TW200704296A - Flexible metal clad laminate for fine pattern - Google Patents

Flexible metal clad laminate for fine pattern

Info

Publication number
TW200704296A
TW200704296A TW095118670A TW95118670A TW200704296A TW 200704296 A TW200704296 A TW 200704296A TW 095118670 A TW095118670 A TW 095118670A TW 95118670 A TW95118670 A TW 95118670A TW 200704296 A TW200704296 A TW 200704296A
Authority
TW
Taiwan
Prior art keywords
fine pattern
clad laminate
flexible metal
metal clad
incident angle
Prior art date
Application number
TW095118670A
Other languages
Chinese (zh)
Other versions
TWI328982B (en
Inventor
Kyung-Kak Kim
Hong-Ki Moon
Jung-Kyu An
Byoung-Kil Song
Original Assignee
Ls Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ls Cable Ltd filed Critical Ls Cable Ltd
Publication of TW200704296A publication Critical patent/TW200704296A/en
Application granted granted Critical
Publication of TWI328982B publication Critical patent/TWI328982B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

A flexible metal clad laminate having a surface shape favorable for forming a fine pattern includes a polymer film; a metal seed layer formed in an upper portion of the polymer film by means of a vacuum film deposition method; and a metal conductive layer formed on the metal seed layer by means of wet plating and having a surface roughness (Rz) of 0.5 μm or less. Assuming that a reflection quantity of light incident on a surface of the metal conductive layer at a first incident angle is I, and a reflection quantity of light incident on the surface at a second incident angle greater than the first incident angle is II, II/I is 1.0 or above.
TW095118670A 2005-05-27 2006-05-25 Flexible metal clad laminate for fine pattern TWI328982B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050045179A KR101001062B1 (en) 2005-05-27 2005-05-27 flexible metal clad laminate for fine pattern

Publications (2)

Publication Number Publication Date
TW200704296A true TW200704296A (en) 2007-01-16
TWI328982B TWI328982B (en) 2010-08-11

Family

ID=37444378

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095118670A TWI328982B (en) 2005-05-27 2006-05-25 Flexible metal clad laminate for fine pattern

Country Status (4)

Country Link
JP (1) JP4566157B2 (en)
KR (1) KR101001062B1 (en)
CN (1) CN100518434C (en)
TW (1) TWI328982B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190031838A (en) * 2017-09-18 2019-03-27 주식회사 아모그린텍 Thin film cirtuit substrate and manufacturing method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2775647B2 (en) * 1989-11-17 1998-07-16 宇部興産株式会社 Manufacturing method of metallized polyimide film
JPH10193505A (en) * 1997-01-09 1998-07-28 Sumitomo Metal Mining Co Ltd 2 layer flexible circuit board production method
JP4350263B2 (en) * 2000-04-03 2009-10-21 三菱伸銅株式会社 Metallized polyimide film and method for producing the same
JPWO2003004262A1 (en) * 2001-07-06 2004-10-21 鐘淵化学工業株式会社 Laminate and manufacturing method thereof
JP2004009357A (en) * 2002-06-04 2004-01-15 Toyo Metallizing Co Ltd Metal vapor-deposited/metal plated laminated film and electronic part using the same

Also Published As

Publication number Publication date
KR20060122592A (en) 2006-11-30
KR101001062B1 (en) 2010-12-14
CN1870855A (en) 2006-11-29
TWI328982B (en) 2010-08-11
JP2006327200A (en) 2006-12-07
JP4566157B2 (en) 2010-10-20
CN100518434C (en) 2009-07-22

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