CN102046345A - 脆性材料基板的加工方法 - Google Patents

脆性材料基板的加工方法 Download PDF

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Publication number
CN102046345A
CN102046345A CN200980119186XA CN200980119186A CN102046345A CN 102046345 A CN102046345 A CN 102046345A CN 200980119186X A CN200980119186X A CN 200980119186XA CN 200980119186 A CN200980119186 A CN 200980119186A CN 102046345 A CN102046345 A CN 102046345A
Authority
CN
China
Prior art keywords
laser
light beam
substrate
beam spot
minute surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200980119186XA
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English (en)
Chinese (zh)
Inventor
熊谷透
平內裕介
井上修一
山本幸司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN102046345A publication Critical patent/CN102046345A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
CN200980119186XA 2008-04-15 2009-03-16 脆性材料基板的加工方法 Pending CN102046345A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-106219 2008-04-15
JP2008106219 2008-04-15
PCT/JP2009/055061 WO2009128316A1 (ja) 2008-04-15 2009-03-16 脆性材料基板の加工方法

Publications (1)

Publication Number Publication Date
CN102046345A true CN102046345A (zh) 2011-05-04

Family

ID=41199016

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980119186XA Pending CN102046345A (zh) 2008-04-15 2009-03-16 脆性材料基板的加工方法

Country Status (5)

Country Link
JP (1) JP5050099B2 (enrdf_load_stackoverflow)
KR (1) KR101165977B1 (enrdf_load_stackoverflow)
CN (1) CN102046345A (enrdf_load_stackoverflow)
TW (1) TW200948524A (enrdf_load_stackoverflow)
WO (1) WO2009128316A1 (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103182746A (zh) * 2011-12-28 2013-07-03 三星钻石工业股份有限公司 分断装置、被加工物的分断方法、及附有光学元件图案的基板的分断方法
CN105436617A (zh) * 2016-01-13 2016-03-30 中国工程物理研究院核物理与化学研究所 同位素辐照盒无屑切割机
CN105436712A (zh) * 2015-12-07 2016-03-30 武汉铱科赛科技有限公司 一种脆性半导体材料的脆性裂片方法及系统
CN105621877A (zh) * 2014-11-25 2016-06-01 三星钻石工业股份有限公司 脆性基板的切断方法
CN108705208A (zh) * 2017-03-30 2018-10-26 三星钻石工业股份有限公司 带树脂层的脆性材料基板的切割方法及切割装置
CN109148260A (zh) * 2017-06-19 2019-01-04 胜高股份有限公司 激光标记的刻印方法、带激光标记的硅晶片及其制造方法
CN113169034A (zh) * 2018-10-22 2021-07-23 胜高股份有限公司 带激光标记的硅晶圆的制造方法及带激光标记的硅晶圆
CN116135503A (zh) * 2021-11-18 2023-05-19 广东博智林机器人有限公司 板料分割设备

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5879106B2 (ja) * 2011-11-25 2016-03-08 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法
KR101388181B1 (ko) 2012-09-04 2014-04-30 (주)하드램 유리 기판 레이저 절단 장치 및 방법
TWI562264B (en) * 2012-12-19 2016-12-11 Genesis Photonics Inc Splitting apparatus and splitting method
EP2980033B1 (en) * 2013-03-26 2021-01-20 AGC Inc. Glass sheet processing method and glass sheet processing apparatus
TWM469728U (zh) * 2013-05-30 2014-01-01 Bungbungame Inc 承載架及運用此承載架的包裝盒
JP7617357B2 (ja) * 2021-11-11 2025-01-20 株式会社東京精密 亀裂進展装置及び亀裂進展方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001130921A (ja) 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
KR100462358B1 (ko) * 2004-03-31 2004-12-17 주식회사 이오테크닉스 폴리곤 미러를 이용한 레이저 가공장치

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103182746A (zh) * 2011-12-28 2013-07-03 三星钻石工业股份有限公司 分断装置、被加工物的分断方法、及附有光学元件图案的基板的分断方法
CN105621877A (zh) * 2014-11-25 2016-06-01 三星钻石工业股份有限公司 脆性基板的切断方法
CN105621877B (zh) * 2014-11-25 2020-05-01 三星钻石工业股份有限公司 脆性基板的切断方法
CN105436712A (zh) * 2015-12-07 2016-03-30 武汉铱科赛科技有限公司 一种脆性半导体材料的脆性裂片方法及系统
CN105436617A (zh) * 2016-01-13 2016-03-30 中国工程物理研究院核物理与化学研究所 同位素辐照盒无屑切割机
CN105436617B (zh) * 2016-01-13 2017-05-31 中国工程物理研究院核物理与化学研究所 同位素辐照盒无屑切割机
CN108705208A (zh) * 2017-03-30 2018-10-26 三星钻石工业股份有限公司 带树脂层的脆性材料基板的切割方法及切割装置
CN109148260A (zh) * 2017-06-19 2019-01-04 胜高股份有限公司 激光标记的刻印方法、带激光标记的硅晶片及其制造方法
CN109148260B (zh) * 2017-06-19 2023-04-25 胜高股份有限公司 激光标记的刻印方法、带激光标记的硅晶片及其制造方法
CN113169034A (zh) * 2018-10-22 2021-07-23 胜高股份有限公司 带激光标记的硅晶圆的制造方法及带激光标记的硅晶圆
CN113169034B (zh) * 2018-10-22 2024-01-30 胜高股份有限公司 带激光标记的硅晶圆的制造方法
CN116135503A (zh) * 2021-11-18 2023-05-19 广东博智林机器人有限公司 板料分割设备

Also Published As

Publication number Publication date
JP5050099B2 (ja) 2012-10-17
WO2009128316A1 (ja) 2009-10-22
TWI375602B (enrdf_load_stackoverflow) 2012-11-01
TW200948524A (en) 2009-12-01
KR20110006678A (ko) 2011-01-20
KR101165977B1 (ko) 2012-07-18
JPWO2009128316A1 (ja) 2011-08-04

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Application publication date: 20110504