KR101045251B1 - 포지티브 레지스트 조성물 및 상기 레지스트 조성물을 사용한 패턴 형성방법 - Google Patents
포지티브 레지스트 조성물 및 상기 레지스트 조성물을 사용한 패턴 형성방법 Download PDFInfo
- Publication number
- KR101045251B1 KR101045251B1 KR1020040040758A KR20040040758A KR101045251B1 KR 101045251 B1 KR101045251 B1 KR 101045251B1 KR 1020040040758 A KR1020040040758 A KR 1020040040758A KR 20040040758 A KR20040040758 A KR 20040040758A KR 101045251 B1 KR101045251 B1 KR 101045251B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- alkyl group
- general formula
- repeating unit
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 0 C*C(C)(C(C)(C)C)C(OC(C)(CI)C(OC(C)(CCC1C2)C2(C)OC1=O)=O)=O Chemical compound C*C(C)(C(C)(C)C)C(OC(C)(CI)C(OC(C)(CCC1C2)C2(C)OC1=O)=O)=O 0.000 description 3
- HFSLKSGRAQEDGD-UHFFFAOYSA-N CC(C(C)(C)C)C(OC(CC1C2)C2C(CO2)C1C2=O)=O Chemical compound CC(C(C)(C)C)C(OC(CC1C2)C2C(CO2)C1C2=O)=O HFSLKSGRAQEDGD-UHFFFAOYSA-N 0.000 description 1
- AMXSWTUSCDJSAH-UHFFFAOYSA-N CC(C)(C)C(C)(C)C(OC(C)(C)C(OC(CC1CC2)C2(C)OC1=O)=O)=O Chemical compound CC(C)(C)C(C)(C)C(OC(C)(C)C(OC(CC1CC2)C2(C)OC1=O)=O)=O AMXSWTUSCDJSAH-UHFFFAOYSA-N 0.000 description 1
- DWRPOPUNEFBDQY-UHFFFAOYSA-N CC(C)(C)C(C)(C)C(OC(C)(C)C(OC(CCC1C2)C2OC1=O)=O)=O Chemical compound CC(C)(C)C(C)(C)C(OC(C)(C)C(OC(CCC1C2)C2OC1=O)=O)=O DWRPOPUNEFBDQY-UHFFFAOYSA-N 0.000 description 1
- IUIJSHHTDDUKCX-UHFFFAOYSA-N CC(C)(C)CC(C)(C(C)(C)C)C(OC(CC1C2)C2C(CO2)C1C2=O)=O Chemical compound CC(C)(C)CC(C)(C(C)(C)C)C(OC(CC1C2)C2C(CO2)C1C2=O)=O IUIJSHHTDDUKCX-UHFFFAOYSA-N 0.000 description 1
- QTGCZWBVEHIMDK-UHFFFAOYSA-N CC(OC(CCC1C2)C2OC1=O)=O Chemical compound CC(OC(CCC1C2)C2OC1=O)=O QTGCZWBVEHIMDK-UHFFFAOYSA-N 0.000 description 1
- YJKPYRTWKGBLAV-GXDHUFHOSA-N CCC(C/C=C(\CCO1)/C1=O)OC(C(C)(C)OC(C(C)(C)C(C)(C)C)=O)=O Chemical compound CCC(C/C=C(\CCO1)/C1=O)OC(C(C)(C)OC(C(C)(C)C(C)(C)C)=O)=O YJKPYRTWKGBLAV-GXDHUFHOSA-N 0.000 description 1
- UAMIIASUVMWCDL-UHFFFAOYSA-N CCC(CCC1C2)(C2OC1=O)OC(C(C)(C)OC(C(C)(C)C(C)(C)C)=O)=O Chemical compound CCC(CCC1C2)(C2OC1=O)OC(C(C)(C)OC(C(C)(C)C(C)(C)C)=O)=O UAMIIASUVMWCDL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2003-00159550 | 2003-06-04 | ||
JP2003159550A JP4360836B2 (ja) | 2003-06-04 | 2003-06-04 | ポジ型レジスト組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040104934A KR20040104934A (ko) | 2004-12-13 |
KR101045251B1 true KR101045251B1 (ko) | 2011-06-29 |
Family
ID=34052578
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020040040758A Expired - Fee Related KR101045251B1 (ko) | 2003-06-04 | 2004-06-04 | 포지티브 레지스트 조성물 및 상기 레지스트 조성물을 사용한 패턴 형성방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4360836B2 (enrdf_load_stackoverflow) |
KR (1) | KR101045251B1 (enrdf_load_stackoverflow) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005300998A (ja) | 2004-04-13 | 2005-10-27 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物及びレジストパターン形成方法 |
JP2006349800A (ja) * | 2005-06-14 | 2006-12-28 | Tokyo Ohka Kogyo Co Ltd | ポジ型レジスト組成物およびレジストパターン形成方法 |
JP4679990B2 (ja) * | 2005-07-22 | 2011-05-11 | 東京応化工業株式会社 | ポジ型レジスト組成物の製造方法、ポジ型レジスト組成物およびレジストパターン形成方法 |
JP4668048B2 (ja) * | 2005-12-02 | 2011-04-13 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
TWI477909B (zh) | 2006-01-24 | 2015-03-21 | Fujifilm Corp | 正型感光性組成物及使用它之圖案形成方法 |
TWI358613B (en) * | 2006-03-10 | 2012-02-21 | Rohm & Haas Elect Mat | Compositions and processes for photolithography |
JP5165227B2 (ja) | 2006-10-31 | 2013-03-21 | 東京応化工業株式会社 | 化合物および高分子化合物 |
JP4818882B2 (ja) * | 2006-10-31 | 2011-11-16 | 東京応化工業株式会社 | ポジ型レジスト組成物およびレジストパターン形成方法 |
KR101401755B1 (ko) | 2006-10-31 | 2014-05-30 | 도쿄 오카 고교 가부시키가이샤 | 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법 |
JP4554665B2 (ja) | 2006-12-25 | 2010-09-29 | 富士フイルム株式会社 | パターン形成方法、該パターン形成方法に用いられる多重現像用ポジ型レジスト組成物、該パターン形成方法に用いられるネガ現像用現像液及び該パターン形成方法に用いられるネガ現像用リンス液 |
JP4982288B2 (ja) * | 2007-04-13 | 2012-07-25 | 富士フイルム株式会社 | パターン形成方法 |
EP2189845B1 (en) * | 2008-11-19 | 2017-08-02 | Rohm and Haas Electronic Materials LLC | Compositions and processes for photolithography |
JP6054608B2 (ja) * | 2011-02-15 | 2016-12-27 | 住友化学株式会社 | レジスト組成物及びレジストパターンの製造方法 |
JP5775772B2 (ja) * | 2011-09-22 | 2015-09-09 | 富士フイルム株式会社 | 有機溶剤現像用の感活性光線性又は感放射線性樹脂組成物、これを用いたレジスト膜、パターン形成方法、及び電子デバイスの製造方法 |
JP5965733B2 (ja) | 2012-06-12 | 2016-08-10 | 富士フイルム株式会社 | パターン形成方法、及び、電子デバイスの製造方法 |
JP6060012B2 (ja) | 2013-03-15 | 2017-01-11 | 富士フイルム株式会社 | パターン形成方法、及び、電子デバイスの製造方法 |
KR102366344B1 (ko) * | 2017-12-18 | 2022-02-23 | 가부시키가이샤 닛폰 쇼쿠바이 | 중합체, 경화성 수지 조성물, 및 그 용도 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000035130A (ko) * | 1998-11-02 | 2000-06-26 | 카나가와 치히로 | 신규한 에스테르 화합물, 고분자 화합물, 레지스트 재료및 패턴 형성 방법 |
JP2000338674A (ja) | 1999-05-26 | 2000-12-08 | Fuji Photo Film Co Ltd | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP2002303978A (ja) | 2001-04-05 | 2002-10-18 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
JP2003107710A (ja) | 2001-09-28 | 2003-04-09 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
-
2003
- 2003-06-04 JP JP2003159550A patent/JP4360836B2/ja not_active Expired - Fee Related
-
2004
- 2004-06-04 KR KR1020040040758A patent/KR101045251B1/ko not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20000035130A (ko) * | 1998-11-02 | 2000-06-26 | 카나가와 치히로 | 신규한 에스테르 화합물, 고분자 화합물, 레지스트 재료및 패턴 형성 방법 |
JP2000338674A (ja) | 1999-05-26 | 2000-12-08 | Fuji Photo Film Co Ltd | 遠紫外線露光用ポジ型フォトレジスト組成物 |
JP2002303978A (ja) | 2001-04-05 | 2002-10-18 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
JP2003107710A (ja) | 2001-09-28 | 2003-04-09 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
Also Published As
Publication number | Publication date |
---|---|
JP4360836B2 (ja) | 2009-11-11 |
KR20040104934A (ko) | 2004-12-13 |
JP2004361629A (ja) | 2004-12-24 |
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