KR101097074B1 - Substrate polishing apparatus and substrate polishing method - Google Patents

Abstract

The present invention provides a substrate polishing apparatus capable of smoothly polishing a glass substrate for a long time.

In the present invention, an intermediate sheet having a higher rigidity in the tensile direction than the adsorption sheet is bonded between the membrane body and the adsorption sheet. Due to the polishing resistance generated during polishing, the film is stretched in the tensile direction and peeling may occur between the intermediate sheet and the film due to the expansion and contraction of the film, and the glass is interposed between the film and the adsorption sheet. Since the intermediate sheet is not stretched in the tensile direction between the adsorption sheet whose expansion and contraction is constrained by the adsorption of the substrate G, and the intermediate sheet having a higher rigidity in the tensile direction than the adsorption sheet, relative shifting does not occur. Peeling from an intermediate sheet can prevent it from rolling up.

Substrate polishing apparatus

Description

Substrate polishing apparatus and substrate polishing method {SUBSTRATE POLISHING APPARATUS AND SUBSTRATE POLISHING METHOD}

TECHNICAL FIELD This invention relates to the grinding | polishing apparatus of a board | substrate. Specifically, It is related with the grinding | polishing apparatus of the board | substrate for manufacturing the thin glass substrate used for a flat panel display etc. by grinding | polishing a glass substrate, and the grinding | polishing method of the board | substrate using the polishing apparatus.

As one of the manufacturing methods of the thin glass substrate for flat panel displays, such as a liquid crystal display, the manufacturing method using the shaping | molding method called a float method is known. This manufacturing method is a method of forming a thin plate with a thickness of 0.5 to 1.1 mm by shaping the molten glass into a plate by the float method, and then polishing and removing minute unevenness and undulation of the surface of the glass plate by a polishing apparatus.

The applicant of this application proposes the grinding | polishing apparatus which targets the thin glass substrate especially for flat panel displays in patent document 1. The polishing apparatus supplies a pressurized fluid between a film body having an adsorption sheet for adsorbing and holding a substrate and a carrier to which the film body is attached, and presses the substrate adsorbed and held on the adsorption sheet to the polishing surface by the pressure of the pressurized fluid. Paste and polish.

In addition, the membrane body disclosed in Patent Document 1 is composed of an airtight holding layer, a strength maintaining layer, and a smoothing layer, and the adsorption sheet is composed of a porous foamed polyurethane sheet having self adsorption force.

However, in the polishing apparatus disclosed in Patent Document 1, there has been a problem that the adsorption sheet is peeled off and wound up from the film body during the polishing of the substrate to damage the substrate. As for the cause of breakage of the substrate generated during polishing, the applicant of the present application has found that it is caused by the following idea as a result of thorough analysis in a test by a practical machine.

That is, the film body receives a force in the tensile direction (extension direction: plane direction) from the polishing plate in a relationship in which polishing resistance is generated between the substrate and the polishing plate during polishing of the substrate. In addition, since the carrier and the polishing plate rotate during the polishing, the film body is stretched in the tensile direction by the force repeatedly stretched in the tensile direction by the force.

Here, there is no problem if the adsorption sheet adhered to the membrane and softer than the membrane is stretched after the membrane. However, since the substrate is adsorbed and held on the adsorption sheet, that is, the expansion and contraction operation of the adsorption sheet is restricted by the substrate, the expansion and contraction in the tensile direction of the adsorption sheet is restricted. By this phenomenon, relative shift | offset | difference arises between a membrane body which expands and contracts and an adsorption | suction sheet which does not expand | stretch, and the peripheral part of an adsorption sheet peels slowly from a membrane body by this shift | offset | difference. And when the peeled part becomes large, the peeled part will curl up during grinding | polishing. Since this problem causes breakage of the substrate, maintenance is required.

[Patent Document 1] Japanese Unexamined Patent Publication No. 2004-122351

DISCLOSURE OF INVENTION

Problems to be Solved by the Invention

This invention is made | formed in view of the above problem, Comprising: It aims at providing the grinding | polishing apparatus of the board | substrate which can smoothly grind a board | substrate over a long time, and the grinding | polishing method of the board | substrate using the polishing apparatus.

Means to solve the problem

In order to achieve the above object, the present invention is to supply a pressurized fluid between the membrane body with the adsorption sheet attached to the substrate and the carrier to which the membrane body is attached, and the substrate adsorbed and held on the adsorption sheet is In a polishing apparatus for pressing and polishing a polishing plate by pressure, an intermediate sheet is bonded between the film body and the adsorption sheet, and the rigidity of the intermediate sheet in the tensile direction is higher than the rigidity of the tensile direction of the adsorption sheet. It provides a polishing apparatus for a substrate, characterized in that.

In the present invention, the intermediate sheet is bonded between the membrane body and the adsorption sheet. For this reason, although peeling may occur between the intermediate | middle sheet and a film | membrane by the extension | stretching operation | movement of the tension | pulling direction of a film | membrane body by polishing resistance, a relative shift | offset | difference does not arise between an intermediate | middle sheet and an adsorption sheet. This is because the expansion and contraction of the adsorption sheet is restricted by the adsorption of the substrate, and the intermediate sheet has a higher rigidity in the tensile direction than the adsorption sheet and does not stretch in the tensile direction. As a result, the adsorption sheet does not peel off from the intermediate sheet, and the adsorption sheet can be prevented from being peeled off and curled up.

In a preferred embodiment of the present invention, the adsorbent sheet is made of foamed polyurethane, and the intermediate sheet is made of polycarbonate, acrylic, aluminum, stainless steel, glass, or carbon fiber reinforced plastics (CFRP). Can be. By manufacturing the intermediate sheet from these materials, it is possible to provide an intermediate sheet having a high rigidity that does not stretch in the tensile direction during polishing of the substrate. It is more preferable if the said intermediate sheet consists of polycarbonate.

In addition to these materials, ABS (Acrylonitrile Butadiene Styrene) and Fiber Reinforced Plastics (FRP) can also be exemplified.

The present invention also provides a method of polishing a substrate, wherein the substrate is polished using the polishing apparatus described above.

Effects of the Invention

According to the polishing apparatus of the substrate and the polishing method of the substrate according to the present invention, since the intermediate sheet having a higher rigidity in the tensile direction than the adsorption sheet is interposed between the membrane body and the absorption sheet, the intermediate sheet is stretched in the tensile direction even if the membrane body is stretched in the tensile direction. Since it does not expand and contract, the relative shift | offset | difference does not generate | occur | produce between an adsorption sheet and an intermediate sheet, and it can prevent that an adsorption sheet peels and rolls up from an intermediate sheet. As a result, the substrate can be smoothly polished for a long time by the polishing apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS It is a top view which shows the whole structure of the grinding | polishing apparatus of 1st Embodiment.

2 is a side view showing an embodiment of a polishing head and a polishing stage.

3 is an assembled perspective view of the polishing head.

4 is an explanatory diagram showing a three-layer structure of a membrane body of a membrane frame.

Fig. 5 is an enlarged sectional view of the main portion showing the detachable structure of the membrane frame with respect to the sliding ring.

6 is a side view showing the arrangement of a membrane body, an intermediate sheet, and an adsorption sheet.

* Description of the sign *

G… Glass substrate, 10... Polishing apparatus, 12... Conveyor, 14... The last frame, 16... Stage 18... First polishing stage, 20... Second polishing stage, 22... Stage, 24... Glass substrate transport conveyor, 26... Membrane cleaning stage, 28... Film-drying stage, 30... Final conveyer, 32 ... robot, 33... Arm, 34... Adsorption pad, 36... Conveyor, 38... ... .., 42. Hart, 44... Airtight layer 46. Strength retention layer, 48... Smooth layer, 50.. Polishing head, 51... Body casing, 52... Carrier, 53.. Lower outer ring portion 54... Air chamber 56... Spindle, 58... Polishing pad, 60... Polishing pad, 62... Polishing plate, 64.. Rotation axis 66... Polishing plate, 68... Rotation axis 70... Linear guide, 72... Guide rail, 74... Maintenance stage, 76... Maintenance stage, 78... Lifting ring, 80... Through hole, 82... Sliding ring, 84.. Sliding ring suspension, 86... Upper spring, 88... Lifting spring, 90.. Through hole, 92... Screw jack, 94... Stopper pin, 96... Line shaft, 98... Nozzle, 100.. Air chamber 102. Air supply, 104.. Valve, 106.. Air pump, 108... Pin, 110... Head portion 112... Hook, 114... Pin, 116... Hole, 118... Stopper plate, 120... Air flow path, 122... Nip member, 124. Nip plate, 126... Paul, 128... Through hole, 130... Through hole, 138... Conveyor, 140... Robot, 142... Arm, 144... Adsorption head, 146... Conveyor, 150, 152, 154... Conveying device, 160... Guide rail, 170... Guide rail, 200.. Adsorption sheet, 210... Middle sheet

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of the grinding | polishing apparatus of the board | substrate which concerns on this invention, and the board | substrate grinding method which concerns on this invention is described in detail.

The polishing apparatus 10 of the board | substrate shown in FIG. 1 is the flatness required for the single side | surface of the large glass substrate G (for example, one side exceeds 2000 mm, thickness 0.5mm-1.1mm) for the glass substrate for liquid crystal displays. It is a polishing device for polishing on the road.

The polishing apparatus 10 includes a conveyor 12 for conveying the glass substrate G before polishing, a stage 16 for adhering the glass substrate G to the film frame 14, a first polishing stage 18, and a second one. The polishing stage 20, the stage 22 for removing the polished glass substrate G from the film mold 14, the glass substrate carrying conveyor 24, the film cleaning stage 26, the film drying stage 28, and The mainframe conveying conveyor 30 is comprised as a main element.

In addition, the polishing apparatus 10 includes the conveying apparatus 150 for conveying the film frame 14 from the stage 16 to the first polishing stage 18, and the second polishing stage 20 from the first polishing stage 18. The conveying apparatus 152 which conveys the film frame 14, and the conveying apparatus 154 which conveys the film frame 14 from the 2nd grinding | polishing stage 20 to the stage 22 are formed.

The glass substrate G before the grinding | polishing conveyed by the conveyor 12 is adsorbed-held by the adsorption pad 34 formed in the arm 33 of the robot 32. As shown in FIG. And it moves and mounts from the conveyor 12 to the conveyor 36 by the rotation operation of the arm 33, and is conveyed toward the stage 16 by the conveyor 36. As shown in FIG.

In the stage 16, first, the glass substrate G is held by the film frame 14. Next, this holding method is described. The film frame 14 is held in a lifting device (not shown) which is a glass substrate adhesion means in the stage 16, and the film frame 14 is lifted by the glass substrate G where the glass substrate G is located below the film frame 14. It moves downward by the film | membrane, and the film body 38 of FIG. 2 installed in the film frame 14 is pressed against the glass substrate G. FIG.

While the adsorption sheet 200 made of porous polyurethane foam which self-adsorbs the glass substrate G is adhere | attached on the lower surface of the membrane body 38, the polycarbonate intermediate sheet | seat between this adsorption sheet 200 and the membrane body 38 210 is interposed and adhere | attached on the adsorption sheet 200 and the film | membrane 38. As shown in FIG.

The glass substrate G is pressed against the adsorption sheet 200 by the pressing force by the above-mentioned lifting device, and is adsorbed and held by the adsorption sheet 200. Thereafter, the film frame 14 is held by the conveying apparatus 150 of FIG. 1, conveyed to the first polishing stage 18 of FIG. 3, and attached to the carrier 52 here.

As shown in Fig. 2, the membrane frame 14 is provided with the membrane body 38 between the upper frame 40 and the lower bottle 42, and then the upper frame 40 and the lower bottle 42 are fastened by bolts (not shown). It is composed. In addition, the film | membrane 14 and the film | membrane 38 are not limited to a circle | round | yen, and may be rectangular.

This film body 38 is comprised by the two-layered structure which consists of the airtight holding layer 44 and the strength holding layer 46 like FIG. As shown in Figs. 2 and 5, the hermetic holding layer 44 is in close contact with the lower outer ring portion 53 of the carrier 52 to provide airtightness with the air chamber 54 of the carrier 52. It is a sheet | seat material to hold. Examples of the material for the sheet material include rubbers, silicones, fluorine resins, vinyls such as vinyl chloride (PVC), nylons, urethanes, and the like. In addition, the strength maintenance layer 46 of FIG. 4 is a sheet | seat material which has predetermined tensile strength which can hold | maintain the airtight holding layer 44, and can withstand the tension which mounts the film body 38 whole. Moreover, the intermediate sheet 210 is adhere | attached on the lower surface. As this adhesive agent, the adhesive agent etc. which are used for the conventional film body can be used suitably, For example, a urethane type adhesive agent or an epoxy type adhesive agent can be used preferably.

The material of the strength retaining layer 46 is aramid fiber, stainless steel wire mesh, steel wire mesh, carbon fiber, glass fiber, nylon fiber, metal sheet, resin sheet, and the like. desirable.

Next, although the polishing head 50 shown in FIG. 3 is demonstrated, since the polishing head 50 of the 1st polishing stage 18 and the polishing head 50 of the 2nd polishing stage 20 are the same structure, It demonstrates with the same code | symbol.

The polishing head 50 is comprised by the motor in the main-body casing 51, Comprising: The output shaft of this motor is connected to the spindle 56 fell in the perpendicular direction. The carrier 52 is connected to this spindle 56. In addition, the main body casing 51 is connected to the slider 158 via the lifting mechanism 156. By the elevating mechanism 156, the main body casing 51 is raised and lowered relative to the slider 158 so that the carrier 52 is polished to the polishing pad 58 of the first polishing stage 18, and the second polishing stage 20. While moving forward and backward with respect to the polishing pad 60, the glass substrate G adhered to the film frame 14 can be pressed against the polishing pads 58 and 60 at a predetermined polishing pressure.

The polishing pad 58 is attached to the upper surface of the polishing platen 62, and a rotating shaft 64 that is rotated by a motor (not shown) is connected to the lower portion of the polishing platen 62. In addition, the polishing pad 60 is attached to the upper surface of the polishing platen 66, and a rotating shaft 68 that is rotated by a motor (not shown) is connected to the lower portion of the polishing platen 66.

Moreover, the main body casing 51 is connected to the idle drive mechanism which is not shown in figure, and also has a function to revolve with a predetermined | prescribed idle radius. The idle drive mechanism can also be configured by incorporating the planetary gear mechanism in the main body casing 51 and connecting the output shaft of the planetary gear mechanism to the spindle 56. The above is the structure of each grinding | polishing stage 18 and 20, glass substrate G is polished by these polishing stages 18 and 20, and the minute unevenness | corrugation and relief of the surface of glass substrate G are removed.

On the other hand, the linear motion guides 70 and 70 are attached to the slider 158 of the first polishing stage 18. The linear guides 70 and 70 are fitted to the guide rails 72 and 72. These guide rails 72 and 72 are arranged toward the maintenance stage 74 which maintains the spindle 56 and the carrier 52 of the 1st grinding | polishing stage 18 like FIG.

In addition, the linear motion guides 70 and 70 are similarly attached to the slider 158 of the second polishing stage 20 as shown in FIG. 2, and the linear motion guides 70 and 70 are fitted to the guide rails 160 and 160. It is aligned. These guide rails 160 and 160 are arrange | positioned toward the maintenance stage 76 which maintains the spindle 56 and the carrier 52 of the 2nd grinding | polishing stage 20 like FIG.

The carrier 52 is fixed to the upper outer periphery of the carrier 52 by bolts not shown by the lifting ring 78 as shown in FIG. 2. In the flange portion protruding from the outer circumferential portion of the carrier 52 of the lifting ring 78, a plurality of through holes 80, 80... Are formed on the concentric circles at equal intervals. The sliding ring suspension 84 formed to protrude on the upper surface of 82 is penetrated from below as shown in FIG. In addition, the sliding ring suspension 84 is penetrated by the lifting spring 88 disposed between the lifting ring 78 and the lifting upper spring 86, and the through hole 90 of the lifting upper spring 86 is provided. It penetrates through and is connected to the screw jack 92.

Therefore, when the screw jack 92 is operated and the sliding ring suspension 84 is pulled upward against the elastic bearing force of the lifting spring 88, the sliding ring 82 is pulled up against the carrier 52. . Thereby, the membrane frame 14 detachably attached to the sliding ring 82 is pulled up, and a predetermined tension is applied to the membrane body 38.

When the tension is automatically applied, a plurality of membrane frames 14 and a membrane body 38 are prepared and operated. However, it can be considered that there is an individual difference in the initial tension of the membrane 38 relative to the membrane frame 14, and due to the difference in the use time, there is a difference in the initial tension of the plurality of membrane bodies 38, 38... It is difficult to give equal use tension to the film body 38 having a tension individual difference. In addition, if exaggerated force is applied to the membrane 38, there is a risk that the membrane 38 and the peripheral device are damaged. In order to solve this, the contraction amount of the lifting spring 88 (gap between the lifting ring 78 and the lifting upper spring 86) is monitored. That is, not only the lifting amount of the screw jack 92 but also the tension actually applied to the membrane body 38 is measured by monitoring the shrinkage amount of the lifting spring 88. By having this lifting spring 88, it is possible to solve the problem that a constant tension is applied to the film body 38 and to prevent the exaggeration force from being applied to the film body 38. In addition, in order to make the tension constant, it is necessary to measure the amount of shrinkage of the lifting spring 88, which, as one means, is a current value of a motor (not shown) connected to the screw jack 92 through the line shaft 96. The torque applied to the membrane body 38 can be monitored by calculating the torque from the force, indirectly acquiring the force for pulling up the screw jack 92, and managing the torque. The line shaft 96 is a shaft that transmits the driving force of the motor to the screw jack 92. Reference numeral 94 denotes a stopper pin for receiving the reaction force of the lifting spring 88 generated between the lifting ring 78 and the lifting upper spring 86.

The carrier 52 is provided with a plurality of injection holes 98, 98... That blow off compressed air (pressurized fluid) in the air chamber 54 of FIG. 5. These injection ports 98, 98... Communicate with the air supply path 102 shown by broken lines on FIG. 3 through the air chamber 100 formed on the upper surface of the carrier 52. The air supply passage 102 extends out of the polishing head 50 through a rotary joint (not shown) attached to the polishing head 50, and is connected to the air pump 106 through the valve 104. . Therefore, when the valve 104 is opened, the compressed air from the air pump 106 is supplied to the air chamber 54 through the air supply path 102, the air chamber 100, and the injection port 98. Thereby, the tension of compressed air is transmitted to the glass substrate G through the film body 38, and by this pressure, the glass substrate G is pressed against the polishing pads 58 and 60, and it grind | polishes.

On the other hand, as shown in FIG. 2, a plurality of fins 108, 108... Protrude at equal intervals on the concentric circles on the upper frame 40 of the membrane frame 14, and are formed in the upper end portions of these fins 108, as shown in FIG. 5. The membrane frame 14 is attached to the sliding ring 82 by the large-diameter head 110 being engaged with the hook 112 fixed to the lower portion of the sliding ring 82. The engagement force between the head 110 and the hook 112 is strengthened by the reaction force of the film 38 when the film 38 is raised by the screw jack 92, and the film 38 at the time of polishing. The head portion 110 does not come out of the hook 112 with the polishing resistance received from the.

When the polishing of the glass substrate G is finished in the second polishing stage 20 shown in FIG. 1, the film frame 14 is separated from the carrier 52 and is conveyed to the stage 22 by the conveying device 154. do. The method of detaching the film frame 14 from the carrier 52 first operates in the direction of loosening the screw jack 92 shown in FIG. 5 to release the tension of the film body 38. Next, the membrane frame 14 is rotated by a predetermined angle with respect to the carrier 52, and the head part 110 is separated from the hook 112. As a result, the membrane frame 14 is separated from the carrier 52.

In the stage 22 shown in FIG. 1, the polishing finished glass substrate G is peeled from the film frame 14 conveyed by the conveying device 154. The peeled glass substrate G is conveyed by the conveyor 138, and is adsorb | sucked by the adsorption head 144 attached to the arm 142 of the robot 140, and is operated by the operation of the robot 140. It is moved and mounted on the conveyor 24 for carrying out, and it is carried out to the exterior of the grinding | polishing apparatus 10. As shown in FIG.

The film frame 14 in which the glass substrate G was peeled off is conveyed to the film frame cleaning stage 26 by the conveyor 146, and water-washed here. The film | membrane 14 by which washing | cleaning was complete | finished is conveyed to the film | membrane drying stage 28 by the conveyor 148, and is heated and dried here. And the film frame 14 with which drying was complete | finished is conveyed to the stage 16 by the film frame conveyer 30, and is reused for adhesion of the glass substrate G. As shown in FIG. The above is the whole structure of the polishing apparatus 10.

The film 38 receives the force in the tensile direction (extension direction: plane direction) in the relation that the film body 38 receives the polishing resistance generated between the glass substrate G and the polishing pads 58 and 60 during polishing of the glass substrate G. 58, 60). In addition, since the carrier 52 and the polishing pads 58 and 60 are rotated during polishing, the film 38 is repeatedly stretched in the tensile direction by the force and stretches in the tensile direction.

Here, in the conventional structure in which the adsorption sheet 200 that is softer than the membrane body 38 is directly bonded to the membrane body 38, the adsorption sheet 200 during polishing is considered to be followed by expansion and contraction of the membrane body 38. There is no problem when the sheet 200 performs the stretching operation, but since the glass substrate G is adsorbed and held on the adsorption sheet 200, that is, the stretching operation of the adsorption sheet 200 is restricted by the glass substrate G. Since it is received, expansion and contraction in the tensile direction of the adsorption sheet 200 is restricted. Due to this idea, a relative shift occurs between the stretched membrane body 38 and the non-stretched adsorption sheet 200, and the peripheral edge of the adsorption sheet 200 is gradually peeled off from the membrane body 38 by the shift. When the exfoliated portion becomes large, the exfoliated portion curls up during polishing.

Therefore, in order to prevent such a problem, in the structure of embodiment, as shown in FIG. 6, the intermediate | middle sheet 210 with high rigidity of the tension direction compared with the adsorption sheet 200 is carried out, the film body 38 and the adsorption sheet 200 are shown. It is interposed between them, and is bonded.

According to this structure, the film body 38 expands and contracts in the tensile direction as described above due to the polishing resistance generated during polishing, but the intermediate sheet 210 is interposed between the film body 38 and the adsorption sheet 200. Therefore, there is a case where peeling occurs between the intermediate sheet 210 and the membrane body 38 due to the expansion and contraction of the membrane body 38, and the adsorption of the glass substrate G between the intermediate sheet 210 and the adsorption sheet 200 may occur. Is not stretched in the tensile direction between the adsorption sheet 200 that is stretched and constrained by the elastic sheet, and the intermediate sheet 210 having a higher rigidity in the tensile direction than the adsorption sheet 200 does not cause relative misalignment. Do not. Therefore, since the adsorption sheet 200 is not peeled from the intermediate sheet 210, it can prevent that the adsorption sheet 200 peels and rolls up.

Therefore, according to the polishing apparatus 10 of embodiment, glass substrate G can be smoothly polished over a long time.

In addition, although the raw material of the intermediate sheet 210 was made into polycarbonate in embodiment, it is not limited to this, Acrylic, aluminum, stainless steel, glass, or carbon fiber reinforced plastics may be sufficient. In addition to these materials, ABS (Acrylonitrile Butadiene Styrene) and FRP (Fiber Reinforced Plastics) can also be exemplified.

Moreover, since the film body 38 was comprised by the airtight holding layer 44 and the strength holding layer 46, and it was set as the structure which adhere | attaches the intermediate sheet 210 to the strength holding layer 46, The adhered smooth layer can be eliminated, and the cost of the film body 38 can be reduced.

This invention is suitable for the grinding | polishing of the glass substrate for manufacturing the thin glass substrate used for a flat panel display etc.

In addition, all the content of the JP Patent application 2005-239040, a claim, drawing, and the abstract for which it applied on August 19, 2005 is referred here, and it introduces as an indication of the specification of this invention.

Claims (6)

A pressurized fluid is supplied between the membrane body with the adsorption sheet to which the substrate is adsorbed and the carrier to which the membrane is attached, and the substrate adsorbed and held by the adsorption sheet is pressed against the polishing plate by the pressure of the pressurized fluid and polished. In the polishing apparatus, An intermediate sheet is adhered between the membrane and the adsorption sheet, The stiffness in the tensile direction of the intermediate sheet is higher than the stiffness in the tensile direction of the adsorption sheet, The film body is composed of a double structure consisting of an airtight holding layer and a strength holding layer, and an intermediate sheet is adhered to the lower surface of the strength holding layer. The method of claim 1, The adsorption sheet is made of foamed polyurethane, And said intermediate sheet is made of polycarbonate, acrylic, aluminum, stainless steel, glass or carbon fiber reinforced plastic. The method of claim 2, A polishing apparatus for a substrate, wherein the intermediate sheet is made of polycarbonate. 4. The method according to any one of claims 1 to 3, A polishing apparatus for a substrate, wherein the adsorption sheet is bonded to the film body mounted on the carrier via an intermediate sheet. delete A substrate polishing method using a polishing apparatus for a substrate according to any one of claims 1 to 3.

Images