KR101052836B1 - Probe card - Google Patents

Abstract

A probe card for inspecting a chip on film (COF) on which a chip protrudes is electrically connected to a printed circuit board and the printed circuit board, and has a tip portion contacting a contact pad formed on the film. Positioned opposite to the probe and the printed circuit board, wherein the probe extends from an upper surface side thereof so that the tip portion of the probe is exposed to the lower surface opposite to the film; And a probe protection plate including a chip alignment portion formed by recessing a bottom surface thereof.

Chip On Film, Chip Alignment, Probe

Description

Probe Card {PROBE CARD}

The present invention relates to a probe card, and more particularly to a probe card for inspecting a chip on film.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

An inspection process is performed between the fabrication process and the assembly process to inspect the electrical characteristics of the wafer by applying an electrical signal to the contact pads formed on the wafer.

This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. The probe card may include a printed circuit board that receives an electrical signal applied from a tester, and a plurality of probes in contact with a contact pad formed on the wafer.

On the other hand, the probe card is also used in the case of inspecting a chip on film (COF) in which a contact pad for circuit pattern and inspection is formed and the chip is mounted.

However, since the film itself has flexibility, the chip-on film not only makes it difficult to accurately contact the contact pads formed on the chip-on film when the film rumbles during the inspection process. Since the mounted chip protrudes upward from the film, the probe of the probe card may be damaged or difficult to contact the contact pad due to the interference of the protruding chip during the inspection process.

One embodiment of the present invention is to solve the above-described problems, it is an object of the present invention to provide a probe card that can not be interfered with the flexibility of the film and the chip mounted on the film when inspecting the chip-on film It is done.

As a technical means for achieving the above-described technical problem, an aspect of the present invention is a probe card for inspecting a chip on film (COF) in which the chip is protruded, a printed circuit board, the printed circuit A probe having a tip portion electrically connected to a substrate, the probe having a tip portion in contact with a contact pad formed on the film, and positioned opposite to the printed circuit board, wherein the probe extends from an upper surface thereof so that the tip portion of the probe faces the film. It is provided to expose to the lower surface, and provides a probe card including a probe protection plate including a chip alignment portion formed by recessing the lower surface of the position corresponding to the position where the chip is formed.

The probe protection plate may further include a tip guide part formed therethrough, and the tip part may pass through the tip guide part.

The recessed length of the chip alignment unit may be larger than the protruding length of the chip.

The width of the chip alignment portion may be larger than the width of the chip.

The probe may further include a beam portion bent from the tip portion and seated on the probe protection plate, and a connection portion extending from the beam portion in the direction of the printed circuit board.

The display device may further include at least one connection guide plate positioned between the probe protection plate and the printed circuit board and including a connection guide portion through which the connection portion passes.

Located between the connection guide plate and the printed circuit board, the connection terminal portion is inserted into the connection portion and directly connected to the connection terminal portion, is formed to face the printed circuit board, electrically connected to the printed circuit board It may further include a conversion substrate including a conversion terminal.

The electronic device may further include an interposer positioned between the conversion substrate and the printed circuit board and connecting the conversion terminal and the printed circuit board.

According to one of the embodiments of the above-described problem solving means of the present invention, by including a probe protection plate having a tip alignment portion and a recessed chip alignment portion, the flexibility of the film and the film when inspecting the chip-on film There is a technical effect that the reliability of the inspection on the chip-on film is improved because it is not subjected to interference by the mounted chip.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when a member is located “on” or “below” with another member, this includes not only when one member is in contact with another member but also when another member exists between the two members. In addition, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless otherwise stated.

Hereinafter, a probe card according to an embodiment of the present invention will be described with reference to FIGS. 1 to 4.

1 is a first exploded perspective view showing an upper side of a probe card according to an embodiment of the present invention, Figure 2 is a second exploded perspective view showing a lower side of a probe card according to an embodiment of the present invention, Figure 3 is A perspective view showing a cross section and a bottom surface of a probe card according to an embodiment of the present invention.

As shown in FIG. 1, a probe card according to an embodiment of the present invention includes an upper reinforcement plate 100, a reinforcement plate cover 200, a printed circuit board 300, an interposer 400, and a conversion substrate 500. ), Lower reinforcement plate 600, the first connection guide plate 700, the second connection guide plate 800, the probe 900, the probe protection plate 1000, the first fixing screw 1100, and the second fixing screw 1200 and the third fixing screw 1300.

As shown in FIGS. 2 and 3, the upper reinforcement plate 100 is positioned on the printed circuit board 300 and has a central area penetrated therethrough. The upper reinforcement plate 100 serves to reinforce the printed circuit board 300 from external impacts. The upper reinforcement plate 100 includes a first screw hole into which the first fixing screw 1100 is inserted.

The reinforcement plate cover 200 is located on the upper reinforcement plate 100, and serves to cover the centered portion of the upper reinforcement plate 100.

The printed circuit board 300 is positioned under the upper reinforcement plate 100 and is formed in a disc shape. The printed circuit board 300 may include a probe circuit pattern (not shown) formed for an inspection process, a substrate through hole 310 formed through a central region, a second screw hole and a first fixing screw 1100 inserted therein. And a third screw hole into which the second fixing screw 1200 is inserted. A lower surface of the printed circuit board 300 is connected to a probe circuit pattern (not shown) and a substrate terminal (not shown) connected to the interposer 400 is formed. The printed circuit board 200 may be connected to a tester for an inspection process, and the tester is electrically connected to a board terminal (not shown) through a probe circuit pattern (not shown) of the printed circuit board 300.

The interposer 400 includes an interposer substrate 410 and an interposer buffer 420.

The interposer substrate 410 is a loop type and serves to connect the printed circuit board 300 and the conversion substrate 500. Interposer terminals (not shown) that are connected to each other are formed on the upper and lower surfaces of the interposer substrate 410. The interposer terminal (not shown) formed on the upper surface of the interposer substrate 410 is connected to the substrate terminal (not shown) formed on the lower surface of the printed circuit board 300, and the interposer terminal formed on the lower surface ( Not shown) is connected to the conversion terminal (not shown) of the conversion substrate 500. The interposer substrate 410 includes a fourth screw hole into which the second fixing screw 1200 is inserted.

The interposer buffer part 420 is positioned between the interposer substrate 410 and the printed circuit board 300. The interposer buffer part 420 is formed of a material having elasticity, and prevents damage to the printed circuit board 300 and the interposer substrate 410 due to the pressure applied to the probe card. The interposer buffer part 420 includes a fifth screw hole into which the second fixing screw is inserted.

The conversion board 500 is positioned between the lower reinforcement plate 600 and the first connection guide plate 700 and the interposer 400, and the connection terminal unit 510, the conversion terminal (not shown), and the first fixing screw ( And a sixth screw hole into which the 1100 is inserted and a seventh screw hole into which the second fixing screw 1200 is inserted.

The connection terminal part 510 is formed to penetrate the central area of the conversion substrate 500 to correspond to the connection part 920 of the probe 900 to be described later, and the connection part 920 of the probe 900 is in contact with the insertion part. A conductive material is formed on an inner surface of the connection terminal unit 510, and the conductive material is connected to the connection unit 920 and the conversion terminal (not shown) of the probe 900.

The conversion terminal (not shown) is formed in the outer region of the upper surface of the conversion substrate 500 corresponding to the interposer terminal (not shown) formed on the lower surface of the interposer substrate 410, and the lower surface of the interposer substrate 410. It is connected to the interposer terminal (not shown) formed at the same time and connected to the connection terminal unit 510.

As described above, the conversion terminal (not shown) is formed in the outer region of the conversion substrate 500 in correspondence with the interposer terminal (not shown) of the interposer substrate 410, and the connection terminal part 510 is connected to the probe 900. The conversion substrate 500 performs pitch conversion from the conversion terminal (not shown) to the connection terminal portion 510 because the conversion substrate 500 is formed in the center region of the conversion substrate 500 in correspondence with the connection portion 920 of FIG. The test object in which the highly integrated circuit pattern was formed by the board | substrate 500 can be inspected. That is, the connection terminal portion 510 of the conversion substrate 500 is electrically connected to the printed circuit board 300 through the conversion terminal (not shown) and the interposer 400 and at the same time, the connection portion 920 of the probe 900. It is electrically connected to the probe 900 through the.

Here, pitch conversion means that the distance between the terminals which adjoins from a 1st point (conversion terminal) to a 2nd point (connection terminal part) is converted.

The lower reinforcement plate 600 is positioned under the conversion substrate 500, and serves to reinforce the conversion substrate 500. In the central region of the lower reinforcing plate 600, a second guide on which the first guide plate seating portion 610 and the second connection guide plate 800 are formed so as to penetrate the first connection guide plate 700 therein. The plate seating portion 620 is formed. An eighth screw hole in which the first fixing screw 1100 is inserted is formed in an outer region of the lower reinforcing plate 600, and a third fixing screw is provided in the second guide plate seating part 620 of the lower reinforcing plate 600. A ninth screw hole into which the 1300 is inserted is formed.

The first connection guide plate 700 is positioned inside the first guide plate seating portion 610 of the lower reinforcing plate 600 and faces the conversion substrate 500. The first connection guide plate 700 passes through the first connection guide plate 700 in correspondence with the connection portion 920 of the probe 900 and the connection terminal portion 510 of the conversion substrate 500 ( 710).

The second connection guide plate 800 is seated on the second guide plate seating portion 620 of the lower reinforcement plate 600 and faces the first connection guide plate 700 and the lower reinforcement plate 600. The second connection guide plate 800 penetrates through the second connection guide plate 800 in correspondence with the connection portion 920 of the probe 900 and the first connection guide portion 710 of the first connection guide plate 700. And a tenth screw hole into which the second connection guide part 810 and the third fixing screw 1300 are inserted.

4 is an enlarged cross-sectional view of part A of FIG. 3.

As shown in FIG. 4, the probe 900 includes a beam part 910, a connection part 920, and a tip part 930.

The beam unit 910 is positioned between the second connection guide plate 800 and the probe protection plate 1000 and extends in one direction and is seated on the upper surface of the probe protection plate 1000.

The connection part 920 extends from the beam part 910 in the direction of the printed circuit board 300, and extends from the beam part 910 so that the second connection guide plate 800, the first connection guide plate 700, and the conversion substrate ( Penetrates 500). That is, the connection part 920 extends from the beam part 910 to contact the connection terminal part 510 of the conversion substrate 500 via the second connection guide part 810 and the first connection guide part 710. An end portion of the connecting portion 920 facing the 910 is positioned in the substrate through hole 310 of the printed circuit board 300 through the connecting terminal portion 510 of the conversion substrate 500.

In another embodiment, an end of the connection portion 920 may be located in the connection terminal portion 510 of the conversion substrate 500.

The tip part 930 is bent and extended downward from the beam part 910 positioned on the upper surface of the probe protection plate 1000. A part of the tip part 930 extends from the upper surface side of the probe protection plate 1000 and is located in the tip guide part 1010 of the probe protection plate 1000 which will be described later. An end of the tip part 930 which is another part of the tip part 930 is The tip guide part 1010 of the probe protection plate 1000 is penetrated so as to be exposed from the lower surface of the probe protection plate 1000. An end portion of the tip portion 930 is in contact with a contact pad formed on a chip on film (COF) that is a test object during an inspection process.

The probe protection plate 1000 faces the second connection guide plate 800 with the beam portion 910 of the probe 900 interposed therebetween. The beam portion 910 of the probe 900 is seated on an upper surface of the probe protection plate 1000, and a lower surface of the probe protection plate 1000 directly faces a chip-on film, which is a test object, during an inspection process. The probe protection plate 1000 includes a tip guide part 1010 in which the tip part 930 of the probe 900 is located, a chip alignment part 1020 and a third fixing screw 1300 formed by being recessed from the lower surface of the probe protection plate 1000. ) Is an eleventh threaded hole into which is inserted.

The tip guide part 1010 penetrates through the probe protection plate 1000 in correspondence with the tip part 930 of the probe 900, and penetrates the tip part 930 of the probe 900. The tip guide part 1010 serves to guide the vertical movement of the tip part 930 of the probe 900.

The chip alignment unit 1020 is recessed and formed from the lower surface of the probe protection plate 1000 corresponding to the protruding position of the chip mounted on the chip-on film, and the tip portion 930 of the probe 900 is formed during the inspection process. When in contact with the contact pad of the on film, the chip mounted on the chip on film is placed therein. That is, the chip alignment unit 1020 accommodates the chip mounted on the chip on film during the inspection process.

The recessed length of the chip alignment portion 1020 should be larger than the protruding length of the chip mounted on the chip on film, and the width of the chip alignment portion 1020 should be larger than the width of the chip mounted on the chip on film. do.

As described above, the probe protection plate 1000 exposes only the tip portion 930 of the probe 900 to the outside, and the chip alignment portion 1020 of the probe protection plate 1000 corresponds to the position of the chip mounted on the chip-on film. Since the chip is recessed and formed from the lower surface of the probe protection plate 1000, and the recessed length and width of the chip alignment unit 1020 are larger than the protruding length and width of the chip, the chip is arranged in the chip alignment film during the inspection process for the chip-on film ( 1020, the probe 900 does not interfere with the chip mounted on the film during the inspection process, and the lower surface of the probe protection plate 1000 supports the film around the chip mounted on the chip-on film. Ripple of the film due to flexibility is prevented so that the tip portion 930 of the probe 900 is exactly in contact with the contact pad formed on the film.

In addition, the chip aligning portion 1020 may align the contact of the tip portion 930 of the probe 900 with the contact pads formed on the chip-on film based on the formation position of the chip mounted on the chip-on film. Can be.

Here, alignment means that the tip portion 930 of the probe 900 is exactly aligned on the contact pad formed on the chip on film.

Hereinafter, an inspection process of a chip on film using a probe card according to an embodiment of the present invention will be described with reference to FIGS. 5 and 6.

5 and 6 are cross-sectional views illustrating an inspection process of a chip on film using a probe card according to an embodiment of the present invention.

First, as shown in FIG. 5, the chip alignment unit 1020 of the probe protection plate 1000 of the probe card is aligned with the chip 11 mounted on the chip on film 10. The alignment of the tip portion 930 of the probe 900 with respect to the contact pad 12 formed on the chip on film 10 is also performed by the alignment of the chip alignment portion 1020 with respect to the chip 11.

Next, as shown in FIG. 6, when the tip portion 930 of the probe 900 of the probe card is brought into contact with the contact pad 12 formed on the chip-on film 10, the chip-on film 10 is directed upward. The chip 11 protruded to be mounted is accommodated in the chip alignment unit 1020 of the probe protection plate 1000.

As such, during the inspection process for the chip-on-film using the probe card according to an embodiment of the present invention, the chip 11 is accommodated in the chip alignment unit 1020 so that the probe 900 interferes with the chip mounted on the film. Not only, but the film around the chip mounted on the chip-on film 10 is supported by the lower surface of the probe protection plate 1000, the lump of the chip-on film 10 due to the flexibility of the chip-on film 10 The anti-vibration prevents the tip portion 930 of the probe 900 from contacting the contact pad 12 formed on the chip-on film 10.

In addition, the tip portion of the probe 900 with respect to the contact pad 12 formed on the chip on film 10 based on the formation position of the chip 11 formed on the chip on film 10 using the chip alignment unit 1020. 930 may align the contacts.

That is, the probe card according to the embodiment of the present invention is not interrupted by the chip 11 protruding from the chip on film 10 and mounted on the chip on film 10 during the inspection process. Inspection reliability of the card is improved.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1 is a first exploded perspective view showing an upper side of a probe card according to an embodiment of the present invention;

2 is a second exploded perspective view showing the lower side of the probe card according to an embodiment of the present invention,

3 is a perspective view showing a cross section and a bottom surface of a probe card according to an embodiment of the present invention;

4 is an enlarged cross-sectional view of portion A of FIG. 3,

5 and 6 are cross-sectional views illustrating an inspection process of a chip on film using a probe card according to an embodiment of the present invention.

Claims (8)

A probe card for inspecting a chip on film (COF) in which a chip protrudes and is mounted, Printed circuit board; A probe electrically connected to the printed circuit board, the probe having a tip contacting the contact pad formed on the film; And The probe is positioned to face the printed circuit board, and the probe extends from an upper surface side thereof so that the tip portion of the probe is exposed to the lower surface opposite to the film, and the lower surface of the position corresponding to the position where the chip is formed is A probe protection plate having a chip alignment portion formed by being recessed; Probe card comprising a. The method of claim 1, The probe protective plate, Further comprising a tip guide portion formed through, And the tip portion penetrates the tip guide portion. The method of claim 1, The recessed length of the chip alignment portion, A probe card larger than the protruding length of the chip. The method of claim 1, The width of the chip alignment portion, A probe card larger than the width of the chip. The method of claim 1, The probe, A beam portion bent from the tip portion and seated on the probe protection plate; A connection part extending from the beam part toward the printed circuit board Probe card further comprising. The method of claim 5, Located between the probe protection plate and the printed circuit board, And at least one connection guide plate having a connection guide part through which the connection part passes. The method of claim 6, Located between the connection guide plate and the printed circuit board, A connection terminal unit into which the connection unit is inserted; And A conversion terminal directly connected to the connection terminal unit and formed to face the printed circuit board and electrically connected to the printed circuit board; A probe card further comprising a conversion substrate having a. The method of claim 7, wherein Located between the conversion substrate and the printed circuit board, An interposer connecting between the conversion terminal and the printed circuit board Probe card further comprising.

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