KR20100025459A - Insulated metal components and method of manufacturing the same - Google Patents

Abstract

PURPOSE: An insulation metal element and a manufacturing method thereof are provided to improve the insulating property and the coherence of an insulating layer, which is formed by a spray coating method, by forming an interface insulating layer on a concavo-convex layer. CONSTITUTION: An insulation metal element comprises a base material(110), a concavo-convex part(120), an insulation-coated layer(130), a filling layer(140), and a wiring layer(150). The concavo-convex part is formed on the base material. The insulation-coated layer is formed on the concavo-convex part through a spray coating process. The filling layer is formed on the insulation-coated layer. The wiring layer is formed on the filling layer. The base material comprises one among the aluminum, the magnesium, the titanium, the copper, the iron, the nickel, and alloy.

Description

Insulated metal components and method of manufacturing the same

The present invention relates to an insulated metal component and a method of manufacturing the same, and more particularly, to an insulated metal component and an method of manufacturing the same, wherein an insulating coating layer is formed on at least one surface of the metal base material.

Light Emitting Diodes (hereinafter referred to as "LEDs") are the next-generation light source products that can replace traditional lighting such as incandescent lamps and fluorescent lamps and satisfy high efficiency and eco-friendliness at the same time. LEDs are used in various fields. In particular, high brightness LEDs have already been applied to backlight units and flashlights of mobile phones and mobile communication devices, and are rapidly expanding their application fields.

However, LEDs generate a lot of heat because the luminous efficiency is still low compared to the input power. The heat generated by the LEDs must be quickly dissipated through the package and the printed circuit board (hereinafter referred to as "PCB"). The thermal conductivity of the FR-4 insulation layer used in general-purpose PCBs is based on the It is very low, about 0.25W / mK, due to its characteristics. Therefore, there is a limitation in using a general-purpose general purpose PCB as a substrate material in LED packages and modules of 0.5W or more.

Metal PCB is a representative method used to effectively solve this heat dissipation problem. Metal PCB is a special board for maximizing heat dissipation effect due to high speed and high density of electronic products. The metal PCB uses aluminum, copper, iron, titanium, magnesium, nickel, or an alloy thereof with excellent thermal conductivity as a base metal, a copper foil as a circuit layer, and an epoxy resin is interposed between the base metal and the circuit layer. It is produced by pressure heat treatment using a press. However, in order to ensure sufficient insulation, an insulating layer of at least 60 μm or more must be formed, and when the thickness of the insulating layer becomes thick, there is a disadvantage in that the thermal resistance increases rapidly. On the other hand, since a general epoxy resin or a phenol resin has a very low thermal conductivity, in order to improve this, a ceramic filler such as alumina (Al ₂ O ₃ ) or boron nitride (Alumina; filler is added to the insulating layer by about 30% to 50%. However, this increases the manufacturing cost of the insulating layer, but attains a thermal conductivity that is not sufficient, as the thermal conductivity is about 2 W / mK. In addition, when the content of the ceramic filler increases, the elasticity of the insulating layer is lost and the hard layer is easily broken, which causes problems such as peeling of the wiring layer or lifting of the insulating layer, and subsequent drilling, routing, and mold for metal PCB fabrication. There is a problem with the punching process. In addition, since the epoxy resin has a high coefficient of thermal expansion above the glass transition temperature (glass transition temperature), there is a problem that the use temperature of the metal PCB is low around 100 ~ 150 ℃.

As another method of manufacturing a conventional metal PCB, an alumina insulating layer is formed by using anodizing on an aluminum base material, but the alumina insulating layer formed by anodizing contains many pores and grows a uniform thickness of at least 40 μm. It takes a lot of process time to make, it is very difficult to ensure sufficient insulation.

In addition, in the case of a conventional metal PCB, it is difficult to increase the size to 500 × 600 mm or more because a photo process is used to form a printed circuit pattern, which causes a problem in using it as a backlight unit for a large LCD or an LED substrate material for illumination. have. In addition, the conventional metal PCB is used by combining a heat sink made of aluminum or copper at the bottom to improve the thermal conductivity, silicon to reduce the thermal contact resistance at the interface of the separately bonded metal PCB and the heat sink. Despite the application of TIM (Thermal Interface Material), the thermal conductivity has been a cause of deterioration and cost increase.

On the other hand, as a general method for producing a ceramic coating layer having a high thermal conductivity can be largely divided into sintering method and vapor deposition method. First, the sintering method to make a thick ceramic substrate can be press-molded using high-purity ceramic powder and achieve densification of ceramic particles at a sufficiently high sintering temperature, but it is difficult to enlarge the substrate and is very expensive. Do not. Vapor deposition methods include pulsed laser deposition (PLD), sputtering, vacuum evaporation, chemical vapor deposition (CVD), and ion plating. It is very difficult to obtain a thick film having a thickness of more than a μm.

In addition to the LEDs, heat dissipation of semiconductor components is also a major problem in control parts of elevators, A / D converters of motors, RF devices, and high output semiconductor devices. In order to use this as a metal PCB for high power semiconductor devices, the metal PCB for LEDs should have a dielectric breakdown voltage of 1000 V or more, but lower the thermal resistance by using an insulating layer having a dielectric breakdown voltage of at least 5 kV and a high thermal conductivity. It is necessary. Therefore, the PCB for such a high power semiconductor device has a problem that a printed circuit must be formed on an expensive ceramic substrate.

In addition, alumina substrates are commonly used as substrate materials of Peltier device modules that convert heat into electricity or electricity into heat. However, alumina substrates are expensive, fragile, and have relatively high thermal conductivity as ceramics, but have very low thermal conductivity compared to metals. To be used as a substrate for a thermoelectric module, it is necessary to be able to form an insulating layer on at least one surface and to form a metal electrode such as copper to solder the thermoelectric element. An insulated metal substrate is used for this purpose. Hereinafter referred to as "IMS"). Since the insulating layer is formed only on the required portion of the IMS as compared to the conventional alumina substrate, the overall thermal resistance of the IMS is much lower than that of the conventional alumina substrate. In the case of such an IMS, as the thickness of the insulating layer is minimized to have the required insulating property, the IMS has a low thermal resistance.

In addition, the electrostatic chuck, which is widely used to adsorb silicon wafers and liquid crystal display (LCD) panels in semiconductor devices using vacuum, has to have sufficient insulation, low thermal resistance, and high temperature stability. One of the methods of manufacturing the electrostatic chuck is to form the insulating layer and the electrode layer by thermal spray coating, but the insulating layer made of the thermal spray coating is very difficult to ensure sufficient insulation and adhesion, low thermal resistance have.

The present invention is to apply a thermal spray coating to a metal PCB for LEDs or high-power semiconductor devices to significantly improve thermal conductivity, insulation, adhesion and productivity, and to provide an insulated metal component and a method of manufacturing the same, which can be enlarged.

The present invention is to use an insulating layer having a high operating temperature by using a thermal spray coating on the uneven layer after forming the uneven layer on the metal base material without using an insulating layer such as glass fiber, epoxy resin and plastic. The present invention provides an insulated metal component capable of securing high thermal conductivity and sufficient insulation and a method of manufacturing the same.

The present invention provides an insulated metal component capable of improving the insulation and bonding strength of an insulating layer formed by thermal spray coating by forming an interfacial insulating layer on an uneven layer formed by surface treatment of a metal base material, and a method of manufacturing the same.

The present invention provides an insulating metal component and a method for manufacturing the same, which can improve insulation by filling a pore and a defect formed in the insulating layer by forming a filling layer on the insulating layer formed by the thermal spray coating.

In the present invention, a thermal spray coating is used on a metal PCB for LEDs and high power semiconductor devices to achieve the above object. Thermal spray coating is a kind of surface treatment coating technique in which molten coating material scattered with high thermal energy and velocity energy impinges on the surface of the base material and is coated with the strong adhesion force between the base material and the fine cohesion between particles. Thermal spray coating is not limited to the type and size of the base material, there is almost no deformation of the base material, can be coated very thick metal, ceramics, alloys, etc. in a short time, and depending on the coating material, such characteristics as abrasion resistance, corrosion resistance, heat resistance You can give it. In particular, in the present invention, by forming the insulating layer in a large area at a high speed by the thermal spraying method, it is possible to secure the thermal conductivity and the insulation required by the insulating metal component.

However, since the thermal spray coating is maintained only by mechanical bonding without chemical bonding between the base material and the insulating coating layer, welding or heat treatment has a disadvantage in that the interface adhesion is relatively weak compared to other bonding techniques. Accordingly, in the present invention, in order to improve the interfacial adhesion between the base material of aluminum, magnesium, titanium, copper, iron, nickel or an alloy thereof and the insulating coating layer, grit blasting or sand blasting, After forming the uneven layer by using a surface treatment such as lapping, chemical etching, etc., an insulating layer is formed thereon using a thermal spray coating. In addition, the surface of the metal base material by anodizing or plasma electrolytic oxidation (hereinafter referred to as "PEO") to a thin thickness after the surface treatment to improve the adhesion between the metal base material and the insulating layer formed by the thermal spray coating. Forming a thin oxide film on the can greatly improve the adhesion.

In addition, the thermal spray coating varies depending on the thermal spraying conditions, but there are many defects such as about 5 to 20% of pores inside the insulating coating layer, and there is a problem in securing thermal conductivity and insulation required by the metal PCB. Therefore, in order to solve this problem, the present invention uses a heat treatment curing process after coating a thermosetting polymer resin such as epoxy or polyimide and a ceramic-based filler on the insulating coating layer by screen printing, inkjet printing, or dipping. By filling the pores and defects of the insulating coating layer can improve the thermal conductivity and insulation. In addition, when the filler is formed on the insulating coating layer in this manner, the pressure heat treatment in a vacuum atmosphere may improve the thermal conductivity and insulation of the insulating coating layer. In addition, in order to increase the thermal conductivity of the ceramic insulating layer formed of the thermal spray coating, the thermal conductivity may be improved by heating the metal base material.

Such thermal spray coating has been widely used for the purpose of coating a single metal layer or a ceramic layer for imparting abrasion resistance, corrosion resistance, heat resistance, etc. to large mechanical structural parts such as aircraft, ships, power plants, steel mills, and textile industries. Until recently, few examples of successful thermal spray coatings on semiconductors and electronic components.

An insulated metal component according to an aspect of the present invention is a metal insulated component for LED and semiconductor, the base material; Uneven parts formed on the base material; An insulation coating layer formed by thermal spray coating on the uneven portion; A filling layer formed on the insulating coating layer; And a wiring layer formed on the filling layer.

The base material may include at least one of aluminum, magnesium, titanium, copper, iron, nickel or an alloy thereof, and may include an aluminum composite material in which a particle-reinforced composite material including SiC or carbon nanotubes is added to aluminum. Can be.

The base material may include any one of a heat sink having a heat dissipation fin, a porous metal, a heat pipe, and a CNT coating.

The uneven portion may include at least one of an uneven layer and a PEO oxide film formed by surface treatment of the base material, and the surface treatment may include grit blasting, sand blasting, lapping and chemical etching.

The uneven portion may further include an interface insulating layer formed on at least one of the uneven layer and the PEO oxide layer.

The insulating coating layer may include at least one of alumina, aluminum nitride, beryllium oxide, silicon carbide, boron nitride, magnesium oxide, and silicon nitride, and may have a thickness of 8 μm to 200 μm.

A second interface insulating layer formed between the filling layer and the wiring layer may be further included.

According to another aspect of the present invention, there is provided a method of manufacturing an insulated metal component, comprising: forming an uneven portion on a base material; Forming an insulating coating layer by thermal spray coating on the uneven parts; Forming a filling layer on the insulating coating layer; And forming a wiring layer on the filling layer.

The uneven portion includes at least one of an uneven layer formed by surface treatment of the base material and a PEO oxide film formed by PEO oxidation of the base material.

The method may further include forming an interfacial insulating layer on at least one of the uneven layer and the PEO oxide layer, wherein the interfacial insulating layer may be anodized, PEO, sputtering, vacuum deposition, CVD, atmospheric plasma deposition, sol-gel method, and the like. It can form using at least one of the injection methods.

The insulating coating layer may be formed by the thermal spray coating while increasing the temperature of the base material.

The filling layer is formed by screen printing, inkjet printing or dipping an epoxy, thermosetting resin or inorganic material.

The wiring layer is formed by using an electrolytic copper foil, sputtering, plating, screen printing, or inkjet printing.

The wiring layer may be formed by simultaneously vacuum pressurizing the filling layer and the wiring layer, and the wiring layer may be hardened and heat-treated after forming the filling layer, and may be formed by plating after forming an adhesive layer and a seed layer by sputtering. have.

The method may further include forming a second interface insulating layer on the filling layer.

The present invention forms an uneven part by surface treatment of a base material on a base material of aluminum, magnesium, titanium, copper, iron, nickel or an alloy thereof, and then forms an insulating layer by spray coating on the uneven part to manufacture an insulated metal part. do.

According to the present invention, by applying the thermal spray coating to metal insulating parts such as LEDs, metal PCBs for high power semiconductor devices, metal insulating substrates for thermoelectric elements, electrostatic chucks for semiconductor equipment, and the like, the thermal conductivity, insulation, adhesiveness, and productivity can be improved. It can achieve large size, mass production and low price of metal insulation parts.

In addition, the parts formed with an insulating coating layer on the base material according to the present invention is not only parts for the electronics and semiconductor industries, but also for aircraft, ships, automobiles, machinery parts, textile industry parts that require characteristics such as wear resistance and corrosion resistance, heat resistance, fatigue resistance, etc. It can be applied to, greatly expanding the application range of the conventional spray coating.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information. In the drawings, the thickness of layers, films, panels, regions, etc., may be exaggerated for clarity, and like reference numerals designate like elements. In addition, when a part such as a layer, a film, an area, etc. is expressed as being on or on another part, not only when each part is directly on or directly above the other part but also another part between each part and another part This includes any case.

1 is a schematic cross-sectional view of an insulated metal part using a thermal spray coating according to a first embodiment of the present invention.

Referring to FIG. 1, an insulated metal component using a thermal spray coating according to a first embodiment of the present invention is a base material 110 and an uneven layer 121 formed by surface treatment of the base material 110 on the base material 110. And, the insulating coating layer 130 formed by the spray coating on the uneven layer 121, the filling layer 140 formed on the insulating coating layer 130 to fill the pores or defects of the insulating coating layer 130, and the filling The wiring layer 150 formed on the layer 140 is included.

The base material 110 may use a metal made of aluminum, magnesium, titanium, copper, iron, nickel, or an alloy thereof. The base material 110 may have various shapes according to the use. For example, various shapes such as a flat surface, a shape having a concavo-convex structure formed on at least one surface such as a heat dissipation fin, etc. are possible, and various shapes such as a cylindrical or semi-cylindrical shape having a circular or polygonal cross section are possible.

The uneven layer 121 is formed on the base material 110 by the surface treatment of the base material 110, may be formed on one surface of the base material 110, the entire surface including the other surface and the side surface of the base material 110. It may be formed. The uneven layer 121 is formed to improve the interfacial adhesion between the base material 110 and the insulating coating layer 130. That is, although the insulating coating layer 130 formed by the thermal spray coating varies depending on the thermal spraying conditions, welding or heat treatment is performed because the chemical bonding is not made between the base material 110 and the insulating coating layer 130 and is merely maintained by mechanical coupling. Compared with other joining techniques, such as a relatively weak interfacial adhesion has a disadvantage. Therefore, the interfacial adhesion between the base material 110 and the insulating coating layer 130 may be improved by forming the uneven layer 121 on the surface of the base material 110 by surface treatment of the base material 110. The uneven layer 121 may be formed by surface treatment of the base material 110 using grit blasting, sand blasting, lapping or chemical etching. Grit blasting is carried out, for example, using square alumina or silicon carbide powder, followed by grit blasting followed by ultrasonic washing with acetone or alcohol. Here, the uneven layer 121 is formed to a thickness of 1㎛ 15㎛, when the uneven layer 121 is formed to a thickness of 1㎛ or less, the thermal spraying efficiency is lowered, when formed to a thickness of 15㎛ or more surface irregularities It is too severe to form a thin insulating coating layer 130 for applications where flatness is important. Meanwhile, in the case of grit blasting or sand blasting, the grit or sand is blasted at a high pressure, and thus a plate having low mechanical strength such as aluminum, magnesium, or copper having a thickness of 2 mm or less occurs, and thus, In this case, it is preferable to form the uneven layer 121 by lapping or chemical etching.

The insulation coating layer 130 is formed on the base material 110 on which the uneven layer 121 is formed using a thermal spray coating. The insulating coating layer 130 is formed by heating the thermal spray raw material to a high temperature in a short time using various thermal spraying methods to instantly melt the thermal spray raw material and collide with the base material 110 at a high speed. Here, the molten thermal spray raw material is impinged on the base material 110 at a speed of less than several hundred meters per second or at a speed of 2 to 3 times the speed of sound. As the thermal spraying raw material, thermal spraying powders or wire rods such as metals, metal alloys, ceramics, semiconductor materials, insulating materials, and the like can be used, and an electric arc, plasma, gas, liquid heat source, or the like can be used as the thermal spraying method. In particular, in the present invention, an insulating material such as ceramics, for example, alumina, aluminum nitride, beryllium oxide, boron nitride, magnesium oxide, silicon nitride, silicon carbide, etc. By forming, it is possible to secure the thermal conductivity and insulation required by the insulated metal parts. In addition, the insulation coating layer 130 may be formed to a thickness of 8㎛ ~ 200㎛, 8㎛ or less thickness may be reduced insulation, 200㎛ or more thickness may be cracked in the layer to reduce the film quality Insulation may also be degraded. The thermal spray coating may adjust the thermal spraying conditions such as flame temperature, molten particles scattering rate, thermal spraying atmosphere, power, gas blending rate, and feed rate to maximize process efficiency. There are various kinds of sprays such as flame thermal spray, high velocity oxygen fuel (HVOF), detonation gun, arc plasma, plasma spray, and welding. . Plasma sprays that are most advantageous for ceramic coatings will be described in detail, and other spray methods do not differ significantly in principle.

Plasma spray coating is a method of forming an insulating coating layer 130 by melting the powder in the form of powder using a high temperature plasma heat source, and then spraying the powder in a high speed to the base material 110. Plasma spray coating has no limitations on the selection of various materials such as metals, ceramics, intermetallic compounds, composite materials, etc., compared to other spray methods, has a high injection speed and deposition efficiency, low fuel gas consumption and cost, and minimal spraying. Only preheating and cooling are required, the plasma system is technically and industrially proven to be highly reliable, the spraying method is easily controlled according to various applications, and it is easy to apply on the production site. In particular, plasma ceramic spray coatings using ceramic powders are widely used to improve abrasion resistance, corrosion resistance, and erosion resistance of structural materials and various mechanical parts. Plasma spray is injected into the plasma stream (speed: Mach 2, center temperature: 16,500 ° C) generated from an inert gas by a non-transfer arc, and then instantly melted to melt completely. Is sprayed and adhered at high speed to form a film. As a thermal spraying material, it is a metal, a nonmetal, ceramic (mainly metal oxide, carbide), cermet, and a wide range of excellent abrasion resistance, heat resistance, corrosion resistance, electrical conductivity, electrical shielding, etc., excellent coatings, and also upkeep maintenance In addition, since the surface temperature of the workpiece during the thermal spraying is controlled to be around 150 ° C., all the base materials can be coated.

In general, the size of the powder used in the spray coating uses a large range of 10㎛ ~ 100㎛, but when using the nano-powder shows excellent mechanical properties such as more than two times the adhesive strength of the coating layer, more than four times the wear resistance is increased. The larger the plasma output, the smaller the argon (Ar) gas flow rate, the longer the thermal spray powder stays in the plasma flame, i.e., the residence time of the thermal spray powder increases, providing sufficient time for the powder to melt. Plasma sprayers use Sulzer Metco's equipment the most worldwide and use argon, hydrogen and nitrogen as fuel gases. In addition, in order to prevent the specimen from overheating during the thermal spraying process, the specimen is often cooled with compressed air and coated while maintaining a constant traverse speed of the thermal spraying gun.

The filling layer 140 is formed on the insulating coating layer 130 and is formed to remove pores existing in the insulating coating layer 130. The filling layer 140 may be formed by screen printing, inkjet printing, or dipping. That is, although the insulation coating layer 130 varies depending on the thermal spraying conditions, there are many pores of about 5% to 20%, and such pores are formed by removing the filling layer 140 of an epoxy or thermosetting resin or an inorganic series. can do. For example, after thermally coating alumina to form an insulating coating layer 130, a paste consisting of alumina powder, other additives and fluxes is screen printed, inkjet printed, or dipping to form an insulating coating layer 130 on the insulating coating layer 130. After the formation, heat treatment at an appropriate temperature may remove pores of the insulating coating layer 130.

The wiring layer 150 is formed on the filling layer 140 and may be formed using a metal material such as copper, aluminum, or silver. The wiring layer 150 can be formed in various ways. For example, the wiring layer 150 may be formed by forming a paste containing a metal material on the insulating coating layer 130 by screen printing or inkjet printing and then heat treating the paste. In addition, the electrolytic copper foil foil formed by electroplating, which is generally known in the PCB industry, may be formed by hot pressing using an epoxy adhesive, and then the electrolytic copper foil foil may be patterned by photolithography and etching to form the wiring layer 150. In addition, after depositing an adhesive layer and a seed layer with a thickness of 0.05 μm to 0.2 μm by sputtering, which is a well-known technique in the semiconductor industry, a metal layer is formed by a plating process, and a metal layer is patterned by a photo and etching process. The wiring layer 150 may be formed. In addition, since the concave-convex structure is formed on the surface of the insulating coating layer 130 of the ceramic material, the wiring layer 150 may be formed by continuously spray coating a metal material. In this case, the wiring layer 150 may be formed in a predetermined pattern. For this, a wiring and an etching process may be used. As another method of forming the wiring layer 150, in order to form the wiring layer 150 in a predetermined pattern, a mask layer (not shown) is formed on the insulating coating layer 130, the metal layer is thermally coated, and then the mask layer is formed. The wiring layer 150 may be formed by removing the wiring layer 150. In this case, the mask layer may use a stencil made of metal or ceramic material. Meanwhile, pores may occur in the wiring layer 150 formed of the thermal spray coating. The pores may be removed by forming the same material as the wiring layer 150 or a layer in which other materials are added to the same material. For example, in the case of forming the wiring layer 150 by thermally coating copper, a paste containing copper powder or a powder containing another alloy-added powder on the copper powder is formed on the wiring layer 150 by screen printing or inkjet printing and then heat-processed. The pores of 150 may be removed. That is, since the metal of the paste component is filled in the pores by the capillary phenomenon, the pores can be removed. In addition, in order to protect the wiring layer 150, a solder resist (not shown) layer may be additionally formed by screen printing, inkjet printing, deeping, or the like. Meanwhile, the epoxy-based filling layer 140 is formed on the insulating coating layer 130 by screen printing, and the wiring layer 150 is formed by laminating an electrolytic copper foil that is frequently used as a wiring layer material in the PCB industry and pressing and heat-treating it in a vacuum atmosphere. This can simplify the process and reduce manufacturing costs. In another method, the epoxy-based filling layer 140 is formed by a screen printing method, heat treated and cured, and then sputtering to deposit an adhesive layer and a seed layer to a thickness of 0.05 μm to 0.2 μm, followed by plating a metal layer. The wiring layer 150 may be formed by patterning the photolithography and etching processes. As such, the wiring layer 150 may be formed on the seed layer as a whole and then patterned through photolithography and etching processes. If the seed layer is patterned first, the wiring layer 150 may be formed at the same time as the plating.

As described above, in the insulating metal component according to the exemplary embodiment, the uneven layer 121 is formed on the base material 110 by surface treatment of the base material 110, and the uneven layer 121 is formed in an anchor shape. Therefore, the interface adhesion between the base material 110 and the insulating coating layer 130 may be improved. Therefore, the base material 110 and the insulating coating layer 130 do not fall even by mechanical shock, thermal shock, thermal fatigue, or the like.

2 is a schematic cross-sectional view of an insulated metal component using a spray coating according to a second exemplary embodiment of the present invention. Hereinafter, descriptions overlapping descriptions of the first exemplary embodiment will be omitted.

Referring to FIG. 2, the insulated metal component according to the second exemplary embodiment of the present invention includes a base material 110, an uneven layer 121 formed on the base material 110 by surface treatment of the base material 110, and an uneven layer. The interfacial insulation layer 122 formed on the 121, the insulation coating layer 130 formed by thermal spray coating on the interface insulation layer 122, and the pores of the insulation coating layer 130 formed on the insulation coating layer 130. Or a filling layer 140 for filling defects and a wiring layer 150 formed on the filling layer 140. That is, in the insulating metal component according to the second embodiment of the present invention, the interface insulating layer 122 is further formed between the uneven layer 121 and the insulating coating layer 130.

The interfacial insulating layer 122 is formed of, for example, a ceramic material, and is formed to improve adhesion, insulation, and thermal conductivity between the base material 110 and the insulating coating layer 130. The interface insulating layer 122 may be formed using anodizing, PEO, sputtering, vacuum deposition, chemical vapor deposition (CVD), atmospheric pressure plasma deposition, sol-gel method, spraying method, or the like. In the method of forming the interfacial insulating layer 122, it is preferable to use a material capable of anodizing as the base material 110 to which anodizing or PEO can be applied. Aluminum, magnesium, titanium, zirconium, or the like may be used. Here, in the anodizing, for example, in the state in which the aluminum base material 110 is deposited in an electrolyte, oxygen generated from the anode reacts with the surface of the aluminum base material 110 through an electrolysis reaction to form an alumina oxide film. However, since the alumina oxide film formed by anodizing is made in a honeycomb shape and numerous pores are made, a sealing process for blocking pores is generally performed. Even in the case of thin anodizing oxide film of about 5 μm through boiling water or metal salt sealing treatment, it is possible to secure insulation of about 500 V or more. Therefore, adhesion and insulation property on the uneven layer 121 formed by using a surface treatment for thermal spraying in the present invention. In addition, the interface insulating layer 122 having high thermal conductivity can be formed.

In addition, the interfacial insulating layer 122 may be formed of a thin oxide film on the surface of the base material 110, and the thin oxide film may be formed using a PEO method. The PEO method connects the base material 110 capable of anodizing in the electrolyte to the positive electrode and applies high voltage alternating current or pulsed direct current so that oxygen is generated by electrolysis, and oxygen reacts with the surface of the base material 110. An interfacial insulating layer 122 is formed on the layer 121. The electrolyte can be used by adding an alkali metal hydroxide such as KOH or NaOH to distilled or deionized water, for example. In addition, water glass (SiO ₂ Na ₂ O) may be additionally added to the electrolyte to form an interfacial insulating layer 122 having excellent adhesion, insulation, and thermal conductivity on the uneven layer 121. The pore, surface roughness, hardness, adhesion, and the like of the interfacial insulating layer 122 can be changed according to the component added to the electrolyte, the concentration of the component, and the like. In addition, when aluminum is used as the base material 110, the interfacial insulating layer 122 formed by PEO may be formed of a ceramic layer in which a main component is alumina and a small amount of silica (SiO ₂ ) is mixed. The interfacial insulating layer 122 formed by the PEO method is formed in a structure in which a transition diffusion layer, a core functional layer, and a porous layer are stacked. The transition diffusion layer is formed on the base material 110 and is chemically strongly bonded to the base material 110. The core functional layer is formed on the transition diffusion layer by the high heat of plasma accompanying the PEO method, and consists of crystalline alumina and amorphous alumina. The porous layer is formed on the core functional layer and is made of amorphous alumina. On the other hand, the interfacial insulating layer 122 formed by PEO method is formed in the form of an anchor, in the case of the thermal spray coating is mechanically bonded to the insulating coating layer 130 in order to bond strongly with the base material 110 in the form of an anchor rather than simple unevenness It is preferable that unevenness | corrugation is formed. Therefore, the insulating coating layer 130 and the base material 110 are very strongly bonded by the interface insulating layer 122 formed on the uneven layer 121 by the PEO method. In addition, while the insulation coating layer 130 has pores and defects of about 5% to 20%, the interfacial insulation layer 122 formed by PEO method is advantageous in terms of insulation and thermal conductivity because pores of much smaller size are formed. . The interfacial insulating layer 122 formed by the PEO method can be formed to a thin thickness to maintain the surface roughness of the uneven layer 121 formed by the surface treatment, the surface roughness of the insulating coating layer 130 formed by plasma spraying Also related to thermal efficiency.

The base material 110 capable of forming the interfacial insulating layer 122 on the uneven layer 121 by applying anodizing and PEO methods is limited to a metal such as aluminum, magnesium, titanium, zirconium, etc., which can be anodized, but sputtering, Vacuum deposition, CVD, atmospheric plasma deposition, sol-gel method, spraying method, etc. are not limited to the metal type of the base material 110. Sputtering and vacuum deposition are typical physical thin film deposition methods using vacuum equipment. Sputtering is a method in which a plasma is generated in a vacuum atmosphere to sputter a material of a target to be deposited on a base material, and vacuum deposition is a method of evaporating and depositing a coating material in a high vacuum atmosphere. CVD and atmospheric pressure plasma deposition method is a method of depositing a desired material on the base material by the chemical reaction of the source gas, the general CVD method uses a vacuum atmosphere, the atmospheric pressure plasma proceeds at atmospheric pressure. In addition, the sol-gel method is a method of depositing a thin film of a gel (gel) state by heat treatment after diluting the material to be deposited in a solvent to make a sol (sol) state and coating by spin coating or dipping method. The spray method is a method of spray coating a liquid substance. The sputtering and vacuum deposition, CVD, atmospheric pressure plasma deposition, sol-gel method, injection method and the like are well known in the semiconductor and coating industry, so further detailed description is omitted.

The interfacial insulating layer 122 formed on the uneven layer 121 by using anodizing, PEO method, sputtering, vacuum deposition, CVD, atmospheric plasma, sol-gel method, and spraying method is an oxide or nitride system having excellent insulation, adhesion, and thermal conductivity. Thin films of are preferred. The interfacial insulating layer 122 is preferably formed in a thickness of 0.05 μm to 20 μm, but a thickness of 0.05 μm or less may be insufficient in insulation, and a thickness of 20 μm or more takes a long process time and the effect of the uneven layer 121. This is because there is a high possibility that cracks and defects of the interface insulating layer 122 are inherent.

3 is a schematic cross-sectional view of an insulated metal part using a thermal spray coating according to a third exemplary embodiment of the present invention.

Referring to FIG. 3, the insulated metal part according to the third exemplary embodiment of the present invention includes a base material 110, an uneven layer 121 formed on the base material 110 by surface treatment of the base material 110, and an uneven layer. PEO oxide film 123 formed on the 121, an insulating coating layer 130 formed by thermal spray coating on the PEO oxide film 123, and pores or defects of the insulating coating layer 130 formed on the insulating coating layer 130. And a wiring layer 150 formed on the filling layer 140. Insulating metal parts according to the third embodiment of the present invention are different from those of the first embodiment in that the PEO oxide film 123 is formed without forming the uneven layer 121 by the surface treatment of the base material 110. Compared to the embodiment, the PEO oxide film 123 is formed without forming the uneven layer 121 and the interfacial insulating layer 122 by the surface treatment of the base material 110. That is, according to the third embodiment of the present invention, after forming the PEO oxide layer 123 on the base material 110, the insulating coating layer 130, the filling layer 140, and the wiring layer 150 are formed.

The PEO oxide film 123 is formed by the above PEO method, and can prevent deformation of the base material 110 by grit blasting or sand blasting. The PEO oxide film 123 is excellent in adhesive force, insulation, and thermal conductivity with the base material 110, and suitable surface irregularities are formed. The PEO oxide film 123 may be applied to the base material 110 such as aluminum, magnesium, titanium, zirconium, or the like having a thickness of 0.1 mm or more, and may be formed to a thickness of 10 μm to 100 μm. If the thickness of the PEO oxide film 123 is 10 μm or less, sufficient insulation cannot be secured, and the thermal spraying efficiency is low because the surface of the PEO oxide film 123 is insufficient, and the thickness of the PEO oxide film 123 is 100 μm or more. Process time and costs are high.

4 is a schematic cross-sectional view of an insulated metal component according to a fourth embodiment of the present invention.

Referring to FIG. 4, the insulated metal part using the thermal spray coating according to the fourth exemplary embodiment of the present invention has a base material 110 and an uneven part 120 formed by surface treatment of the base material 110 on the base material 110. And, the insulating coating layer 130 formed by the spray coating on the uneven portion 120, the filling layer 140 formed on the insulating coating layer 130 to fill the pores or defects of the insulating coating layer 130, and filling The second interface insulating layer 160 formed on the layer 140 and the wiring layer 150 formed on the second interface insulating layer 160 are included. Here, the uneven part 120 includes an uneven layer 121, an interfacial insulating layer 122, and a PEO oxide film 123 formed on the base material 110 to increase the thermal spraying efficiency. In the insulating metal component according to the fourth embodiment of the present invention, a second interface insulating layer 160 is further formed between the filling layer 140 and the wiring layer 140 as compared with the first to third embodiments of the present invention.

The second interfacial insulating layer 160 is formed of, for example, a ceramic material, and is formed to improve adhesion, insulation, and thermal conductivity between the filling layer 140 and the wiring layer 150. The second interface insulating layer 160 may be formed using anodizing, PEO, sputtering, vacuum deposition, CVD, atmospheric plasma deposition, sol-gel, spraying, or the like.

Meanwhile, the second interface insulating layer 160 may be formed without forming the filling layer 140, and before the filling layer 140 is formed or before and after the filling layer 140 is formed, the second interface insulating layer 160 is formed. 160 may be formed.

5 to 7 are schematic cross-sectional views of an insulated metal component according to a modified example of the present invention, and are modified examples for improving heat dissipation characteristics.

Referring to FIG. 5, an insulated metal component according to a modification of the present invention includes a heat dissipation fin 105 and a surface treatment of the base material 110 on which the heat sink is integrated and the base material 110 on the base material 110. Filled to fill the pores or defects of the uneven portion 120, the insulating coating layer 130 formed by the spray coating on the uneven portion 120 and the insulating coating layer 130 formed on the insulating coating layer 130 The layer 140 and the wiring layer 150 formed on the filling layer 140 are included.

Referring to FIG. 6, the insulated metal component according to another modification of the present invention further includes a porous metal layer 180 including a bonding layer 170 and pores 185 sequentially formed on the other surface of the base material 110. . The bonding layer 170 is for bonding the base material 110 and the porous metal layer 180, and the base material 110 and the porous metal layer 180 are bonded by various methods such as solder bonding, welding, ultrasonic bonding, and bonding using a joint. can do. The porous metal layer 180 may be made of, for example, a porous metal such as copper, aluminum, iron, or nickel, and the heat generated from an electronic component provided on the insulating metal component may be effectively released through the porous metal layer 180. Can be.

Referring to FIG. 7, the insulated metal component according to another modified example of the present invention further includes a heat pipe 190 provided in the base material 110. In general, the heat pipe 190 forms a void 191 in copper or aluminum having high thermal conductivity, maintains a vacuum below atmospheric pressure in the void 191, and a working fluid such as water, acetone, or alcohol 192, using the principle of heat absorption and heat release while moving at high speed through a porous channel called (wick). Therefore, when the heat pipe 190 is formed in the base material 110, the heat dissipation characteristics may be further improved by the high speed heat transfer characteristics of the heat pipe 190. In FIG. 7, a cross-sectional view of the flat heat pipe 190 is illustrated for convenience of description, but a heat pipe 190 coupled with a heat dissipation fin and a heat pipe 190 having various shapes are also included in the technical idea of the present invention.

As another modification, although not shown in the drawings, the carbon nanotube (CNT) coating may be applied to the lower portion of the base material 110 to improve heat transfer characteristics, thereby improving heat transfer characteristics of the metal insulation component. In general, CNTs are well known as materials having excellent heat dissipation properties, and CNTs are mixed with polymer materials such as polyethylene or epoxy, acrylic, and silicone to form a CNT coating solution. When the CNT coating liquid is sprayed on the lower surface of the base material 110 of the present invention with a thickness of about 1 to 30 μm and then hardened and heat treated, the thermal emissivity of the insulated metal part of the present invention can be increased. This CNT coating can also be applied to heatsinks that are variations of the invention.

8 is a graph showing thermal conductivity and thermal expansion coefficient of various semiconductor materials used as a thermal spraying raw material.

As shown in FIG. 8, copper, which is widely used as a lead frame for a semiconductor, has the highest thermal conductivity of 398 W / mK, aluminum 237, iron 80, silicon (Si) 116, aluminum nitride (AlN) 200, A beryllium oxide (BeO) is 260, silicon carbide (SiC) is 240, boron nitride (BN) is 180 and alumina (Al ₂ O ₃ ) has a thermal conductivity of about 25. Although not shown in FIG. 8, the thermal conductivity of magnesium oxide (MgO) is about 60 W / mK, and silicon carbide (SiC) has a thermal conductivity of about 114 W / mK. Alumina, for example, has better insulation (dielectric strength 9.0), lower density (3.6 g / cc) and higher thermal conductivity (25 W / mK) than other ceramic materials. Compared with ordinary pure metal materials, aluminum nitride, beryllium oxide, silicon carbide, boron nitride, alumina, aluminum oxide, silicon nitride, and the like have a wide range of thermal conductivity depending on the manufacturing method, purity, and heat treatment. FR-4 insulation layer has a thermal conductivity of about 0.25W / mK in the conventional general PCB, and thermal conductivity of about 2W / mK and about 3 in the case of an insulation layer containing ceramic filler in epoxy resin used in the existing metal PCB. It has a dielectric constant of ˜5. Therefore, the thermal spray insulating layer 130 of the present invention uses a ceramic having a higher dielectric constant than the epoxy insulating layer, so that the thickness of the insulating coating layer 130 can be made thinner than the existing metal PCB in order to secure the same insulating property, thereby lowering the thermal resistance. Can be. In addition, it can be seen that the thermal conductivity of aluminum nitride, beryllium oxide, silicon carbide, boron nitride, and silicon nitride having excellent insulation properties is several tens to several hundred times higher than that of an insulating layer of a conventional metal PCB. Of course, when the ceramic insulation layer is formed by the thermal spray coating, the thermal conductivity is relatively lower than that of the ceramic sintered with little pores manufactured by the conventional sintering method, but it is still at least several times higher than that of the conventional PCB or metal PCB. It has ten times higher thermal conductivity.

In addition, the coefficient of thermal expansion of aluminum 25.5 ppm / deg, copper 16.5, iron 12.3, nickel has a value of 13.3, and materials such as aluminum nitride, alumina, silicon has a coefficient of thermal expansion of about 4-8.

Therefore, both the semiconductor and the ceramic material can be used as a thermal spraying material, and particularly in an environment subject to high thermal fatigue, it is preferable to use a material having a small difference in thermal expansion coefficient between the base material and the insulating coating layer. On the other hand, when forming a base metal with a thermal spray coating, an aluminum composite in which a particle-reinforced composite material such as SiC or carbon nanotubes (CNT) is added to aluminum instead of a material having a larger thermal expansion coefficient such as aluminum or copper than ceramics Materials can be used. Base metals using aluminum composite materials have higher strength and stiffness, and better wear and heat resistance than aluminum alloys. In addition, it has a high thermal conductivity and a coefficient of thermal expansion almost similar to that of ceramics. The heat dissipation material of the electronic device should have characteristics of low thermal expansion coefficient, high thermal conductivity, low density and low production cost. The aluminum composite material can be designed as desired according to the type and fraction of reinforcing particles. It is highly applicable to heat dissipation material of electronic equipment. In addition, since SiC has excellent physical and mechanical properties despite low raw material prices, it is widely used as a reinforcing material for composite materials, and a method of manufacturing a composite material of aluminum and SiC having a network structure using a pressurized or pressureless agglomeration method. Is being developed. In general, a composite material of aluminum and SiC has a relatively high thermal conductivity of about 120 to 180 W / mK depending on the manufacturing method and the fraction of SiC. In addition, the recently developed carbon nanotubes are added to the surface of the aluminum nanomaterials are added to the surface of the carbon nanotubes so that the aluminum melts well. Here, the thermal conductivity of the composite material is changed by various factors such as the fraction and distribution of SiC particles and carbon nanotubes, the interface state between the matrix and the reinforcing material, and the thermal conductivity of the constituent elements. Therefore, when manufacturing a metal PCB using a composite material of aluminum and SiC or carbon nanotubes as the base material 110, it is possible to make a product having excellent reliability by minimizing the difference in thermal expansion coefficient with the insulating coating layer (130). Accordingly, as the thermal spray coating material, alumina, aluminum nitride, beryllium oxide, silicon carbide, boron nitride, magnesium oxide, silicon nitride, and mixtures thereof may be used.

9 is a schematic diagram of a light emitting module having a heat sink as an insulated metal part using a thermal spray coating according to the present invention.

9 (a) and 9 (b), the light emitting module according to the present invention includes a substrate 210 having a heat dissipation fin 205 and a heat sink integrated therein, and an insulating layer formed on the substrate 210. 220, a wiring layer 230 formed in a predetermined region on the insulating layer 220, a light emitting element 240 mounted on the wiring layer 230, and a portion of the insulating layer 220 and the wiring layer 230. The solder resist layer 250 is included.

The substrate 210 is made of, for example, an aluminum alloy, and a heat dissipation fin 205 is formed on one surface thereof. An insulating layer 220 is formed on the other surface of the substrate 210, and the insulating layer 220 includes the uneven parts 120, the insulating coating layer 130, and the filling layer 140. The wiring layer 230 is formed on the insulating layer 220.

The light emitting device 240, for example, a light emitting device package having a lead frame, is surface mounted on the wiring layer 230.

The solder resist layer 250 may be formed by screen printing, inkjet printing, or dipping and then photographing and etching.

As described above, when a printed circuit board is manufactured using the substrate 210 having the heat sink having the heat dissipation fins 205 integrated therein, a metal printed circuit board, a TIM such as silicon, and a heat sink are used. Compared to the material and manufacturing process can be significantly reduced, in particular, there is an advantage that can significantly reduce the thermal resistance.

By applying an insulated metal component using the thermal spray coating according to the present invention as described above, it is possible to manufacture a light emitting module or a light emitting module having excellent thermal conductivity. There is a limitation in manufacturing a backlight unit for a large liquid crystal display device using a conventional metal PCB, but if the component using the spray coating according to the present invention is applied, there is no limitation in size or material and a light emitting module having a minimum heat resistance can be manufactured. have.

10 is a schematic cross-sectional view of an electrostatic chuck as an insulated metal part using a thermal spray coating according to the present invention. The electrostatic chuck serves to fix the silicon wafer and the glass panel by forming an electrode 330 for generating electrostatic power in semiconductor equipment.

Referring to FIG. 10, the electrostatic chuck according to the present invention may be formed in a body 310 having a step, a first insulating layer 320 formed on the body 310, and a predetermined region on the first insulating layer 320. The electrode 330 includes a first insulating layer 320 and a second insulating layer 340 formed on the electrode 330.

The body 310 may be made of a metal material, for example, aluminum or an aluminum alloy, and the center portion is made to have a high step compared to other areas. A first insulating layer 320 is formed on the central portion of the body 310, and the first insulating layer 320 is formed of the uneven portion 120, the insulating coating layer 130, and the filling layer 140 as described above. . On the other hand, a method for manufacturing an electrostatic chuck using a thermal spray coating has been proposed by a known technique, but in the present invention, the uneven portion 120 having a strong bonding force, high insulation, and high thermal conductivity and the insulating coating layer ( Forming the filling layer 140 on the 130 is different from the conventional.

The electrode 330 is formed in a predetermined region on the first insulating layer 310 and may be formed by spray coating a conductive material. Therefore, after forming a mask layer in a region other than the region where the electrode 330 is to be formed, the conductive material may be thermally coated and the mask layer may be removed to form the electrode 330. In addition, the electrode 330 may be formed by applying and heat-treating the electrode material by screen printing or inkjet printing. In addition, the electrode 330 may be formed using sputtering or vacuum deposition.

The second insulating layer 340 is formed on the first insulating layer 320 and the electrode 330, it may be formed by thermal spray coating. That is, the second insulating layer 340 may also be configured of the uneven portion 120, the insulating coating layer 130, and the filling layer 140 in the same manner as the first insulating layer 320. If a step is formed by the electrode 330 after the second insulating layer 340 is formed, it is preferable to remove the step by a lapping or polishing method in a subsequent process.

11 is a schematic cross-sectional view of a thermoelectric element module as an insulated metal part using a thermal spray coating according to the present invention.

Referring to FIG. 11, the thermoelectric device module according to the present invention includes a lower substrate 410 having heat dissipation fins 405 and a heat sink integrated therein, a first insulating layer 420 formed on the lower substrate 410, and a first insulating layer 420. 1 The lower electrode layer 430 formed in a predetermined region on the insulating layer 420, the P-type thermoelectric semiconductor layer 440 and the N-type thermoelectric semiconductor layer 450 repeatedly formed on the lower electrode layer 430, and the upper substrate 460. ), A second insulating layer 470 formed on the upper substrate 460, and a P-type thermoelectric semiconductor layer 440 and an N-type thermoelectric semiconductor layer 450 formed in predetermined regions on the second insulating layer 470. And an upper electrode layer 480 bonded thereto. Here, the P-type thermoelectric semiconductor layer 440 and the N-type thermoelectric semiconductor layer 450 are soldered or brazed to be connected to the upper electrode layer 470 and the lower electrode layer 430, thereby manufacturing a thermoelectric element.

In addition, the first and second insulating layers 420 and 470 formed on the lower substrate 410 and the upper substrate 460 for the thermoelectric element module respectively have the uneven portion 120 and the insulating coating layer 130 as described above. And a filling layer 140. The lower electrode layer 430 and the upper electrode layer 480 may also be formed in the same manner as the wiring layer 150 described above.

The conventional alumina ceramic substrate for a thermoelectric element module has a problem of having a very high price, a complicated manufacturing process, a high manufacturing cost according to a unit process that cannot be mass produced, and low thermal conductivity. Therefore, when the thermal spray coating according to the present invention is applied to the lower and upper substrate materials for thermoelectric element modules, it is possible to easily mass-produce insulated metal substrates having excellent thermal conductivity, insulation, and adhesiveness, and to increase the manufacturing process and manufacturing cost compared to the prior art. Can be reduced.

It is a photograph of the surface shape which carried out the grit blasting on the aluminum base material. The surface shape which processed the aluminum 5052 flat plate of thickness 2mm by grit blasting is the photograph magnified 60 times with the optical microscope, and average surface roughness is 2.5 micrometers. Grit blasting, unlike ordinary sand blasting, injects silicon carbide (SiC) or alumina (Al ₂ O ₃ ) into the substrate at a high speed with a very irregular blasting material. Therefore, the uneven | corrugated layer of 1-10 micrometers magnitude | size is formed in the surface of a base material. In general, surface treatment using grit blasting depends on the type of the base material, but the base metal is stressed in the thin plate having a thickness of 2 mm or less, and deformation occurs. However, it is possible to minimize the deformation of the base metal by automatically controlling the injection speed of the grit and the base material movement speed, rather than the grit blasting by hand.

13 (a) and 13 (b) are photographs in which a concave-convex layer is formed on both surfaces of an aluminum thin plate by PEO coating on a 0.2 mm thick aluminum (Al) plate. Fig. 10 (a) is a photograph of the surface of the uneven layer observed at a magnification of 100 times with an optical microscope, and Fig. 10 (b) is a cross-sectional photograph of an aluminum thin plate on which an uneven layer was observed at a magnification of 400 times with an electron microscope.

As shown in FIGS. 13 (a) and 13 (b), when the PEO coating is performed on the aluminum sheet, an uneven layer of porous alumina having very many pores is formed on the aluminum sheet. In particular, since the thermal spray coating is mechanically bonded, an anchor-type concave-convex structure is more preferable than a simple concave-convex structure in order for the insulating coating layer to strongly bond with the base material. In addition, when the aluminum plate having a thickness of 0.2 mm is formed with an uneven layer by PEO coating, the aluminum layer has a thickness of 95 μm, and upper and lower uneven layers are formed at about 75 nm, respectively. When the PEO coating is applied to the aluminum thin plate, the uneven layer is formed by reacting with the aluminum, but the thickness of the aluminum layer is smaller than the original thickness, but the uneven layer is formed to a predetermined thickness. Therefore, the overall thickness after the uneven layer is formed is about 45 μm thicker than before the uneven layer is formed. Although it is not possible to grit blast the 0.2 mm thick aluminum sheet without deforming the base material, PEO coating can be used to form an anchor-shaped uneven portion which is very suitable for spray coating on the surface of the base material without deforming the base material. can do.

Table 1 shows the thermal conductivity change of the alumina insulation coating layer according to the base material temperature. Here, the plasma spraying equipment used Sulzer-Metco's 9MB model, aluminum base material using Al 1050 (610 * 550 * 1.5㎜) grit blasting using gold steel of # 80, dry speed (Gun speed) is 425 mm / sec, gun-base distance is 80 mm, Ar gas flow rate is 33 L / min, hydrogen gas flow rate is 4.5 L / min, and alumina spray powder is sprayed to a thickness of about 40 μm using Sulzer-Metco 105NS. Coated.

Temperature of substrate Room temperature 100 ℃ 200 ℃ 300 ℃ 400 ℃ 500 ℃ Thermal conductivity 4.0 4.08 6.40 8.15 10.27 9.73

When forming an alumina insulating coating layer using plasma spraying, a base material is locally heated by the plasma sprayed from a spraying gun. However, when the temperature of the base material is raised rather than the thermal spray coating at room temperature, the thermal conductivity of the alumina insulation coating layer is increased from 100 ° C to 400 ° C. The thermal conductivity of the alumina insulating coating layer shows a very low value compared to having a thermal conductivity of approximately 20 to 35 W / mK in the case of pure alumina. have. Increasing the base material temperature may cause deformation of the base material, but by appropriately adjusting variables such as heating rate and cooling rate of the base material and stress of the initial base material, the deformation of the base material can be minimized.

Table 2 shows the variation of the dielectric breakdown voltage according to the thickness and epoxy filling of the plasma insulating coating layer. Plasma spraying conditions were the same as in [Table 1] above, and the base material was not heated separately. The thickness of the insulating coating layer was converted using a micrometer and a weight change.

Insulation Coating Layer Thickness (㎛) 8 14 21 49 64 83 Breakdown voltage A (kV) - 0.34 0.46 0.78 1.35 1.78 Breakdown voltage B (kV) 0.38 0.67 1.01 2.83 > 5.0 > 5.0 Breakdown voltage C (kV) 1.45 2.55 3.24 > 5.0 > 5.0 > 5.0

Insulation breakdown voltage was measured and averaged 10 times with DU-1336 tester of Delta United Instrument in accordance with KS standard D8514. Insulation breakdown voltage A was an insulation breakdown voltage of the insulation coating layer without forming the filling layer, and the insulation breakdown voltage A was not insulated in the case of 8 μm. As the thickness increased, the breakdown voltage A increased. The dielectric breakdown voltage B is measured by the screen breakdown using epoxy mixed with 30% alumina filler and the dielectric breakdown voltage after 100 minutes hardening heat treatment. The dielectric breakdown voltage C is a measure of the dielectric breakdown voltage after screen printing an epoxy, laminating an electrolytic copper foil, and performing vacuum pressure heat treatment. Vacuum pressurized heat treatment was performed using a German Burkle LAMV 150 equipment, the vacuum was 20torr or less, the pressure was 50kgf / ㎠, 100 minutes heat treatment at 200 ℃ setting temperature and then cooled. When the epoxy filling layer was formed using vacuum pressurized heat treatment, it was confirmed that the insulation breakdown voltage of the insulation coating layer was increased by about 6 to 8 times, and the measurement of the insulation breakdown voltage tester was not possible over 5 kV. At this time, the thickness of the epoxy filling layer was about 10㎛. Therefore, the effect of increasing the dielectric breakdown voltage was confirmed by hardening heat treatment or vacuum pressurization heat treatment after screen printing the epoxy filling layers described in the first to third embodiments of the present invention. It is preferable that the insulation coating layer for use as a metal insulation component has a thickness of 8 micrometers-200 micrometers. If the thickness is within 8 μm, even if the filling layer is used, it is difficult to secure sufficient dielectric breakdown voltage. A thickness of 200 μm or more is not preferable due to an increase in process time, coating cost, and increase in thermal resistance.

Table 3 shows the change in dielectric breakdown voltage according to the interface insulating layer and the insulating coating layer. Using aluminum base material that performed grit blasting under the same conditions as [Table 1], KOH concentration was 15g / L, water glass was 24g / L, voltage was AC 400V, current density was 5A / dm ² To form a PEO oxide film. The dielectric breakdown voltage D of the interface insulating layer under these conditions was measured. The 8-micrometer-thick alumina insulating coating layer of [Table 2] was continuously formed on the interface insulating layer, and each dielectric breakdown voltage E was measured. Finally, epoxy was screen-printed and hardened heat treatment was performed at 200 ° C. for 100 minutes to measure each dielectric breakdown voltage F.

PEO oxide thickness (um) 3 5 10 Breakdown voltage D (kV) - 0.11 0.32 Breakdown voltage E (kV) 0.37 0.42 0.46 Breakdown voltage F (kV) 1.55 1.68 1.80

In the case of the insulating coating layer having a thickness of 8 μm in Table 3, the thickness of the interface insulating layer was increased to 3 μm, 5 μm, and 10 μm as compared with the case where the dielectric breakdown voltage was not measured. The dielectric breakdown voltage E was increased and the dielectric breakdown voltage F was increased to 1.55, 1.68 and 1.80 kV, respectively, according to the epoxy curing heat treatment. Therefore, by forming the interfacial insulating layer presented in the second embodiment of the present invention on the base material grit blasted using PEO, the effect of increasing the dielectric breakdown voltage after curing heat treatment of the insulating coating layer and the screen printed epoxy was confirmed. .

14 is a cross-sectional photograph of an interfacial insulating layer, an insulating coating layer and a filling layer of an insulating metal substrate according to the present invention. The cross-sectional photograph was observed magnified 1200 times with a digital microscope. It can be seen that the thickness of the interfacial insulating layer of Table 3, the thickness of the insulating coating layer of 8 µm, and the thickness of the epoxy filling layer that was cured and heat-treated after screen printing were formed around 10 µm. In particular, it can be seen that the interfacial insulating layer 122, the insulating coating layer 130, and the epoxy filling layer 140 are densely and continuously formed on the uneven layer 121 formed by grit blasting on the aluminum base material.

15 is a measurement result of the thermal resistance of the LED module using an insulated metal substrate prepared by a plasma spray coating according to the present invention. The insulating metal substrate of the present invention uses an insulating coating layer 130 of about 40 ㎛ thickness, epoxy filling layer 140 of about 20 ㎛ thickness, electrolytic copper foil of about 35 ㎛ thickness and using a vacuum pressurized heat treatment After fabrication, a single-sided metal PCB was fabricated using the PCB process. The LED package was mounted on the metal PCB of the present invention using P7 (10W) of Seoul Semiconductor, and the thermal resistance of the LED module was measured. The thermal resistance measurement equipment used T3ster equipment of Micred, the thermal resistance of the insulated metal substrate according to the present invention can be seen that the thermal resistance is significantly reduced compared to the existing metal PCB products. In order to further reduce the thermal resistance, the thickness of the epoxy filler 140 may be reduced, or the surface may be polished after epoxy filling and curing heat treatment, and a metal substrate may be manufactured by the sputtering and plating method as described above. Alternatively, by forming the interfacial insulating layer 122 and minimizing the thicknesses of the insulating coating layer 130 and the filling layer 131, the target insulating properties and thermal conductivity may be optimized.

16 is a cross-sectional photograph of a metal PCB using an insulated metal component according to the present invention. To protect the uneven layer 121 and the insulating coating layer 130, the epoxy filling layer 140, the copper wiring layer 150, and finally exposed copper wiring layer 150 by grit blasting on the surface of the aluminum base material 110 The solder resist layer 170 is shown well.

Parts using the spray coating according to the present invention can be applied to various parts in addition to the above embodiment. For example, as a metal insulation component using the thermal spray coating according to the present invention, a roller for a printing machine, a steelmaking or steelmaking roller, or the like can be produced. That is, the above-mentioned concave-convex portion 120 may be formed on a circular columnar roller base material, and then spray-coated to form an insulation coating layer 130 and a filling layer 140. Depending on the application, the filling layer 140 may be excluded. The insulating coating layer 130 may be used for rollers having smooth surfaces, as well as rollers having threads or bends, aircraft jet fans, ship screws, and the like. Therefore, by using the technical spirit proposed in the present invention, the adhesion between the base material 110 and the insulating coating layer 130 and the insulation, and the thermal conductivity can be improved to obtain high heat resistance fatigue resistance and wear resistance.

1 is a schematic cross-sectional view of an insulated metal component using a thermal spray coating according to a first embodiment of the present invention.

2 is a schematic cross-sectional view of an insulated metal component using a thermal spray coating according to a second embodiment of the present invention.

3 is a schematic cross-sectional view of an insulated metal component using a thermal spray coating according to a third embodiment of the present invention.

4 is a schematic cross-sectional view of an insulated metal part using a thermal spray coating according to a fourth embodiment of the present invention.

5 to 7 are schematic cross-sectional views of insulated metal parts using a thermal spray coating according to a modification of the present invention.

8 is a graph showing thermal conductivity and thermal expansion coefficient of various semiconductor materials used as a thermal spraying raw material.

9 is a schematic view of a light emitting module having a heat sink as an insulated metal part using a thermal spray coating according to the present invention.

10 is a schematic cross-sectional view of an electrostatic chuck as an insulated metal part using a sprayed coating according to the present invention.

11 is a schematic cross-sectional view of a thermoelectric element module as an insulated metal part using a thermal spray coating according to the present invention.

12 is a photograph of the surface shape of the aluminum base material subjected to grit blasting.

13 (a) and 13 (b) are surface and cross-sectional photographs of a PEO oxide film formed on an aluminum base material;

14 is a partial cross-sectional photograph of an insulated metal part using a thermal spray coating according to the present invention.

15 is a heat resistance measurement result of the LED module using the insulated metal substrate prepared by the plasma-spray coating according to the present invention.

16 is a cross-sectional photograph of a metal PCB using an insulated metal component according to the present invention.

 <Description of the symbols for the main parts of the drawings>

110: base material 120: uneven portion

130: insulation coating layer 140: filling layer

150: wiring layer

Claims (20)

As metal insulation parts for LEDs and semiconductors, Base material; Uneven parts formed on the base material; An insulation coating layer formed by thermal spray coating on the uneven portion; A filling layer formed on the insulating coating layer; And Insulating metal parts comprising a wiring layer formed on the filling layer. The insulated metal part of claim 1, wherein the base material comprises at least one of aluminum, magnesium, titanium, copper, iron, nickel, or an alloy thereof. The insulated metal part of claim 1, wherein the base material comprises an aluminum composite material in which a particle-reinforced composite material including SiC or carbon nanotubes is added to aluminum. The insulated metal part of claim 1, wherein the base material includes any one of a heat sink having a heat dissipation fin, a porous metal, a heat pipe, and a CNT coating. The insulated metal part according to claim 1, wherein the uneven portion includes at least one of an uneven layer and a PEO oxide film formed by surface treatment of the base material. 6. The insulated metal part of claim 5, wherein said surface treatment comprises grit blasting, sand blasting, lapping, and chemical etching. The insulated metal part according to claim 5, wherein the uneven portion further comprises an interface insulating layer formed on at least one of the uneven layer and the PEO oxide film. The insulating metal component of claim 1, wherein the insulating coating layer comprises at least one of alumina, aluminum nitride, beryllium oxide, silicon carbide, boron nitride, magnesium oxide, and silicon nitride. The insulated metal part of claim 1, wherein the insulation coating layer has a thickness of about 8 μm to about 200 μm. The insulated metal part according to claim 1, further comprising a second interfacial insulating layer formed between the filling layer and the wiring layer. As a manufacturing method of metal insulation parts for LEDs and semiconductors, Forming an uneven portion on the base material; Forming an insulating coating layer by thermal spray coating on the uneven parts; Forming a filling layer on the insulating coating layer; And Forming a wiring layer on the filling layer. The method of claim 11, wherein the uneven portion comprises at least one of an uneven layer formed by surface treatment of the base material and a PEO oxide film formed by PEO oxidation of the base material. The method of claim 12, further comprising forming an interfacial insulating layer on at least one of the uneven layer and the PEO oxide layer. The method of claim 13, wherein the interfacial insulating layer is formed using at least one of anodizing, PEO, sputtering, vacuum deposition, CVD, atmospheric plasma deposition, sol-gel, and spraying. 12. The method of claim 11, wherein the insulating coating layer is formed by the thermal spray coating while raising the temperature of the base material. The method of claim 11, wherein the filling layer is formed of an epoxy, a thermosetting resin, or an inorganic material by screen printing, inkjet printing, or dipping. The method of claim 11, wherein the wiring layer is formed by using an electrolytic copper foil, sputtering, plating, screen printing, or inkjet printing. 18. The method of claim 16 or 17, wherein the wiring layer is formed by simultaneously vacuum pressurizing the filling layer and the wiring layer. 18. The method of claim 16 or 17, wherein the wiring layer is cured and heat-treated after the filling layer is formed, and the adhesive layer and the seed layer are formed by sputtering and then formed by a plating process. The method of claim 11, further comprising forming a second interfacial insulating layer on the filling layer.

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