KR101003615B1 - 세라믹 기판의 전극패턴 형성방법 - Google Patents
세라믹 기판의 전극패턴 형성방법 Download PDFInfo
- Publication number
- KR101003615B1 KR101003615B1 KR1020090048593A KR20090048593A KR101003615B1 KR 101003615 B1 KR101003615 B1 KR 101003615B1 KR 1020090048593 A KR1020090048593 A KR 1020090048593A KR 20090048593 A KR20090048593 A KR 20090048593A KR 101003615 B1 KR101003615 B1 KR 101003615B1
- Authority
- KR
- South Korea
- Prior art keywords
- ceramic substrate
- pattern
- forming
- electrode pattern
- conductive adhesive
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (8)
- 세라믹 기판 상에 서로 이격된 복수의 도전성 접착패턴을 형성하는 단계;상기 세라믹 기판 상에 상기 도전성 접착패턴을 덮는 도금 씨드층을 형성하는 단계;상기 도금 씨드층 상에 상기 도전성 접착패턴과 대응하는 부분을 노출시키는 감광막 패턴을 형성하는 단계;상기 감광막 패턴에 의해 노출된 상기 도금 씨드층 상에 도금층을 형성하는 단계;상기 감광막 패턴을 제거하는 단계; 및상기 감광막 패턴이 제거되어 노출된 상기 도금 씨드층 부분을 식각하는 단계;를 포함하는 세라믹 기판의 전극패턴 형성방법.
- 제1항에 있어서,상기 세라믹 기판은 LTCC 기판인 세라믹 기판의 전극패턴 형성방법.
- 제1항에 있어서,상기 세라믹 기판 상에 서로 이격된 복수의 도전성 접착패턴을 형성하는 단계는,상기 세라믹 기판 상에 상기 도전성 접착패턴이 형성될 영역과 대응하는 부분이 천공되어 있는 마스크를 형성하는 단계;상기 마스크에 의해 오픈된 상기 세라믹 기판 상에 도전성 접착패턴을 증착하는 단계; 및상기 마스크를 제거하는 단계;를 포함하는 세라믹 기판의 전극패턴 형성방법.
- 제3항에 있어서,상기 마스크는 금속, 글라스, 아크릴 및 포토레지스트 중 어느 하나의 재질로 이루어진 세라믹 기판의 전극패턴 형성방법.
- 제3항에 있어서,상기 도전성 접착패턴은 Ti로 증착하는 세라믹 기판의 전극패턴 형성방법.
- 제1항에 있어서,상기 도금 씨드층은 Cu로 형성하는 세라믹 기판의 전극패턴 형성방법.
- 제1항에 있어서,상기 도금층은 Cu, Ni 및 Au 중 적어도 어느 하나를 포함하는 세라믹 기판의 전극패턴 형성방법.
- 제1항에 있어서,상기 감광막 패턴이 제거되어 노출된 상기 도금 씨드층 부분을 식각하는 단계에서,pH 가 6 내지 7인 에천트를 사용하여 상기 도금 씨드층을 식각하는 세라믹 기판의 전극패턴 형성방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090048593A KR101003615B1 (ko) | 2009-06-02 | 2009-06-02 | 세라믹 기판의 전극패턴 형성방법 |
US12/458,834 US8198198B2 (en) | 2009-06-02 | 2009-07-23 | Method for forming electrode pattern of ceramic substrate |
JP2009180968A JP4819150B2 (ja) | 2009-06-02 | 2009-08-03 | セラミック基板の電極パターン形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090048593A KR101003615B1 (ko) | 2009-06-02 | 2009-06-02 | 세라믹 기판의 전극패턴 형성방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100129968A KR20100129968A (ko) | 2010-12-10 |
KR101003615B1 true KR101003615B1 (ko) | 2010-12-23 |
Family
ID=43219068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090048593A KR101003615B1 (ko) | 2009-06-02 | 2009-06-02 | 세라믹 기판의 전극패턴 형성방법 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8198198B2 (ko) |
JP (1) | JP4819150B2 (ko) |
KR (1) | KR101003615B1 (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9128123B2 (en) | 2011-06-03 | 2015-09-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Interposer test structures and methods |
KR101214734B1 (ko) * | 2011-08-05 | 2012-12-21 | 삼성전기주식회사 | 박막 전극 세라믹 기판 및 이의 제조방법 |
KR101865799B1 (ko) * | 2011-11-07 | 2018-06-08 | 삼성전기주식회사 | 인쇄회로기판 및 그의 제조방법 |
US9105490B2 (en) | 2012-09-27 | 2015-08-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contact structure of semiconductor device |
KR101567580B1 (ko) | 2015-07-24 | 2015-11-12 | 한국기계연구원 | 유연 접속 구조물 및 그 제조 방법 |
KR101719145B1 (ko) * | 2015-11-12 | 2017-03-23 | 백종호 | 플라즈마 광원 시스템용 무전극 플라즈마 광원 소켓 베이스 성형방법 |
KR101959381B1 (ko) * | 2016-08-18 | 2019-03-18 | 한국생산기술연구원 | C4f8 가스 중합을 이용한 실리카 파이버 어레이용 그루브의 제조방법 |
US20180337391A1 (en) * | 2017-05-18 | 2018-11-22 | GM Global Technology Operations LLC | Pressing process of creating a patterned surface on battery electrodes |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000323845A (ja) | 1999-05-14 | 2000-11-24 | Sony Corp | 電子回路実装用基板の製造方法 |
JP2002171029A (ja) | 2000-11-30 | 2002-06-14 | Kyocera Corp | セラミック配線基板およびその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002096166A1 (en) * | 2001-05-18 | 2002-11-28 | Corporation For National Research Initiatives | Radio frequency microelectromechanical systems (mems) devices on low-temperature co-fired ceramic (ltcc) substrates |
JP2007250929A (ja) * | 2006-03-17 | 2007-09-27 | Koa Corp | Ltcc基板上の配線形成方法 |
KR100771783B1 (ko) | 2006-09-28 | 2007-10-30 | 삼성전기주식회사 | 무수축 세라믹 기판의 제조방법 |
US7943510B2 (en) * | 2007-09-10 | 2011-05-17 | Enpirion, Inc. | Methods of processing a substrate and forming a micromagnetic device |
US20090107851A1 (en) * | 2007-10-10 | 2009-04-30 | Akira Kodera | Electrolytic polishing method of substrate |
-
2009
- 2009-06-02 KR KR1020090048593A patent/KR101003615B1/ko active IP Right Grant
- 2009-07-23 US US12/458,834 patent/US8198198B2/en not_active Expired - Fee Related
- 2009-08-03 JP JP2009180968A patent/JP4819150B2/ja not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000323845A (ja) | 1999-05-14 | 2000-11-24 | Sony Corp | 電子回路実装用基板の製造方法 |
JP2002171029A (ja) | 2000-11-30 | 2002-06-14 | Kyocera Corp | セラミック配線基板およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US8198198B2 (en) | 2012-06-12 |
US20100301009A1 (en) | 2010-12-02 |
KR20100129968A (ko) | 2010-12-10 |
JP2010283318A (ja) | 2010-12-16 |
JP4819150B2 (ja) | 2011-11-24 |
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