TW200720018A - Substrate polishing apparatus and substrate polishing method - Google Patents
Substrate polishing apparatus and substrate polishing methodInfo
- Publication number
- TW200720018A TW200720018A TW095130466A TW95130466A TW200720018A TW 200720018 A TW200720018 A TW 200720018A TW 095130466 A TW095130466 A TW 095130466A TW 95130466 A TW95130466 A TW 95130466A TW 200720018 A TW200720018 A TW 200720018A
- Authority
- TW
- Taiwan
- Prior art keywords
- sheet
- suction
- film body
- intermediate sheet
- substrate polishing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 238000005498 polishing Methods 0.000 title abstract 4
- 238000000034 method Methods 0.000 title 1
- 230000008602 contraction Effects 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 238000005096 rolling process Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Provided is a substrate polishing apparatus which can smoothly polish a glass substrate for a long time. An intermediate sheet, which has a high rigidity in a tensile direction compared with that of a suction sheet, is sandwiched between a film body and the suction sheet and bonded. There are cases where the film body expands and contracts in the tensile direction due to polish resistance generated during polishing, and that peeling is generated between the intermediate sheet and the film body due to expansion and contraction of the film body. Since the intermediate sheet is arranged between the film body and the suction sheet, the intermediate sheet does not expand nor contact in the tensile direction between the suction sheet wherein expansion and contraction are limited due to suction of the glass substrate (G) and the intermediate sheet having higher rigidity in the tensile direction than that of the suction sheet. Thus, relative shift is not generated and the suction sheet is prevented from peeling and rolling up from the intermediate sheet.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005239040 | 2005-08-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200720018A true TW200720018A (en) | 2007-06-01 |
TWI389767B TWI389767B (en) | 2013-03-21 |
Family
ID=37757521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095130466A TWI389767B (en) | 2005-08-19 | 2006-08-18 | Substrate grinding apparatus and substrate grinding method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5013200B2 (en) |
KR (1) | KR101097074B1 (en) |
TW (1) | TWI389767B (en) |
WO (1) | WO2007020859A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012179680A (en) * | 2011-03-01 | 2012-09-20 | Asahi Glass Co Ltd | Method for polishing glass plate |
JP2012192470A (en) * | 2011-03-15 | 2012-10-11 | Asahi Glass Co Ltd | Plate-like body polishing apparatus |
JP2015171733A (en) * | 2012-07-13 | 2015-10-01 | 旭硝子株式会社 | Polishing device of plate-like body and polishing method of plate-like body |
JP2015171734A (en) * | 2012-07-18 | 2015-10-01 | 旭硝子株式会社 | Polishing device for plate-like body and polishing method for plate-like body |
JP2017127938A (en) * | 2016-01-21 | 2017-07-27 | 信越半導体株式会社 | Wafer polishing method, back pad manufacturing method, back pad, and polishing head having the back pad |
KR102040019B1 (en) * | 2017-11-28 | 2019-11-04 | 윤주영 | Carbon fiber reinforced plastic molded article and supporting unit for polishing glass base plate comprising the same |
CN113172539B (en) * | 2021-06-30 | 2021-08-31 | 南通环球光学仪器有限公司 | Positioning jig and positioning method for mechanical engineering casting |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000167762A (en) * | 1998-12-04 | 2000-06-20 | Speedfam-Ipec Co Ltd | Carrier and cmp device |
US6494774B1 (en) * | 1999-07-09 | 2002-12-17 | Applied Materials, Inc. | Carrier head with pressure transfer mechanism |
JP2001138223A (en) * | 1999-11-10 | 2001-05-22 | Sony Corp | Grinding head and grinding apparatus |
JP2003257910A (en) * | 2001-12-28 | 2003-09-12 | Fujikoshi Mach Corp | Method for polishing copper layer of substrate |
JP4207153B2 (en) * | 2002-07-31 | 2009-01-14 | 旭硝子株式会社 | Substrate polishing method and apparatus |
JP2004268157A (en) * | 2003-03-05 | 2004-09-30 | Tamagawa Machinery Co Ltd | Glass substrate polishing head, polishing device using this polishing head, glass substrate polishing method and glass substrate |
-
2006
- 2006-08-09 JP JP2007530964A patent/JP5013200B2/en active Active
- 2006-08-09 KR KR1020087003966A patent/KR101097074B1/en active IP Right Grant
- 2006-08-09 WO PCT/JP2006/315770 patent/WO2007020859A1/en active Application Filing
- 2006-08-18 TW TW095130466A patent/TWI389767B/en active
Also Published As
Publication number | Publication date |
---|---|
JP5013200B2 (en) | 2012-08-29 |
KR101097074B1 (en) | 2011-12-22 |
KR20080035644A (en) | 2008-04-23 |
JPWO2007020859A1 (en) | 2009-02-26 |
WO2007020859A1 (en) | 2007-02-22 |
TWI389767B (en) | 2013-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200720018A (en) | Substrate polishing apparatus and substrate polishing method | |
KR102099188B1 (en) | Device for peeling substrate, method for peeling substrate and method for producing electronic device | |
TW200712607A (en) | Flexible pixel array substrate and method of fabricating the same | |
WO2010129459A3 (en) | Carrier for glass substrates | |
WO2009041422A1 (en) | Polishing pad | |
WO2009137290A3 (en) | 3-dimensional curved substrate lamination | |
MY153006A (en) | Wafer processing film | |
WO2009066704A1 (en) | Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module | |
EP2816588A3 (en) | Diamond semiconductor element and process for producing the same | |
TW200732156A (en) | Method for transferring a multilayer body and a transfer film | |
SG11201807645SA (en) | Supporting sheet and composite sheet for protective film formation | |
TW200500657A (en) | Adhesion type optical film, method for manufacturing adhesion type optical film, and image display device | |
TW200636009A (en) | Multilayer sheet, production method thereof and pressure-sensitive adhesive sheet using the multilayer sheet | |
TW200710195A (en) | Pressure-sensitive adhesive sheet, production method thereof and method of processing articles | |
WO2006081315A3 (en) | Method of eliminating curl for devices on thin flexible substrates, and devices made thereby | |
MX2007002658A (en) | Repositionable optical film. | |
TW200603946A (en) | Polishing pad for electrochemical mechanical polishing | |
EP2063293A3 (en) | Optical sheet, method for manufacturing the same , and liquid crystal display using the same | |
TW200708587A (en) | Anisotropic conductive film and method for producing the same | |
WO2011047670A3 (en) | Device for stiffening a workpiece by means of a clamping plate, and method for retaining and processing a workpiece with a clamping plate | |
WO2017065155A1 (en) | Device for delaminating laminate, delamination method, and method for manufacturing electronic device | |
WO2008120578A1 (en) | Metal film polishing pad and method for polishing metal film using the same | |
KR102100160B1 (en) | Device for peeling substrate, method for peeling substrate and method for producing electronic device | |
US20160001521A1 (en) | Curved display device and method of fabricating the same | |
WO2008081561A1 (en) | Perforated support plate |