WO2007020859A1 - Substrate polishing apparatus and substrate polishing method - Google Patents

Substrate polishing apparatus and substrate polishing method Download PDF

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Publication number
WO2007020859A1
WO2007020859A1 PCT/JP2006/315770 JP2006315770W WO2007020859A1 WO 2007020859 A1 WO2007020859 A1 WO 2007020859A1 JP 2006315770 W JP2006315770 W JP 2006315770W WO 2007020859 A1 WO2007020859 A1 WO 2007020859A1
Authority
WO
WIPO (PCT)
Prior art keywords
sheet
polishing
film body
substrate
intermediate sheet
Prior art date
Application number
PCT/JP2006/315770
Other languages
French (fr)
Japanese (ja)
Inventor
Takashi Kubo
Hiroshi Kimura
Minoru Yokota
Junichi Miyashita
Original Assignee
Asahi Glass Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Company, Limited filed Critical Asahi Glass Company, Limited
Priority to JP2007530964A priority Critical patent/JP5013200B2/en
Publication of WO2007020859A1 publication Critical patent/WO2007020859A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Definitions

  • the present invention relates to a substrate polishing apparatus, and more particularly to a substrate polishing apparatus for polishing a glass substrate to produce a thin glass substrate used for a flat panel display or the like, and a substrate polishing using the polishing apparatus. Regarding the method.
  • a production method using a molding method called a float method is known.
  • the molten glass is formed into a plate shape by the float method, and then the fine irregularities and undulations on the surface of the glass plate are polished and removed by a polishing apparatus to obtain a thickness of 0.5.
  • This is a method of forming a thin plate of ⁇ 1.1 mm.
  • the present applicant has proposed a polishing apparatus particularly for a thin glass substrate for a flat panel display.
  • a pressurized fluid is supplied between a film body to which an adsorption sheet for adsorbing and holding a substrate is attached and a carrier to which the film body is attached, and the substrate adsorbed and held on the adsorption sheet is removed. Polishing by pressing against the polishing platen with the pressure of the pressurized fluid.
  • the film body disclosed in Patent Document 1 is composed of an airtight retaining layer, a strength retaining layer, and a smooth layer, and the adsorbing sheet is composed of a porous foamed polyurethane sheet having self-adsorptive power. Has been.
  • Patent Document 1 has a problem that the adsorbing sheet peels off from the film body during the polishing of the substrate and is damaged.
  • the applicant of the present invention has found out that it occurs due to the following events.
  • the film body also receives a force in the pulling direction (extension direction: surface direction) due to the polishing resistance generated between the substrate and the polishing surface plate during polishing of the substrate. Further, since the carrier and the polishing platen rotate during polishing, the film body is repeatedly pulled by the force. It receives a force that expands and contracts in the direction of stretching, and expands and contracts in the direction of pulling.
  • the adsorbing sheet that is adhered to the film body and is softer than the film body expands and contracts continuously with the expansion and contraction of the film body.
  • the substrate is adsorbed and held on the suction sheet, that is, the expansion and contraction operation of the suction sheet is restricted by the substrate, the expansion and contraction of the suction sheet in the pulling direction is restricted. Due to such a phenomenon, a relative shift occurs between the stretchable film body and the non-stretchable suction sheet, and the peripheral edge of the suction sheet is gradually peeled off from the film body due to the shift. Then, when the peeled portion becomes large, the peeled portion rises during polishing. These failures can cause damage to the board and require maintenance.
  • Patent Document 1 JP-A-2004-122351
  • the present invention has been made in view of the above problems, and a substrate polishing apparatus capable of smoothly polishing a substrate for a long time, and a substrate using the polishing apparatus
  • An object of the present invention is to provide a polishing method.
  • the present invention provides a pressurized fluid between a film body to which an adsorption sheet for adsorbing and holding a substrate is attached and a carrier to which the film body is attached,
  • a polishing apparatus for polishing by pressing a substrate held on an adsorption sheet against a polishing platen by the pressure of the pressurized fluid an intermediate sheet is bonded between the film body and the adsorption sheet.
  • a substrate polishing apparatus characterized in that the rigidity in the pulling direction of the sheet is higher than the rigidity in the pulling direction of the suction sheet.
  • an intermediate sheet is bonded between the film body and the adsorption sheet. For this reason, peeling may occur between the intermediate sheet and the film body due to the expansion and contraction of the film body in the pulling direction due to the polishing resistance, but a relative deviation occurs between the intermediate sheet and the suction sheet. Absent. This is because the expansion and contraction of the suction sheet is restricted by the adsorption of the substrate, and the intermediate sheet has higher rigidity in the pulling direction than the suction sheet and does not expand and contract in the pulling direction. As a result, the suction sheet does not peel off from the intermediate sheet, and the suction sheet peels off. Can be prevented.
  • the adsorbent sheet has a foamed polyurethane force
  • the intermediate sheet is made of polycarbonate, acrylic, aluminum, stainless steel, glass, or carbon fiber reinforced plastics (CFRP). Can be used.
  • CFRP carbon fiber reinforced plastics
  • ABS Adieneitrile Butadiene Styrene
  • FRP fiber reinforced plastics
  • the present invention also provides a method for polishing a substrate, characterized in that the substrate is polished using the polishing apparatus.
  • the intermediate sheet having higher rigidity in the tension direction than the suction sheet is interposed between the film body and the suction sheet. Even if the body expands and contracts in the tension direction, the intermediate sheet does not expand and contract in the tension direction, so there is no relative displacement between the suction sheet and the intermediate sheet, and the suction sheet is in the middle. It can be prevented from coming off the sheet. Thus, the substrate can be smoothly polished for a long time by the polishing apparatus.
  • FIG. 1 is a plan view showing an overall structure of a polishing apparatus according to a first embodiment.
  • FIG. 2 is a side view showing an embodiment of a polishing head and a polishing stage.
  • FIG. 3 is an assembled perspective view of a polishing head.
  • FIG. 4 is an explanatory view showing a three-layer structure of a film body of a film frame.
  • FIG. 5 is an enlarged cross-sectional view of the main part showing the structure for attaching and detaching the membrane frame to the sliding ring.
  • FIG. 6 is a side view showing an arrangement configuration of a film body, an intermediate sheet, and an adsorption sheet.
  • G glass substrate, 10 ... polishing apparatus, 12 ... conveyor, 14 ... film frame, 16 ... stage, 18 ... first polishing stage, 20 ... second polishing stage, 22 ... "Stage, 24 ... Outlet conveyor, 26 ... Membrane frame washing stage, 28 ... Membrane frame drying stage, 30 ⁇ Membrane frame return conveyor, 32 ⁇ Robot, 33 ⁇ ⁇ Conveyor, 38 ⁇ Film body, 40 ⁇ ⁇ ⁇ Upper frame, 42 ⁇ ⁇ ⁇ Lower frame, 44 ⁇ ⁇ ⁇ Airtight retention layer, 46 ⁇ ⁇ ⁇ Strength retention layer, 48 ⁇ ⁇ ⁇ Smooth layer, 50 ⁇ ⁇ ⁇ Polishing Head 51 ⁇ Main body casing 52 ⁇ Carrier 53 ⁇ Lower outer ring portion 54 ⁇ ⁇ ⁇ Air chamber 56 ⁇ ⁇ ⁇ Spindle 58 ⁇ ⁇ ⁇ Polishing pad 60 ⁇ ⁇ ⁇ Polishing pad 62 ⁇ Polishing surface plate, 64 ⁇ Rotating shaft, 66
  • the substrate polishing apparatus 10 shown in FIG. 1 has a large glass substrate G (for example, one side of more than 2000 mm and a thickness of 0.5 mm to l.1 mm) with the flatness required for a glass substrate for a liquid crystal display.
  • a polishing apparatus for polishing for polishing.
  • the polishing apparatus 10 includes a conveyor 12 that transports a glass substrate G before polishing, a stage 16 that adheres the glass substrate G to a film frame 14, a first polishing stage 18, a second polishing stage 20, a polishing
  • the main components are a stage 22 for removing the polished glass substrate G from the membrane frame 14, a glass substrate carry-out competitor 24, a membrane frame cleaning stage 26, a membrane frame drying stage 28, and a membrane frame return conveyor 30.
  • the polishing apparatus 10 has a transfer apparatus 150 for transferring the film frame 14 from the stage 16 to the first polishing stage 18, and the film frame 14 from the first polishing stage 18 to the second polishing stage 20.
  • Transport A transfer device 152 for transferring the film frame 14 from the second polishing stage 20 to the stage 22 is provided.
  • the unpolished glass substrate G that has been conveyed by the conveyor 12 is sucked and held by a suction pad 34 provided on the arm 33 of the robot 32. Then, it is transferred from the conveyor 12 to the conveyor 36 by the rotation operation of the arm 33, and is conveyed toward the stage 16 by the conveyor 36.
  • stage 16 glass substrate G is held on film frame 14. Next, this holding method will be described.
  • the film frame 14 is held by a lifting device (not shown), which is a glass substrate attaching means, at the stage 16, and when the glass substrate G is positioned below the film frame 14, the film frame 14 is moved downward by the lifting device.
  • the film body 38 of FIG. 2 stretched on the film frame 14 is pressed against the glass substrate G.
  • a porous foamed polyurethane adsorption sheet 200 that self-adsorbs the glass substrate G is adhered to the lower surface of the film body 38, and a polycarbonate made between the adsorption sheet 200 and the film body 38.
  • the intermediate sheet 210 is interposed and adhered to the adsorption sheet 200 and the film body 38.
  • the glass substrate G is pressed against the suction sheet 200 by the pressing force by the lifting device described above, and is sucked and held by the suction sheet 200. Thereafter, the film frame 14 is held by the transfer device 150 of FIG. 1, and transferred to the first polishing stage 18 of FIG. 3, where it is attached to the carrier 52.
  • the membrane frame 14 is stretched between the upper frame 40 and the lower frame 42, and then the upper frame 40 and the lower frame 42 are fastened by bolts (not shown). It is composed by doing.
  • the film frame 14 and the film body 38 are not limited to a circular shape, but may be a rectangular shape.
  • the film body 38 has a two-layer structure including an airtight holding layer 44 and a strength holding layer 46.
  • the airtight holding layer 44 is a sheet material whose outer peripheral portion is closely attached to the lower outer peripheral ring portion 53 of the carrier 52 and maintains airtightness with the air chamber 54 of the carrier 52. is there. Examples of the material for the sheet material include rubbers, silicones, fluorine resin, salt resin (PVC), nylon, urethane, and the like.
  • the strength holding layer 46 of FIG. 4 can withstand the tension that holds the airtight holding layer 44 and stretches the entire film body 38.
  • an intermediate sheet 210 is bonded to the lower surface.
  • the adhesive etc. which are used for the conventional film body can be used suitably, for example, a urethane type adhesive or an epoxy-type adhesive can be used preferably.
  • the material of the strength retaining layer 46 is aramid fiber, stainless steel wire mesh, steel wire mesh, carbon fiber, glass fiber, nylon fiber, metal sheet, resin sheet, and the like. U, which is preferred for very few reasons.
  • the polishing head 50 is configured such that a motor is built in a main body casing 51, and an output shaft of the motor is connected to a spindle 56 suspended in a vertical direction.
  • a carrier 52 is connected to the spindle 56.
  • the main body casing 51 is connected to a slider 158 via an elevating mechanism 156. As the main body casing 51 is moved up and down with respect to the slider 158 by the lifting mechanism 156, the carrier 52 is moved back and forth with respect to the polishing pad 58 of the first polishing stage 18 and the polishing pad 60 of the second polishing stage 20. At the same time, the glass substrate G adhered to the film frame 14 can be pressed against the polishing pads 58 and 60 with a predetermined polishing pressure.
  • the polishing pad 58 is affixed to the upper surface of the polishing surface plate 62, and a rotating shaft 64 that is rotated by a motor (not shown) is connected to the lower portion of the polishing surface plate 62.
  • the polishing pad 60 is affixed to the upper surface of the polishing surface plate 66, and a rotating shaft 68 that is rotated by a motor (not shown) is connected to the lower portion of the polishing surface plate 66.
  • the main casing 51 is connected to a revolving drive mechanism (not shown) and has a function of revolving at a predetermined revolving radius.
  • This revolution drive mechanism can also be configured by incorporating a planetary gear mechanism in the main body casing 51 and connecting the output shaft of the planetary gear mechanism to the spindle 56.
  • linear motion guides 70 and 70 are attached to the slider 158 of the first polishing stage 18. It is.
  • the linear guides 70 and 70 are fitted to guide rails 72 and 72. As shown in FIG. 1, the guide rails 72 and 72 are arranged toward the maintenance stage 74 that maintains the spindle 56 and the carrier 52 of the first polishing stage 18! /
  • the linear motion guides 70 and 70 are similarly attached to the slider 158 of the second polishing stage 20, and the linear motion guides 70 and 70 are fitted to the guide rails 160 and 160. Yes. As shown in FIG. 1, the guide rails 160 and 160 are arranged toward the maintenance stage 76 for maintaining the spindle 56 and the carrier 52 of the second polishing stage 20.
  • the carrier 52 has a lifting ring 78 fixed to the upper outer peripheral portion of the carrier 52 by a bolt (not shown).
  • a plurality of through-holes 80, 80 ... are formed at equal intervals on a concentric circle in the flange portion where the outer peripheral force of the carrier 52 of the lifting ring 78 protrudes, and these through-holes 80, 80 ...
  • a downward force is also pierced by the sliding ring hanger 84 projecting from the upper surface of the sliding ring 82.
  • the sliding ring suspension 84 is penetrated by a lifting spring 88 disposed between the lifting ring 78 and the lifting disc spring 86 and penetrates through the through hole 90 of the lifting disc spring 86. And is connected to a screw jack 92.
  • the lifting spring 88 By having the lifting spring 88, it is possible to simultaneously solve the problem that a constant tension is applied to the film body 38 and the prevention of an excessive tension applied to the film body 38. Na The force required to measure the amount of contraction of the lifting spring 88 in order to maintain a constant tension. Torque is calculated from the above, and the lifting force of the screw jack 92 is obtained indirectly, and the tension applied to the film body 38 can be monitored by managing this.
  • the line shaft 96 is a shaft that transmits the driving force of the motor to the screw jack 92.
  • Reference numeral 94 denotes a stopper pin for receiving the reaction force of the lifting spring 88 generated between the lifting ring 78 and the lifting disc spring 86.
  • the carrier 52 is formed with a plurality of ejection ports 98, 98,... For ejecting compressed air (pressurized fluid) into the air chamber 54 of FIG.
  • These injection ports 98, 98... Communicate with an air supply path 102 indicated by a broken line in FIG. 3 through an air chamber 100 formed on the upper surface of the carrier 52.
  • the air supply path 102 extends outside the polishing head 50 via a rotary joint (not shown) attached to the polishing head 50, and is connected to the air pump 106 via a valve 104. Therefore, when the valve 104 is opened, the compressed air from the air pump 106 is supplied to the air chamber 54 via the air supply path 102, the air chamber 100, and the injection port 98. Thereby, the pressure of the compressed air is transmitted to the glass substrate G through the film body 38, and the glass substrate G is pressed against the polishing pads 58 and 60 by this pressure and polished.
  • the upper frame 40 of the membrane frame 14 is provided with a plurality of pins 108, 108... Protruding at equal intervals on a concentric circle and formed at the upper ends of these pins 108.
  • the membrane frame 14 is attached to the sliding ring 82 by engaging the large-diameter head portion 110 shown in FIG.
  • the engagement force between the head part 110 and the hook 112 is strengthened by the reaction force of the film body 38 when the film body 38 is lifted by the screw jack 92, and the polishing resistance received from the film body 38 during polishing causes the head part to move from the hook 112. 110 is not off.
  • the film frame 14 is removed from the carrier 52 and transferred to the stage 22 by the transfer device 154.
  • the screw jack 92 shown in FIG. the film frame 14 is rotated by a predetermined angle with respect to the carrier 52 to remove the head portion 110 from the hook 112. As a result, the membrane frame 14 is removed from the carrier 52.
  • the glass substrate G that has been polished is peeled off from the film frame 14 that has been transported by the transport device 154.
  • the peeled glass substrate G is conveyed by the conveyor 138, and is adsorbed by the suction head 144 attached to the arm 142 of the robot 140, and is transferred to the glass substrate carry-out conveyor 24 by the operation of the robot 140. It is loaded and carried out of the polishing apparatus 10.
  • the film frame 14 from which the glass substrate G has been peeled off is conveyed to the film frame cleaning stage 26 by the conveyor 146, where it is washed with water.
  • the washed film frame 14 is conveyed to the film frame drying stage 28 by the conveyor 148, where it is heated and dried. Then, the dried film frame 14 is transported to the stage 16 by the film frame return conveyor 30 and reused for bonding the glass substrate G.
  • the above is the overall configuration of the polishing apparatus 10.
  • the film body 38 receives a polishing resistance generated between the glass substrate G and the polishing pads 58 and 60 during the polishing of the glass substrate G, and applies a force in the tensile direction (extension direction: surface direction) to the polishing pad. Receive from 58, 60. Further, since the carrier 52 and the polishing pads 58 and 60 are rotated during polishing, the film body 38 receives a force repeatedly expanded and contracted in the pulling direction by the force, and expands and contracts in the pulling direction.
  • the behavior of the adsorption sheet 200 during polishing is linked to the expansion and contraction of the film body 38. If the suction sheet 200 expands and contracts, there is no problem. However, since the glass substrate G is adsorbed and held on the suction sheet 200, the expansion and contraction operation of the suction sheet 200 is restricted by the glass substrate G. Therefore, expansion and contraction of the suction sheet 200 in the pulling direction is restricted.
  • the intermediate sheet 210 having a higher rigidity in the pulling direction than the suction sheet 200 as shown in FIG. G.
  • the film body 38 expands and contracts in the tension direction as described above due to the polishing resistance generated during polishing, but the intermediate sheet 210 is interposed between the film body 38 and the suction sheet 200. Therefore, there is a case where peeling occurs between the intermediate sheet 210 and the film body 38 due to the expansion and contraction of the film body 38, but the glass substrate G is adsorbed between the intermediate sheet 210 and the adsorption sheet 200. Since the intermediate sheet 210 does not expand and contract in the pulling direction, no relative deviation occurs between the suction sheet 200 whose expansion and contraction is restricted and the intermediate sheet 210 having higher rigidity in the pulling direction than the suction sheet 200. Therefore, since the suction sheet 200 is not peeled off from the intermediate sheet 210, it is possible to prevent the suction sheet 200 from peeling off and rising.
  • the glass substrate G can be smoothly polished for a long time.
  • the force using polycarbonate as the material of the intermediate sheet 210 is not limited to this, and may be acrylic, aluminum, stainless steel, glass, or carbon fiber reinforced plastic.
  • ABS Acrylonitrile Butadiene Styrene
  • FRP Fiber Reinforced Plastics
  • the film body 38 is composed of the airtight holding layer 44 and the strength holding layer 46, and the intermediate sheet 210 is bonded to the strength holding layer 46, the smooth layer bonded to the strength holding layer 46 is used. The cost of the film body 38 can be reduced.
  • the present invention is suitable for polishing a glass substrate for producing a thin glass substrate used for a flat panel display or the like.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

Provided is a substrate polishing apparatus which can smoothly polish a glass substrate for a long time. An intermediate sheet, which has a high rigidity in a tensile direction compared with that of a suction sheet, is sandwiched between a film body and the suction sheet and bonded. There are cases where the film body expands and contracts in the tensile direction due to polish resistance generated during polishing, and that peeling is generated between the intermediate sheet and the film body due to expansion and contraction of the film body. Since the intermediate sheet is arranged between the film body and the suction sheet, the intermediate sheet does not expand nor contact in the tensile direction between the suction sheet wherein expansion and contraction are limited due to suction of the glass substrate (G) and the intermediate sheet having higher rigidity in the tensile direction than that of the suction sheet. Thus, relative shift is not generated and the suction sheet is prevented from peeling and rolling up from the intermediate sheet.

Description

明 細 書  Specification
基板の研磨装置及び基板の研磨方法  Substrate polishing apparatus and substrate polishing method
技術分野  Technical field
[0001] 本発明は基板の研磨装置に係り、特にガラス基板を研磨してフラットパネルデイス プレイ等に用いる薄板ガラス基板を製造するための基板の研磨装置及び該研磨装 置を用いた基板の研磨方法に関する。  TECHNICAL FIELD [0001] The present invention relates to a substrate polishing apparatus, and more particularly to a substrate polishing apparatus for polishing a glass substrate to produce a thin glass substrate used for a flat panel display or the like, and a substrate polishing using the polishing apparatus. Regarding the method.
背景技術  Background art
[0002] 液晶ディスプレイ等のフラットパネルディスプレイ用の薄板ガラス基板の製造方法の 一つとして、フロート法といわれる成形法を用いた製造方法が知られている。この製 造方法は、前記フロート法により溶融ガラスを板状に成形し、その後研磨装置によつ てガラス板の表面の微小な凹凸やうねりを研磨して除去することにより、厚さ 0. 5〜1 . 1mmの薄板状にする方法である。  [0002] As a method for producing a thin glass substrate for a flat panel display such as a liquid crystal display, a production method using a molding method called a float method is known. In this production method, the molten glass is formed into a plate shape by the float method, and then the fine irregularities and undulations on the surface of the glass plate are polished and removed by a polishing apparatus to obtain a thickness of 0.5. This is a method of forming a thin plate of ~ 1.1 mm.
[0003] 本願出願人は特許文献 1において、特にフラットパネルディスプレイ用の薄板ガラ ス基板を対象とする研磨装置を提案している。この研磨装置は、基板を吸着して保 持する吸着シートが取り付けられた膜体と、この膜体が取り付けられるキャリアとの間 に加圧流体を供給し、吸着シートに吸着保持された基板を加圧流体の圧力により研 磨定盤に押し付けて研磨する。  [0003] In the patent document 1, the present applicant has proposed a polishing apparatus particularly for a thin glass substrate for a flat panel display. In this polishing apparatus, a pressurized fluid is supplied between a film body to which an adsorption sheet for adsorbing and holding a substrate is attached and a carrier to which the film body is attached, and the substrate adsorbed and held on the adsorption sheet is removed. Polishing by pressing against the polishing platen with the pressure of the pressurized fluid.
[0004] また、特許文献 1に開示された膜体は気密保持層、強度保持層、及び平滑層から 構成されるとともに、吸着シートは自己吸着力を有する多孔質の発泡ポリウレタンシ ートによって構成されている。  [0004] In addition, the film body disclosed in Patent Document 1 is composed of an airtight retaining layer, a strength retaining layer, and a smooth layer, and the adsorbing sheet is composed of a porous foamed polyurethane sheet having self-adsorptive power. Has been.
しかしながら、特許文献 1に開示された研磨装置では、基板の研磨中に吸着シート が膜体から剥がれて捲れ上がり基板を破損する問題があった。研磨中に発生する基 板の破損原因について、本願出願人は実機による試験において鋭意解析した結果 、以下の事象により発生することを突きとめた。  However, the polishing apparatus disclosed in Patent Document 1 has a problem that the adsorbing sheet peels off from the film body during the polishing of the substrate and is damaged. As a result of diligent analysis of the cause of damage to the substrate that occurs during polishing, the applicant of the present invention has found out that it occurs due to the following events.
つまり、膜体は、基板の研磨中に基板と研磨定盤との間に生じる研磨抵抗を受ける 関係で引っ張り方向（伸展方向：面方向）の力を研磨定盤カも受ける。また、研磨中 にはキャリア及び研磨定盤が回転しているため膜体は、前記力により繰り返し引っ張 り方向に伸縮される力を受け、引っ張り方向に伸縮することになる。 That is, the film body also receives a force in the pulling direction (extension direction: surface direction) due to the polishing resistance generated between the substrate and the polishing surface plate during polishing of the substrate. Further, since the carrier and the polishing platen rotate during polishing, the film body is repeatedly pulled by the force. It receives a force that expands and contracts in the direction of stretching, and expands and contracts in the direction of pulling.
ここで、膜体に接着され該膜体よりも軟質な吸着シートは、膜体の伸縮に連なって 伸縮動作をすれば問題はない。しかし、吸着シートに基板が吸着保持されているた め、すなわち吸着シートの伸縮動作が基板によって制約されているため、吸着シート の引っ張り方向の伸縮が制約される。このような現象により、伸縮する膜体と伸縮しな い吸着シートとの間に相対的なずれが発生し、そのずれにより吸着シートの周縁部が 膜体から徐々に剥がれる。そして、その剥がれた部分が大きくなると、剥がれた部分 が研磨中に捲くれ上がる。こうした不具合は基板の破損を招くため、保守が必要にな る。  Here, there is no problem if the adsorbing sheet that is adhered to the film body and is softer than the film body expands and contracts continuously with the expansion and contraction of the film body. However, since the substrate is adsorbed and held on the suction sheet, that is, the expansion and contraction operation of the suction sheet is restricted by the substrate, the expansion and contraction of the suction sheet in the pulling direction is restricted. Due to such a phenomenon, a relative shift occurs between the stretchable film body and the non-stretchable suction sheet, and the peripheral edge of the suction sheet is gradually peeled off from the film body due to the shift. Then, when the peeled portion becomes large, the peeled portion rises during polishing. These failures can cause damage to the board and require maintenance.
特許文献 1 :特開 2004— 122351号公報  Patent Document 1: JP-A-2004-122351
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0005] 本発明は、前記のような問題に鑑みてなされたものであって、基板を長時間にわた り円滑に研磨加工することができる基板の研磨装置、及び該研磨装置を用いた基板 の研磨方法を提供することを目的とする。 [0005] The present invention has been made in view of the above problems, and a substrate polishing apparatus capable of smoothly polishing a substrate for a long time, and a substrate using the polishing apparatus An object of the present invention is to provide a polishing method.
課題を解決するための手段  Means for solving the problem
[0006] 前記の目的を達成するため、本発明は、基板を吸着保持する吸着シートが取り付 けられた膜体と該膜体が取り付けられるキャリアとの間に加圧流体を供給し、前記吸 着シートに吸着保持された基板を前記加圧流体の圧力により研磨定盤に押し付けて 研磨する研磨装置において、前記膜体と前記吸着シートとの間に中間シートが接着 されており、該中間シートの引っ張り方向の剛性が、前記吸着シートの引っ張り方向 の剛性よりも高いものであることを特徴とする基板の研磨装置を提供する。 [0006] In order to achieve the above object, the present invention provides a pressurized fluid between a film body to which an adsorption sheet for adsorbing and holding a substrate is attached and a carrier to which the film body is attached, In a polishing apparatus for polishing by pressing a substrate held on an adsorption sheet against a polishing platen by the pressure of the pressurized fluid, an intermediate sheet is bonded between the film body and the adsorption sheet. There is provided a substrate polishing apparatus characterized in that the rigidity in the pulling direction of the sheet is higher than the rigidity in the pulling direction of the suction sheet.
[0007] 本発明では、膜体と吸着シートとの間に中間シートが接着されている。このため、研 磨抵抗による膜体の引っ張り方向の伸縮動作により中間シートと膜体との間に剥が れが生じる場合があるが、中間シートと吸着シートとの間では相対的なずれは発生し ない。なぜならば、吸着シートは基板の吸着により伸縮が制約されており、中間シート は吸着シートよりも引っ張り方向の剛性が高く引っ張り方向に伸縮しないためである。 その結果、吸着シートが中間シートから剥がれなくなり、吸着シートが剥がれて捲り上 がることを防止することができる。 In the present invention, an intermediate sheet is bonded between the film body and the adsorption sheet. For this reason, peeling may occur between the intermediate sheet and the film body due to the expansion and contraction of the film body in the pulling direction due to the polishing resistance, but a relative deviation occurs between the intermediate sheet and the suction sheet. Absent. This is because the expansion and contraction of the suction sheet is restricted by the adsorption of the substrate, and the intermediate sheet has higher rigidity in the pulling direction than the suction sheet and does not expand and contract in the pulling direction. As a result, the suction sheet does not peel off from the intermediate sheet, and the suction sheet peels off. Can be prevented.
[0008] 本発明の好ましい実施形態では、前記吸着シートが発泡ポリウレタン力もなり、前記 中間シートがポリカーボネイト、アクリル、アルミニウム、ステンレス、ガラス、又は炭素 繊維強化プラスチック（CFRP : Carbon Fiber Reinforced Plastics)からなるものを 使用できる。これらの材料によって中間シートを製造することにより、基板の研磨中に ぉ 、て引っ張り方向に伸縮しな 、剛性の高い中間シートを提供できる。前記中間シ ートはポリカーボネイトからなるものであればより好ましい。  [0008] In a preferred embodiment of the present invention, the adsorbent sheet has a foamed polyurethane force, and the intermediate sheet is made of polycarbonate, acrylic, aluminum, stainless steel, glass, or carbon fiber reinforced plastics (CFRP). Can be used. By producing an intermediate sheet using these materials, it is possible to provide a highly rigid intermediate sheet that does not expand or contract in the pulling direction during polishing of the substrate. More preferably, the intermediate sheet is made of polycarbonate.
[0009] また、これらの材料の他、 ABS (Acrylonitrile Butadiene Styrene)、繊維強化プラ スチック（FRP : Fiber Reinforced Plastics)も例示できる。  [0009] In addition to these materials, ABS (Acrylonitrile Butadiene Styrene) and fiber reinforced plastics (FRP) can also be exemplified.
[0010] また本発明は、前記の研磨装置を用いて基板を研磨することを特徴とする基板の 研磨方法を提供する。  The present invention also provides a method for polishing a substrate, characterized in that the substrate is polished using the polishing apparatus.
発明の効果  The invention's effect
[0011] 本発明に係る基板の研磨装置及び基板の研磨方法によれば、吸着シートよりも引 つ張り方向の剛性が高い中間シートを膜体と吸着シートとの間に介在させたので、膜 体が弓 Iつ張り方向に伸縮しても中間シートが引つ張り方向に伸縮しな 、ため、吸着シ ートと中間シートの間には相対的なずれが発生しなくなり、吸着シートが中間シートか ら剥がれて捲り上がることを防止できる。これにより、研磨装置で長時間にわたり基板 を円滑に研磨することができる。  According to the substrate polishing apparatus and the substrate polishing method of the present invention, the intermediate sheet having higher rigidity in the tension direction than the suction sheet is interposed between the film body and the suction sheet. Even if the body expands and contracts in the tension direction, the intermediate sheet does not expand and contract in the tension direction, so there is no relative displacement between the suction sheet and the intermediate sheet, and the suction sheet is in the middle. It can be prevented from coming off the sheet. Thus, the substrate can be smoothly polished for a long time by the polishing apparatus.
図面の簡単な説明  Brief Description of Drawings
[0012] [図 1]第 1の実施の形態の研磨装置の全体構造を示す平面図。  FIG. 1 is a plan view showing an overall structure of a polishing apparatus according to a first embodiment.
[図 2]研磨ヘッドと研磨ステージの実施の形態を示す側面図。  FIG. 2 is a side view showing an embodiment of a polishing head and a polishing stage.
[図 3]研磨ヘッドの組立斜視図。  FIG. 3 is an assembled perspective view of a polishing head.
[図 4]膜枠の膜体の三層構造を示す説明図。  FIG. 4 is an explanatory view showing a three-layer structure of a film body of a film frame.
[図 5]摺動リングに対する膜枠の着脱構造を示す要部拡大断面図。  FIG. 5 is an enlarged cross-sectional view of the main part showing the structure for attaching and detaching the membrane frame to the sliding ring.
[図 6]膜体、中間シート、吸着シートの配置構成を示した側面図。  FIG. 6 is a side view showing an arrangement configuration of a film body, an intermediate sheet, and an adsorption sheet.
符号の説明  Explanation of symbols
[0013] G…ガラス基板、 10…研磨装置、 12· · ·コンベア、 14…膜枠、 16· · ·ステージ、 18· · · 第 1の研磨ステージ、 20…第 2の研磨ステージ、 22· "ステージ、 24· · ·ガラス基板搬 出コンベア、 26…膜枠洗净ステージ、 28…膜枠乾燥ステージ、 30···膜枠返送コン ベア、 32···ロボット、 33···アーム、 34···吸着ノ ッド、 36···コンベア、 38···膜体、 40 …上枠、 42···下枠、 44···気密保持層、 46···強度保持層、 48…平滑層、 50···研磨 ヘッド、 51···本体ケーシング、 52···キャリア、 53···下部外周リング部、 54···空気室、 56···スピンドル、 58···研磨パッド、 60…研磨パッド、 62···研磨定盤、 64…回転軸、 66…研磨定盤、 68···回転軸、 70···直動ガイド、 72···ガイドレール、 74···メンテナン スステージ、 76···メンテナンスステージ、 78···吊上リング、 80···貫通孔、 82···摺動リ ング、 84···摺動リング吊具、 86···上ばね、 88···吊上ばね、 90···貫通孔、 92···スクリ ユウジャッキ、 94···ストッノ《ピン、 96···ラインシャフト、 98···噴射口、 100···空気室、 1 02···エア供給路、 104···ノ レブ、 106· "エアポンプ、 108···ピン、 110···ヘッド部、 112···フック、 114···ピン、 116···孔、 118···ストッノ板、 120···エア流路、 122···挟 持部材、 124···挟みプレート、 126···ポール、 128···貫通孔、 130···貫通孔、 138··. コンベア、 140···ロボット、 142···アーム、 144···吸着ヘッド、 146···コンベア、 150、 152、 154···搬送装置、 160···ガイドレール、 170···ガイドレール、 200···吸着シート 、 210···中間シート [0013] G ... glass substrate, 10 ... polishing apparatus, 12 ... conveyor, 14 ... film frame, 16 ... stage, 18 ... first polishing stage, 20 ... second polishing stage, 22 ... "Stage, 24 ... Outlet conveyor, 26 … Membrane frame washing stage, 28 … Membrane frame drying stage, 30 ··· Membrane frame return conveyor, 32 ··· Robot, 33 ····································· ··· Conveyor, 38 ··· Film body, 40 · · · Upper frame, 42 · · · Lower frame, 44 · · · Airtight retention layer, 46 · · · Strength retention layer, 48 · · · Smooth layer, 50 · · · Polishing Head 51 ··· Main body casing 52 ··· Carrier 53 ··· Lower outer ring portion 54 · · · Air chamber 56 · · · Spindle 58 · · · Polishing pad 60 · · · Polishing pad 62 ··· Polishing surface plate, 64 ··· Rotating shaft, 66 ··· Polishing surface plate, 68 ··· Rotating shaft, 70 ··· Linear guide, 72 ··· Guide rail, 74 ··· Maintenance stage, 76 ··· Maintenance stage, 78 ... Lifting ring, 80 ... Through hole, 82 ... Sliding ring, 84 ... Sliding ring lifting device, 86 ... Upper spring, 88 ... Suspension spring, 90 ... through hole, 92 ... , 94 ······························· Pin, 96 ··· Line shaft, 98 · · · Injection port, 100 · · · Air chamber, 1 ····· Air supply path, ··································· , 108 ··· Pin, 110 ··· Head, 112 · · · Hook, 114 · · · Pin, 116 ··· Hole, 118 ··· Stocko plate, 120 · · · Air flow path, 122 ··· ················································································· 128 144 ··· Suction head, 146 ··· Conveyor, 150, 152, 154 ··· Conveyor device, 160 ··· Guide rail, 170 ··· Guide rail, 200 ··· Suction sheet, 210 ··· Intermediate Sheet
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0014] 以下、図面に従って本発明に係る基板の研磨装置及び基板の研磨方法の好まし[0014] Hereinafter, preferred embodiments of a substrate polishing apparatus and a substrate polishing method according to the present invention according to the drawings.
V、実施の形態につ!、て詳説する。 V, the embodiment!
[0015] 図 1に示す基板の研磨装置 10は、大型のガラス基板 G (例えば、一辺が 2000mm を超え、厚み 0.5mm〜l.1mm)の片面を液晶ディスプレイ用ガラス基板に必要な 平坦度に研磨する研磨装置である。 [0015] The substrate polishing apparatus 10 shown in FIG. 1 has a large glass substrate G (for example, one side of more than 2000 mm and a thickness of 0.5 mm to l.1 mm) with the flatness required for a glass substrate for a liquid crystal display. A polishing apparatus for polishing.
[0016] この研磨装置 10は、研磨前のガラス基板 Gを搬送するコンベア 12、ガラス基板 Gを 膜枠 14に貼着するステージ 16、第 1の研磨ステージ 18、第 2の研磨ステージ 20、研 磨完了したガラス基板 Gを膜枠 14から取り外すステージ 22、ガラス基板搬出コンペ ァ 24、膜枠洗浄ステージ 26、膜枠乾燥ステージ 28、及び膜枠返送コンベア 30を主 要素として構成されている。 The polishing apparatus 10 includes a conveyor 12 that transports a glass substrate G before polishing, a stage 16 that adheres the glass substrate G to a film frame 14, a first polishing stage 18, a second polishing stage 20, a polishing The main components are a stage 22 for removing the polished glass substrate G from the membrane frame 14, a glass substrate carry-out competitor 24, a membrane frame cleaning stage 26, a membrane frame drying stage 28, and a membrane frame return conveyor 30.
[0017] また、研磨装置 10には、ステージ 16から第 1の研磨ステージ 18に膜枠 14を搬送す る搬送装置 150、第 1の研磨ステージ 18から第 2の研磨ステージ 20に膜枠 14を搬送 する搬送装置 152、及び第 2の研磨ステージ 20からステージ 22に膜枠 14を搬送す る搬送装置 154が設けられている。 In addition, the polishing apparatus 10 has a transfer apparatus 150 for transferring the film frame 14 from the stage 16 to the first polishing stage 18, and the film frame 14 from the first polishing stage 18 to the second polishing stage 20. Transport A transfer device 152 for transferring the film frame 14 from the second polishing stage 20 to the stage 22 is provided.
[0018] コンベア 12によって搬送されてきた研磨前のガラス基板 Gは、ロボット 32のアーム 3 3に設けられた吸着パッド 34に吸着保持される。そして、アーム 33の回転動作によつ てコンベア 12からコンベア 36に移載され、コンベア 36によってステージ 16に向けて 搬送される。 The unpolished glass substrate G that has been conveyed by the conveyor 12 is sucked and held by a suction pad 34 provided on the arm 33 of the robot 32. Then, it is transferred from the conveyor 12 to the conveyor 36 by the rotation operation of the arm 33, and is conveyed toward the stage 16 by the conveyor 36.
[0019] ステージ 16において、まず、ガラス基板 Gが膜枠 14に保持される。次にこの保持方 法について説明する。膜枠 14はステージ 16において、ガラス基板貼着手段である不 図示の昇降装置に保持されており、膜枠 14の下方にガラス基板 Gが位置したところ で、膜枠 14が昇降装置により下降移動され、膜枠 14に張設された図 2の膜体 38が ガラス基板 Gに押し付けられる。  In stage 16, first, glass substrate G is held on film frame 14. Next, this holding method will be described. The film frame 14 is held by a lifting device (not shown), which is a glass substrate attaching means, at the stage 16, and when the glass substrate G is positioned below the film frame 14, the film frame 14 is moved downward by the lifting device. The film body 38 of FIG. 2 stretched on the film frame 14 is pressed against the glass substrate G.
[0020] 膜体 38の下面には、ガラス基板 Gを自己吸着する多孔質性の発泡ポリウレタン製 吸着シート 200が接着されるとともに、この吸着シート 200と膜体 38との間にポリカー ボネイト製の中間シート 210が介在されて吸着シート 200と膜体 38とに接着されてい る。  [0020] A porous foamed polyurethane adsorption sheet 200 that self-adsorbs the glass substrate G is adhered to the lower surface of the film body 38, and a polycarbonate made between the adsorption sheet 200 and the film body 38. The intermediate sheet 210 is interposed and adhered to the adsorption sheet 200 and the film body 38.
[0021] ガラス基板 Gは、前述した昇降装置による押圧力によって吸着シート 200に押し付 けられ、吸着シート 200によって吸着保持される。その後、膜枠 14が図 1の搬送装置 150に保持されて、図 3の第 1の研磨ステージ 18に搬送され、ここでキャリア 52に取り 付けられる。  The glass substrate G is pressed against the suction sheet 200 by the pressing force by the lifting device described above, and is sucked and held by the suction sheet 200. Thereafter, the film frame 14 is held by the transfer device 150 of FIG. 1, and transferred to the first polishing stage 18 of FIG. 3, where it is attached to the carrier 52.
[0022] 膜枠 14は図 2に示したように、膜体 38を上枠 40と下枠 42との間で張設した後、上 枠 40と下枠 42とを不図示のボルトによって締結することによって構成される。なお、 膜枠 14や膜体 38は円形に限定されるものではなぐ矩形でもよい。  [0022] As shown in FIG. 2, the membrane frame 14 is stretched between the upper frame 40 and the lower frame 42, and then the upper frame 40 and the lower frame 42 are fastened by bolts (not shown). It is composed by doing. The film frame 14 and the film body 38 are not limited to a circular shape, but may be a rectangular shape.
[0023] この膜体 38は図 4の如く気密保持層 44、強度保持層 46からなる二層構造に構成 されている。気密保持層 44は図 2及び図 5に示すように、その外周部がキャリア 52の 下部外周リング部 53に密着されてキャリア 52の空気室 54との間で気密を保持するシ ート材である。シート材の材料としてはゴム類、シリコン類、フッ素榭脂、塩ィ匕ビュル（ PVC)等のビュル系、ナイロン系及びウレタン等を例示できる。また、図 4の強度保持 層 46は、気密保持層 44を保持するとともに膜体 38全体を張設する張力に耐え得る 所定の引張強さを有するシート材である。また、その下面には中間シート 210が接着 されている。この接着剤としては、従来の膜体に使用されている接着剤などが適宜使 用でき、例えばウレタン系接着剤又はエポキシ系接着剤が好ましく使用できる。 As shown in FIG. 4, the film body 38 has a two-layer structure including an airtight holding layer 44 and a strength holding layer 46. As shown in FIGS. 2 and 5, the airtight holding layer 44 is a sheet material whose outer peripheral portion is closely attached to the lower outer peripheral ring portion 53 of the carrier 52 and maintains airtightness with the air chamber 54 of the carrier 52. is there. Examples of the material for the sheet material include rubbers, silicones, fluorine resin, salt resin (PVC), nylon, urethane, and the like. Further, the strength holding layer 46 of FIG. 4 can withstand the tension that holds the airtight holding layer 44 and stretches the entire film body 38. A sheet material having a predetermined tensile strength. Further, an intermediate sheet 210 is bonded to the lower surface. As this adhesive, the adhesive etc. which are used for the conventional film body can be used suitably, for example, a urethane type adhesive or an epoxy-type adhesive can be used preferably.
[0024] 強度保持層 46の材料としては、ァラミド繊維、ステンレス製金網、スチール金網、炭 素繊維、ガラス繊維、ナイロン繊維、金属シート、榭脂シート等であり、ァラミド繊維が 引張力に対する伸びが極めて少な 、と 、う理由で好ま U、。  [0024] The material of the strength retaining layer 46 is aramid fiber, stainless steel wire mesh, steel wire mesh, carbon fiber, glass fiber, nylon fiber, metal sheet, resin sheet, and the like. U, which is preferred for very few reasons.
[0025] 次に、図 3に示す研磨ヘッド 50について説明する力 第 1の研磨ステージ 18の研 磨ヘッド 50及び第 2の研磨ステージ 20の研磨ヘッド 50は同一構造なので、同一の 符号を付して説明する。  Next, the force for explaining the polishing head 50 shown in FIG. 3. Since the polishing head 50 of the first polishing stage 18 and the polishing head 50 of the second polishing stage 20 have the same structure, they are given the same reference numerals. I will explain.
[0026] 研磨ヘッド 50は、本体ケーシング 51にモータが内蔵され、このモータの出力軸が、 鉛直方向に垂下されたスピンドル 56に連結されて構成される。このスピンドル 56にキ ャリア 52が連結されている。また、本体ケーシング 51は、昇降機構 156を介してスラ イダ 158に連結されて 、る。この昇降機構 156によって本体ケーシング 51がスライダ 158に対して昇降されることにより、キャリア 52が第 1の研磨ステージ 18の研磨パッド 58、及び第 2の研磨ステージ 20の研磨パッド 60に対し進退移動されるとともに、膜 枠 14に貼着されたガラス基板 Gを研磨パッド 58、 60に所定の研磨圧力で押圧するこ とがでさる。  The polishing head 50 is configured such that a motor is built in a main body casing 51, and an output shaft of the motor is connected to a spindle 56 suspended in a vertical direction. A carrier 52 is connected to the spindle 56. The main body casing 51 is connected to a slider 158 via an elevating mechanism 156. As the main body casing 51 is moved up and down with respect to the slider 158 by the lifting mechanism 156, the carrier 52 is moved back and forth with respect to the polishing pad 58 of the first polishing stage 18 and the polishing pad 60 of the second polishing stage 20. At the same time, the glass substrate G adhered to the film frame 14 can be pressed against the polishing pads 58 and 60 with a predetermined polishing pressure.
[0027] 研磨パッド 58は、研磨定盤 62の上面に貼り付けられ、研磨定盤 62の下部には、不 図示のモータによって回転される回転軸 64が連結される。また、研磨パッド 60は、研 磨定盤 66の上面に貼り付けられ、研磨定盤 66の下部には、不図示のモータによつ て回転される回転軸 68が連結されている。  The polishing pad 58 is affixed to the upper surface of the polishing surface plate 62, and a rotating shaft 64 that is rotated by a motor (not shown) is connected to the lower portion of the polishing surface plate 62. The polishing pad 60 is affixed to the upper surface of the polishing surface plate 66, and a rotating shaft 68 that is rotated by a motor (not shown) is connected to the lower portion of the polishing surface plate 66.
[0028] さらに、本体ケーシング 51は、不図示の公転駆動機構に連結され、所定の公転半 径で公転する機能も有している。なお、この公転駆動機構は、本体ケーシング 51に プラネタリーギア機構を内蔵し、プラネタリーギア機構の出力軸をスピンドル 56に連 結すること〖こよっても構成できる。以上が各研磨ステージ 18、 20の構成であり、これ らの研磨ステージ 18、 20によってガラス基板 Gが研磨され、ガラス基板 Gの表面の微 小な凹凸やうねりが除去される。  Furthermore, the main casing 51 is connected to a revolving drive mechanism (not shown) and has a function of revolving at a predetermined revolving radius. This revolution drive mechanism can also be configured by incorporating a planetary gear mechanism in the main body casing 51 and connecting the output shaft of the planetary gear mechanism to the spindle 56. The above is the configuration of each polishing stage 18, 20, and the glass substrate G is polished by these polishing stages 18, 20, and minute irregularities and undulations on the surface of the glass substrate G are removed.
[0029] 一方、第 1の研磨ステージ 18のスライダ 158には、直動ガイド 70、 70が取り付けら れている。直動ガイド 70、 70はガイドレール 72、 72に嵌合されている。このガイドレ ール 72、 72は、図 1の如く第 1の研磨ステージ 18のスピンドル 56やキャリア 52をメン テナンスするメンテナンスステージ 74に向けて配設されて！/、る。 On the other hand, linear motion guides 70 and 70 are attached to the slider 158 of the first polishing stage 18. It is. The linear guides 70 and 70 are fitted to guide rails 72 and 72. As shown in FIG. 1, the guide rails 72 and 72 are arranged toward the maintenance stage 74 that maintains the spindle 56 and the carrier 52 of the first polishing stage 18! /
[0030] また、図 2の如く第 2の研磨ステージ 20のスライダ 158にも同様に、直動ガイド 70、 70が取り付けられ、直動ガイド 70、 70はガイドレール 160、 160に嵌合されている。 このガイドレール 160、 160は、図 1の如く第 2の研磨ステージ 20のスピンドル 56ゃキ ャリア 52をメンテナンスするメンテナンスステージ 76に向けて配設されている。  Further, as shown in FIG. 2, the linear motion guides 70 and 70 are similarly attached to the slider 158 of the second polishing stage 20, and the linear motion guides 70 and 70 are fitted to the guide rails 160 and 160. Yes. As shown in FIG. 1, the guide rails 160 and 160 are arranged toward the maintenance stage 76 for maintaining the spindle 56 and the carrier 52 of the second polishing stage 20.
[0031] キャリア 52は、図 2の如くキャリア 52の上部外周部に吊上リング 78が不図示のボル トによって固定されている。吊上リング 78のキャリア 52の外周部力も突出したフランジ 部には、貫通孔 80、 80· ··が同心円上で等間隔に複数個形成され、これらの貫通孔 80、 80· ··に、摺動リング 82の上面に突設された摺動リング吊具 84が図 5の如く下方 力も貫通される。また、摺動リング吊具 84は、吊上リング 78と吊上用皿ばね 86との間 に配置された吊上ばね 88に貫通されるとともに、吊上用皿ばね 86の貫通孔 90に貫 通され、スクリュウジャッキ 92に連結されている。  As shown in FIG. 2, the carrier 52 has a lifting ring 78 fixed to the upper outer peripheral portion of the carrier 52 by a bolt (not shown). A plurality of through-holes 80, 80 ... are formed at equal intervals on a concentric circle in the flange portion where the outer peripheral force of the carrier 52 of the lifting ring 78 protrudes, and these through-holes 80, 80 ... As shown in FIG. 5, a downward force is also pierced by the sliding ring hanger 84 projecting from the upper surface of the sliding ring 82. The sliding ring suspension 84 is penetrated by a lifting spring 88 disposed between the lifting ring 78 and the lifting disc spring 86 and penetrates through the through hole 90 of the lifting disc spring 86. And is connected to a screw jack 92.
[0032] したがって、スクリュウジャッキ 92を動作させ、摺動リング吊具 84を吊上ばね 88の付 勢力に抗して上方に引き上げると、摺動リング 82がキャリア 52に対して引き上げられ る。これにより、摺動リング 82に着脱自在に取り付けられた膜枠 14が引き上げられて 、膜体 38に所定の張力が付与される。  Accordingly, when the screw jack 92 is operated and the sliding ring suspension 84 is pulled upward against the urging force of the lifting spring 88, the sliding ring 82 is lifted with respect to the carrier 52. Thereby, the membrane frame 14 detachably attached to the sliding ring 82 is pulled up, and a predetermined tension is applied to the membrane body 38.
[0033] 張力付与の自動化に際しては、膜枠 14と膜体 38とを複数個用意し運用する。しか し、膜枠 14に対して膜体 38の初期張力には個体差があることが考えられること、また 使用時間の違いにより、複数存在する膜体 38、 38· ··の初期張力に違いがあることか ら、いかなる張力個体差を有する膜体 38にも同等の使用張力を付与することは難し い。また、膜体 38に過張力が力かってしまうと膜体 38や周辺機器の破損にもつなが る危険がある。これを解決するために、吊上ばね 88の収縮量（吊上リング 78と吊上用 皿ばね 86との間隔）を監視する。すなわち、スクリュウジャッキ 92の引き上げ量だけ ではなぐ実際に膜体 38に付与される張力を吊上ばね 88の縮み量を監視することで 測るものである。この吊上ばね 88を有することで、膜体 38に一定張力が力かるように することと、膜体 38に過張力が力かることの防止とを同時に解決することができる。な お、一定張力にするために、吊上ばね 88の縮み量の測定が必要となる力 その一つ の手段として、スクリュウジャッキ 92にラインシャフト 96を介して連結された不図示の モータの電流値からトルクを算出し、スクリュウジャッキ 92の吊上力を間接的に取得し 、これを管理することで膜体 38に付与される張力を監視することができる。ラインシャ フト 96は、前記モータの駆動力をスクリュウジャッキ 92に伝達するシャフトである。ま た、符号 94は、吊上リング 78と吊上用皿ばね 86との間に生じている吊上ばね 88の 反力を受けておくためのストッパピンである。 [0033] When automating tension application, a plurality of film frames 14 and film bodies 38 are prepared and operated. However, there may be individual differences in the initial tension of the film body 38 with respect to the film frame 14, and there are differences in the initial tension of the multiple film bodies 38, 38 ... Therefore, it is difficult to give the same working tension to the film body 38 having any individual tension difference. Further, if excessive tension is applied to the film body 38, the film body 38 and peripheral devices may be damaged. In order to solve this, the amount of contraction of the lifting spring 88 (the distance between the lifting ring 78 and the lifting disc spring 86) is monitored. That is, the tension actually applied to the film body 38 is measured by monitoring the contraction amount of the lifting spring 88 in addition to the pulling amount of the screw jack 92 alone. By having the lifting spring 88, it is possible to simultaneously solve the problem that a constant tension is applied to the film body 38 and the prevention of an excessive tension applied to the film body 38. Na The force required to measure the amount of contraction of the lifting spring 88 in order to maintain a constant tension. Torque is calculated from the above, and the lifting force of the screw jack 92 is obtained indirectly, and the tension applied to the film body 38 can be monitored by managing this. The line shaft 96 is a shaft that transmits the driving force of the motor to the screw jack 92. Reference numeral 94 denotes a stopper pin for receiving the reaction force of the lifting spring 88 generated between the lifting ring 78 and the lifting disc spring 86.
[0034] キャリア 52には、図 5の空気室 54に圧縮エア (加圧流体）を噴出する噴射口 98、 9 8…が複数形成される。これらの噴射口 98、 98· ··は、キャリア 52の上面に形成された 空気室 100を介して、図 3上で破線で示すエア供給路 102に連通される。エア供給 路 102は、研磨ヘッド 50に取り付けられた不図示のロータリジョイントを介して研磨へ ッド 50の外部に延設され、バルブ 104を介してエアポンプ 106に接続されている。し たがって、バルブ 104を開放すると、エアポンプ 106からの圧縮エアがエア供給路 1 02、空気室 100、及び噴射口 98を介して空気室 54に供給される。これにより、圧縮 エアの圧力が膜体 38を介してガラス基板 Gに伝達され、この圧力によってガラス基板 Gが研磨パッド 58、 60に押し付けられて研磨される。  The carrier 52 is formed with a plurality of ejection ports 98, 98,... For ejecting compressed air (pressurized fluid) into the air chamber 54 of FIG. These injection ports 98, 98... Communicate with an air supply path 102 indicated by a broken line in FIG. 3 through an air chamber 100 formed on the upper surface of the carrier 52. The air supply path 102 extends outside the polishing head 50 via a rotary joint (not shown) attached to the polishing head 50, and is connected to the air pump 106 via a valve 104. Therefore, when the valve 104 is opened, the compressed air from the air pump 106 is supplied to the air chamber 54 via the air supply path 102, the air chamber 100, and the injection port 98. Thereby, the pressure of the compressed air is transmitted to the glass substrate G through the film body 38, and the glass substrate G is pressed against the polishing pads 58 and 60 by this pressure and polished.
[0035] 一方、図 2の如く膜枠 14の上枠 40には、複数のピン 108、 108· ··が同心円上で等 間隔に突設され、これらのピン 108の上端部に形成された、図 5に示す大径のヘッド 部 110が、摺動リング 82の下部に固定されたフック 112に係合されることにより、膜枠 14が摺動リング 82に取り付けられる。ヘッド部 110とフック 112との係合力は、スクリュ ゥジャッキ 92によって膜体 38を張り上げた時の膜体 38の反力によって強固になり、 研磨時に膜体 38から受ける研磨抵抗ではフック 112からヘッド部 110が外れな 、。  On the other hand, as shown in FIG. 2, the upper frame 40 of the membrane frame 14 is provided with a plurality of pins 108, 108... Protruding at equal intervals on a concentric circle and formed at the upper ends of these pins 108. The membrane frame 14 is attached to the sliding ring 82 by engaging the large-diameter head portion 110 shown in FIG. The engagement force between the head part 110 and the hook 112 is strengthened by the reaction force of the film body 38 when the film body 38 is lifted by the screw jack 92, and the polishing resistance received from the film body 38 during polishing causes the head part to move from the hook 112. 110 is not off.
[0036] 図 1に示した第 2の研磨ステージ 20でガラス基板 Gの研磨が終了すると、ここで膜 枠 14がキャリア 52から取り外されて搬送装置 154によりステージ 22に搬送される。 キャリア 52から膜枠 14を取り外す方法は、まず、図 5に示したスクリュウジャッキ 92を 緩める方向に動作させ、膜体 38の張力を解消する。次に、キャリア 52に対して膜枠 1 4を所定角度回動させてフック 112からヘッド部 110を取り外す。これにより、キャリア 52から膜枠 14が取り外される。 [0037] 図 1に示したステージ 22では、搬送装置 154で搬送されてきた膜枠 14から、研磨 終了したガラス基板 Gを剥ぎ取る。剥ぎ取られたガラス基板 Gは、コンベア 138によつ て搬送され、そして、ロボット 140のアーム 142に取り付けられた吸着ヘッド 144に吸 着され、ロボット 140の動作によってガラス基板搬出用コンベア 24に移載され、研磨 装置 10の外部に搬出される。 When the polishing of the glass substrate G is completed at the second polishing stage 20 shown in FIG. 1, the film frame 14 is removed from the carrier 52 and transferred to the stage 22 by the transfer device 154. In order to remove the membrane frame 14 from the carrier 52, first, the screw jack 92 shown in FIG. Next, the film frame 14 is rotated by a predetermined angle with respect to the carrier 52 to remove the head portion 110 from the hook 112. As a result, the membrane frame 14 is removed from the carrier 52. In the stage 22 shown in FIG. 1, the glass substrate G that has been polished is peeled off from the film frame 14 that has been transported by the transport device 154. The peeled glass substrate G is conveyed by the conveyor 138, and is adsorbed by the suction head 144 attached to the arm 142 of the robot 140, and is transferred to the glass substrate carry-out conveyor 24 by the operation of the robot 140. It is loaded and carried out of the polishing apparatus 10.
[0038] ガラス基板 Gが剥ぎ取られた膜枠 14はコンベア 146によって膜枠洗浄ステージ 26 に搬送され、ここで水洗浄される。洗浄終了した膜枠 14は、コンベア 148によって膜 枠乾燥ステージ 28に搬送され、ここで加熱されて乾燥される。そして、乾燥終了した 膜枠 14は、膜枠返送コンベア 30によってステージ 16に搬送され、ガラス基板 Gの貼 着に再使用される。以上が研磨装置 10の全体構成である。  [0038] The film frame 14 from which the glass substrate G has been peeled off is conveyed to the film frame cleaning stage 26 by the conveyor 146, where it is washed with water. The washed film frame 14 is conveyed to the film frame drying stage 28 by the conveyor 148, where it is heated and dried. Then, the dried film frame 14 is transported to the stage 16 by the film frame return conveyor 30 and reused for bonding the glass substrate G. The above is the overall configuration of the polishing apparatus 10.
[0039] 膜体 38は、ガラス基板 Gの研磨中にガラス基板 Gと研磨パッド 58、 60との間に生じ る研磨抵抗を受ける関係で引っ張り方向（伸展方向：面方向）の力を研磨パッド 58、 60から受ける。また、研磨中にはキャリア 52及び研磨パッド 58、 60が回転しているた め膜体 38は、前記力により繰り返し引っ張り方向に伸縮される力を受け、引っ張り方 向に伸縮することになる。  [0039] The film body 38 receives a polishing resistance generated between the glass substrate G and the polishing pads 58 and 60 during the polishing of the glass substrate G, and applies a force in the tensile direction (extension direction: surface direction) to the polishing pad. Receive from 58, 60. Further, since the carrier 52 and the polishing pads 58 and 60 are rotated during polishing, the film body 38 receives a force repeatedly expanded and contracted in the pulling direction by the force, and expands and contracts in the pulling direction.
[0040] ここで、膜体 38よりも軟質な吸着シート 200が膜体 38に直接接着されている従来の 構造では、研磨中の吸着シート 200の挙動をみると、膜体 38の伸縮に連なって吸着 シート 200が伸縮動作を行えば問題はな 、が、吸着シート 200にガラス基板 Gが吸 着保持されているため、すなわち、吸着シート 200の伸縮動作がガラス基板 Gによつ て制約されているため吸着シート 200の引っ張り方向の伸縮が制約される。このよう な事象により、伸縮する膜体 38と伸縮しない吸着シート 200との間に相対的なずれ が発生し、そのずれにより吸着シート 200の周縁部が膜体 38から徐々に剥がれてい き、その剥がれた部分が大きくなると、剥がれた部分が研磨中に捲くれ上がる。  [0040] Here, in the conventional structure in which the adsorption sheet 200, which is softer than the film body 38, is directly bonded to the film body 38, the behavior of the adsorption sheet 200 during polishing is linked to the expansion and contraction of the film body 38. If the suction sheet 200 expands and contracts, there is no problem. However, since the glass substrate G is adsorbed and held on the suction sheet 200, the expansion and contraction operation of the suction sheet 200 is restricted by the glass substrate G. Therefore, expansion and contraction of the suction sheet 200 in the pulling direction is restricted. Due to such an event, a relative shift occurs between the film body 38 that expands and contracts and the suction sheet 200 that does not expand and contract, and the peripheral edge of the suction sheet 200 gradually peels off from the film body 38 due to the shift. When the peeled part becomes large, the peeled part is rolled up during polishing.
[0041] そこで、このような不具合を防止するため、実施の形態の構造では図 6の如ぐ吸着 シート 200と比較して引っ張り方向の剛性が高い中間シート 210を、膜体 38と吸着シ ート 200との間に介在させて接着している。  [0041] Therefore, in order to prevent such a problem, in the structure of the embodiment, the intermediate sheet 210 having a higher rigidity in the pulling direction than the suction sheet 200 as shown in FIG. G.
[0042] この構造によれば、研磨中に発生する研磨抵抗によって膜体 38は前述の如く引つ 張り方向に伸縮するが、膜体 38と吸着シート 200との間に中間シート 210が介在され ているため、膜体 38の伸縮動作により中間シート 210と膜体 38との間に剥がれが生 じる場合があるが、中間シート 210と吸着シート 200との間では、ガラス基板 Gの吸着 により伸縮が制約された吸着シート 200と、吸着シート 200よりも引っ張り方向の剛性 が高い中間シート 210との間には、中間シート 210が引っ張り方向に伸縮しないため 相対的なずれは発生しない。よって、吸着シート 200が中間シート 210から剥がれな いため、吸着シート 200が剥がれて捲り上がることを防止することができる。 According to this structure, the film body 38 expands and contracts in the tension direction as described above due to the polishing resistance generated during polishing, but the intermediate sheet 210 is interposed between the film body 38 and the suction sheet 200. Therefore, there is a case where peeling occurs between the intermediate sheet 210 and the film body 38 due to the expansion and contraction of the film body 38, but the glass substrate G is adsorbed between the intermediate sheet 210 and the adsorption sheet 200. Since the intermediate sheet 210 does not expand and contract in the pulling direction, no relative deviation occurs between the suction sheet 200 whose expansion and contraction is restricted and the intermediate sheet 210 having higher rigidity in the pulling direction than the suction sheet 200. Therefore, since the suction sheet 200 is not peeled off from the intermediate sheet 210, it is possible to prevent the suction sheet 200 from peeling off and rising.
[0043] したがって、実施の形態の研磨装置 10によれば、ガラス基板 Gを長時間にわたり円 滑に研磨することができる。  Therefore, according to the polishing apparatus 10 of the embodiment, the glass substrate G can be smoothly polished for a long time.
[0044] なお、実施の形態では、中間シート 210の素材をポリカーボネイトとした力 これに 限定されるものではなくアクリル、アルミニウム、ステンレス、ガラス又は炭素繊維強化 プラスチックでもよい。また、これらの材質の他、 ABS (Acrylonitrile Butadiene Styr ene)、 FRP (Fiber Reinforced Plastics)も例示できる。  [0044] In the embodiment, the force using polycarbonate as the material of the intermediate sheet 210 is not limited to this, and may be acrylic, aluminum, stainless steel, glass, or carbon fiber reinforced plastic. In addition to these materials, ABS (Acrylonitrile Butadiene Styrene) and FRP (Fiber Reinforced Plastics) can also be exemplified.
[0045] さらに、膜体 38を気密保持層 44、強度保持層 46から構成して強度保持層 46に中 間シート 210を接着する構造としたので、強度保持層 46に接着していた平滑層を無 くすことができ、膜体 38のコストを削減することができる。  [0045] Further, since the film body 38 is composed of the airtight holding layer 44 and the strength holding layer 46, and the intermediate sheet 210 is bonded to the strength holding layer 46, the smooth layer bonded to the strength holding layer 46 is used. The cost of the film body 38 can be reduced.
産業上の利用可能性  Industrial applicability
[0046] 本発明は、フラットパネルディスプレイ等に用いる薄板ガラス基板を製造するための ガラス基板の研磨に好適である。 なお、 2005年 8月 19曰に出願された曰本特許出願 2005— 239040号の明細書 、特許請求の範囲、図面及び要約書の全内容をここに引用し、本発明の明細書の開 示として、取り入れるものである。 The present invention is suitable for polishing a glass substrate for producing a thin glass substrate used for a flat panel display or the like. The entire contents of the specification, claims, drawings, and abstract of Japanese Patent Application No. 2005-239040, filed on August 19, 2005, are hereby incorporated herein by reference. As it is incorporated.

Claims

請求の範囲 The scope of the claims
[1] 基板を吸着し保持する吸着シートが取り付けられた膜体と該膜体が取り付けられる キャリアとの間に加圧流体を供給し、前記吸着シートに吸着されて保持された基板を 前記加圧流体の圧力により研磨定盤に押し付けて研磨する研磨装置において、 前記膜体と前記吸着シートとの間に中間シートが接着されており、  [1] A pressurized fluid is supplied between a film body to which an adsorption sheet for adsorbing and holding a substrate is attached and a carrier to which the film body is attached, and the substrate adsorbed and held by the adsorption sheet is added to the substrate. In a polishing apparatus for polishing by pressing against a polishing surface plate by the pressure of a pressurized fluid, an intermediate sheet is bonded between the film body and the adsorption sheet,
該中間シートの引っ張り方向の剛性が、前記吸着シートの引っ張り方向の剛性より も高 、ことを特徴とする基板の研磨装置。  A polishing apparatus for a substrate, wherein the rigidity in the pulling direction of the intermediate sheet is higher than the rigidity in the pulling direction of the suction sheet.
[2] 前記吸着シートが、発泡ポリウレタン力 なり、  [2] The adsorbent sheet has a polyurethane foam force,
前記中間シートが、ポリカーボネイト、アクリル、アルミニウム、ステンレス、ガラス又 は炭素繊維強化プラスチック力 なる請求項 1に記載の基板の研磨装置。  2. The substrate polishing apparatus according to claim 1, wherein the intermediate sheet is made of polycarbonate, acrylic, aluminum, stainless steel, glass or carbon fiber reinforced plastic.
[3] 前記中間シートが、ポリカーボネイトからなる請求項 2に記載の基板の研磨装置。 3. The substrate polishing apparatus according to claim 2, wherein the intermediate sheet is made of polycarbonate.
[4] 前記吸着シートが、キャリアに張設された膜体に中間シートを介して接着されている 請求項 1〜3のいずれか 1項に記載の基板の研磨装置 4. The substrate polishing apparatus according to claim 1, wherein the suction sheet is bonded to a film body stretched on a carrier via an intermediate sheet.
[5] 前記膜体が気密保持層と強度保持層からなる二重構造に構成されており、中間シ ートが前記強度保持層の下面に接着されている請求項 1〜4のいずれか 1項に記載 の基板の研磨装置。 5. The film body according to any one of claims 1 to 4, wherein the film body has a double structure including an airtight holding layer and a strength holding layer, and an intermediate sheet is bonded to the lower surface of the strength holding layer. 4. The substrate polishing apparatus according to the item.
[6] 請求項 1〜5のいずれか 1項に記載の基板の研磨装置を用いて基板を研磨するこ とを特徴とする基板の研磨方法。  [6] A substrate polishing method comprising polishing a substrate using the substrate polishing apparatus according to any one of [1] to [5].
PCT/JP2006/315770 2005-08-19 2006-08-09 Substrate polishing apparatus and substrate polishing method WO2007020859A1 (en)

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