TW200720018A - Substrate polishing apparatus and substrate polishing method - Google Patents

Substrate polishing apparatus and substrate polishing method

Info

Publication number
TW200720018A
TW200720018A TW095130466A TW95130466A TW200720018A TW 200720018 A TW200720018 A TW 200720018A TW 095130466 A TW095130466 A TW 095130466A TW 95130466 A TW95130466 A TW 95130466A TW 200720018 A TW200720018 A TW 200720018A
Authority
TW
Taiwan
Prior art keywords
sheet
suction
film body
intermediate sheet
substrate polishing
Prior art date
Application number
TW095130466A
Other languages
Chinese (zh)
Other versions
TWI389767B (en
Inventor
Takashi Kubo
Hiroshi Kimura
Minoru Yokota
Junichi Miyashita
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW200720018A publication Critical patent/TW200720018A/en
Application granted granted Critical
Publication of TWI389767B publication Critical patent/TWI389767B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

Provided is a substrate polishing apparatus which can smoothly polish a glass substrate for a long time. An intermediate sheet, which has a high rigidity in a tensile direction compared with that of a suction sheet, is sandwiched between a film body and the suction sheet and bonded. There are cases where the film body expands and contracts in the tensile direction due to polish resistance generated during polishing, and that peeling is generated between the intermediate sheet and the film body due to expansion and contraction of the film body. Since the intermediate sheet is arranged between the film body and the suction sheet, the intermediate sheet does not expand nor contact in the tensile direction between the suction sheet wherein expansion and contraction are limited due to suction of the glass substrate (G) and the intermediate sheet having higher rigidity in the tensile direction than that of the suction sheet. Thus, relative shift is not generated and the suction sheet is prevented from peeling and rolling up from the intermediate sheet.
TW095130466A 2005-08-19 2006-08-18 Substrate grinding apparatus and substrate grinding method TWI389767B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005239040 2005-08-19

Publications (2)

Publication Number Publication Date
TW200720018A true TW200720018A (en) 2007-06-01
TWI389767B TWI389767B (en) 2013-03-21

Family

ID=37757521

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130466A TWI389767B (en) 2005-08-19 2006-08-18 Substrate grinding apparatus and substrate grinding method

Country Status (4)

Country Link
JP (1) JP5013200B2 (en)
KR (1) KR101097074B1 (en)
TW (1) TWI389767B (en)
WO (1) WO2007020859A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012179680A (en) * 2011-03-01 2012-09-20 Asahi Glass Co Ltd Method for polishing glass plate
JP2012192470A (en) * 2011-03-15 2012-10-11 Asahi Glass Co Ltd Plate-like body polishing apparatus
JP2015171733A (en) * 2012-07-13 2015-10-01 旭硝子株式会社 Polishing device of plate-like body and polishing method of plate-like body
JP2015171734A (en) * 2012-07-18 2015-10-01 旭硝子株式会社 Polishing device for plate-like body and polishing method for plate-like body
JP2017127938A (en) * 2016-01-21 2017-07-27 信越半導体株式会社 Wafer polishing method, back pad manufacturing method, back pad, and polishing head having the back pad
KR102040019B1 (en) * 2017-11-28 2019-11-04 윤주영 Carbon fiber reinforced plastic molded article and supporting unit for polishing glass base plate comprising the same
CN113172539B (en) * 2021-06-30 2021-08-31 南通环球光学仪器有限公司 Positioning jig and positioning method for mechanical engineering casting

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000167762A (en) * 1998-12-04 2000-06-20 Speedfam-Ipec Co Ltd Carrier and cmp device
US6494774B1 (en) * 1999-07-09 2002-12-17 Applied Materials, Inc. Carrier head with pressure transfer mechanism
JP2001138223A (en) * 1999-11-10 2001-05-22 Sony Corp Grinding head and grinding apparatus
JP2003257910A (en) * 2001-12-28 2003-09-12 Fujikoshi Mach Corp Method for polishing copper layer of substrate
JP4207153B2 (en) * 2002-07-31 2009-01-14 旭硝子株式会社 Substrate polishing method and apparatus
JP2004268157A (en) * 2003-03-05 2004-09-30 Tamagawa Machinery Co Ltd Glass substrate polishing head, polishing device using this polishing head, glass substrate polishing method and glass substrate

Also Published As

Publication number Publication date
JP5013200B2 (en) 2012-08-29
KR101097074B1 (en) 2011-12-22
KR20080035644A (en) 2008-04-23
JPWO2007020859A1 (en) 2009-02-26
WO2007020859A1 (en) 2007-02-22
TWI389767B (en) 2013-03-21

Similar Documents

Publication Publication Date Title
TW200720018A (en) Substrate polishing apparatus and substrate polishing method
KR102099188B1 (en) Device for peeling substrate, method for peeling substrate and method for producing electronic device
TW200712607A (en) Flexible pixel array substrate and method of fabricating the same
WO2010129459A3 (en) Carrier for glass substrates
WO2009041422A1 (en) Polishing pad
WO2009137290A3 (en) 3-dimensional curved substrate lamination
MY153006A (en) Wafer processing film
WO2009066704A1 (en) Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module
EP2816588A3 (en) Diamond semiconductor element and process for producing the same
TW200732156A (en) Method for transferring a multilayer body and a transfer film
SG11201807645SA (en) Supporting sheet and composite sheet for protective film formation
TW200500657A (en) Adhesion type optical film, method for manufacturing adhesion type optical film, and image display device
TW200636009A (en) Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet
TW200710195A (en) Pressure-sensitive adhesive sheet, production method thereof and method of processing articles
WO2006081315A3 (en) Method of eliminating curl for devices on thin flexible substrates, and devices made thereby
MX2007002658A (en) Repositionable optical film.
TW200603946A (en) Polishing pad for electrochemical mechanical polishing
EP2063293A3 (en) Optical sheet, method for manufacturing the same , and liquid crystal display using the same
TW200708587A (en) Anisotropic conductive film and method for producing the same
WO2011047670A3 (en) Device for stiffening a workpiece by means of a clamping plate, and method for retaining and processing a workpiece with a clamping plate
WO2017065155A1 (en) Device for delaminating laminate, delamination method, and method for manufacturing electronic device
WO2008120578A1 (en) Metal film polishing pad and method for polishing metal film using the same
KR102100160B1 (en) Device for peeling substrate, method for peeling substrate and method for producing electronic device
US20160001521A1 (en) Curved display device and method of fabricating the same
WO2008081561A1 (en) Perforated support plate