KR101001062B1 - 미세 패턴용 연성금속 적층판 - Google Patents

미세 패턴용 연성금속 적층판 Download PDF

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Publication number
KR101001062B1
KR101001062B1 KR1020050045179A KR20050045179A KR101001062B1 KR 101001062 B1 KR101001062 B1 KR 101001062B1 KR 1020050045179 A KR1020050045179 A KR 1020050045179A KR 20050045179 A KR20050045179 A KR 20050045179A KR 101001062 B1 KR101001062 B1 KR 101001062B1
Authority
KR
South Korea
Prior art keywords
metal
incident angle
flexible metal
amount
fine pattern
Prior art date
Application number
KR1020050045179A
Other languages
English (en)
Korean (ko)
Other versions
KR20060122592A (ko
Inventor
김경각
안중규
송병길
문홍기
Original Assignee
엘에스엠트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘에스엠트론 주식회사 filed Critical 엘에스엠트론 주식회사
Priority to KR1020050045179A priority Critical patent/KR101001062B1/ko
Priority to TW095118670A priority patent/TWI328982B/zh
Priority to JP2006145796A priority patent/JP4566157B2/ja
Priority to CNB2006100812546A priority patent/CN100518434C/zh
Publication of KR20060122592A publication Critical patent/KR20060122592A/ko
Application granted granted Critical
Publication of KR101001062B1 publication Critical patent/KR101001062B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
KR1020050045179A 2005-05-27 2005-05-27 미세 패턴용 연성금속 적층판 KR101001062B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020050045179A KR101001062B1 (ko) 2005-05-27 2005-05-27 미세 패턴용 연성금속 적층판
TW095118670A TWI328982B (en) 2005-05-27 2006-05-25 Flexible metal clad laminate for fine pattern
JP2006145796A JP4566157B2 (ja) 2005-05-27 2006-05-25 微細パターン用軟性金属積層板
CNB2006100812546A CN100518434C (zh) 2005-05-27 2006-05-26 用于精细图案的柔性覆金属层压板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050045179A KR101001062B1 (ko) 2005-05-27 2005-05-27 미세 패턴용 연성금속 적층판

Publications (2)

Publication Number Publication Date
KR20060122592A KR20060122592A (ko) 2006-11-30
KR101001062B1 true KR101001062B1 (ko) 2010-12-14

Family

ID=37444378

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050045179A KR101001062B1 (ko) 2005-05-27 2005-05-27 미세 패턴용 연성금속 적층판

Country Status (4)

Country Link
JP (1) JP4566157B2 (zh)
KR (1) KR101001062B1 (zh)
CN (1) CN100518434C (zh)
TW (1) TWI328982B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190031838A (ko) * 2017-09-18 2019-03-27 주식회사 아모그린텍 박막 회로 기판 및 이의 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2775647B2 (ja) * 1989-11-17 1998-07-16 宇部興産株式会社 メタライズドポリイミドフィルムの製法
JPH10193505A (ja) * 1997-01-09 1998-07-28 Sumitomo Metal Mining Co Ltd ２層フレキシブル基板の製造方法
JP4350263B2 (ja) * 2000-04-03 2009-10-21 三菱伸銅株式会社 金属化ポリイミドフィルムおよびその製造方法
WO2003004262A1 (fr) * 2001-07-06 2003-01-16 Kaneka Corporation Stratifie et son procede de production
JP2004009357A (ja) * 2002-06-04 2004-01-15 Toyo Metallizing Co Ltd 金属蒸着／金属メッキ積層フィルム及びこれを用いた電子部品

Also Published As

Publication number Publication date
TW200704296A (en) 2007-01-16
JP2006327200A (ja) 2006-12-07
TWI328982B (en) 2010-08-11
CN1870855A (zh) 2006-11-29
KR20060122592A (ko) 2006-11-30
JP4566157B2 (ja) 2010-10-20
CN100518434C (zh) 2009-07-22

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