KR101165977B1 - 취성 재료 기판의 가공 방법 - Google Patents

취성 재료 기판의 가공 방법 Download PDF

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Publication number
KR101165977B1
KR101165977B1 KR1020107025336A KR20107025336A KR101165977B1 KR 101165977 B1 KR101165977 B1 KR 101165977B1 KR 1020107025336 A KR1020107025336 A KR 1020107025336A KR 20107025336 A KR20107025336 A KR 20107025336A KR 101165977 B1 KR101165977 B1 KR 101165977B1
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KR
South Korea
Prior art keywords
laser
substrate
beam spot
laser beam
polygon mirror
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020107025336A
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English (en)
Korean (ko)
Other versions
KR20110006678A (ko
Inventor
토루 구마가이
유스케 히라우치
슈이치 이노우에
고오지 야마모토
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication date
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Publication of KR20110006678A publication Critical patent/KR20110006678A/ko
Application granted granted Critical
Publication of KR101165977B1 publication Critical patent/KR101165977B1/ko
Expired - Fee Related legal-status Critical Current
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020107025336A 2008-04-15 2009-03-16 취성 재료 기판의 가공 방법 Expired - Fee Related KR101165977B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2008-106219 2008-04-15
JP2008106219 2008-04-15
PCT/JP2009/055061 WO2009128316A1 (ja) 2008-04-15 2009-03-16 脆性材料基板の加工方法

Publications (2)

Publication Number Publication Date
KR20110006678A KR20110006678A (ko) 2011-01-20
KR101165977B1 true KR101165977B1 (ko) 2012-07-18

Family

ID=41199016

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107025336A Expired - Fee Related KR101165977B1 (ko) 2008-04-15 2009-03-16 취성 재료 기판의 가공 방법

Country Status (5)

Country Link
JP (1) JP5050099B2 (enrdf_load_stackoverflow)
KR (1) KR101165977B1 (enrdf_load_stackoverflow)
CN (1) CN102046345A (enrdf_load_stackoverflow)
TW (1) TW200948524A (enrdf_load_stackoverflow)
WO (1) WO2009128316A1 (enrdf_load_stackoverflow)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5879106B2 (ja) * 2011-11-25 2016-03-08 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
JP2013136074A (ja) * 2011-12-28 2013-07-11 Mitsuboshi Diamond Industrial Co Ltd 分断装置、被加工物の分断方法、および光学素子パターン付き基板の分断方法
KR101388181B1 (ko) 2012-09-04 2014-04-30 (주)하드램 유리 기판 레이저 절단 장치 및 방법
TWI562264B (en) * 2012-12-19 2016-12-11 Genesis Photonics Inc Splitting apparatus and splitting method
EP2980033B1 (en) * 2013-03-26 2021-01-20 AGC Inc. Glass sheet processing method and glass sheet processing apparatus
TWM469728U (zh) * 2013-05-30 2014-01-01 Bungbungame Inc 承載架及運用此承載架的包裝盒
JP6413693B2 (ja) * 2014-11-25 2018-10-31 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN105436712B (zh) * 2015-12-07 2017-12-12 武汉铱科赛科技有限公司 一种脆性半导体材料的脆性裂片方法及系统
CN105436617B (zh) * 2016-01-13 2017-05-31 中国工程物理研究院核物理与化学研究所 同位素辐照盒无屑切割机
JP6888808B2 (ja) * 2017-03-30 2021-06-16 三星ダイヤモンド工業株式会社 樹脂層付き脆性材料基板の分断方法並びに分断装置
JP6855955B2 (ja) * 2017-06-19 2021-04-07 株式会社Sumco レーザマークの印字方法、レーザマーク付きシリコンウェーハの製造方法
JP6717353B2 (ja) * 2018-10-22 2020-07-01 株式会社Sumco レーザマーク付きシリコンウェーハの製造方法
JP7617357B2 (ja) * 2021-11-11 2025-01-20 株式会社東京精密 亀裂進展装置及び亀裂進展方法
CN116135503B (zh) * 2021-11-18 2025-07-25 广东博智林机器人有限公司 板料分割设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001130921A (ja) 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
JP2005288541A (ja) 2004-03-31 2005-10-20 Eo Technics Co Ltd ポリゴンミラーを利用するレーザ加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001130921A (ja) 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
JP2005288541A (ja) 2004-03-31 2005-10-20 Eo Technics Co Ltd ポリゴンミラーを利用するレーザ加工装置

Also Published As

Publication number Publication date
JP5050099B2 (ja) 2012-10-17
WO2009128316A1 (ja) 2009-10-22
TWI375602B (enrdf_load_stackoverflow) 2012-11-01
TW200948524A (en) 2009-12-01
KR20110006678A (ko) 2011-01-20
CN102046345A (zh) 2011-05-04
JPWO2009128316A1 (ja) 2011-08-04

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