KR101089634B1 - 세정장치의 노즐모듈 - Google Patents
세정장치의 노즐모듈 Download PDFInfo
- Publication number
- KR101089634B1 KR101089634B1 KR1020090127806A KR20090127806A KR101089634B1 KR 101089634 B1 KR101089634 B1 KR 101089634B1 KR 1020090127806 A KR1020090127806 A KR 1020090127806A KR 20090127806 A KR20090127806 A KR 20090127806A KR 101089634 B1 KR101089634 B1 KR 101089634B1
- Authority
- KR
- South Korea
- Prior art keywords
- nozzle
- cleaning liquid
- cleaning
- sensor unit
- nozzle module
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 78
- 239000007788 liquid Substances 0.000 claims abstract description 52
- 238000002347 injection Methods 0.000 claims abstract description 36
- 239000007924 injection Substances 0.000 claims abstract description 36
- 239000007921 spray Substances 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 12
- 238000005507 spraying Methods 0.000 claims description 3
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 32
- 239000000243 solution Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 210000000582 semen Anatomy 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (6)
- 분사홀이 형성되어 상기 분사홀로 웨이퍼를 세정하는 세정액을 분사하는 노즐;상기 세정액의 유출 여부를 감지하는 센서부;상기 센서부와 연결되어, 상기 노즐의 분사 여부에 따라 사용자 인터페이스를 제공하는 제어부; 및상기 센서부를 감싸도록 형성되어 상기 노즐과 결합되는 커버;를 포함하는 것을 특징으로 하는 노즐모듈.
- 삭제
- 제1항에 있어서,상기 센서부는 상기 분사홀을 중심으로 양쪽에 각각 배치되어 적외선을 주고 받아 세정액의 유출 유무를 감지하는 발광파트와 수광파트를 포함하는 것을 특징으로 하는 노즐모듈.
- 제1항에 있어서,상기 분사홀은 복수인 것을 특징으로 하는 노즐모듈.
- 제1항에 있어서,상기 사용자 인터페이스는 상기 사용자에게 경보수단을 제공하는 것을 특징으로 하는 노즐모듈.
- 제5항에 있어서,상기 경보수단은 알람(alarm)인 것을 특징으로 하는 노즐모듈.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090127806A KR101089634B1 (ko) | 2009-12-21 | 2009-12-21 | 세정장치의 노즐모듈 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090127806A KR101089634B1 (ko) | 2009-12-21 | 2009-12-21 | 세정장치의 노즐모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20110071286A KR20110071286A (ko) | 2011-06-29 |
KR101089634B1 true KR101089634B1 (ko) | 2011-12-06 |
Family
ID=44402434
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090127806A KR101089634B1 (ko) | 2009-12-21 | 2009-12-21 | 세정장치의 노즐모듈 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101089634B1 (ko) |
-
2009
- 2009-12-21 KR KR1020090127806A patent/KR101089634B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20110071286A (ko) | 2011-06-29 |
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