KR101012780B1 - 기판 건조 장치 - Google Patents
기판 건조 장치 Download PDFInfo
- Publication number
- KR101012780B1 KR101012780B1 KR1020080089174A KR20080089174A KR101012780B1 KR 101012780 B1 KR101012780 B1 KR 101012780B1 KR 1020080089174 A KR1020080089174 A KR 1020080089174A KR 20080089174 A KR20080089174 A KR 20080089174A KR 101012780 B1 KR101012780 B1 KR 101012780B1
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- chamber member
- process space
- support
- upper chamber
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 143
- 238000001035 drying Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 30
- 230000008569 process Effects 0.000 claims abstract description 27
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 7
- 239000012530 fluid Substances 0.000 description 14
- 238000012546 transfer Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
Abstract
Description
Claims (4)
- 상하로 업다운 동작하며, 하부가 개방된 구조를 갖는 상부 챔버 부재;상기 상부 챔버 부재의 하부에 결합되어 공정 공간을 형성하는 하부 챔버 부재;상기 공정 공간 내에 위치하도록 상기 하부 챔버 부재의 상부에 설치되며, 포토레지스트가 도포된 기판을 전달받아 지지하는 기판 지지부; 및상기 하부 챔버 부재와 연결되고, 상기 기판의 건조를 진행하기 위하여 상기 공정 공간이 감압되도록 배기하는 배기부를 포함하며,상기 기판과 마주하는 상부 챔버 부재의 하부면 부위는 상기 공정 공간을 배기 할 때 상기 기판 상부에서의 유속이 균일해지도록 상기 기판의 중심에서 가장자리로 갈수록 상기 기판에 대해 거리가 멀어지는 원뿔 또는 각뿔 구조를 갖는 것을 특징으로 하는 기판 건조 장치.
- 제1항에 있어서, 상기 기판 지지부는지지 플레이트;상기 지지 플레이트 상부에 설치되고, 상기 기판의 하부를 직접 접촉하여 지지하는 다수의 지지핀들; 및상기 지지 플레이트를 상하로 업다운 동작시키는 다수의 서포트핀들을 포함하는 것을 특징으로 하는 기판 건조 장치.
- 제1항에 있어서, 상기 배기부는진공 펌프; 및상기 진공 펌프와 연결되며, 상기 하부 챔버 부재의 하부면에 균일하게 배치되는 다수의 배기홀을 포함하는 것을 특징으로 하는 기판 건조 장치.
- 제1항에 있어서, 상기 기판과 마주하는 상기 상부 챔버 부재 하면 부위의 원뿔 또는 각뿔 구조는 분리 가능한 것을 특징으로 하는 기판 건조 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080089174A KR101012780B1 (ko) | 2008-09-10 | 2008-09-10 | 기판 건조 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080089174A KR101012780B1 (ko) | 2008-09-10 | 2008-09-10 | 기판 건조 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100030291A KR20100030291A (ko) | 2010-03-18 |
KR101012780B1 true KR101012780B1 (ko) | 2011-02-08 |
Family
ID=42180268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080089174A KR101012780B1 (ko) | 2008-09-10 | 2008-09-10 | 기판 건조 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101012780B1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102219881B1 (ko) * | 2013-12-27 | 2021-02-24 | 세메스 주식회사 | 공정 챔버 및 이를 포함하는 기판 처리 장치 |
KR102185468B1 (ko) * | 2014-12-02 | 2020-12-03 | 삼성디스플레이 주식회사 | 감압건조장치 및 이를 이용한 감압건조방법 |
KR102258986B1 (ko) * | 2019-02-13 | 2021-06-02 | 무진전자 주식회사 | 기판 건조 챔버 |
KR102285672B1 (ko) * | 2019-06-04 | 2021-08-06 | 무진전자 주식회사 | 기판 건조 챔버 |
KR102383007B1 (ko) * | 2020-06-01 | 2022-04-05 | 무진전자 주식회사 | 기판 건조 챔버 |
KR102391208B1 (ko) * | 2020-07-15 | 2022-04-27 | 무진전자 주식회사 | 기판 건조 챔버 |
KR102283290B1 (ko) * | 2020-07-27 | 2021-07-29 | 무진전자 주식회사 | 기판 건조 챔버 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100811824B1 (ko) * | 2006-08-01 | 2008-03-10 | 세메스 주식회사 | 기판 처리 장치 |
KR20080060403A (ko) * | 2006-12-27 | 2008-07-02 | 주식회사 케이씨텍 | 대면적 기판의 포토레지스트 건조장치 |
-
2008
- 2008-09-10 KR KR1020080089174A patent/KR101012780B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100811824B1 (ko) * | 2006-08-01 | 2008-03-10 | 세메스 주식회사 | 기판 처리 장치 |
KR20080060403A (ko) * | 2006-12-27 | 2008-07-02 | 주식회사 케이씨텍 | 대면적 기판의 포토레지스트 건조장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20100030291A (ko) | 2010-03-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101012780B1 (ko) | 기판 건조 장치 | |
JP6369054B2 (ja) | 基板載置装置及び基板処理装置 | |
TWI761687B (zh) | 減壓乾燥裝置、基板處理裝置及減壓乾燥方法 | |
US20060156987A1 (en) | Lift pin mechanism and substrate carrying device of a process chamber | |
JP2013161946A (ja) | 基板処理装置及び基板処理方法 | |
KR102190687B1 (ko) | 슬릿코터 시스템 | |
JP2013225681A (ja) | 減圧乾燥装置及び減圧乾燥方法 | |
JP2006059844A (ja) | 減圧乾燥装置 | |
KR20100059238A (ko) | 기판 상의 포토레지스트막을 건조하기 위한 장치 | |
KR101020675B1 (ko) | 기판 상의 포토레지스트막을 건조하기 위한 장치 | |
KR102010267B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
TWI508210B (zh) | 基板處理裝置及基板處理方法 | |
KR101846146B1 (ko) | 액정 디스펜서 | |
KR101332505B1 (ko) | 필름 이송용 로봇핸드의 주름방지장치 | |
KR101817217B1 (ko) | 척핀, 척핀 제조 방법 및 기판 처리 장치 | |
KR100974937B1 (ko) | 기판 이송 장치 및 이를 포함하는 기판 처리 설비 | |
KR20090012468A (ko) | 리프트 핀 유닛 및 이를 갖는 기판 가공 장치 | |
JP2006153315A (ja) | 減圧乾燥装置 | |
KR20160027393A (ko) | 개선된 부상 방식의 기판 코팅 장치, 코팅 시스템, 및 코팅 방법 | |
KR101034375B1 (ko) | 이송 로봇 및 이를 갖는 기판 가공 장치 | |
KR20160005462A (ko) | 기판 처리 장치 및 기판 처리 방법 | |
CN117583215A (zh) | 减压干燥装置 | |
CN117358548A (zh) | 减压干燥装置 | |
KR20230028151A (ko) | 감압 건조 장치, 감압 건조 방법 및 컴퓨터로 판독 가능한 기억 매체에 기억된 컴퓨터 프로그램 | |
KR101490451B1 (ko) | 기판처리장치용 지그 및 이를 이용한 유지보수 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20140106 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20150106 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20151230 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20161229 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20180104 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20190104 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20200106 Year of fee payment: 10 |