KR101166234B1 - Frit composition for oled display panel sealing and paste composotion comprising said frit composition - Google Patents

Abstract

The present invention relates to a frit composition for sealing an OLED display panel and a paste composition including the frit composition, and more specifically, does not substantially include a lead (Pb) component and a bismuth (Bi) component, and V ₂ O ₅ 40 To 60 mol% (mol%), ZnO 10 to 30 mol% (mol%), P ₂ O ₅ 20 to 40 mol% (mol%), A (TiO ₂ ) 0.01 to 10 mol% and B (R ₂ O : At least one selected from the group consisting of Li ₂ O, Na ₂ O, and K ₂ O) 0.01 to 15 mol%, wherein the A + B component is contained in a range of 0.5 mol% to 15 mol% from 70 to 100 mother glass The present invention relates to a frit composition for encapsulating an OLED display panel composed of wt% (wt.%) And the remaining low-expansion ceramic filler, and a paste composition including the frit composition, wherein the frit composition for encapsulating an OLED display panel of the present invention is a problem of environmental pollution. Softening point and low glass transition temperature to ensure low temperature sealing It has excellent fluidity, and there is no problem of crystal precipitation even at low temperature firing, so it is possible to manufacture OLED display panel with excellent reliability and durability after sealing, and it also improves productivity by reducing temperature conditions and time of sealing process.

OLED, frit, paste, alkali metal oxide

Description

FRIT COMPOSITION FOR OLED DISPLAY PANEL SEALING AND PASTE COMPOSOTION COMPRISING SAID FRIT COMPOSITION

The present invention relates to a frit composition for sealing an OLED display panel and a paste composition including the frit composition, and more specifically, does not substantially contain a lead (Pb) component and a bismuth (Bi) component, and V ₂ O ₅ 40 to 60 mol% (mol%), ZnO 10 to 30 mol% (mol%), P ₂ O ₅ 20 to 40 mol% (mol%), A (TiO ₂ ) 0.01 to 10 mol% and B (R ₂ O: Li ₂ O, Na ₂ O and K ₂ O at least one selected from the group consisting of 0.01 to 15 mol%, wherein the A + B component 70 to 70 mol% including in the range of 15 mol% A frit composition for sealing an OLED display panel composed of 100% by weight (wt.%) And the remaining low-expansion ceramic filler and a paste composition comprising the frit composition.

Currently, commercially available flat panel display panels include LCD, PDP and OLED, each with independent driving principles and mutually competitive industrial structures. In particular, according to the regulation of hazardous substances in developed countries including Europe, it is not possible to use materials containing lead and chromium, and to reduce production costs in order to survive in the competitive structure between technology and companies. In response to the demand for price improvement and raw material cost reduction, the development of eco-friendly and cost-saving materials is a common core task for all display technologies. In particular, in the case of the sealing material, the upper and lower plates are bonded to the flat panel display while protecting internal elements and materials, and thus, the sealing material is a key material for the flat panel display technology. In the case of PDP, the main ingredient is lead mainly, and frits that can be fired at 450 ~ 480 ℃ are mainly used. However, according to the Restriction of Hazardous Materials (ROHS) regulations, the regulatory movement of sealing materials containing lead, which causes environmental pollution, is taking place. Accordingly, the development of lead-free frits containing no lead has been actively conducted. In particular, in the case of AM-OLED technology, which is preparing to mass-produce large screen displays among OLEDs, the polymer-based encapsulant used in the past has a high permeability and gas permeability, which significantly shortens the life span of the panel and can replace it. There is an urgent need for the development of sealing materials that can realize the process, and lead-free sealing materials are actively being developed.

Lead-free frits that have been developed so far include bismuth-based, vanadium-based, and phosphate-based. Japanese Unexamined Patent Publication No. 6-24797 discloses a sealing glass composition composed of 82.5-87.5 wt% Bi2O3, 10-18 wt% B2O3, 0.2-1 wt% SiO2, and 0.2-1.5 wt% CeO2. . In addition, Japanese Laid-Open Patent Publication No. 2001-180972 discloses a molar percentage of 55-62% P2O5, 20-39% ZnO, 3-15% Al2O3, 2-20% Li2O + Na2O + K2O and MgO + CaO + SrO + BaO. Lead-free frit base glass compositions having a composition ratio of 0-20% are disclosed. However, the bismuth-based frit composition has the characteristics similar to the existing frit containing lead, but the unit cost of the bismuth raw material is very high compared to the softening agent, bismuth also has a disadvantage in that it is a substance having restrictions in use as a harmful substance to the human body. In addition, Korean Patent Publication No. 2005-38472 discloses 5-40 wt% of barium oxide (BaO), 5-40 wt% of zinc oxide (ZnO), 10-40 wt% of boron oxide (B2O3), and vanadium pentoxide (V2O5) 5 Frit glass with glass composition ratio of -45 wt%, arsenic oxide (As2O3) 5-45 wt%, antimony oxide (Sb2O3) 5-45 wt%, silicon oxide (SiO2) or alkali-free waste glass 5-32 wt% Is disclosed. However, most of the vanadium- and phosphate-free frit compositions presented to date generally require higher process temperatures due to higher softening point and glass transition temperature than softener frit, and do not match the performance of existing softeners in terms of fluidity and durability. I can't. In addition, even if the composition has a low transition softening (Korean Patent Publication No. 10-2006-00032950) it is difficult to apply to the process in terms of temperature control because crystallization occurs easily at low temperatures.

Particularly, in order to prevent cracking when bonding with display panel glass, it is necessary to develop a frit whose thermal expansion coefficient is similar to that of the substrate glass.In the case of existing lead-free frit materials, a frit having a thermal expansion coefficient similar to that of the substrate glass is required. In the case of the thermal expansion coefficient is suitable when the sealing temperature is high or low temperature sealing is possible in the case of applying the existing softening agent sealing process, such as the problem of crystallization of the properties required for low temperature sealing of the display panel.

Accordingly, the technical problem to be achieved by the present invention is that it does not contain Pb and Bi, so there is no concern about environmental pollution, and it is economical and low in softening point and glass transition temperature so as to enable low temperature sealing. It is possible to manufacture OLED display panel with excellent reliability and durability after sealing because there is no problem of crystal precipitation, etc. Also, it is possible to form sealing layer by low-temperature firing, and to reduce the temperature condition and time of sealing process for sealing the upper and lower glass. It is to provide a frit composition for encapsulating an OLED display panel that can improve productivity and reduce manufacturing costs.

In order to achieve the above technical problem, the present invention does not substantially include a lead (Pb) component and a bismuth (Bi) component, and V ₂ O ₅ 40 to 60 mol% (mol%), ZnO 10 to 30 mol% (mol %), P ₂ O ₅ 20-40 mol% (mol%), A (TiO ₂ ) 0.01-10 mol% and B (R ₂ O: Li ₂ O, Na ₂ O and K ₂ O At least one) OLED display comprising 0.01 to 15 mol%, A + B component of 70-100% by weight (wt.%) Of the mother glass including 0.5 mol to 15 mol% and the remaining low-expansion ceramic filler It provides a frit composition for panel sealing.

In addition, the present invention is the low-expansion ceramic filler cordierite (cordierite), amorphous silica (silica), eucryptite (eucryptite), alumina titanate (aluminum titanate), zircon (sirum), spodumene, Provided is a frit composition for sealing an OLED display panel, characterized in that at least one selected from the group consisting of mite (willemite) and mullite (mulite).

In addition, the present invention is an OLED display panel rod, characterized in that the softening point (Ts) of the mother glass is 450 ℃ or less and the average thermal expansion coefficient in the range from room temperature to 300 ℃ after firing in the range of 30 to 100 × 10 ^-7 / ℃ A wear frit composition is provided.

In addition, the present invention provides an OLED display panel sealing paste composition consisting of 70 to 90% by weight (wt.%) Of the OLED display panel sealing frit composition and the remaining organic vehicle.

In addition, the present invention is an organic binder and the remaining butyl carbitol acetate, wherein the organic vehicle is added in the range of 1 to 29% by weight based on the total weight of the paste composition as nitro cellulose (NC) or acrylate-based polymer (AC), Provided is an OLED display panel sealing paste composition comprising one or more organic solvents selected from the group consisting of butyl carbitol and terpineol.

According to the present invention, since it does not contain lead (Pb) and bismuth (Bi) components, there is no problem of environmental pollution, low fluidization point and low glass transition point to enable low temperature sealing, and excellent in fluidity, crystal precipitation, etc. even at low temperature baking The present invention provides a lead-free frit composition for sealing an OLED display panel having excellent reliability and durability after sealing.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The frit composition of the present invention is substantially free of lead (Pb) components and bismuth (Bi) components, and is an economical frit composition having low environmental pollution and human hazards by using V2O5, ZnO and P2O5 ternary glass compositions as main components. Can provide The composition presented by the present invention has low glass transition temperature and softening point, which enables low-temperature firing, exhibits excellent fluidity, and resistance to crystal precipitation in high-temperature firing, thereby overcoming the limitations of the conventional lead-free frit composition and thereby improving OLED display. Productivity of the panel manufacturing process can be improved, manufacturing costs can be reduced, and durability and reliability of the produced display panel can be greatly improved.

The frit composition for sealing an OLED panel of the present invention is substantially free of lead (Pb) component and bismuth (Bi) component, V ₂ O ₅ 40 to 60 mol% (mol%), ZnO 10 to 30 mol% (mol% ), P ₂ O ₅ 20 to 40 mol% (mol%), A (TiO ₂ ) 0.01 to 10 mol% and B (R ₂ O: Li ₂ O, Na ₂ O and K ₂ O selected from the group consisting of 1 Species) from 0.01 to 15 mol%, wherein the A + B component consists of 70 to 100 weight percent (wt.%) Of the parent glass, including 0.5 mol to 15 mol%, and the remaining low expansion ceramic filler. In the present specification, the mole% indication is based on the entire mother glass unless otherwise specified.

As described above, the vanadium-based lead-free frit disclosed in the conventional literature could not solve the problem of crystallization during low temperature sealing, but according to the researches and tests of the present inventors, crystal precipitation during panel sealing even though low temperature sealing is performed through the addition of an appropriate oxide. It is possible to obtain a mother glass composition that does not cause a problem, such as to satisfy the glass transition temperature, softening point and glass stability.

The present inventors have found that some of the compositions are due to the formation of intermediate compounds for two or three minutes depending on the composition of V ₂ O ₅ -ZnO-P ₂ O ₅ in V ₂ O ₅ , ZnO and P ₂ O ₅ ternary composition mother glass. Crystallization occurs, and it is believed that it affects the crystallization generated during heat treatment in stably shaped mother glass, and the stability, reactivity, viscosity characteristics, and crystallization tendency of glass structure depend on the composition ratio of the composition. Doing. That is, it is thought that thermal characteristics and dynamic viscosity characteristics depend on the role and mutual ratio in the mother glass structure of the composition to add. In particular, the limitation of the thermal stability of the ternary composition can be overcome by introducing a change in the mother glass structure.

V ₂ O ₅ is a glass forming oxide and makes the glass low melting. If the V ₂ O ₅ is less than 20 mol% based on the composition of the entire mother glass, the viscosity of the glass increases and the firing temperature is increased, whereas if it exceeds 60 mol%, the vitrification is vitrified, but the devitrification becomes stronger and foaming is more likely to occur during firing. It is preferable that it is% or less. When V ₂ O ₅ is 20 mol% or more based on the composition of the entire mother glass, the flow of mother glass and frit is improved.

P ₂ O ₅ is a glass-forming oxide, and if it is less than 20 mol% based on the composition of the entire mother glass, the stability of the glass is insufficient, a low melting point effect is not obtained, and if it exceeds 40 mol%, there may be a problem in moisture resistance. have. P ₂ O ₅ is a glass forming oxide and high thermal stability is obtained when added in the range of 20 to 40 mole%, based on the composition of the entire parent glass. In the mother glass composition, V ₂ O ₅ and P ₂ O ₅ generally form a layered structure, exhibit a similar structure in glass, form a basic skeleton of the mother glass structure, and provide excellent fluidity due to the weak bonding force between the layers. In the case of the above two compositions, if the content in the glass is less than or equal to a certain amount, the glass does not match with the glass structure, causing crystallization easily during the process, or excessively strengthening the internal structure, thereby increasing the softening point and failing to secure sufficient viscosity at the firing temperature. This will not happen. As a result of the test of the present inventors, when the content of V ₂ O ₅ suitable for low temperature firing and flow is 40 to 60 mol% based on the ternary base glass composition, and the content of P ₂ O ₅ is in the range of 20 to 40 mol%, 430 ° C It can be seen that a proper flow is shown in the firing.

In addition, ZnO in the mother glass changes the V ₂ O ₅ and P ₂ O ₅ glass skeleton structure in the glass and complements the layered structure to increase glass stability, thereby improving glass structure such as thermal stability and water resistance of the mother glass. Proper addition is essential for this. According to our tests, the preferred content of ZnO is in the range of 10 to 30 mole percent, based on the total parent glass. If the content of ZnO is less than 10 mol%, the content of V ₂ O ₅ and P ₂ O ₅ is too high to obtain the viscosity required for flow, whereas if it exceeds 30 mol%, glass formation is difficult or excessive. Curing prevents flow from occurring at the same time as the glass transition temperature and softening point are raised.

However, in the case of the three-component composition has been found to cause cracking of the glass due to the strong reaction with the test panel glass or crystallization proceeds at high temperature firing, it is necessary to add an additional composition to compensate for this. Therefore, the mother glass further includes A: TiO _{2 up} to 0.01 to 10 mol% based on the composition of the entire mother glass in addition to the main component. The TiO ₂ stabilizes the unstable bonds caused by the basic unit structures of V ₂ O ₅ and P ₂ O ₅ due to the Ti element having a large number of electrons in the glass structure, thereby increasing the chemical durability of the mother glass. As a result, the stability of crystallization during high temperature firing can be improved, and the excessive reaction between the mother glass composition and the glass substrate can be suppressed and the adhesive strength is enhanced. In addition, the strong bonding force of Ti-O contributes to the reduction of the coefficient of thermal expansion of the entire mother glass. The content of the TiO ₂ can be added up to 10 mol% based on the entire mother glass, in case of exceeding this TiO ₂ acts as a crystallization center to bring the crystallization of the mother glass.

In addition, the mother glass further comprises 0.01 to 15 mol% of an alkali metal oxide of B (R ₂ O: at least one selected from the group consisting of Li ₂ O, Na ₂ O and K ₂ O) based on the composition of the entire mother glass. do. When at least one of B: R ₂ O is added in the composition, the softening point and the transition point (glass transition temperature) are lowered and the adhesive strength is increased. In particular, Li ₂ O is most preferred because it is most excellent in improving the adhesion to the substrate.

In addition, in the frit composition for sealing an OLED display panel of the present invention, the A + B component is preferably included in the range of 0.5 mol% to 15 mol% based on the composition of the entire mother glass. If the content of the A + B component is less than 0.5 mol% based on the composition of the entire mother glass, such as crystallization occurs, the stability is lowered, whereas if it exceeds 15 mol% may cause problems with the substrate glass.

The vanadium phosphate-based glass of the present invention having such characteristics requires proper control of the coefficient of thermal expansion. In the case of sealing of VFD, FED, PDP, CRT, the coefficient of thermal expansion is about 60 ~ 90 × 10 ^-7 / ℃, and a refractory low-expansion ceramic filler may be added to control the coefficient of thermal expansion and improve mechanical strength. In particular, since the thermal expansion coefficient of the substrate glass of the OLED display panel is 30 ~ 50 × 10 ^-7 / ℃, it is necessary to add a low-expansion ceramic filler in order to further reduce the thermal expansion coefficient of the mother glass, the low-expansion ceramic filler for this It should have a coefficient of thermal expansion of 15 × 10 ^-7 / ℃ or less. When mixing the low expansion ceramic filler, the mixing amount is preferably in the range of 0 to 30% by weight (wt%) based on the total weight of the entire frit composition. If the low-expansion ceramic filler exceeds 30% by weight, the proportion of glass powder is relatively low, making it difficult to obtain the required fluidity. Preferred examples of the filler include cordierite, amorphous silica, eucryptite, alumina titanate, zircon, spodumene, willemite and willemite; It is preferable that it is at least one selected from the group consisting of mullite.

In addition, the present invention provides an OLED display panel sealing paste composition consisting of 70 to 90% by weight of the frit composition and the remaining organic vehicle. The organic vehicle refers to a mixture of a binder which is an organic substance for bonding frit and a solvent for dispersing the binder, which is a term commonly known in the art. The content of the frit composition in the paste composition for sealing a display panel of the present invention is 60 to 99% by weight, preferably 70 to 90% by weight of the whole paste. If the content of the frit is less than 70% by weight, the application line width of the sealing layer becomes wider and the height is lowered, so that the sealing property may be lowered. When the content of the frit exceeds 90% by weight, the sealing paste stability is lowered, so that quantitative discharge by the dispensing method is difficult. This is because layer formation can be difficult.

In addition, in the OLED display panel sealing paste of the present invention, the organic binder in the organic vehicle comprises 1 to 29% by weight based on the total weight of the entire paste composition. The binder serves to disperse and bind the frit powder forming the sealing layer and to adjust the viscosity. Preferred examples of the binder used in the OLED display panel sealing paste composition of the present invention is nitro cellulose or an acrylate polymer. If the viscosity is too low (less than 20,000 cps), the binder polymer content in the sealing paste must be adjusted to control the flow characteristics. If the viscosity is too high (more than 80,000 cps), bubbles are formed on the surface of the sealing layer or in the panel after the firing process. The amount of gas in the binder polymer family is increased to increase the burden of outgassing in the subsequent exhaust process. In addition, when the molecular weight of the binder polymer is too high, there is a problem that the solubility in the solvent is lowered, the wettability and dispersibility of the inorganic frit powder particles are lowered.

In addition, the solvent in the organic vehicle is mixed with the binder and collectively referred to as an organic vehicle, and the solvent dissolves the binder polymer to maintain a paste state of a predetermined viscosity. Preferred examples of the solvent are one or more selected from the group consisting of butyl carbitol acetate, butyl gabitol and terpineol. In addition, the organic vehicle may further include known additives such as a modifier for improving flowability.

Hereinafter, the present invention will be described in more detail with reference to preferred embodiments of the present invention. However, the following examples are only to help the understanding of the present invention, the scope of the present invention is not limited only to the following examples.

Example 1 (preparation)

Powder of each glass was prepared as Table 1 below. First, each batch raw material was combined so that it might have a composition of Table 1, and it melt | dissolved in air for 10-30 minutes at the temperature of 1160 degreeC. Next, the molten glass was passed through a roller to form a thin plate, and ball milled to prepare a frit. The frit and softening points of the prepared frit were measured, and flow button values were measured on a schedule of 10 minutes at 430 ° C. at a temperature of 7.7 ° C. per minute to test the spreadability of the frit and matching with the substrate glass. .

Classification (mol%) Manufacturing example One 2 3 4 5 6 7 Creation costs
(mol%) Li ₂ O 0.2 0.2 0.2 2.6 3.7 3.9 4.1 Na ₂ O 0.2 0.1 0.2 0.4 0.1 0.2 0.3 K ₂ O - 0.1 0.1 - 0.1 0.1 0.1 ZnO 12.6 12.6 14.5 14.0 13.6 13.3 13.0 TiO ₂ 2.0 2.0 2.0 3.0 5.4 5.4 5.4 P ₂ O ₅ 30.0 30.0 28.0 30.0 27.2 27.2 27.2 V ₂ O ₅ 55.0 55.0 55.0 50.0 49.9 49.9 49.9 Softening point (℃) 385.8 383.2 385.9 386.4 384.6 392.1 394.2 Transition point (℃) 307.5 306.5 307.4 308.7 304.0 310.0 311.2 F / B (mm) 19.7 20.0 19.5 21.2 22.6 19.9 19.8 CTE (× 10 ^-7 / K) 73.2 74.2 74.8 71.6 70.5 70.8 70.9 Adhesion △ ○ △ ○ ◎ △ △ crystallization radish radish radish radish radish radish radish

◎: Good overall adhesive strength ○: Good adhesive strength Δ: Poor adhesion

* F / B (flowability) is measured while keeping 430 ℃ for 10 minutes

In the above embodiment, in the case of the composition 1, the size of the flow button was appropriate, but the adhesive form was not evenly sealed on the entire surface of the substrate. On the other hand, in the case of composition 2, the adhesive force was well attached to the entire substrate, and in the case of composition 3, the size of the flow button was the largest, but the adhesive form was not evenly sealed on the entire surface of the substrate. The Tg temperature range of the button was the lowest and the size of the flow button was good, but the adhesion was low. In the case of the crystallization temperature Tc, the thermal stability of the glass can be ensured even if plasticity is carried out in a section of 420 to 500 ° C. in a section of composition 511 ° C. at 500 ° C. or less. In the case of the composition 5 in Example 1, it can be seen that the F / B, Tg, and Ts which are easy to fire at 430 ° C.

Example 2-1 (Preparation and Sealing of Paste Composition)

After preparing a solvent by mixing 90 parts by weight of butyl carbitol acetate and 10 parts by weight of terpineol, an organic vehicle was prepared by adding 2.3 parts by weight of nitrocellulose to 100 parts by weight of the solvent. A glass encapsulant paste composition was prepared by mixing 25 parts by weight of the organic vehicle and 75 parts by weight of the frit of composition 5 in Example 1. The prepared sealing paste composition was dispensed quantitatively on a general soda lime front substrate by a dispensing method, and sealed at 430 ° C.

Example 2-2 (Preparation and Sealing of Paste Composition)

After preparing a solvent by mixing 90 parts by weight of butyl carbitol acetate and 10 parts by weight of terpineol, an organic vehicle was prepared by adding 2.3 parts by weight of nitrocellulose to 100 parts by weight of the solvent. A glass sealing material paste composition was prepared by mixing 22 parts by weight of the organic vehicle and 78 parts by weight of the mother glass of composition 5 of Preparation Example. The prepared sealing paste composition was dispensed quantitatively on a general soda lime front substrate by a dispensing method, and sealed at 430 ° C.

FIG. 1 is a photomicrograph of the paste based on the general Pb-based frit and the line formation when dispensing the above-mentioned paste composition in Examples 2-1 and 2-2, respectively, and FIG. It is a high magnification micrograph observing the line formation when dispensing the above-mentioned paste composition in 2-1 and 2-2. As shown in Figure 1 and 2, in the case of the paste composition according to the present invention was well formed of the line, it was confirmed that the sealing well throughout the whole period. The adhesion state of the upper and lower plate glass substrates of the said sealing layer is about 150-200 micrometers of line width 3-6 mm height. In addition, the results of the sealing performed in Examples 1 and 2 were confirmed by the optical microscope and thermal analysis (TG-DTA) to confirm the firing characteristics of the paste composition. 3 is a thermal analysis result of the paste composition prepared in Examples 2-1 and 2-2. As can be seen in Figure 3, in the case of Example 2 of the OLED display panel sealing paste composition of the present invention it can be seen that it is completely decomposed at around 200 ℃ suitable for low temperature exhaust.

The embodiments of the present invention described above should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

1 is a photomicrograph of contrasting line formation when dispensing the paste based on the general Pb-based frit and the paste compositions mentioned above in Examples 2-1 and 2-2, respectively;

2 is a high magnification micrograph observing line formation when dispensing the above-mentioned paste composition in Examples 2-1 and 2-2, respectively.

3 is a thermal analysis of the paste composition prepared in Examples 2-1 and 2-2

Claims (5)

V ₂ O ₅ 45 to 55 mol% (mol%), ZnO 12 to 20 mol% (mol%), P ₂ O ₅ 25 to 30 substantially free of lead (Pb) component and bismuth (Bi) component Mol% (mol%), 2 to 6 mol% of A (TiO ₂ ) and 3 to 4 mol% of B (at least one selected from the group consisting of R ₂ O: Li ₂ O, Na ₂ O and K ₂ O) Including, but A + B component consists of 70 to 100% by weight (wt.%) And the remaining low-expansion ceramic filler, including in the range of 5 mol% to 9.3 mol%, The softening point (Ts) of the mother glass is 400 ℃ or less and after firing the average coefficient of thermal expansion in the range from room temperature to 300 ℃ 30 to 72 × 10 ^-7 / ℃ characterized in that the frit composition for sealing an OLED display panel. The method of claim 1, The low expansion ceramic filler is cordierite, amorphous silica, silica, eucryptite, alumina titanate, zircon, spodumene, willemite and willemite and A frit composition for sealing an OLED display panel, characterized in that at least one member selected from the group consisting of mullite. delete The paste composition for sealing an OLED display panel comprising 70 to 90% by weight (wt.%) Of the frit composition for sealing the OLED display panel according to any one of claims 1 to 2 and the remaining organic vehicle. 5. The method of claim 4, The organic vehicle is a nitro cellulose (NC) or an acrylate polymer (AC), which is added in the range of 1 to 29% by weight based on the total weight of the paste composition, and the remaining butylcarbitol acetate, butyl carbitol and ter Paste composition for sealing an OLED display panel, characterized in that composed of one or more organic solvents selected from the group consisting of pineol.

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