KR101118210B1 - 인쇄회로기판의 외관 검사 시스템 및 방법 - Google Patents

인쇄회로기판의 외관 검사 시스템 및 방법 Download PDF

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Publication number
KR101118210B1
KR101118210B1 KR1020090021200A KR20090021200A KR101118210B1 KR 101118210 B1 KR101118210 B1 KR 101118210B1 KR 1020090021200 A KR1020090021200 A KR 1020090021200A KR 20090021200 A KR20090021200 A KR 20090021200A KR 101118210 B1 KR101118210 B1 KR 101118210B1
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KR
South Korea
Prior art keywords
inspection
image
region
camera
inspection object
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KR1020090021200A
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English (en)
Korean (ko)
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KR20100102900A (ko
Inventor
최현호
김민수
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아주하이텍(주)
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Priority to KR1020090021200A priority Critical patent/KR101118210B1/ko
Priority to JP2010021054A priority patent/JP2010217169A/ja
Priority to CN201010122193A priority patent/CN101832948A/zh
Publication of KR20100102900A publication Critical patent/KR20100102900A/ko
Application granted granted Critical
Publication of KR101118210B1 publication Critical patent/KR101118210B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G01N2021/8893—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques providing a video image and a processed signal for helping visual decision
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
KR1020090021200A 2009-03-12 2009-03-12 인쇄회로기판의 외관 검사 시스템 및 방법 KR101118210B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020090021200A KR101118210B1 (ko) 2009-03-12 2009-03-12 인쇄회로기판의 외관 검사 시스템 및 방법
JP2010021054A JP2010217169A (ja) 2009-03-12 2010-02-02 印刷回路基板の外観検査システム及びその方法
CN201010122193A CN101832948A (zh) 2009-03-12 2010-03-11 印刷电路板的外观检查系统及其方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090021200A KR101118210B1 (ko) 2009-03-12 2009-03-12 인쇄회로기판의 외관 검사 시스템 및 방법

Publications (2)

Publication Number Publication Date
KR20100102900A KR20100102900A (ko) 2010-09-27
KR101118210B1 true KR101118210B1 (ko) 2012-03-16

Family

ID=42717091

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090021200A KR101118210B1 (ko) 2009-03-12 2009-03-12 인쇄회로기판의 외관 검사 시스템 및 방법

Country Status (3)

Country Link
JP (1) JP2010217169A (zh)
KR (1) KR101118210B1 (zh)
CN (1) CN101832948A (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5267891B2 (ja) * 2010-09-30 2013-08-21 横河電機株式会社 シートに形成されたパターンの位置および形状測定装置および塗工パターン測定装置
TW201312503A (zh) 2011-09-15 2013-03-16 Chroma Ate Inc 一種處理用於測試之影像資料之系統及方法
KR101870718B1 (ko) * 2011-10-11 2018-07-20 엘지전자 주식회사 이물질을 판별하는 광학 장치 및 그 방법
WO2013069100A1 (ja) * 2011-11-08 2013-05-16 株式会社メガトレード プリント基板の検査装置
CN104280398A (zh) * 2013-07-05 2015-01-14 上海维锐智能科技有限公司 一种电子元器件的自动测试装置
CN103630544B (zh) * 2013-11-07 2016-09-14 江苏大学 一种视觉在线检测系统
TWI487924B (zh) * 2013-11-19 2015-06-11 Machvision Inc 印刷電路板的檢測方法及其裝置
JP6654805B2 (ja) * 2015-03-12 2020-02-26 日東電工株式会社 配線回路基板の製造方法および検査方法
JP2017049974A (ja) * 2015-09-04 2017-03-09 キヤノン株式会社 識別器生成装置、良否判定方法、およびプログラム
KR101714625B1 (ko) * 2015-09-21 2017-03-09 주식회사 온비젼 슬릿조명을 구비한 비젼검사시스템 및 비젼검사방법
JP6165297B1 (ja) * 2016-06-13 2017-07-19 日本メクトロン株式会社 基板検査装置および基板製造方法
WO2018056341A1 (ja) * 2016-09-21 2018-03-29 株式会社小森コーポレーション 印刷品質検査装置及び印刷品質検査方法
DE102017213262B4 (de) * 2017-08-01 2022-09-22 Heidelberger Druckmaschinen Ag Bilderfassung mit bereichsweiser Bildauflösung
KR101981394B1 (ko) * 2017-08-07 2019-05-22 김용관 컬러 영상을 이용한 고속 실시간 ｃｏｆ 필름 복합 검사장치
CN108344752A (zh) * 2018-02-08 2018-07-31 江西景旺精密电路有限公司 一种pcb外观自动检测装置及检测方法
CN113884508B (zh) * 2020-07-02 2024-05-03 由田新技股份有限公司 用于基板的线路量测系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100200213B1 (ko) * 1996-05-23 1999-06-15 윤종용 인쇄회로기판의 부품 검사장치
KR19990070849A (ko) * 1998-02-25 1999-09-15 이종수 인쇄회로기판의 납땜 검사장치 및 방법
JP2003303841A (ja) 2002-04-10 2003-10-24 Hitachi Ltd 半導体装置の製造方法
KR200384722Y1 (ko) * 2005-02-24 2005-05-17 삼성전기주식회사 인쇄회로 기판의 메탈/에스알 패턴 동시 검사장치 및 이에적용되는 조명장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100200213B1 (ko) * 1996-05-23 1999-06-15 윤종용 인쇄회로기판의 부품 검사장치
KR19990070849A (ko) * 1998-02-25 1999-09-15 이종수 인쇄회로기판의 납땜 검사장치 및 방법
JP2003303841A (ja) 2002-04-10 2003-10-24 Hitachi Ltd 半導体装置の製造方法
KR200384722Y1 (ko) * 2005-02-24 2005-05-17 삼성전기주식회사 인쇄회로 기판의 메탈/에스알 패턴 동시 검사장치 및 이에적용되는 조명장치

Also Published As

Publication number Publication date
CN101832948A (zh) 2010-09-15
JP2010217169A (ja) 2010-09-30
KR20100102900A (ko) 2010-09-27

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