate; Providing a roughness surface having a predetermined surface roughness to the entire surface of the metal plate as a projection material sprayed through the sanding nozzle on the surface of the metal plate; Washing the metal plate provided with the surface roughness and then drying the metal plate; Bonding the metal plate and the copper foil structure to each other by an adhesive applied to one side of the metal plate or one side of the copper foil structure; And thermocompressing the laminated plate on which the metal plate and the copper foil structure are stacked at a high temperature to produce a metal base disc.

According to the present invention, instead of roughening one side of the copper foil layer by plating, one side of the metal plate is roughened by sanding to prevent harmful gas and water pollution due to water pollution and electrolytic solution. Essentially, it is possible to sufficiently improve the bonding strength between the roughened metal plate and the copper foil layer.

Metal Plate, Sanding, Sand Blast, Surface Roughness, Substrate

Description

Method for Fabricating Metal Base Substrate using Sanding Process

The present invention relates to a method for manufacturing a metal base disc using a sanding method, and more particularly, instead of roughening one side of the joint surface of the copper foil layer by plating, the human body is roughened by sanding the one side of the joint surface of the metal plate. The present invention relates to a method of manufacturing a metal base disc using a sanding method that can fundamentally prevent facility contamination caused by gas generation and water treatment, which are harmful to gas, and corrosion of equipment due to electrolytic solutions, and can sufficiently improve the bonding strength between the roughened metal plate and the copper foil layer. .

In general, heat generated from an LED, which is a light emitting source of an illuminator, or heat generated from an electronic device such as a power module is radiated to the air through a package and a substrate.

Accordingly, high heat dissipation is required for a package in which an LED is mounted or a package in which a power module is mounted. In a substrate made of a resin material, thermal response of 0.5 W or less is limited in heat dissipation. High heat radiation substrates such as these must be applied.

In particular, since the heat dissipation of the board on which various components are mounted is a major factor that greatly affects the product performance and lifespan, the board is becoming a very important basic component in the design of high-brightness LED products or high output power modules.

On the other hand, the metal base substrate can be said to be a substrate utilizing the characteristics of the metal such as high thermal conductivity, easy processing, magnetic shielding, thermal shock resistance, in addition to the characteristics of the conventional resin substrate or ceramic substrate.

Basically, the metal base substrate is made of a laminated metal plate in which a copper foil layer for patterning design is bonded to one side of a metal plate made of a metal material through an adhesive such as an epoxy resin material, and is insulated from the material of the metal plate. By changing the combination of layer materials, metal base substrates for various applications are produced.

As the metal plate, aluminum or copper having excellent thermal conductivity may be used, and a filler epoxy resin filled with an inorganic filler having high thermal conductivity may be used as the insulating layer interposed between the metal plate and the copper foil layer.

On the other hand, during the process of manufacturing the metal base substrate, the surface of the copper foil layer is subjected to rough plating to increase the bonding strength where the metal plate and the copper foil layer are bonded by an adhesive before bonding the copper foil layer for a printed circuit to the metal plate. The process will be carried out.

The rough plating process of the copper foil layer is to produce a raw foil (electrode foil) by the electrolytic electrodeposition method continuously in the copper sulfate solution, and to cooper nodel on the surface of the brother foil to increase the bonding strength between the prepared brother foil and the metal plate After forming a rough plating process or forming a rough barrier layer (barrier layer) to form an electrolytic chromate anti-rust treatment to produce a copper foil layer.

However, in order to increase the bonding strength between the metal plate and the copper foil layer, the plating process of electrolytically treating the copper foil layer uses an toxic acidic electrolytic solution, so there is a high risk of generating harmful gases during operation, and the environment contaminating water quality during wastewater treatment. In addition to the problems of contamination, the peripheral equipment was corroded by acidic electrolyte solution.

In the etching process for forming a pattern circuit in the copper foil layer, zinc is dissolved faster than copper by an etchant such as cuprous chloride solution, ferric chloride solution, or ammonium persulfate solution, and zinc is eroded first, and the copper foil circuit and the metal sheet are etched. Undermining phenomenon occurs in which the adhesive area decreases, which results in a decrease in the bonding strength between the metal plate and the copper foil layer, resulting in a product defect in which the copper foil layer and the metal plate are separated from each other, thereby reducing product reliability. It acted as a major cause of deterioration.

Accordingly, the present invention is to solve the above problems, the object of the present invention is that instead of roughening one side of the joint surface of the copper foil layer by plating, by roughening one side of the metal plate by sanding to generate harmful gases to the human body. And it is to provide a metal base disc manufacturing method using a sanding method that can fundamentally prevent water pollution and corrosion of the equipment due to the water treatment, and sufficiently improve the bonding strength between the roughened metal plate and the copper foil layer.

As a specific means for achieving the above object, the present invention is a method for manufacturing a metal base substrate by bonding a metal plate and a copper foil structure, providing a metal plate; Providing a roughness surface having a predetermined surface roughness to the entire surface of the metal plate as a projection material sprayed through the sanding nozzle on the surface of the metal plate; Washing the metal plate provided with the surface roughness with water sprayed from a water spray nozzle, and then drying the washed metal plate through a heating furnace; Applying an adhesive to one side of the metal plate or one side of the copper foil structure, and bonding the metal plate and the copper foil structure through the adhesive; And arranging the laminated plate in which the metal plate and the copper foil structure are laminated between the upper and lower pressure members, and then thermocompressing them at a high temperature to produce a metal base disc. do.

Preferably, the metal plate is made of any one of aluminum, SUS or steel.

Preferably, the step of providing the rough surface is made by the relative movement of the metal plate in the state in which the sanding nozzle is stopped or by the relative movement of the sanding nozzle in the state in which the metal plate is stopped.

Preferably, the copper foil structure consists of at least one layer of copper foil.

Preferably, the copper foil structure is composed of an insulating layer in which at least one copper foil layer is bonded to one side.

According to the present invention, as a projection material sprayed at high speed through a sanding nozzle, the surface of the metal plate is provided with a roughness surface having a surface roughness, and the metal plate is applied to the roughened surface of the washed and dried metal plate or an adhesive applied to one side of the copper foil structure. And copper foil structures are bonded together, and then a metal base disc is manufactured by thermocompression bonding the metal plate and the laminated sheet on which the copper foil structures are laminated to a high temperature, thereby roughly treating one side of the copper foil layer by a chemical treatment method such as plating method. Since there is no need to do it, there is no harmful gas to the human body, it is possible to fundamentally prevent water pollution caused by water treatment, improve the working environment, and prevent corrosion of equipment by electrolyte solution.

In addition, by improving and stably maintaining the bonding strength between the metal plate having the roughness surface and the copper foil layer, it is possible to prevent product defects from which the copper foil is peeled off, thereby improving the reliability of the product and reducing the manufacturing cost.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 1 (a) (b) (c) (d) (e) (f) is a process chart showing a metal base disc manufacturing process using a sanding method according to an embodiment of the present invention, Figure 2 is a practice of the present invention It is a flowchart which shows the metal base disc manufacturing process using the sanding method which concerns on the example.

According to an embodiment of the present invention, the process of manufacturing the metal base substrate 100 by bonding the metal plate 10 and the copper foil structure 20 is illustrated in FIGS. 1 (a) (b) (c) (d) (e) and FIG. As shown in FIG. 2, providing a metal plate (S110), giving a surface roughness (S120), washing and drying the metal plate (S130), bonding (S140), and thermocompressing step 150 ).

First, as shown in FIG. 1 (a), a metal plate 10 cut to a predetermined size is prepared and provided (S110).

As a projection material sprayed on the surface of the metal plate 10 through the sanding nozzle 3, a surface roughness Ra having a predetermined size is applied to the entire surface of the metal plate 10 (S120).

In the step of providing a surface roughness to the surface of the metal plate 10, as shown in Fig. 2 (a), the sanding in the state in which at least one sanding nozzle (3) is arranged on the upper portion of the metal plate 10 Roughening surface 12 having a predetermined surface roughness on the surface of the metal plate 10 by hitting the surface of the metal plate 10 with a projection material such as sand, grinding material, etc. sprayed at high speed through the nozzle (3) By forming.

In this case, when a plurality of sanding nozzles 3 are provided, the plurality of sanding nozzles 3 may be disposed at a predetermined interval in the width direction of the metal plate or at a predetermined interval in the longitudinal direction of the metal plate.

The sanding nozzle 3 may be provided to be movable so as to vary a predetermined interval formed between the metal plate and the metal nozzle.

Here, a treatment method for forming the rough surface 12 having surface roughness on the surface of the metal plate through the sanding nozzle 3 is also referred to as a sand blast method, and the sand blast method is an abrasive particle used for blasting. By spraying the projection material such as to the side of the highway metal plate to remove foreign substances and dirt attached to the surface of the metal plate and at the same time to form a rough surface called "anchor pattern" to impart surface roughness.

In addition, the step of forming the rough surface 12 having a predetermined surface roughness on the entire surface of the metal plate 10, as shown in Figure 1 (b), the sanding nozzle (3) in the stopped state Although the metal plate 10 is shown and described as being made by relative movement by the rotational power of the roller not shown in the direction of arrow P in one direction, the present invention is not limited thereto, and conversely, the sanding in the state in which the metal plate 10 is stopped. The nozzle 3 may be made to move relative to the direction opposite to the arrow P in the one-way drawing.

At this time, the moving speed of the metal plate 10 or the sanding nozzle 3 and the distance between the exit end of the metal plate and the sanding nozzle may be varied depending on the roughness to give roughness to the surface of the metal plate.

The metal plate 10 may be made of any one of aluminum, SUS or steel.

Subsequently, after washing the metal plate 10 given the surface roughness by the sanding nozzle (3) (S130).

The metal plate 10 in which the process of providing surface roughness with respect to one surface to which the adhesive is applied by the sand blasting process is completed is transferred to the washing and drying process.

The process of cleaning the surface of the metal plate 10 is performed in a state in which at least one or more water spray nozzles 4 are disposed on the upper portion of the metal plate 10, as shown in FIG. When a plurality of water spray nozzles 4 are provided, the plurality of water spray nozzles 4 may be disposed at a predetermined interval in the width direction of the metal plate or at a predetermined interval in the longitudinal direction of the metal plate.

The water spray nozzle 4 may be provided to be movable so as to vary a predetermined interval formed between the metal plate and the metal spray nozzle.

In addition, the process of cleaning the surface of the metal plate 10, as shown in Fig. 1 (c), the metal plate 10 in the direction of the arrow P in one direction in the state in which the water spray nozzle 4 is stopped. Although shown and described as being made by the relative movement by the rotational power of the roller not shown, but not limited to this, on the contrary, in the state in which the metal plate 10 is stopped, the water spray nozzle 4 in one direction on the arrow P direction It can also be achieved by relative movement in the opposite direction of.

At this time, the moving speed of the metal plate 10 or the water spray nozzle 4 and the interval between the exit end of the metal plate and the water spray nozzle may vary depending on the strength and the spraying area of the water spray pressure to be delivered to the surface of the metal plate. Can be.

In addition, the water spray nozzle 4 is also made by moving the metal plate 10 in a stationary state similar to the sanding nozzle 3 by the rotational force of the roller, which is not shown in the direction of arrow P on the one-way drawing. Although illustrated and described, the present invention is not limited thereto, and on the contrary, the water spray nozzle 4 may be relatively moved in the opposite direction of the arrow P direction on the one-way drawing while the metal plate 10 is stopped.

In addition, the process of drying the washed metal plate 10 while going through the washing process can be naturally dried by exposing the metal plate to the atmosphere for a predetermined time, but in order to shorten the drying time by passing the metal plate through a heating furnace at 65 ℃ 50 It is preferable to carry out a drying step of preheating and drying at < RTI ID = 0.0 >

In this case, it is preferable to use an oven chamber-type heating furnace using a heating plate, the temperature is controlled in a SCR (silicon controlled rectifier) proportional control method, the tolerance ± 1 It is possible to control the internal temperature of the furnace within ℃.

Subsequently, the metal plate 10 and the copper foil structure 20 are bonded to each other by the adhesive 30 applied to one side of the metal plate 10 or one side of the copper foil structure 20 (S140).

As shown in FIG. 1 (d), an adhesive 30 is applied to one surface of the rough surface 12 or the copper foil structure 20, which is one side of the metal plate 10, and then the metal plate is formed through the adhesive. (10) and the copper foil structure 20 are joined up and down to produce a laminate.

Here, the copper foil structure 20 may be formed of at least one copper foil layer 21, but is not limited thereto. Insulation in which at least one copper foil layer 21 and the copper foil layer 21 are bonded to one side thereof. It may consist of a laminate of layers 22.

The insulating layer 22 is made of a resin material such as FR4, PI or a ceramic material.

In addition, the metal plate 10 and the copper foil structure 20 are laminated and laminated to each other between the upper and lower pressurizing members 41 and 42, and then the laminate is thermocompressed to complete the metal base disc 100. (S150).

That is, as shown in Fig. 1 (e) (f), the laminated plate to which the metal plate 10 and the copper foil structure 20 are bonded is disposed between the upper pressing member 41 and the lower pressing member 42. When the laminate is thermocompressed by providing heat at a constant temperature while pressing at a pressing force (F) of strength, the metal plate 10 and the copper foil structure 20 are manufactured by integrating a metal base disc 100 through an adhesive. You are done.

Example

A roughness surface having various surface roughnesses of various sizes is given to the entire surface of the metal plate made of aluminum, and the bonding strength of the metal base disc manufactured by bonding the metal plate and the copper foil structure through the adhesive of epoxy material is given. The measured results are shown in Table 1 below.

Metal plate surface roughness Copper Foil Structure Bonding strength
(kgf / cm) Copper foil thickness (㎛) Insulation layer thickness (mm) One ＃ 80 35 0.055 2.2 2 ＃ 200 35 0.055 2.6 3 ＃ 600 35 0.055 2.4

As shown in Table 1 above, the surface roughness of the metal plate is increased and the bonding strength of the copper foil structure increases as the roughness of the rough surface is fine. However, if the surface roughness of the metal plate is finer than necessary, the roughness is more than ＃ 600. It can be seen that the bonding strength begins to decrease, and that the highest bonding strength occurs at around -600.

While the invention has been shown and described with respect to particular embodiments, it will be understood that various changes and modifications can be made in the art without departing from the spirit or scope of the invention as set forth in the claims below. It will be appreciated that those skilled in the art can easily know.

Figure 1 (a) (b) (c) (d) (e) (f) is a process chart showing a metal base disc manufacturing process using a sanding method according to an embodiment of the present invention.

2 is a flowchart illustrating a metal base disc manufacturing process using a sanding method according to an embodiment of the present invention.

Description of the Related Art [0002]

3: sanding nozzle 4: water spray nozzle

10 metal plate 12 roughness surface

20: copper foil structure 21: copper foil layer

22: insulating layer 30: adhesive

Claims (5)

In the method of manufacturing a metal base substrate by bonding a metal plate and a copper foil structure, Providing a metal plate; Providing a roughness surface having a predetermined surface roughness to the entire surface of the metal plate as a projection material sprayed through the sanding nozzle on the surface of the metal plate; Washing the metal plate provided with the surface roughness with water sprayed from a water spray nozzle, and then drying the washed metal plate through a heating furnace; Applying an adhesive to one side of the metal plate or one side of the copper foil structure, and bonding the metal plate and the copper foil structure through the adhesive; And The method of manufacturing a metal base disc using the sanding method, characterized in that the metal plate and the laminated copper plate laminated structure is disposed between the upper and lower pressure members, and then thermally compressed to high temperature to produce a metal base disc. The method of claim 1, wherein the metal plate is made of aluminum, SUS, or steel. The method of claim 1, wherein the step of providing the roughness surface is performed by relative movement of the metal plate while the sanding nozzle is stopped, or by relative movement of the sanding nozzle while the metal plate is stopped. Metal base disc manufacturing method using the sanding method. 4. The method of claim 1, wherein the copper foil structure comprises at least one copper foil layer. 5. 4. The method of claim 1, wherein the copper foil structure comprises an insulating layer in which at least one copper foil layer is bonded to one side. 5.

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