KR101139073B1 - 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법 - Google Patents

회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법 Download PDF

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Publication number
KR101139073B1
KR101139073B1 KR1020097023996A KR20097023996A KR101139073B1 KR 101139073 B1 KR101139073 B1 KR 101139073B1 KR 1020097023996 A KR1020097023996 A KR 1020097023996A KR 20097023996 A KR20097023996 A KR 20097023996A KR 101139073 B1 KR101139073 B1 KR 101139073B1
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KR
South Korea
Prior art keywords
adhesive
layer
circuit
circuit member
connection terminal
Prior art date
Application number
KR1020097023996A
Other languages
English (en)
Korean (ko)
Other versions
KR20100002284A (ko
Inventor
모또히로 아리후꾸
니찌오미 모찌즈끼
고우지 고바야시
가즈요시 고지마
다까시 나까자와
유끼히사 히로사와
Original Assignee
히다치 가세고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 히다치 가세고교 가부시끼가이샤 filed Critical 히다치 가세고교 가부시끼가이샤
Priority claimed from PCT/JP2008/057534 external-priority patent/WO2008133186A1/ja
Publication of KR20100002284A publication Critical patent/KR20100002284A/ko
Application granted granted Critical
Publication of KR101139073B1 publication Critical patent/KR101139073B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
KR1020097023996A 2007-04-19 2008-04-17 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법 KR101139073B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007110385 2007-04-19
JPJP-P-2007-110385 2007-04-19
JP2008002577A JP5181220B2 (ja) 2007-04-19 2008-01-09 回路接続用接着フィルム、接続構造体及びその製造方法
JPJP-P-2008-002577 2008-01-09
PCT/JP2008/057534 WO2008133186A1 (ja) 2007-04-19 2008-04-17 回路接続用接着フィルム、接続構造体及びその製造方法

Publications (2)

Publication Number Publication Date
KR20100002284A KR20100002284A (ko) 2010-01-06
KR101139073B1 true KR101139073B1 (ko) 2012-04-30

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ID=40147951

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097023996A KR101139073B1 (ko) 2007-04-19 2008-04-17 회로 접속용 접착 필름, 접속 구조체 및 그의 제조 방법

Country Status (4)

Country Link
JP (1) JP5181220B2 (zh)
KR (1) KR101139073B1 (zh)
CN (2) CN101611659B (zh)
TW (1) TWI399420B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5521848B2 (ja) 2010-07-21 2014-06-18 デクセリアルズ株式会社 異方性導電フィルム、接続構造体及びそれらの製造方法
JP5823117B2 (ja) * 2010-11-16 2015-11-25 デクセリアルズ株式会社 異方性導電フィルム、接合体、及び接合体の製造方法
JP5972009B2 (ja) * 2012-03-30 2016-08-17 デクセリアルズ株式会社 回路接続材料、及びこれを用いた実装体の製造方法
CN105225729B (zh) * 2015-08-26 2017-02-22 京东方科技集团股份有限公司 各向异性导电膜、及覆晶薄膜与柔性电路板的邦定方法
JP2017098077A (ja) * 2015-11-24 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、及び接続方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4214416B2 (ja) * 1997-02-27 2009-01-28 セイコーエプソン株式会社 接着方法及び液晶装置の製造方法
KR100643640B1 (ko) * 1997-02-27 2007-06-07 세이코 엡슨 가부시키가이샤 접속구조체,액정장치,전자기기와이방도전성접착제및그제조방법
JP4011157B2 (ja) * 1997-08-08 2007-11-21 日立化成フィルテック株式会社 包装用ラップフィルムの収納ケース
WO2001082363A1 (en) * 2000-04-25 2001-11-01 Hitachi Chemical Co., Ltd. Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure
JP4747396B2 (ja) * 2000-05-17 2011-08-17 日立化成工業株式会社 接着剤組成物、それを用いた回路端子の接続方法及び回路端子の接続構造
JP4325379B2 (ja) * 2003-12-02 2009-09-02 日立化成工業株式会社 回路接続材料、これを用いたフィルム状回路接続材料、回路部材の接続構造及びその製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003049152A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 回路接続用接着剤及びそれを用いた接続方法、接続構造体

Also Published As

Publication number Publication date
CN101611659B (zh) 2012-05-23
CN102638944B (zh) 2014-12-10
CN101611659A (zh) 2009-12-23
JP2008288551A (ja) 2008-11-27
CN102638944A (zh) 2012-08-15
TWI399420B (zh) 2013-06-21
KR20100002284A (ko) 2010-01-06
TW200911950A (en) 2009-03-16
JP5181220B2 (ja) 2013-04-10

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