KR101101892B1 - 검사용 프로브 - Google Patents
검사용 프로브 Download PDFInfo
- Publication number
- KR101101892B1 KR101101892B1 KR1020090108883A KR20090108883A KR101101892B1 KR 101101892 B1 KR101101892 B1 KR 101101892B1 KR 1020090108883 A KR1020090108883 A KR 1020090108883A KR 20090108883 A KR20090108883 A KR 20090108883A KR 101101892 B1 KR101101892 B1 KR 101101892B1
- Authority
- KR
- South Korea
- Prior art keywords
- inspection
- probe
- frame
- resist layer
- probes
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008291385A JP2010117268A (ja) | 2008-11-13 | 2008-11-13 | 検査用プローブ |
JPJP-P-2008-291385 | 2008-11-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100054099A KR20100054099A (ko) | 2010-05-24 |
KR101101892B1 true KR101101892B1 (ko) | 2012-01-05 |
Family
ID=42278919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090108883A KR101101892B1 (ko) | 2008-11-13 | 2009-11-12 | 검사용 프로브 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2010117268A (zh) |
KR (1) | KR101101892B1 (zh) |
CN (1) | CN101738510A (zh) |
TW (1) | TW201022680A (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5255459B2 (ja) * | 2009-01-06 | 2013-08-07 | 日本電子材料株式会社 | コンタクトプローブ |
JPWO2013061486A1 (ja) * | 2011-10-26 | 2015-04-02 | ユニテクノ株式会社 | コンタクトプローブおよびそれを備えた検査ソケット |
KR101439342B1 (ko) | 2013-04-18 | 2014-09-16 | 주식회사 아이에스시 | 포고핀용 탐침부재 |
JP6084591B2 (ja) * | 2014-08-05 | 2017-02-22 | 株式会社アイエスシーIsc Co., Ltd. | ポゴピン用プローブ部材 |
CN115575678A (zh) * | 2014-12-30 | 2023-01-06 | 泰克诺探头公司 | 包括用于测试头的多个接触探针的半成品及相关制造方法 |
KR102461856B1 (ko) * | 2014-12-30 | 2022-11-02 | 테크노프로브 에스.피.에이. | 검사 헤드용 접촉 프로브의 제조 방법 |
JP6740630B2 (ja) * | 2016-02-15 | 2020-08-19 | オムロン株式会社 | プローブピンおよびこれを用いた検査装置 |
WO2017209357A1 (ko) * | 2016-05-30 | 2017-12-07 | 주식회사 이노글로벌 | 양방향 도전성 핀, 양방향 도전성 패턴 모듈 및 그 제조방법 |
WO2017209356A1 (ko) * | 2016-05-30 | 2017-12-07 | 주식회사 이노글로벌 | 초정밀 가공 기술을 이용한 양방향 도전성 핀, 양방향 도전성 패턴 모듈 및 그 제조방법 |
JP2020180889A (ja) * | 2019-04-25 | 2020-11-05 | オムロン株式会社 | プローブピン、検査治具および検査ユニット |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01287484A (ja) * | 1988-05-16 | 1989-11-20 | Hitachi Ltd | プローブヘッド及びその製造方法とそれを用いた半導体lsi検査装置 |
JP2005156365A (ja) * | 2003-11-26 | 2005-06-16 | Shinko Electric Ind Co Ltd | 電気特性測定用プローブ及びその製造方法 |
KR20060118816A (ko) * | 2005-05-17 | 2006-11-24 | 주식회사 크라또 | 프로브 유닛 및 그 제조 방법 |
JP2008191027A (ja) * | 2007-02-06 | 2008-08-21 | Micronics Japan Co Ltd | プローブの製造方法 |
-
2008
- 2008-11-13 JP JP2008291385A patent/JP2010117268A/ja active Pending
-
2009
- 2009-11-11 TW TW098138277A patent/TW201022680A/zh unknown
- 2009-11-12 KR KR1020090108883A patent/KR101101892B1/ko active IP Right Grant
- 2009-11-13 CN CN200910206470A patent/CN101738510A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01287484A (ja) * | 1988-05-16 | 1989-11-20 | Hitachi Ltd | プローブヘッド及びその製造方法とそれを用いた半導体lsi検査装置 |
JP2005156365A (ja) * | 2003-11-26 | 2005-06-16 | Shinko Electric Ind Co Ltd | 電気特性測定用プローブ及びその製造方法 |
KR20060118816A (ko) * | 2005-05-17 | 2006-11-24 | 주식회사 크라또 | 프로브 유닛 및 그 제조 방법 |
JP2008191027A (ja) * | 2007-02-06 | 2008-08-21 | Micronics Japan Co Ltd | プローブの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2010117268A (ja) | 2010-05-27 |
TW201022680A (en) | 2010-06-16 |
CN101738510A (zh) | 2010-06-16 |
KR20100054099A (ko) | 2010-05-24 |
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