KR20100025457A - Insulated metal components and method of manufacturing the same - Google Patents

Abstract

PURPOSE: An insulation metal element and a manufacturing method thereof are provided to improve thermal conductivity and insulating property by forming an insulating layer which has high use temperature using spray coating. CONSTITUTION: A manufacturing method of an insulation metal element comprises following steps. A concavo-convex part is formed on a base material(110). A thermal sprayed coating layer(130) is formed on the concavo-convex part. A charging layer(131) is formed on the thermal sprayed coating layer. A wiring layer(190) is formed on the charging layer.

Description

Insulated metal components and method of manufacturing the same

The present invention relates to an insulated metal component having an insulating layer formed on at least one surface of a metal base material using a thermal spray coating, and a method of manufacturing the same. In particular, an insulating layer and a metal wiring layer made of a thermal spray coating after surface treatment of forming an uneven portion on the metal base material. The present invention relates to a metal printed circuit board for LEDs and high power semiconductor devices, a metal insulating board for thermoelectric module, an electrostatic chuck for semiconductor equipment, and the like, and a method of manufacturing the same.

Light Emitting Diodes (LEDs) are the next-generation light source products that can replace traditional lighting such as incandescent lamps and fluorescent lamps and satisfy high efficiency and eco-friendliness at the same time. LEDs are used in various fields. In particular, high brightness LEDs are already being applied to backlight units and flashlights of mobile phones and mobile communication devices, and are expanding rapidly. .

However, LEDs generate a lot of heat because the luminous efficiency is still low compared to the input power. The heat generated by LEDs must be quickly dissipated through the package and the printed circuit board (hereinafter referred to as PCB) .The thermal conductivity of FR-4 insulation layer used in general purpose PCB is characterized by the properties of glass fiber and epoxy. By about 0.25 W / mK, which is very low. Therefore, there is a limitation in using a general-purpose general purpose PCB as a substrate material in LED packages and modules of 0.5W or more.

A representative example used to effectively solve the heat dissipation problem is a metal printed circuit board (hereinafter referred to as a metal PCB). Metal PCB is a special board to maximize heat dissipation effect due to high speed and high density of electronic products. The metal PCB uses aluminum (Al), copper (Cu), iron, titanium, magnesium, nickel, or an alloy thereof having excellent thermal conductivity as a base metal, and a copper foil as a circuit layer, and a base metal and a circuit layer. The epoxy resin is put in between, and it press-processes using a press and produces it. However, in order to ensure sufficient insulation, an insulating layer of at least 60 μm or more must be formed, and when the thickness of the insulating layer becomes thick, there is a disadvantage in that the thermal resistance increases rapidly. On the other hand, since a general epoxy resin or a phenol resin has a very low thermal conductivity, in order to improve this, a ceramic filler such as alumina (Al ₂ O ₃ ) or boron nitride (Alumina; filler) is in the insulating layer of about 30% to 50%. However, this does not obtain sufficient thermal conductivity of about 2 W / mK, while increasing the manufacturing cost of the insulating layer. In addition, as the content of the ceramic filler increases, the elasticity of the insulating layer is lost and the hard layer is easily broken, which causes problems such as peeling of the wiring layer or lifting of the insulating layer, and subsequent drilling, routing, and mold punching for metal PCB manufacturing. There is a problem with the process. In addition, since the epoxy resin has a high coefficient of thermal expansion above the glass transition temperature (glass transition temperature), there is a problem that the use temperature of the metal PCB is low around 100 ~ 150 ℃.

For reference, the thermal conductivity (W / mK) is an intrinsic property of the material, and the thermal resistance (K / W) is a value in which the thickness parameter of the material is considered. In other words, even if an insulating layer having a good thermal conductivity is used, as the thickness of the insulating layer is increased, the thermal resistance becomes relatively large, and even if the material having a low thermal conductivity is made thin, the thermal resistance is lowered.

In addition, another method of manufacturing a conventional metal PCB is to make an alumina insulating layer using anodizing on an aluminum metal substrate, but the alumina insulating layer formed by anodizing contains many pores and has a uniform thickness of at least 30 μm. It takes a lot of process time to grow, it is very difficult to ensure sufficient insulation.

In addition, as another method of manufacturing a conventional metal PCB, a method of forming an uneven layer by grit blasting on an aluminum plate, and manufacturing an alumina insulating layer by thermal spray coating is disclosed. However, because the alumina insulating layer prepared by the thermal spray coating contains many pores and defects, the bonding strength with the base material is low, the dielectric breakdown voltage is low, and it is difficult to obtain sufficient thermal conductivity. In addition, when the uneven layer is formed on the base material by grit blasting, there is a problem that severe deformation occurs in the case of the thin base material of 2 mm or less.

In addition, in the case of a conventional metal PCB, it is difficult to increase the size to 500 × 600 mm or more because a photo process is used to form a printed circuit pattern, which causes a problem in using it as a large LCD backlight unit or an LED substrate material for lighting. have. In addition, the conventional metal PCB is used by combining a heat sink made of aluminum or copper at the bottom to improve the thermal conductivity, silicon to reduce the thermal contact resistance at the interface between the separately bonded metal PCB and the heat sink. Despite the application of TIM (Thermal Interface Material), the thermal conductivity has been a cause of deterioration and cost increase.

On the other hand, as a general method for producing a ceramic coating layer having a high thermal conductivity can be largely divided into sintering method and vapor deposition method. First, the sintering method for making a thick ceramic substrate can be press-molded using high-purity ceramic powder and achieve densification of the ceramic particles at a sufficiently high sintering temperature, but it is not used for special purposes because it is difficult to enlarge the substrate and the price is very high. . Vapor deposition methods include pulsed laser deposition (PLD), sputtering, vacuum evaporation, chemical vapor deposition (CVD), and ion plating. It is very difficult to obtain a thick film having a thickness of more than a μm.

In addition to the LEDs, heat dissipation of semiconductor components is also a major problem in elevator control components, motor A / D converters, RF devices, and high output semiconductor devices. In order to use this as a metal PCB for high power semiconductor device, LED metal PCB has to have insulation breakdown voltage of 1000V or higher, but lower insulation resistance by using insulation layer having insulation breakdown voltage and high thermal conductivity of at least 5KV. It is necessary. Therefore, the PCB for such a high power semiconductor device has a problem that a printed circuit must be formed on an expensive ceramic substrate.

In addition, alumina substrates are commonly used as substrate materials of Peltier device modules that convert heat into electricity or electricity into heat. Alumina substrates are expensive, fragile, and have relatively high thermal conductivity as ceramics. Compared with the low thermal conductivity. In order to use as a substrate for a thermoelectric element module, an insulating layer must be formed on at least one surface and a metal electrode such as copper to solder the thermoelectric element can be formed. For this purpose, an insulated metal substrate, Hereinafter referred to as IMS). Since the insulating layer is formed only on the required portion of the IMS as compared to the conventional alumina substrate, the overall thermal resistance of the IMS is much lower than that of the conventional alumina substrate. In the case of such an IMS, as the thickness of the insulating layer is minimized to have the required insulation property, the IMS has a low thermal resistance.

In addition, in the case of an electrostatic chuck, which is widely used to adsorb silicon wafers and liquid crystal display (LCD) panels in semiconductor devices that use vacuum recently, they should have sufficient insulation, low thermal resistance, and high temperature stability. One of the methods of manufacturing such electrostatic chucks is to form an insulating layer and an electrode layer by thermal spray coating, but the insulating layer made of the thermal spray coating is very difficult to secure sufficient insulation and adhesion and low thermal resistance. have.

The present invention can significantly improve thermal conductivity and insulation, adhesion, productivity, etc. by applying a thermal spray coating to a metal PCB for LEDs and high power semiconductor devices, and provides an insulated metal component and a method of manufacturing the same.

The present invention provides a metal PCB and a method of manufacturing the same, which can ensure a high thermal conductivity and sufficient insulation by forming an insulating layer having a high use temperature using a thermal spray coating without using an insulating layer such as glass fiber and epoxy resin. To provide.

The present invention provides a component for forming a printed circuit pattern using a masking method, an inkjet printing, or a direct writing method using screen printing, without using a photographic process while using a thermal spray coating, and a method of manufacturing the same.

The present invention provides a method of increasing the insulation by filling the pores and defects in the interior of the insulating layer prepared by the spray coating.

The present invention provides a method for increasing the thermal conductivity of an insulating layer prepared using a thermal spray coating.

The present invention provides a method of forming a very thin thermal spray coating layer having a very high insulation and bonding strength by forming an additional interfacial insulating layer on the concavo-convex layer formed by surface treatment on a metal base material, and spray coating thereon.

In the present invention, a thermal spray coating is used on a metal PCB for LEDs and high power semiconductor devices in order to achieve the above object. Thermal spray coating is a kind of surface treatment coating technique in which molten coating material scattered with high thermal energy and velocity energy impinges on the surface of the base material and is coated with a strong adhesion force between the base material and the fine cohesion between particles. Thermal spray coating is not limited to the type and size of the base material, there is almost no deformation of the base material, can be coated very thick metal, ceramics, alloys, etc. in a short time, and depending on the coating material, such characteristics as abrasion resistance, corrosion resistance, heat resistance You can give it. In particular, in the present patent, by thermally forming an insulating layer in a large area at a high speed, thermal conductivity and insulation properties required by the metal insulating part can be secured.

However, the thermal spray coating varies depending on the thermal spraying conditions within the thermal spray coating layer, but there are many pores of about 5 to 20%, and because the chemical bond is not formed between the base material and the thermal spray coating layer, it is maintained only by mechanical bonding. Heat treatment and the like have a disadvantage in that the interfacial adhesion is relatively weak compared to other bonding techniques. Therefore, in the present invention, in order to improve the interfacial adhesion between the base material and the thermal spray coating layer of aluminum, magnesium, titanium, copper, iron, nickel or alloy thereof, grit blasting or sand blasting, Surface treatment such as lapping, chemical etching, etc. (hereinafter referred to as "surface treatment") is usually used to form an uneven layer having a thickness of about 1 μm to 15 μm, and then therein, using a thermal spray coating thereon. Form a layer. When the uneven layer of the surface of the base material is less than 1㎛ the spray efficiency is lowered, if more than 15㎛ the overall uneven surface of the surface is too severe, there is a problem in bringing a thin sprayed layer of the application of the flatness is important. In addition, grit blasting or sand blasting causes grit or sand to be blasted at a high pressure. Therefore, deformation occurs in low mechanical strength plates such as aluminum, magnesium, and copper. Lapping or chemical etching can be applied to improve adhesion.

The surface treatment is performed to improve the adhesion between the metal base material and the insulating layer formed by the thermal spray coating, and then the surface of the metal base material is subjected to an anodizing or plasma electrolytic oxidation method (hereinafter referred to as "PEO") in a thin thickness. Forming a thin oxide film can greatly improve the adhesion. The metal base material to which such anodizing or PEO can be applied is limited to aluminum or magnesium, titanium, zirconium, etc., which can be anodized, and can improve not only adhesion but also insulation.

In addition, due to defects such as pores present in the thermal spray coating layer, there is a problem in securing the thermal conductivity and insulation required by the metal PCB. In order to solve this problem, screen printing, inkjet printing, and dipping of the thermal spray coating layer using a thermosetting polymer resin such as epoxy or polyimide and a ceramic-based filler are applied, followed by heat treatment and curing to remove pores and defects of the thermal spray layer. Filling can improve thermal conductivity and insulation. In addition, when the filler is applied to the sprayed layer in this manner, the pressure heat treatment in a vacuum atmosphere may improve the thermal conductivity and insulation of the sprayed coating layer.

In addition, in order to increase the thermal conductivity of the ceramic insulating layer formed of the thermal spray coating, the thermal conductivity may be improved by heating the metal base material.

Such thermal spray coating has been widely used for the purpose of coating a single metal layer or a ceramic layer for imparting abrasion resistance, corrosion resistance, heat resistance, etc. to large mechanical structural parts such as aircraft, ships, power plants, steel mills, and textile industries. Until recently, few examples of successful thermal spray coatings on semiconductors and electronic components.

An insulated metal component according to an aspect of the present invention is a metal insulated component for LED and semiconductor, the base material; Uneven parts formed on the base material; A thermal spray coating layer formed by thermal spray coating on the uneven portion; A filling layer formed on the spray coating layer; And a wiring layer formed on the filling layer.

The base material includes at least one of aluminum, magnesium, titanium, copper, iron, nickel or an alloy thereof, and the base material includes a heat sink having a heat dissipation fin.

The uneven portion includes at least one of an uneven layer and a PEO oxide film formed by surface treatment.

The surface treatments include grit blasting, sand blasting, lapping and chemical etching.

The uneven portion further includes an interface insulating layer formed on at least one of the uneven layer and the PEO oxide film.

The thermal spray coating layer includes at least one of alumina, aluminum nitride, beryllium oxide, boron nitride, and silicon nitride.

According to another aspect of the present invention, there is provided a method of manufacturing an insulated metal part, comprising: forming an uneven part on a base material base material; Forming a thermal spray coating layer by thermal spray coating on the uneven portion; Forming a filling layer on the thermal spray coating layer; And forming a wiring layer on the filling layer.

The uneven portion includes at least one of an uneven layer formed by surface treatment and a PEO oxide film formed by PEO oxidation.

Forming an interfacial insulating layer on at least one of the concave-convex layer and the PEO oxide film, the interfacial insulating layer is anodizing, PEO method, sputtering, vacuum deposition, CVD, atmospheric pressure plasma deposition, sol-gel method and spraying method It is formed using at least one of.

The filling layer is formed by screen printing, inkjet printing, or dipping of epoxy, thermosetting resin, or inorganic material, and the wiring layer is formed by using electrolytic copper foil, sputtering and plating, screen printing, or inkjet printing.

The wiring layer is formed by a photographic process after the vacuum pressure heat treatment of the filling layer and the wiring layer at the same time.

The wiring layer is cured and heat-treated after the filling layer is formed, and the adhesive layer and the seed layer are formed, and then formed by a photolithography process after the sputtering or plating process.

This invention manufactures a metal insulation part by forming the sprayed coating layer on the uneven | corrugated part and the uneven | corrugated part of moderate roughness formed by surface treatment on the base material of aluminum, magnesium, titanium, copper, iron, nickel, or its alloy. The thermal conductivity, insulation and adhesiveness of the thermal spray coating, which are rarely used in the semiconductor or electronics industry, are applied to metal insulation parts such as metal PCBs for LEDs and high-power semiconductor devices, metal insulation substrates for thermoelectric elements, and electrostatic chucks for semiconductor equipment. The productivity can be dramatically improved, and the metal insulation parts can be enlarged, mass produced, and at low cost.

In addition, the parts with the thermal spray coating layer formed on the base material according to the present invention are not only parts for electronic and semiconductor industries, but also parts for aircraft, ships, automobiles, machinery, textile industries that require characteristics such as wear resistance and corrosion resistance, heat resistance, fatigue resistance, and the like. It can be applied to, greatly expanding the application range of the conventional spray coating.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention; However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention and to those skilled in the art. It is provided for complete information. In the drawings, the thickness of layers, films, panels, regions, etc., may be exaggerated for clarity, and like reference numerals designate like elements. In addition, when a part such as a layer, a film, an area, etc. is expressed as being on or on another part, not only when each part is directly on or directly above the other part but also another part between each part and another part This includes any case.

1 is a schematic cross-sectional view of an insulated metal part using a thermal spray coating according to a first embodiment of the present invention.

Referring to FIG. 1, a part using a thermal spray coating according to a first embodiment of the present invention is formed on a base metal 110 and a base metal 110 made of aluminum, magnesium, titanium, copper, iron, nickel, or an alloy thereof. The uneven layer 121 formed by the surface treatment, the thermal spray coating layer 130 of the ceramic type formed by the thermal spray coating on the uneven layer 121, the filling layer 131 for filling the pores or defects of the thermal spray coating layer 130 And a circuit wiring layer 190 formed on the filling layer 131.

The base material 110 may have various shapes according to the use, and various shapes, such as a shape having a flat surface and a concavo-convex structure formed on at least one surface such as a heat radiating fin, are possible. In addition, the base material 110 may have various shapes such as a cylindrical or semi-cylindrical shape having a circular or polygonal cross section.

The uneven layer 121 formed by the surface treatment may be formed on the base material 110, may be formed on one surface of the base material 110, or may be formed on the entire surface including the other surface and the side surface of the base material 110. . The uneven layer 121 formed by the surface treatment on the base material 110 may be formed on the base material 110 by grit blasting or sand blasting, lapping, and chemical etching. Grit blasting is carried out, for example, using square alumina or silicon carbide powder, followed by grit blasting followed by ultrasonic washing with acetone or alcohol. The concave-convex layer 121 formed on the base material 110 by such a surface treatment typically forms the concave-convex layer 121 of about 1 μm to 15 μm, and then uses the thermal spray coating on the ceramic insulating layer 130. Form. When the uneven layer on the surface of the base material is less than 1 μm, the thermal spraying efficiency is lowered. When the uneven surface of the base material is 15 μm or more, the overall unevenness of the surface is so severe that there is a problem in thinning the sprayed layer of the application where flatness is important. In addition, grit blasting or sand blasting causes the grit or sand to be blasted at a high pressure. Therefore, a sheet having a low mechanical strength such as aluminum, magnesium, or copper having a thickness of 2 mm or less may be bent. In this case, adhesion may be improved by applying lapping or chemical etching to form an appropriate surface uneven layer 121.

The thermal spray coating layer 130 is formed on the base material 110 on which the uneven layer 121 formed by the surface treatment is formed. The thermal spray coating layer 130 is heated on a high temperature in a short time by using a variety of thermal spraying method to melt the thermal spraying material instantaneously and collide with the base material 110 at a high speed to form on the base material (110). Here, the molten thermal spray raw material is impinged on the base material 110 at a speed of less than several hundred meters per second or at a speed of 2 to 3 times the speed of sound. As the thermal spraying raw material, thermal spraying powders or wire rods such as metals, metal alloys, ceramics, semiconductor materials, insulating materials, and the like can be used, and an electric arc, plasma, gas, liquid heat source, or the like can be used as the thermal spraying method. The thermal spray coating can control the thermal spray conditions such as flame temperature, molten particles flying rate, spray atmosphere, power, gas blending rate, transfer rate in order to maximize the efficiency of the process. There are various kinds of sprays such as flame thermal spray, high velocity oxygen fuel (HVOF), detonation gun, arc plasma, plasma spray, and welding. .

In the following, only the plasma spraying which is most advantageous for the ceramic coating will be described in detail, and other spraying methods have no major difference in principle. Plasma spray coating is a method of forming a thermal spray coating layer by melting a powder of a powder form using a high temperature plasma heat source and spraying it on a substrate at high speed. Plasma spray coating has no restrictions on the selection of various materials such as metals, ceramics, intermetallic compounds, composite materials, etc., compared to other spray methods, has a high injection speed and deposition efficiency, low fuel gas consumption and cost, and minimal spraying. Only preheating and cooling are required, the plasma system is technically and industrially proven to be highly reliable, the spraying method can be easily controlled according to various applications, and it is easy to apply on the production site. In particular, plasma ceramic spray coatings using ceramic powders are widely used to improve abrasion resistance, corrosion resistance, and erosion resistance of structural materials and various mechanical parts. Plasma spray is injected into the plasma flow (speed: Mach 2, center temperature: 16,500 ° C) generated from an inert gas by a non-transfer arc, and then instantly melted to melt completely. It is a coating method of forming a film by spray-contacting at high speed. As a thermal spraying material, metal, nonmetal, ceramic (mainly metal oxide, carbide), cermet, and a wide range of excellent abrasion resistance, heat resistance, corrosion resistance, electrical conductivity, electrical shielding, etc., excellent coatings can be obtained, and also can be raised and repaired, Since the surface temperature of the workpiece during spraying is controlled to around 150, all the base materials can be coated.

In general, the size of the powder used in the spray coating is used in the range of about 10 to 100, but when the nano-powder is used, the coating layer exhibits excellent mechanical properties such as an increase in the adhesive strength of the coating layer by more than two times and the wear resistance by four times or more. Known. The larger the plasma output, the smaller the argon (Ar) gas flow rate, the longer the thermal spray powder stays in the plasma flame, i.e., the residence time of the thermal spray powder increases, providing sufficient time for the powder to melt. Plasma sprayers use Sulzer Metco's equipment the most in the world, and argon, hydrogen and nitrogen are used as fuel gases. In addition, in order to prevent the specimen from overheating during the thermal spraying process, the specimen is often cooled with compressed air and coated while maintaining a constant traverse speed of the thermal spraying gun.

However, in general, the spray coating layer 130 may vary depending on the thermal spraying conditions, but there are many pores of about 5% to 20%, and chemical bonding is not performed between the base material 110 and the spray coating layer 130. Since it is maintained only by mechanical bonding, there is a disadvantage that the interfacial adhesion is relatively weak compared to other joining techniques such as welding or heat treatment. These pores may be removed by forming an epoxy or thermosetting resin and an inorganic filler layer 131. For example, after spray coating alumina to form a spray layer 130, a paste composed of alumina powder, other additives and fluxes is screen printed, inkjet printed, or dipping to form a spray coating layer 130 on the spray coating layer 130. After forming in the heat treatment at an appropriate temperature can be removed pores of the thermal spray coating layer (130). A detailed description of the formation method and effect of the filling layer 131 will be described later.

In addition, the wiring layer 190 on the filling layer 131 is formed using a metal material such as copper, aluminum, silver, or the like. The wiring layer 190 may be formed by screen printing or inkjet printing using a paste containing the metal material on the thermal spray coating layer 130 and then heat-treating the same. Also, in general, an electrolytic copper foil foil formed by electroplating using an epoxy adhesive known in the PCB industry is hot-pressed to form a wiring layer without a pattern first, and then a wiring layer 190 having a pattern is formed using a photo process. It may be. In another method, an adhesive layer and a seed layer are deposited to a thickness of about 0.05 μm to 0.2 μm by sputtering, a technique well known in the semiconductor industry, and then the wiring layer 190 is formed by using a plating and a photographing process. May be formed. Here, the photo process is a concept including all of the application and exposure of a photoresist, etching, stripping, seed layer, and etching of the adhesive layer, and since it is well known in the PCB and semiconductor industry, detailed description thereof will be omitted.

As another method, since the uneven structure is formed on the surface of the thermal spray coating layer 130 of the ceramic material, the wiring layer 190 may be formed by continuously spray coating with a metal material. In addition, the wiring layer 190 may be formed in a predetermined pattern. In order to form the wiring layer 190 in a predetermined pattern, a photo process may be used. Alternatively, a mask layer (not shown) may be formed on the thermal spray coating layer 130 to form the wiring layer 190 in a predetermined pattern, and the mask layer may be removed after thermal spray coating of a metal material. The mask layer may use a stencil made of metal or ceramic. Meanwhile, pores may occur in the wiring layer 190 formed of the thermal spray coating, and the pores may be removed by forming the same material as the wiring layer 190 or a layer in which other materials are added to the same material. For example, in the case of forming the wiring layer 190 by thermally coating copper, a paste containing copper powder or a powder containing another alloy added to the copper powder is formed on the wiring layer 190 by screen printing or inkjet printing, and then heat-treated to form pores. Can be removed That is, since the metal of the paste component is filled in the pores by the capillary phenomenon, the pores can be removed. In addition, in order to protect the wiring layer 190, an additional solder resist layer may be formed by screen printing, inkjet printing, or dipping.

The filling layer 131 and the wiring layer 190 are formed by forming the epoxy-based filling layer 131 on the thermal spray coating layer 130 by screen printing rather than separately forming the wiring layer material in the PCB industry. Lamination of the electrolytic copper foil used and pressure heat treatment in a vacuum atmosphere are preferred in view of process simplification and manufacturing cost. In another method, the epoxy-based filling layer 131 is formed by a screen printing method, heat-treated, and cured, and then the thickness of the adhesive layer and the seed layer is about 0.05 μm to 0.2 μm by sputtering. After the deposition, the wiring layer 190 may be formed by using a plating or a photographic process. As such, the wiring layer 190 may be plated on the seed layer as a whole, and then may be formed as a wiring layer 190 having a pattern formed through a subsequent photo process. Alternatively, the wiring layer 190 may be plated by using a photo process on the seed layer first. At the same time, the patterned wiring layer 190 may be formed.

As described above, in the metal insulation part according to the exemplary embodiment, the uneven layer 121 formed by the surface treatment is formed on the base material 110, and the uneven layer 121 is formed in the anchor shape, so that the base material ( The interface adhesion between the 110 and the thermal spray coating layer 130 may be improved. Therefore, the base material 110 and the thermal spray coating layer 130 do not fall even by mechanical shock, thermal shock, thermal fatigue, or the like.

2 is a schematic cross-sectional view of an insulated metal component using a spray coating according to a second exemplary embodiment of the present invention. Duplicate explanations will be omitted.

The difference from the first embodiment of FIG. 1 is that the thin interfacial insulating layer 122 is formed before the thermal spray coating layer 130 made of ceramic is formed on the uneven layer 121 formed by the surface treatment. The method of forming the interfacial insulating layer 122 to improve the adhesion, insulation, and thermal conductivity between the base material 110 and the thermal spray coating layer 130 may be anodizing or PEO, sputtering, vacuum deposition, chemical vapor deposition, chemical vapor deposition, and the like. Vapor deposition method, hereinafter referred to as CVD), atmospheric plasma deposition method, sol-gel method, spray method and the like can be used.

Among the methods for forming the interfacial insulating layer 122, the metal base material 110 to which anodizing or PEO can be applied may be applied to aluminum, magnesium, titanium, zirconium, etc., which can be anodized. In anodizing, the oxygen generated from the anode reacts with the surface of the aluminum base material by electrolysis while the aluminum base material is deposited in the electrolyte to form an alumina oxide film. However, the alumina oxide film formed by anodizing is made in a honeycomb shape, and thus many pores are made, and thus, a sealing process for blocking pores is generally performed. Even though the thin anodizing oxide film having a thickness of about 5 μm can be secured by boiling water or a metal salt sealing process, the adhesion and the insulating property on the uneven layer 121 formed by using the surface treatment for the thermal spraying in the present patent. The interface insulating layer 122 having high thermal conductivity may be formed. Anodizing is well known in the art and thus further detailed description is omitted.

Another method for forming a thin oxide film on the surface of aluminum is to use the PEO method. The PEO method connects the base material 110 capable of anodizing in the electrolyte to the positive electrode and applies high voltage alternating current or pulsed direct current so that oxygen is generated by electrolysis, and oxygen reacts with the surface of the base material 110. An interfacial insulating layer 122 is formed on the layer 121. The electrolyte can be used, for example, by adding a hydroxide of an alkali metal such as KOH or NaOH to distilled or deionized water. In addition, water glass (SiO ₂ Na ₂ O) may be additionally added to the electrolyte to form an interfacial insulating layer 122 having excellent adhesion, insulation, and thermal conductivity on the uneven layer 121. The pore, surface roughness, hardness, adhesion, and the like of the interfacial insulating layer 122 can be changed according to the component added to the electrolyte, the concentration of the component, and the like. In addition, the interface insulating layer 122 formed by PEO method using aluminum as a base material may be formed of a ceramic layer in which a main component is alumina and a small amount of silica (SiO ₂ ) is mixed. The interfacial insulating layer 122 formed by the PEO method is formed in a structure in which a transition diffusion layer, a core functional layer, and a porous layer are stacked. The transition diffusion layer is formed on the base material 110 and is chemically strongly bonded to the base material 110. The core functional layer is formed on the transition diffusion layer by the high heat of plasma accompanying the PEO method, and consists of crystalline alumina and amorphous alumina. The porous layer is formed on the core functional layer and is made of amorphous alumina. On the other hand, the interfacial insulating layer 122 formed by PEO method is formed in an anchor shape, because the thermal spray coating is mechanically bonded in order to bond the thermal spray coating layer 130 with the base material 110 in an anchor rather than simple irregularities It is preferable that unevenness | corrugation is formed. Therefore, the thermal spray coating layer 130 and the base material 110 after the formation of the interfacial insulating layer 122 formed on the uneven layer 121 by the PEO method are very strongly bonded. In addition, the thermal spray coating layer 130 has pores and defects of about 5% to 20%, the oxide film 121 formed by PEO method is advantageous in terms of insulation and thermal conductivity because pores of much smaller size are formed. The interfacial insulation layer 122 formed by the PEO method must maintain a thin thickness to maintain the surface roughness of the uneven layer 121 formed by the surface treatment, and the surface roughness of the thermal spray coating layer 130 formed by plasma spraying. Also related to thermal efficiency. Further descriptions of the filling layer 131 and the wiring layer 190 sequentially formed thereon will be omitted.

The metal base material capable of manufacturing the interfacial insulating layer 122 on the uneven layer 121 by applying the anodizing and PEO methods is limited to aluminum or magnesium, titanium, zirconium, etc. capable of anodizing, but the sputtering, vacuum deposition, CVD The atmospheric plasma deposition method, the sol-gel method, and the spraying method are not limited to the type of metal base material 110. Sputtering and vacuum deposition are typical physical thin film deposition methods using vacuum equipment. Sputtering is a method in which a plasma is generated in a vacuum atmosphere to sputter a material of a target to be deposited on a base material, and vacuum deposition is a method of evaporating and depositing a coating material in a high vacuum atmosphere. CVD and atmospheric plasma deposition method is a method of depositing a desired material on the base material by inducing chemical reaction to decompose the source gas, except that the general CVD method uses a vacuum atmosphere and the atmospheric pressure plasma is at atmospheric pressure. The sol-gel method is a method of diluting a material to be deposited into a solvent to make a sol state, coating the film by spin coating or dipping, and then depositing a gel thin film through heat treatment. Spraying is a method of spray coating a liquid substance. The sputtering and vacuum deposition, CVD, atmospheric pressure plasma deposition method, sol-gel method, spraying method, etc. are well known in the semiconductor and coating industry, so further detailed description thereof will be omitted.

The interfacial insulating layer 122 formed on the uneven layer 121 by using the anodizing or PEO method, sputtering, vacuum deposition, CVD, atmospheric pressure plasma, sol-gel method, and spraying method has an oxide or nitride having excellent insulation, adhesion, and thermal conductivity. Thin films of the system are preferred. The thickness of the interface insulating layer is preferably 0.05 µm to 20 µm. A thickness of 0.05 μm or less may be insufficient in insulation, and a thickness of 20 μm or more may take a long process time, eliminate the effect of the uneven layer 121, and may cause cracks or defects in the interface insulating layer 122. Because it is high.

3 is a schematic cross-sectional view of an insulated metal part using a thermal spray coating according to a third exemplary embodiment of the present invention. In the third embodiment, as shown in FIGS. 1 and 2, the surface unevenness of the PEO oxide film 123 manufactured by the PEO method is directly formed on the base material 110 without forming the uneven layer 121 by the surface treatment. It is used instead of the uneven | corrugated layer 121 by surface treatment. The advantage of the PEO oxide film 123 on the base material 110 can prevent the base material 110 from being deformed by the grit blasting and sand blasting, and the appropriate unevenness excellent in adhesion and insulation and thermal conductivity with the base material The formed PEO oxide film 122 is formed. The PEO oxide layer 123 may be applied to aluminum, magnesium, titanium, zirconium, or the like having a thickness of 0.1 mm or more, and a thickness of at least 10 μm to 100 μm is preferable. If the thickness of the PEO oxide film 123 is less than 10㎛ the thermal spraying efficiency is low because the lack of sufficient insulation and irregularities on the surface of the PEO oxide film 123, and if the thickness of more than 100㎛ thick process time and cost is high. Forming the thermal spray coating layer 130, the filling layer 131, and the wiring layer 190 on the PEO oxide film 123 as described above in detail above will be omitted.

4 is a schematic cross-sectional view illustrating a method of manufacturing an insulated metal component using a thermal spray coating according to the first to third embodiments of the present invention, and a description overlapping with the above-described parts will be omitted for convenience.

In the first to third embodiments described above, the method of forming the uneven layer 121 on the base material 110 by surface treatment, the method of forming the interfacial insulating layer 122, and the PEO oxide film 123 The method using the surface roughness was demonstrated. As described above, in the three kinds of embodiments of the present invention, after forming the uneven parts 121, 122, and 123 which are required to increase the thermal spraying efficiency (hereinafter, referred to as 120), the thermal spray coating layer 130 is formed. The bonding force, insulation, and thermal conductivity of the base material 110 and the thermal spray coating layer 130 can be greatly improved.

Referring to FIG. 4A, the uneven part 120 is formed on the base material 110. The base material 110 may be a variety of materials having a variety of shapes depending on the application. The uneven portion 120 may form the uneven layer 121 by the surface treatment, form the interfacial insulating layer 122, or use the PEO oxide layer 123 without the uneven layer 121.

Subsequently, as shown in FIG. 4B, a spray coating layer 130 is formed on the base material 110 on which the uneven parts 120 are formed.

Subsequently, as shown in FIG. 4 (c), the filling layer 131 is formed by screen printing, inkjet printing, dipping, or the like of the epoxy or thermosetting resin and the inorganic filling layer. The filling layer 121 may be subjected to a hardening heat treatment process first, and may preferably be formed simultaneously by laminating the electrolytic copper foil and pressurizing heat treatment in a vacuum atmosphere to simultaneously form the filling layer and the electrolytic copper foil. As another method, as described above, first, the filling layer 121 is formed and a hardening heat treatment is performed, and then an adhesive layer and a seed layer are deposited by sputtering to a thickness of about 0.05 μm to 0.2 μm. The plating layer without a pattern may be formed using electroplating, or may be selectively plated only on a specific region by performing a photo process after a sputtering process. In addition, instead of the filling layer 131, an additional interface insulating layer (not shown) of oxide or nitride is formed by sputtering or vacuum deposition, CVD, atmospheric pressure plasma deposition, sol-gel, or spraying to improve interfacial adhesion and insulation. You may. Alternatively, an additional interface insulating layer (not shown) may be formed before or after the filling layer 131 is formed. It is apparent that the anodizing and PEO methods cannot be applied on the thermal spray coating layer 130. This additional interfacial insulation layer may be applied to the electrolytic copper foil, or may be applied prior to forming the adhesive layer and the seed layer by sputtering.

Subsequently, as shown in FIG. 4 (d), a wiring layer 190 having a circuit pattern is finally formed by using a photolithography process for the wiring layer formed by the electrolytic copper foil or sputtering and electroplating. As another method, the wire layer 190 may be heat-treated after forming the metal layer 190 by screen printing or inkjet printing. In another method, the metal coating layer may be formed by a thermal spraying method, and the wiring layer 190 may be formed by a photolithography process, or the wiring layer 190 may be formed without a photolithography process using a mask when thermally spraying a metal material.

5 is a graph showing thermal conductivity and thermal expansion coefficient of various semiconductor materials used as a thermal spraying raw material.

As shown in FIG. 5, copper, which is frequently used as a lead frame for semiconductors, has the highest thermal conductivity of 398 W / mK, aluminum 237, iron 80, silicon (Si) 116, aluminum nitride (AlN) 200, The beryllium oxide (BeO) is 260, the boron nitride (BN) is 180 and the alumina (Al ₂ O ₃ ) has a thermal conductivity of about 25. Although not shown in FIG. 5, the thermal conductivity of aluminum oxide (MgO) has a thermal conductivity of about 60 W / mK. Alumina, for example, has better insulation (dielectric strength 9.0), lower density (3.6 g / cc), and higher thermal conductivity (25 W / mK) than other ceramic materials. Compared with ordinary pure metal materials, aluminum nitride, beryllium oxide, boron nitride, alumina, aluminum oxide, etc. have a wide range of thermal conductivity depending on the manufacturing method, purity, heat treatment, and the like. In case of conventional general PCB, FR-4 insulation layer has thermal conductivity around 0.25W / mK, and in case of insulation layer containing ceramic filler in epoxy resin used in existing metal PCB, it is usually 2W / mK and 3 It has a dielectric constant of about -5. Therefore, since the thermal spray insulation layer 130 used in the present patent uses a ceramic having a higher dielectric constant than the epoxy insulation layer, the thermal spray resistance may be thinner than that of the conventional metal PCB in order to secure the same insulation property. Can be lowered. In addition, it can be seen that the thermal conductivity of aluminum nitride, beryllium oxide, boron nitride, and silicon nitride having excellent insulating properties is several ten to several hundred times higher than that of an insulating layer of a conventional metal PCB. Of course, if the ceramic insulation layer is manufactured by thermal spray coating, the thermal conductivity is relatively lower than that of the ceramic sintered body with little pores manufactured by the conventional sintering method, but it is still several times smaller than the insulation layer used in the conventional PCB or metal PCB. It has ten times higher thermal conductivity.

In addition, the coefficient of thermal expansion of aluminum 25.5 ppm / deg, copper 16.5, iron 12.3, nickel has a value of 13.3, and materials such as aluminum nitride, alumina, silicon has a coefficient of thermal expansion of about 4-8.

Therefore, both of these semiconductor and ceramic materials can be used as a thermal spraying material, and particularly in an environment receiving high thermal fatigue, it is preferable to use a material having a small difference in thermal expansion coefficient between the base material and the thermal spray coating layer. On the other hand, when forming a base metal with a thermal spray coating, an aluminum composite in which a particle-reinforced composite material such as SiC or carbon nanotubes (CNT) is added to aluminum instead of a material having a larger thermal expansion coefficient such as aluminum or copper than ceramics Materials can be used. Base metals using aluminum composite materials have higher strength and stiffness, and better wear and heat resistance than aluminum alloys. In addition, it has a high thermal conductivity and a coefficient of thermal expansion almost similar to that of ceramics. The heat dissipation material of the electronic device should have characteristics of low thermal expansion coefficient, high thermal conductivity, low density and low production cost. The aluminum composite material can be designed as desired according to the type and fraction of reinforcing particles. It is highly applicable to heat dissipation material of electronic equipment. In addition, since SiC has excellent physical and mechanical properties despite low raw material prices, it is widely used as a reinforcing material for composite materials, and a method of manufacturing a composite material of aluminum and SiC having a network structure using a pressurized or pressureless agglomeration method. Has been developed and commercialized. In general, a composite material of aluminum and SiC has a relatively high thermal conductivity of about 120 to 180 W / mK depending on the manufacturing method and the fraction of SiC. In addition, recently developed CNT-added aluminum has been added to reduce the weight and strength of aluminum composites by adding CNTs that have been surface-treated so that they can be melted well with aluminum when melting aluminum. Here, the thermal conductivity of the composite material is changed by various factors such as the fraction and distribution of SiC particles and CNTs, the interface state between the matrix and the reinforcing material, and the thermal conductivity of the constituent elements. Therefore, when manufacturing a metal PCB using a composite material of aluminum and SiC or CNT as the base material 110, it is possible to make a product having excellent reliability by minimizing the difference in thermal expansion coefficient with the thermal spray coating layer (130). Thus, as the thermal spray coating material, alumina, aluminum nitride, beryllium oxide, boron nitride, aluminum oxide, silicon nitride, and mixtures thereof may be used.

6 is a schematic view of a light emitting module having a heat sink as an insulated metal part using a thermal spray coating according to the present invention.

6 (a) and 6 (b), the light emitting module according to the present invention includes a substrate 510 having a heat dissipation fin 505 and a heat sink integrated therein, and an insulating layer formed on the substrate 510. 520, a wiring layer 530 formed in a predetermined region on the insulating layer 520, a light emitting element 540 mounted on the wiring layer 530, and a portion of the insulating layer 520 and the wiring layer 530. The solder resist layer 550 is included.

The substrate 510 is made of, for example, an aluminum alloy, and a heat dissipation fin 505 is formed on one surface thereof. An insulating layer 520 is formed on the other surface of the substrate 510, and the insulating layer 520 includes the uneven portion 120, the thermal spray coating layer 130, and the filling layer 131. The wiring layer 530 is formed on the insulating layer 520. Overlapping descriptions in this regard are omitted.

The solder resist layer 550 may also be formed by thermal spray coating. Alternatively, the solder resist layer 550 may be formed by screen printing, inkjet printing, or dipping and subsequently by a photo process.

The light emitting device 540, for example, a light emitting device package having a lead frame, is surface mounted on the wiring layer 530. By applying the component using the thermal spray coating according to the present invention as described above it can be produced a light emitting module or a light emitting module for excellent thermal conductivity. There is a limitation in manufacturing a backlight unit for a large liquid crystal display device using a conventional metal PCB, but if the component using the thermal spray coating according to the present invention is applied, there is no limitation in size or material and a light emitting module having a minimum thermal resistance can be manufactured. have.

7 is a schematic cross-sectional view of an electrostatic chuck as an insulated metal part using a sprayed coating according to the present invention. The electrostatic chuck serves to fix the silicon wafer and the glass panel by forming an electrode 630 for generating electrostatic force in semiconductor equipment.

Referring to FIG. 7, the electrostatic chuck according to the present invention includes a body 610 having a step, a first insulating layer 620 formed on the body 610, and a predetermined region formed on the first insulating layer 620. The electrode 630 includes a first insulating layer 620 and a second insulating layer 640 formed on the electrode 630. The body 610 may be made of a metal material, for example, aluminum or an aluminum alloy, and the center portion 610 may be made to have a higher step than other areas. The first insulating layer 620 is formed on the central portion of the body 610, the first insulating layer 620 is composed of the uneven portion 120, the thermal spray coating layer 130, the filling layer 131 as described above. The detailed description is omitted. On the other hand, a method for manufacturing an electrostatic chuck using a thermal spray coating has been proposed by a known technique, but in the present invention, the uneven portion 120 having a strong bonding force and insulation and high thermal conductivity and a thermal spray coating layer ( Forming the filling layer 131 on the 130 is different from the conventional.

The electrode 630 may be formed in a predetermined region on the first insulating layer 610, and may be formed by spray coating a conductive material. Therefore, after forming a mask layer in a region other than the region where the electrode 630 is to be formed, the conductive material may be thermally coated and the mask layer may be removed to form the electrode 630. In addition, the electrode 630 may be formed by applying and heat-treating the electrode material by screen printing or inkjet printing. Alternatively, the electrode 630 may be formed by sputtering or vacuum deposition.

The second insulating layer 640 may be formed on the first insulating layer 620 and the electrode 630, and may be formed by spray coating. The second insulating layer 640 may also apply a spray coating method in the same manner as the first insulating layer 620. If a step is formed by the electrode 630 after the second insulating layer 640 is formed, it is preferable to remove the step by a lapping or polishing method in a subsequent process.

8 is a schematic cross-sectional view of a thermoelectric element module substrate as an insulated metal part using a thermal spray coating according to the present invention.

Referring to FIG. 8, the thermoelectric element module substrate according to the present invention may be applied to the upper substrate 760 and the lower substrate 710. First, the lower substrate for the thermoelectric element module includes a heat dissipation fin 705 and a lower substrate 710 in which a heat sink is integrated, and an insulating layer 720 and an insulating layer 720 formed on the lower substrate 710. The lower electrode layer 730 is formed. In addition, the upper substrate 760 may be made of ceramic or metal, and may be made of metal, and overlapping description thereof will be omitted. Herein, the insulating layer 720 on the upper substrate 760 and the lower substrate 710 for the thermoelectric element module includes the uneven portion 120, the thermal spray coating layer 130, and the filling layer 131. Is omitted. Since the upper electrode layer 770 and the lower electrode layer 730 may be formed by the same method as the above-described wiring layer 190, a detailed description thereof will be omitted. Then, a thermoelectric element module is manufactured by soldering or brazing the upper electrode layer 770 and the lower electrode layer 730 so as to be connected to the P-type thermoelectric semiconductor layer 740 and the N-type thermoelectric semiconductor layer 750. Detailed description thereof is omitted since it is well known in the art.

The conventional alumina ceramic substrate for a thermoelectric element module has a problem of having a very high price, a complicated manufacturing process, a high manufacturing cost according to a unit process impossible for mass production, and low thermal conductivity. Therefore, when the thermal spray coating according to the present invention is applied to the upper and lower substrate materials for the thermoelectric element module, it is possible to easily mass-produce a metal insulation substrate having excellent thermal conductivity, insulation property, adhesiveness, and the like. Can be reduced.

9 is a photograph of the surface shape of the aluminum base material grit blasting. It is the photograph which magnified the surface shape which processed the aluminum 5052 plate of thickness 2mm by grit blasting by the optical microscope 60 times, and the average surface roughness is 2.5. Grit blasting, unlike ordinary sand blasting, injects silicon carbide (SiC) or alumina (Al ₂ O ₃ ) into the substrate at a high speed with a very irregular blasting material. Therefore, the uneven | corrugated layer of about 1-10 size is formed in the surface of a base material. In general, surface treatment using grit blasting depends on the type of the base material, but the base metal is stressed in the thin plate having a thickness of 2 or less, and deformation occurs. However, it is possible to minimize the deformation of the base metal by automatically controlling the injection speed of the grit and the base material movement speed, rather than the grit blasting by hand.

10 (a) and 10 (b) are surface and cross-sectional photographs in which a PEO oxide film is formed on an aluminum base material. Fig. 10 (a) is a surface shape photograph of an uneven layer observed at 100 times magnification with an optical microscope, and Fig. 10 (b) is a cross-sectional photograph of an aluminum base material having a porous uneven layer formed at 400 times magnification with an electron microscope. to be. At this time, the thickness of the aluminum thin plate was 0.2mm.

As shown in FIGS. 10 (a) and 10 (b), when the PEO oxide film is formed on the aluminum sheet, a dense inner layer and an uneven layer of porous alumina having very many pores on the surface are formed on the aluminum sheet. In particular, since the thermal spray coating is mechanically bonded, the anchored concave-convex structure is more preferable than the simple concave-convex structure in order to strongly bond the sprayed coating layer with the base material, and the cross-section of the concave-convex layer formed by PEO coating is formed in the form of an anchor. In addition, when the aluminum thin plate having a thickness of 0.2 is formed by the PEO coating, the aluminum layer has a thickness of 95, and the upper and lower uneven layers are formed at about 75 um, respectively. When the PEO coating is applied to the aluminum thin plate, the uneven layer is formed by reacting with the aluminum, but the thickness of the aluminum layer is smaller than the original thickness, but the uneven layer is formed to a predetermined thickness. Therefore, the overall thickness after the uneven layer is formed is about 45 thicker than before the uneven layer is formed. Although it is not possible to grit blast the 0.2 thickness aluminum sheet without deforming the base material, PEO coating can form an anchor-shaped uneven portion which is very suitable for spray coating on the surface of the base material without deforming the base material. Can be.

Table 1 shows the change in thermal conductivity of the thermal spray coating layer of alumina depending on the base material temperature. Thermal spraying conditions are as follows. Plasma spraying equipment used Sulzer-Metco's 9MB model, aluminum base was Al 1050 (610 * 550 * 1.5mm) and grit blasting was carried out using gold steel of # 80. Gun speed Was 425 mm / sec, gun-base material distance was 80 mm, Ar gas flow rate 33 L / min, hydrogen gas flow rate 4.5 L / min, alumina spray powder was spray-coated to a thickness of about 40um using Sulzer-Metco 105NS.

Temperature of substrate Room temperature 100 ℃ 200 ℃ 300 ℃ 400 ℃ 500 ℃ Thermal conductivity 4.0 4.08 6.40 8.15 10.27 9.73

When forming an alumina spray coating layer using plasma spraying, a base material is locally heated by the plasma sprayed from a spraying gun. However, if the temperature of the base material is raised rather than the thermal spray coating at room temperature, the thermal conductivity of the thermal spray coating layer of the alumina shows a tendency to increase the thermal conductivity from 100 ℃ to 400 ℃. The thermal conductivity of the alumina thermal spray coating layer shows a very low value compared to having a thermal conductivity of approximately 20 to 35 W / mK in the case of pure alumina, but it is confirmed that the thermal conductivity is significantly improved by raising the temperature of the base material during the thermal spray coating. Could. When the base material temperature is raised, deformation of the base material occurs. By properly adjusting variables such as heating rate and cooling rate of the base material and stress of the initial base material, the deformation of the base material can be minimized.

Table 2 shows the variation of dielectric breakdown voltage with the thickness of plasma sprayed layer and epoxy filling. Plasma spraying conditions were as shown in Table 1, the temperature of the base material was not heated separately. The thickness of the thermal spray coating layer was converted using a micrometer and weight change.

Sprayed layer thickness (㎛) 8 14 21 49 64 83 Breakdown voltage A (kV) - 0.34 0.46 0.78 1.35 1.78 Breakdown voltage B (kV) 0.38 0.67 1.01 2.83 > 5.0 > 5.0 Breakdown voltage C (kV) 1.45 2.55 3.24 > 5.0 > 5.0 > 5.0

The breakdown voltage was measured and averaged 10 times with DU-1336 tester of Delta United Instrument according to KS standard D8514. Insulation breakdown voltage A is the insulation breakdown voltage of the thermal spray coating layer was not insulated in the case of 8㎛, the breakdown voltage A increased with increasing thickness. The dielectric breakdown voltage B is the dielectric breakdown voltage after screen printing using 30% of alumina filler mixed with epoxy, followed by curing heat treatment at 200 ° C. for 100 minutes. The dielectric breakdown voltage C measures the dielectric breakdown voltage after vacuum pressurizing heat treatment by laminating the electrolytic copper foil after screen printing the epoxy. Vacuum pressurization heat treatment was performed using a Burmek LAMV 150 equipment in Germany, the vacuum was 20torr or less, the pressure was 50kgf / cm2, and cooled after 100 minutes heat treatment at a 200 ° setting temperature. When the epoxy filling layer 131 was formed using vacuum pressurization heat treatment, it was confirmed that the insulation breakdown voltage of the thermal sprayed coating layer 130 was increased by about 6 to 8 times, and the measurement of 5 kV or more was impossible due to the characteristics of the insulation breakdown voltage tester. . At this time, the thickness of the epoxy filling layer was about 10 μm. Therefore, it was possible to confirm the effect of increasing the dielectric breakdown voltage according to the curing heat treatment or vacuum pressurization heat treatment after screen printing the epoxy filling layer 131 described in Examples 1 to 3 of the present invention. It is preferable that the thermal spray coating layer for use as a metal insulation component has a thickness within 8 micrometers-200 micrometers. If the thickness is within 8 μm, it is difficult to secure sufficient breakdown voltage even when the filling layer is used. A thickness of 200 μm or more is not preferable due to an increase in process time, coating cost, and increase in thermal resistance.

PEO oxide thickness (um) 3 5 10 Breakdown voltage D (kV) - 0.11 0.32 Breakdown voltage E (kV) 0.37 0.42 0.46 Breakdown voltage F (kV) 0.95 1.11 1.24

Table 3 shows the change of dielectric breakdown voltage according to the interfacial insulation layer and the thermal spray coating layer. Using Grit blasting aluminum base material of Table 1, PEO conditions were 15g / L for KOH, 24g / L for water glass, 400V for AC and 5A / dm2 for current density. A PEO oxide film was formed at 122. The dielectric breakdown voltage D of the interface insulating layer 122 under these conditions was measured. The alumina thermal spray coating layer 130 having a thickness of 8 μm in Table 2 was continuously formed on the interface insulating layer 122, and each dielectric breakdown voltage E was measured. Finally, the epoxy was screen printed and the heat treatment was performed at 200 ° C. for 100 minutes to measure the dielectric breakdown voltages F. In the case of the spray coating layer having a thickness of 8 μm in Table 2, the thickness of the interface insulating layer 122 was increased to 3 μm, 5 μm, and 10 μm, respectively, as compared with the case where the dielectric breakdown voltage was not measured. The dielectric breakdown voltage E increased to kV, and the dielectric breakdown voltage F increased to 0.95, 1.11, and 1.24 kV, respectively, according to the epoxy curing heat treatment. Therefore, by forming the interfacial insulating layer 122 shown in Example 2 of the present invention on the base material grit blasted using PEO, it is possible to confirm the effect of increasing the dielectric breakdown voltage after curing heat treatment of the thermal spray coating layer and the screen-printed epoxy. there was.

11 is a cross-sectional photograph of an interface insulating layer, a thermal spray coating layer, and an epoxy layer. The cross-sectional photograph was observed magnified 1200 times with a digital microscope. It can be seen that the thickness of the interfacial insulation layer of Table 3, the thickness of the thermal spray coating layer of 8㎛, the thickness of 10㎛ the thickness of the epoxy heat-treated after screen printing is formed. In particular, it can be seen that the interfacial insulating layer 122, the thermal spray coating layer 130, and the epoxy filling layer 131 are densely and continuously formed on the uneven layer 121 formed by grit blasting on the aluminum base material.

12 is a heat resistance measurement result of the LED module using a metal substrate prepared by the plasma-spray coating according to the present invention. In the metal substrate of the present invention, the thermal spray coating layer 130 has a thickness of about 40 μm, the epoxy filling layer 131 has a thickness of about 20 μm, and the thickness of the electrolytic copper foil is about 35 μm to form a disc using vacuum pressure heat treatment. After that, a single-sided metal printed circuit board was manufactured using a PCB process. The LED package was mounted on the metal printed circuit board of the present invention using P7 (10W) of Seoul Semiconductor, and then the thermal resistance of the LED module was measured. The thermal resistance measuring equipment used T3ster equipment of Micred Inc., the thermal resistance of the metal substrate according to the present invention can be seen that the thermal resistance is significantly reduced compared to the existing metal PCB products. In order to further reduce the thermal resistance, the thickness of the epoxy filling 131 may be reduced, or the surface may be polished after the epoxy filling and curing heat treatment, and the metal substrate may be manufactured by the sputtering and plating method as described above. Alternatively, by forming the interfacial insulating layer 122 and minimizing the thicknesses of the thermal spray coating layer 130 and the filling layer 131, the target insulation and thermal conductivity may be optimized.

13 is a cross-sectional photograph of a metal printed circuit board of the present invention. A solder resist layer (white) for protecting the uneven layer 121 and the thermal spray coating layer 130, the epoxy filling layer 131, the copper wiring layer 190, and the finally exposed copper wiring layer on the surface of the aluminum base material by grit blasting. Shows well).

Parts using the spray coating according to the present invention can be applied to various parts in addition to the above embodiment. For example, as a metal insulation component using the thermal spray coating according to the present invention, a roller for a printing machine, a steelmaking or steelmaking roller, or the like can be produced. That is, after forming the above-mentioned concave-convex portion 120 on the roller-shaped base material of the columnar shape, the thermal spray coating may be performed to form the thermal spray coating layer 130 and the filling layer 131. Depending on the application, the filling layer 131 may be excluded. The thermal spray coating layer 130 may be used for rollers having smooth surfaces, as well as rollers having threads or bends, aircraft jet fans, ship screws, and the like. Therefore, by using the technical spirit proposed in the present invention, it is possible to improve the adhesion between the base material 110 and the thermal spray coating layer 130, insulation, and thermal conductivity, thereby obtaining high heat resistance fatigue characteristics and wear resistance characteristics.

1 is a schematic cross-sectional view of an insulated metal component using a thermal spray coating according to a first embodiment of the present invention.

2 is a schematic cross-sectional view of an insulated metal component using a thermal spray coating according to a second embodiment of the present invention.

3 is a schematic cross-sectional view of an insulated metal component using a thermal spray coating according to a third embodiment of the present invention.

4 is a schematic cross-sectional view for explaining a method of manufacturing an insulated metal component using a thermal spray coating according to the first to third embodiments of the present invention.

5 is a graph showing thermal conductivity and thermal expansion coefficient of various semiconductor materials used as a thermal spraying raw material.

6 is a schematic view of a light emitting module having a heat sink as an insulated metal part using a thermal spray coating according to the present invention.

7 is a schematic cross-sectional view of an electrostatic chuck as an insulated metal part using a sprayed coating according to the present invention.

8 is a schematic cross-sectional view of a thermoelectric element module substrate as an insulated metal part using a thermal spray coating according to the present invention.

9 is a photograph of the surface of the aluminum base material grit blasting.

10 (a) and 10 (b) are surface and cross-sectional photographs of a PEO oxide film formed on an aluminum base material.

11 is a cross-sectional photograph of an interface insulating layer, a thermal spray coating layer, and an epoxy layer.

12 is a heat resistance measurement results of the LED module using a metal substrate prepared by the plasma spray coating according to the present invention.

13 is a cross-sectional photograph of a metal printed circuit board of the present invention.

 <Description of the symbols for the main parts of the drawings>

110: base material 120: uneven portion

130: thermal spray coating layer 131: filling layer

190: wiring layer

Claims (15)

As metal insulation parts for LEDs and semiconductors, Base material; Uneven parts formed on the base material; A thermal spray coating layer formed by thermal spray coating on the uneven portion; A filling layer formed on the spray coating layer; And Insulating metal parts comprising a wiring layer formed on the filling layer. The method of claim 1, The base metal is at least one of aluminum, magnesium, titanium, copper, iron, nickel or alloys thereof. The insulated metal part of claim 2, wherein the base material comprises a heat sink having heat dissipation fins. The insulated metal part according to claim 1, wherein the uneven portion includes at least one of an uneven layer and a PEO oxide film formed by surface treatment. The insulated metal part of claim 4, wherein the surface treatment comprises grit blasting, sand blasting, lapping, and chemical etching. The insulated metal part according to claim 4, wherein the uneven portion further includes an interface insulating layer formed on at least one of the uneven layer and the PEO oxide film. The insulated metal part of claim 1, wherein the thermal spray coating layer comprises at least one of alumina, aluminum nitride, beryllium oxide, boron nitride, and silicon nitride. As a manufacturing method of metal insulation parts for LEDs and semiconductors, Forming an uneven part on the base material; Forming a thermal spray coating layer by thermal spray coating on the uneven portion; Forming a filling layer on the thermal spray coating layer; And Forming a wiring layer on the filling layer. The method of claim 8, wherein the uneven portion comprises at least one of an uneven layer formed by surface treatment and a PEO oxide film formed by PEO oxidation. The method of claim 9, further comprising forming an interfacial insulating layer on at least one of the uneven layer and the PEO oxide layer. The method of claim 10, wherein the interfacial insulating layer is formed using at least one of anodizing, PEO, sputtering, vacuum deposition, CVD, atmospheric plasma deposition, sol-gel, and spraying. The method of claim 8, wherein the filling layer is formed of an epoxy, a thermosetting resin, or an inorganic material by screen printing, inkjet printing, or dipping. The method of claim 8, wherein the wiring layer is formed using an electrolytic copper foil, sputtering and plating, screen printing, or inkjet printing. The method for manufacturing an insulated metal part according to claim 12 or 13, wherein the wiring layer is formed by performing a vacuum pressure heat treatment on the filling layer and the wiring layer simultaneously. The method of claim 12, wherein the wiring layer is cured and heat-treated after the filling layer is formed, and the adhesive layer and the seed layer are formed, and then formed by a photographic process after a sputtering or plating process.

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