KR101101892B1 - 검사용 프로브 - Google Patents

검사용 프로브 Download PDF

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Publication number
KR101101892B1
KR101101892B1 KR1020090108883A KR20090108883A KR101101892B1 KR 101101892 B1 KR101101892 B1 KR 101101892B1 KR 1020090108883 A KR1020090108883 A KR 1020090108883A KR 20090108883 A KR20090108883 A KR 20090108883A KR 101101892 B1 KR101101892 B1 KR 101101892B1
Authority
KR
South Korea
Prior art keywords
inspection
probe
frame
resist layer
probes
Prior art date
Application number
KR1020090108883A
Other languages
English (en)
Korean (ko)
Other versions
KR20100054099A (ko
Inventor
미치오 가이다
미노루 가토
고스케 히로베
Original Assignee
니혼덴산리드가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 니혼덴산리드가부시키가이샤 filed Critical 니혼덴산리드가부시키가이샤
Publication of KR20100054099A publication Critical patent/KR20100054099A/ko
Application granted granted Critical
Publication of KR101101892B1 publication Critical patent/KR101101892B1/ko

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2896Testing of IC packages; Test features related to IC packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
KR1020090108883A 2008-11-13 2009-11-12 검사용 프로브 KR101101892B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008291385A JP2010117268A (ja) 2008-11-13 2008-11-13 検査用プローブ
JPJP-P-2008-291385 2008-11-13

Publications (2)

Publication Number Publication Date
KR20100054099A KR20100054099A (ko) 2010-05-24
KR101101892B1 true KR101101892B1 (ko) 2012-01-05

Family

ID=42278919

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090108883A KR101101892B1 (ko) 2008-11-13 2009-11-12 검사용 프로브

Country Status (4)

Country Link
JP (1) JP2010117268A (zh)
KR (1) KR101101892B1 (zh)
CN (1) CN101738510A (zh)
TW (1) TW201022680A (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5255459B2 (ja) * 2009-01-06 2013-08-07 日本電子材料株式会社 コンタクトプローブ
JPWO2013061486A1 (ja) * 2011-10-26 2015-04-02 ユニテクノ株式会社 コンタクトプローブおよびそれを備えた検査ソケット
KR101439342B1 (ko) 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
JP6084591B2 (ja) * 2014-08-05 2017-02-22 株式会社アイエスシーIsc Co., Ltd. ポゴピン用プローブ部材
CN115575678A (zh) * 2014-12-30 2023-01-06 泰克诺探头公司 包括用于测试头的多个接触探针的半成品及相关制造方法
KR102461856B1 (ko) * 2014-12-30 2022-11-02 테크노프로브 에스.피.에이. 검사 헤드용 접촉 프로브의 제조 방법
JP6740630B2 (ja) * 2016-02-15 2020-08-19 オムロン株式会社 プローブピンおよびこれを用いた検査装置
WO2017209357A1 (ko) * 2016-05-30 2017-12-07 주식회사 이노글로벌 양방향 도전성 핀, 양방향 도전성 패턴 모듈 및 그 제조방법
WO2017209356A1 (ko) * 2016-05-30 2017-12-07 주식회사 이노글로벌 초정밀 가공 기술을 이용한 양방향 도전성 핀, 양방향 도전성 패턴 모듈 및 그 제조방법
JP2020180889A (ja) * 2019-04-25 2020-11-05 オムロン株式会社 プローブピン、検査治具および検査ユニット

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287484A (ja) * 1988-05-16 1989-11-20 Hitachi Ltd プローブヘッド及びその製造方法とそれを用いた半導体lsi検査装置
JP2005156365A (ja) * 2003-11-26 2005-06-16 Shinko Electric Ind Co Ltd 電気特性測定用プローブ及びその製造方法
KR20060118816A (ko) * 2005-05-17 2006-11-24 주식회사 크라또 프로브 유닛 및 그 제조 방법
JP2008191027A (ja) * 2007-02-06 2008-08-21 Micronics Japan Co Ltd プローブの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01287484A (ja) * 1988-05-16 1989-11-20 Hitachi Ltd プローブヘッド及びその製造方法とそれを用いた半導体lsi検査装置
JP2005156365A (ja) * 2003-11-26 2005-06-16 Shinko Electric Ind Co Ltd 電気特性測定用プローブ及びその製造方法
KR20060118816A (ko) * 2005-05-17 2006-11-24 주식회사 크라또 프로브 유닛 및 그 제조 방법
JP2008191027A (ja) * 2007-02-06 2008-08-21 Micronics Japan Co Ltd プローブの製造方法

Also Published As

Publication number Publication date
JP2010117268A (ja) 2010-05-27
TW201022680A (en) 2010-06-16
CN101738510A (zh) 2010-06-16
KR20100054099A (ko) 2010-05-24

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