KR101135746B1 - 온도 제어 방법 및 장치 - Google Patents

온도 제어 방법 및 장치 Download PDF

Info

Publication number
KR101135746B1
KR101135746B1 KR1020067014163A KR20067014163A KR101135746B1 KR 101135746 B1 KR101135746 B1 KR 101135746B1 KR 1020067014163 A KR1020067014163 A KR 1020067014163A KR 20067014163 A KR20067014163 A KR 20067014163A KR 101135746 B1 KR101135746 B1 KR 101135746B1
Authority
KR
South Korea
Prior art keywords
temperature
heat transfer
transfer fluid
fluid
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020067014163A
Other languages
English (en)
Korean (ko)
Other versions
KR20070003823A (ko
Inventor
폴 모로즈
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20070003823A publication Critical patent/KR20070003823A/ko
Application granted granted Critical
Publication of KR101135746B1 publication Critical patent/KR101135746B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020067014163A 2004-04-15 2005-02-17 온도 제어 방법 및 장치 Expired - Fee Related KR101135746B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/824,643 US20050229854A1 (en) 2004-04-15 2004-04-15 Method and apparatus for temperature change and control
US10/824,643 2004-04-15
PCT/US2005/005211 WO2005106928A1 (en) 2004-04-15 2005-02-17 Method and apparatus for temperature control

Publications (2)

Publication Number Publication Date
KR20070003823A KR20070003823A (ko) 2007-01-05
KR101135746B1 true KR101135746B1 (ko) 2012-04-16

Family

ID=34960955

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067014163A Expired - Fee Related KR101135746B1 (ko) 2004-04-15 2005-02-17 온도 제어 방법 및 장치

Country Status (5)

Country Link
US (2) US20050229854A1 (enExample)
JP (1) JP4772779B2 (enExample)
KR (1) KR101135746B1 (enExample)
CN (1) CN1943008A (enExample)
WO (1) WO2005106928A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180130601A (ko) * 2016-05-05 2018-12-07 어플라이드 머티어리얼스, 인코포레이티드 이중 루프 서셉터 온도 제어 시스템

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7304715B2 (en) * 2004-08-13 2007-12-04 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7244311B2 (en) * 2004-10-13 2007-07-17 Lam Research Corporation Heat transfer system for improved semiconductor processing uniformity
JP4533732B2 (ja) * 2004-11-30 2010-09-01 三菱重工業株式会社 製膜装置及びその製造方法
US8226769B2 (en) 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US20070283709A1 (en) * 2006-06-09 2007-12-13 Veeco Instruments Inc. Apparatus and methods for managing the temperature of a substrate in a high vacuum processing system
KR100757851B1 (ko) * 2006-07-04 2007-09-11 세메스 주식회사 웨이퍼 이송용 로봇암 및 이를 구비하는 웨이퍼 이송 장치
US9275887B2 (en) 2006-07-20 2016-03-01 Applied Materials, Inc. Substrate processing with rapid temperature gradient control
US20100032146A1 (en) * 2006-11-17 2010-02-11 Centrotherm Thermal Solutions Gmbh + Co.Kg Method and arrangement for heat treatment of substrates
KR20090001091A (ko) * 2007-06-29 2009-01-08 (주)티티에스 외부발열부재가 구성된 반도체 제조장치
TW200913798A (en) 2007-09-14 2009-03-16 Advanced Display Proc Eng Co Substrate processing apparatus having electrode member
KR101055749B1 (ko) 2008-11-17 2011-08-11 주식회사 하이닉스반도체 수직게이트를 구비한 반도체장치 제조 방법
DE102009018434B4 (de) * 2009-04-22 2023-11-30 Ev Group Gmbh Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten
US8637794B2 (en) 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
CN105428295B (zh) * 2009-12-15 2020-08-11 朗姆研究公司 调节基板温度来改进关键尺寸（cd）的均匀性
US9629280B2 (en) * 2010-06-24 2017-04-18 Raytheon Company Multiple liquid loop cooling for electronics
US8791392B2 (en) 2010-10-22 2014-07-29 Lam Research Corporation Methods of fault detection for multiplexed heater array
US8546732B2 (en) 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
JP5709505B2 (ja) * 2010-12-15 2015-04-30 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理方法、および記憶媒体
US9307578B2 (en) 2011-08-17 2016-04-05 Lam Research Corporation System and method for monitoring temperatures of and controlling multiplexed heater array
US8624168B2 (en) 2011-09-20 2014-01-07 Lam Research Corporation Heating plate with diode planar heater zones for semiconductor processing
US8461674B2 (en) 2011-09-21 2013-06-11 Lam Research Corporation Thermal plate with planar thermal zones for semiconductor processing
US9324589B2 (en) 2012-02-28 2016-04-26 Lam Research Corporation Multiplexed heater array using AC drive for semiconductor processing
US8809747B2 (en) 2012-04-13 2014-08-19 Lam Research Corporation Current peak spreading schemes for multiplexed heated array
CN103791550B (zh) * 2012-10-30 2016-08-03 海门黄海创业园服务有限公司 一种工作台加热系统
US10049948B2 (en) 2012-11-30 2018-08-14 Lam Research Corporation Power switching system for ESC with array of thermal control elements
CN103538039A (zh) * 2013-10-09 2014-01-29 郭进标 一种工作台
KR102411194B1 (ko) * 2014-09-04 2022-06-20 삼성전자주식회사 냉매의 양방향 흐름이 가능한 정전척 어셈블리 및 이를 구비한 반도체 제조장치
CN107851559B (zh) * 2015-06-26 2022-04-26 东京毅力科创株式会社 气相蚀刻系统和方法
CN106637132B (zh) * 2015-10-29 2020-01-10 沈阳拓荆科技有限公司 循环媒介自动控温、热传导气体传导温度的晶圆反应台
JP6991870B2 (ja) 2018-01-29 2022-01-13 東京エレクトロン株式会社 フレキシブル配管および温度制御システム
US10509321B2 (en) * 2018-01-30 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Temperature controlling apparatus and method for forming coating layer
JP2019201086A (ja) * 2018-05-15 2019-11-21 東京エレクトロン株式会社 処理装置、部材及び温度制御方法
WO2020023409A1 (en) * 2018-07-24 2020-01-30 Applied Materials, Inc. Optically transparent pedestal for fluidly supporting a substrate
JP7316179B2 (ja) * 2019-10-04 2023-07-27 東京エレクトロン株式会社 基板支持台、及びプラズマ処理装置
CN111235547B (zh) * 2020-04-27 2020-08-07 上海陛通半导体能源科技股份有限公司 化学气相沉积方法
JP7550104B2 (ja) * 2021-04-23 2024-09-12 東京エレクトロン株式会社 基板搬送装置及びアームの冷却方法
CN115110119B (zh) * 2022-06-20 2024-03-29 阳光氢能科技有限公司 制氢系统的温度控制方法及装置、制氢系统
TWI846254B (zh) * 2022-12-30 2024-06-21 中國砂輪企業股份有限公司 溫度控制裝置及方法
CN116798920B (zh) * 2023-08-16 2024-05-17 北京北方华创微电子装备有限公司 温度控制装置、方法及半导体工艺设备
US20250065462A1 (en) * 2023-08-21 2025-02-27 Applied Materials, Inc. Temperature control system with flammable heat transfer fluid
US20250349575A1 (en) * 2024-05-09 2025-11-13 Applied Materials, Inc. Semiconductor processing chamber thermal control

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0087120A1 (de) * 1982-02-18 1983-08-31 Mistral Windsurfing AG Mastfussanordnung für ein Segelbrett
JPH07271452A (ja) * 1994-03-25 1995-10-20 Dainippon Screen Mfg Co Ltd 基板の温度調節用プレート装置
WO1998005060A1 (en) * 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Multizone bake/chill thermal cycling module
WO2003012567A1 (en) * 2001-07-30 2003-02-13 Tokyo Electron Limited Plasma chamber wall segment temperature control

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4060997A (en) * 1976-03-31 1977-12-06 Application Engineering Corporation Water chiller control
JPS6060060A (ja) * 1983-09-12 1985-04-06 株式会社日立製作所 鉄道車両の扉開閉装置
US4484978A (en) * 1983-09-23 1984-11-27 Fairchild Camera & Instrument Corp. Etching method
FR2631010B1 (fr) * 1988-05-06 1991-03-22 Sagem Dispositif de support et de regulation thermique d'une piece et appareillage de test de plaques de circuits semi-conducteurs incluant un tel dispositif
US5775416A (en) * 1995-11-17 1998-07-07 Cvc Products, Inc. Temperature controlled chuck for vacuum processing
JPH09172001A (ja) * 1995-12-15 1997-06-30 Sony Corp 半導体製造装置の温度制御方法および装置
US5846375A (en) * 1996-09-26 1998-12-08 Micron Technology, Inc. Area specific temperature control for electrode plates and chucks used in semiconductor processing equipment
US6026896A (en) * 1997-04-10 2000-02-22 Applied Materials, Inc. Temperature control system for semiconductor processing facilities
US6102113A (en) * 1997-09-16 2000-08-15 B/E Aerospace Temperature control of individual tools in a cluster tool system
US6117245A (en) * 1998-04-08 2000-09-12 Applied Materials, Inc. Method and apparatus for controlling cooling and heating fluids for a gas distribution plate
KR100389872B1 (ko) * 2001-11-12 2003-07-04 삼성전자주식회사 전자사진 형성장치의 정착롤러를 위한 전력 제어 방법 및장치
US6677167B2 (en) * 2002-03-04 2004-01-13 Hitachi High-Technologies Corporation Wafer processing apparatus and a wafer stage and a wafer processing method
US6822202B2 (en) * 2002-03-15 2004-11-23 Oriol, Inc. Semiconductor processing temperature control
KR100488535B1 (ko) * 2002-07-20 2005-05-11 엘지.필립스 엘시디 주식회사 액정토출장치 및 토출방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0087120A1 (de) * 1982-02-18 1983-08-31 Mistral Windsurfing AG Mastfussanordnung für ein Segelbrett
JPH07271452A (ja) * 1994-03-25 1995-10-20 Dainippon Screen Mfg Co Ltd 基板の温度調節用プレート装置
WO1998005060A1 (en) * 1996-07-31 1998-02-05 The Board Of Trustees Of The Leland Stanford Junior University Multizone bake/chill thermal cycling module
WO2003012567A1 (en) * 2001-07-30 2003-02-13 Tokyo Electron Limited Plasma chamber wall segment temperature control

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180130601A (ko) * 2016-05-05 2018-12-07 어플라이드 머티어리얼스, 인코포레이티드 이중 루프 서셉터 온도 제어 시스템
KR102204916B1 (ko) * 2016-05-05 2021-01-18 어플라이드 머티어리얼스, 인코포레이티드 이중 루프 서셉터 온도 제어 시스템

Also Published As

Publication number Publication date
CN1943008A (zh) 2007-04-04
KR20070003823A (ko) 2007-01-05
JP4772779B2 (ja) 2011-09-14
US20050229854A1 (en) 2005-10-20
US20090095451A1 (en) 2009-04-16
JP2007533155A (ja) 2007-11-15
WO2005106928A1 (en) 2005-11-10

Similar Documents

Publication Publication Date Title
KR101135746B1 (ko) 온도 제어 방법 및 장치
KR101957526B1 (ko) 반도체 기판 지지체의 온도 제어를 위한 장치 및 방법
US7141763B2 (en) Method and apparatus for rapid temperature change and control
CN1841654B (zh) 载置台的温度控制装置、方法和程序以及处理装置
US10502508B2 (en) System including temperature-controllable stage, semiconductor manufacturing equipment and stage temperature control method
CN102142351B (zh) 等离子体处理装置的腔室内部件和基板载置台
JP5032269B2 (ja) 被処理基板の温度調節装置及び温度調節方法、並びにこれを備えたプラズマ処理装置
US6949722B2 (en) Method and apparatus for active temperature control of susceptors
TWI674638B (zh) 工件處理系統及其設備
TW503440B (en) Apparatus for controlling temperature in a semiconductor processing system
CN102057476B (zh) 快速衬底支撑件温度控制
US10312062B2 (en) Temperature control system and temperature control method
WO2019204124A1 (en) Ceramic wafer heater with integrated pressurized helium cooling
KR20070039884A (ko) 기판 온도 프로파일 제어를 위한 방법 및 시스템
WO2007117740A2 (en) Multi-zone substrate temperature control system and method of operating
KR101039085B1 (ko) 플라즈마처리장치 및 플라즈마처리방법
KR20220007518A (ko) 탑재대, 기판을 처리하는 장치, 및 기판을 온도 조절하는 방법
KR100920399B1 (ko) 냉각블럭 및 이를 포함하는 기판처리장치
TWM619803U (zh) 可調整晶圓溫度的承載盤及應用該承載盤的薄膜沉積裝置
KR20100065608A (ko) 증착 장치

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20160318

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20170302

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20180316

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20190318

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240405

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240405