KR101121417B1 - 표시소자의 제조장치 - Google Patents
표시소자의 제조장치 Download PDFInfo
- Publication number
- KR101121417B1 KR101121417B1 KR1020040086470A KR20040086470A KR101121417B1 KR 101121417 B1 KR101121417 B1 KR 101121417B1 KR 1020040086470 A KR1020040086470 A KR 1020040086470A KR 20040086470 A KR20040086470 A KR 20040086470A KR 101121417 B1 KR101121417 B1 KR 101121417B1
- Authority
- KR
- South Korea
- Prior art keywords
- gas
- raw material
- gas injector
- injector
- evaporator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000007789 gas Substances 0.000 claims abstract description 164
- 239000002994 raw material Substances 0.000 claims abstract description 95
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 239000012159 carrier gas Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 33
- 230000008016 vaporization Effects 0.000 claims abstract description 30
- 238000009834 vaporization Methods 0.000 claims abstract description 23
- 239000000843 powder Substances 0.000 claims description 31
- 238000002347 injection Methods 0.000 claims description 21
- 239000007924 injection Substances 0.000 claims description 21
- 238000003860 storage Methods 0.000 claims description 12
- 238000009792 diffusion process Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 6
- 238000010926 purge Methods 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000010409 thin film Substances 0.000 abstract description 12
- 238000007665 sagging Methods 0.000 abstract description 3
- 238000005507 spraying Methods 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 description 12
- 230000008021 deposition Effects 0.000 description 11
- 239000011368 organic material Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011553 magnetic fluid Substances 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 4
- 239000006200 vaporizer Substances 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- TVIVIEFSHFOWTE-UHFFFAOYSA-K tri(quinolin-8-yloxy)alumane Chemical compound [Al+3].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 TVIVIEFSHFOWTE-UHFFFAOYSA-K 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- HXWWMGJBPGRWRS-CMDGGOBGSA-N 4- -2-tert-butyl-6- -4h-pyran Chemical compound O1C(C(C)(C)C)=CC(=C(C#N)C#N)C=C1\C=C\C1=CC(C(CCN2CCC3(C)C)(C)C)=C2C3=C1 HXWWMGJBPGRWRS-CMDGGOBGSA-N 0.000 description 1
- -1 DCJTB for red Chemical compound 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical class N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- CYDYNVMCEGXBEM-JXOAFFINSA-N TDP Chemical compound O=C1NC(=O)C(C)=CN1[C@H]1[C@H](O)[C@H](O)[C@@H](COP(O)(=O)OP(O)(O)=O)O1 CYDYNVMCEGXBEM-JXOAFFINSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N coumarin Chemical class C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000011364 vaporized material Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040086470A KR101121417B1 (ko) | 2004-10-28 | 2004-10-28 | 표시소자의 제조장치 |
| US11/255,062 US8157916B2 (en) | 2004-10-28 | 2005-10-19 | Apparatus for fabricating display device |
| TW094136806A TWI453800B (zh) | 2004-10-28 | 2005-10-21 | 用於製造顯示裝置之設備 |
| CN2005101095762A CN1766157B (zh) | 2004-10-28 | 2005-10-26 | 用于制作显示装置的设备 |
| JP2005312875A JP4942985B2 (ja) | 2004-10-28 | 2005-10-27 | 薄膜製造用装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020040086470A KR101121417B1 (ko) | 2004-10-28 | 2004-10-28 | 표시소자의 제조장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060037513A KR20060037513A (ko) | 2006-05-03 |
| KR101121417B1 true KR101121417B1 (ko) | 2012-03-15 |
Family
ID=36260374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040086470A Expired - Lifetime KR101121417B1 (ko) | 2004-10-28 | 2004-10-28 | 표시소자의 제조장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8157916B2 (https=) |
| JP (1) | JP4942985B2 (https=) |
| KR (1) | KR101121417B1 (https=) |
| CN (1) | CN1766157B (https=) |
| TW (1) | TWI453800B (https=) |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI341872B (en) * | 2006-08-07 | 2011-05-11 | Ind Tech Res Inst | Plasma deposition apparatus and depositing method thereof |
| KR101301642B1 (ko) * | 2007-03-07 | 2013-08-29 | 주성엔지니어링(주) | 가열수단을 가지는 가스분사장치와 이를 포함하는기판처리장치 |
| KR101394481B1 (ko) * | 2007-10-30 | 2014-05-13 | 주성엔지니어링(주) | 가스 분사 장치 및 이를 이용한 유기 박막 증착 장치 |
| KR101363395B1 (ko) * | 2007-10-31 | 2014-02-21 | 주성엔지니어링(주) | 가스 분사 장치 및 이를 이용한 유기 박막 증착 장치와유기 박막 증착 방법 |
| KR101173645B1 (ko) * | 2007-12-31 | 2012-08-20 | (주)에이디에스 | 가스 분사 유닛 및 이를 구비하는 박막 증착 장치 |
| KR100952313B1 (ko) * | 2009-03-26 | 2010-04-09 | 에스엔유 프리시젼 주식회사 | 원료 공급 유닛과 원료 공급 방법 및 박막 증착 장치 |
| JP5623786B2 (ja) * | 2009-05-22 | 2014-11-12 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置 |
| JP5620146B2 (ja) | 2009-05-22 | 2014-11-05 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置 |
| US8882920B2 (en) * | 2009-06-05 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| US8882921B2 (en) * | 2009-06-08 | 2014-11-11 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| KR101074792B1 (ko) * | 2009-06-12 | 2011-10-19 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| KR101117719B1 (ko) * | 2009-06-24 | 2012-03-08 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| KR101127575B1 (ko) * | 2009-08-10 | 2012-03-23 | 삼성모바일디스플레이주식회사 | 증착 가림막을 가지는 박막 증착 장치 |
| JP5328726B2 (ja) | 2009-08-25 | 2013-10-30 | 三星ディスプレイ株式會社 | 薄膜蒸着装置及びこれを利用した有機発光ディスプレイ装置の製造方法 |
| JP5677785B2 (ja) | 2009-08-27 | 2015-02-25 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法 |
| US20110052795A1 (en) * | 2009-09-01 | 2011-03-03 | Samsung Mobile Display Co., Ltd. | Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same |
| US8696815B2 (en) | 2009-09-01 | 2014-04-15 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| US8876975B2 (en) | 2009-10-19 | 2014-11-04 | Samsung Display Co., Ltd. | Thin film deposition apparatus |
| KR101084184B1 (ko) | 2010-01-11 | 2011-11-17 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| KR101174875B1 (ko) | 2010-01-14 | 2012-08-17 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101193186B1 (ko) * | 2010-02-01 | 2012-10-19 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101156441B1 (ko) | 2010-03-11 | 2012-06-18 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 |
| KR101202348B1 (ko) | 2010-04-06 | 2012-11-16 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법 |
| US8894458B2 (en) | 2010-04-28 | 2014-11-25 | Samsung Display Co., Ltd. | Thin film deposition apparatus, method of manufacturing organic light-emitting display device by using the apparatus, and organic light-emitting display device manufactured by using the method |
| KR101223723B1 (ko) | 2010-07-07 | 2013-01-18 | 삼성디스플레이 주식회사 | 박막 증착 장치, 이를 이용한 유기 발광 디스플레이 장치의 제조방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR101673017B1 (ko) | 2010-07-30 | 2016-11-07 | 삼성디스플레이 주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 표시장치의 제조 방법 |
| KR101723506B1 (ko) | 2010-10-22 | 2017-04-19 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| KR101738531B1 (ko) | 2010-10-22 | 2017-05-23 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치의 제조 방법 및 이에 따라 제조된 유기 발광 디스플레이 장치 |
| KR20120045865A (ko) | 2010-11-01 | 2012-05-09 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
| KR20120065789A (ko) | 2010-12-13 | 2012-06-21 | 삼성모바일디스플레이주식회사 | 유기층 증착 장치 |
| JP5718362B2 (ja) * | 2010-12-14 | 2015-05-13 | シャープ株式会社 | 蒸着装置、蒸着方法、並びに、有機エレクトロルミネッセンス表示装置の製造方法 |
| KR101760897B1 (ko) | 2011-01-12 | 2017-07-25 | 삼성디스플레이 주식회사 | 증착원 및 이를 구비하는 유기막 증착 장치 |
| KR101852517B1 (ko) | 2011-05-25 | 2018-04-27 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| KR101840654B1 (ko) | 2011-05-25 | 2018-03-22 | 삼성디스플레이 주식회사 | 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
| KR101857249B1 (ko) | 2011-05-27 | 2018-05-14 | 삼성디스플레이 주식회사 | 패터닝 슬릿 시트 어셈블리, 유기막 증착 장치, 유기 발광 표시장치제조 방법 및 유기 발광 표시 장치 |
| KR101826068B1 (ko) | 2011-07-04 | 2018-02-07 | 삼성디스플레이 주식회사 | 유기층 증착 장치 |
| US20130269613A1 (en) * | 2012-03-30 | 2013-10-17 | Applied Materials, Inc. | Methods and apparatus for generating and delivering a process gas for processing a substrate |
| US9279185B2 (en) * | 2012-06-14 | 2016-03-08 | Asm Technology Singapore Pte Ltd | Feed-through apparatus for a chemical vapour deposition device |
| US9388494B2 (en) | 2012-06-25 | 2016-07-12 | Novellus Systems, Inc. | Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region |
| KR102017744B1 (ko) | 2012-12-12 | 2019-10-15 | 삼성디스플레이 주식회사 | 증착 장치, 이를 이용한 박막 형성 방법 및 유기 발광 표시 장치 제조 방법 |
| KR101448046B1 (ko) * | 2012-12-28 | 2014-10-15 | 엘아이지에이디피 주식회사 | 유기발광소자 제조장치 |
| US9399228B2 (en) | 2013-02-06 | 2016-07-26 | Novellus Systems, Inc. | Method and apparatus for purging and plasma suppression in a process chamber |
| JP5837962B1 (ja) * | 2014-07-08 | 2015-12-24 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法およびガス整流部 |
| US10954597B2 (en) * | 2015-03-17 | 2021-03-23 | Asm Ip Holding B.V. | Atomic layer deposition apparatus |
| US9758868B1 (en) | 2016-03-10 | 2017-09-12 | Lam Research Corporation | Plasma suppression behind a showerhead through the use of increased pressure |
| KR102935543B1 (ko) | 2019-07-17 | 2026-03-05 | 램 리써치 코포레이션 | 기판 프로세싱을 위한 산화 프로파일의 변조 |
| KR102894024B1 (ko) * | 2019-09-19 | 2025-12-02 | 가부시키가이샤 후지킨 | 기화 공급 장치 |
| DE102021117574A1 (de) * | 2021-07-07 | 2023-01-12 | Thyssenkrupp Steel Europe Ag | Beschichtungsanlage zur Beschichtung eines flächigen Gegenstands sowie ein Verfahren zum Beschichten eines flächigen Gegenstands |
| CN116555733B (zh) * | 2023-05-17 | 2024-07-05 | 拓荆科技(上海)有限公司 | 一种高温喷淋装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980032712A (ko) * | 1996-10-11 | 1998-07-25 | 마에다시게루 | 반응가스 분출 헤드 |
| KR20020038625A (ko) * | 2002-04-01 | 2002-05-23 | 배경빈 | 기상유기물 증착방법과 이를 이용한 기상유기물 증착장치 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3914515A (en) * | 1973-07-16 | 1975-10-21 | Rca Corp | Process for forming transition metal oxide films on a substrate and photomasks therefrom |
| GB8328858D0 (en) * | 1983-10-28 | 1983-11-30 | Atomic Energy Authority Uk | Metal vapour deposition |
| JPH0758036A (ja) * | 1993-08-16 | 1995-03-03 | Ebara Corp | 薄膜形成装置 |
| JP3452617B2 (ja) * | 1993-12-10 | 2003-09-29 | 真空冶金株式会社 | ガスデポジション装置 |
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- 2004-10-28 KR KR1020040086470A patent/KR101121417B1/ko not_active Expired - Lifetime
-
2005
- 2005-10-19 US US11/255,062 patent/US8157916B2/en active Active
- 2005-10-21 TW TW094136806A patent/TWI453800B/zh not_active IP Right Cessation
- 2005-10-26 CN CN2005101095762A patent/CN1766157B/zh not_active Expired - Fee Related
- 2005-10-27 JP JP2005312875A patent/JP4942985B2/ja not_active Expired - Fee Related
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| KR19980032712A (ko) * | 1996-10-11 | 1998-07-25 | 마에다시게루 | 반응가스 분출 헤드 |
| KR20020038625A (ko) * | 2002-04-01 | 2002-05-23 | 배경빈 | 기상유기물 증착방법과 이를 이용한 기상유기물 증착장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060090705A1 (en) | 2006-05-04 |
| TW200620421A (en) | 2006-06-16 |
| CN1766157A (zh) | 2006-05-03 |
| CN1766157B (zh) | 2010-08-25 |
| JP4942985B2 (ja) | 2012-05-30 |
| KR20060037513A (ko) | 2006-05-03 |
| JP2006124837A (ja) | 2006-05-18 |
| TWI453800B (zh) | 2014-09-21 |
| US8157916B2 (en) | 2012-04-17 |
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