KR100993104B1 - 토로이달 소스 반응기를 위한 매우 균일한 챔버 시즈닝프로세스를 가진 플라즈마 잠입 이온 주입방법 - Google Patents

토로이달 소스 반응기를 위한 매우 균일한 챔버 시즈닝프로세스를 가진 플라즈마 잠입 이온 주입방법 Download PDF

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KR100993104B1
KR100993104B1 KR1020080045088A KR20080045088A KR100993104B1 KR 100993104 B1 KR100993104 B1 KR 100993104B1 KR 1020080045088 A KR1020080045088 A KR 1020080045088A KR 20080045088 A KR20080045088 A KR 20080045088A KR 100993104 B1 KR100993104 B1 KR 100993104B1
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South Korea
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gas
chamber
ion implantation
pedestal
wafer
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Korean (ko)
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KR20080101740A (ko
Inventor
시지안 리
릴리 엘. 팡
마지드 에이. 포아드
선-미 조
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H01L21/2236—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32412—Plasma immersion ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020080045088A 2007-05-15 2008-05-15 토로이달 소스 반응기를 위한 매우 균일한 챔버 시즈닝프로세스를 가진 플라즈마 잠입 이온 주입방법 Expired - Fee Related KR100993104B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/748,783 2007-05-15
US11/748,783 US7691755B2 (en) 2007-05-15 2007-05-15 Plasma immersion ion implantation with highly uniform chamber seasoning process for a toroidal source reactor

Publications (2)

Publication Number Publication Date
KR20080101740A KR20080101740A (ko) 2008-11-21
KR100993104B1 true KR100993104B1 (ko) 2010-11-08

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KR1020080045088A Expired - Fee Related KR100993104B1 (ko) 2007-05-15 2008-05-15 토로이달 소스 반응기를 위한 매우 균일한 챔버 시즈닝프로세스를 가진 플라즈마 잠입 이온 주입방법

Country Status (5)

Country Link
US (1) US7691755B2 (enExample)
JP (1) JP2009004755A (enExample)
KR (1) KR100993104B1 (enExample)
CN (1) CN101308784B (enExample)
TW (1) TW200915396A (enExample)

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JPWO2008050596A1 (ja) * 2006-10-25 2010-02-25 パナソニック株式会社 プラズマドーピング方法及びプラズマドーピング装置
US8320191B2 (en) 2007-08-30 2012-11-27 Infineon Technologies Ag Memory cell arrangement, method for controlling a memory cell, memory array and electronic device
US7968439B2 (en) * 2008-02-06 2011-06-28 Applied Materials, Inc. Plasma immersion ion implantation method using a pure or nearly pure silicon seasoning layer on the chamber interior surfaces
US8642128B2 (en) * 2009-04-20 2014-02-04 Applied Materials, Inc. Enhanced scavenging of residual fluorine radicals using silicon coating on process chamber walls
JP2011054376A (ja) 2009-09-01 2011-03-17 Ihi Corp Ｌｐｐ方式のｅｕｖ光源とその発生方法
KR101415886B1 (ko) 2009-09-01 2014-07-04 가부시키가이샤 아이에이치아이 플라즈마 광원
CN102296275B (zh) * 2010-06-25 2013-10-16 中国科学院微电子研究所 基片离子均匀注入的方法
US10658161B2 (en) * 2010-10-15 2020-05-19 Applied Materials, Inc. Method and apparatus for reducing particle defects in plasma etch chambers
US8309474B1 (en) * 2011-06-07 2012-11-13 Ultratech, Inc. Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication
US9302348B2 (en) 2011-06-07 2016-04-05 Ultratech Inc. Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication
CN103165377B (zh) * 2011-12-12 2016-02-03 中国科学院微电子研究所 一种等离子体浸没注入电极结构
CN103915307B (zh) * 2012-12-31 2016-08-17 中微半导体设备(上海)有限公司 等离子体处理室及用于该等离子体处理室的气体注入装置
KR102104018B1 (ko) * 2013-03-12 2020-04-23 어플라이드 머티어리얼스, 인코포레이티드 방위각 및 방사상 분배 제어되는 다중-구역 가스 주입 조립체
SG11201506564RA (en) * 2013-03-15 2015-09-29 Plasmability Llc Toroidal plasma processing apparatus
CN104576280B (zh) * 2013-10-23 2017-10-20 中微半导体设备(上海)有限公司 等离子体处理腔室及其去夹持装置和方法
CN104810238A (zh) * 2014-01-23 2015-07-29 北京北方微电子基地设备工艺研究中心有限责任公司 匀气结构及等离子体系统
JP6242288B2 (ja) * 2014-05-15 2017-12-06 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US9613819B2 (en) * 2014-06-06 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Process chamber, method of preparing a process chamber, and method of operating a process chamber
CN105529237B (zh) * 2014-10-23 2018-05-01 中微半导体设备(上海)有限公司 气体导流环、气体供应装置及等离子体处理装置
US9828672B2 (en) 2015-03-26 2017-11-28 Lam Research Corporation Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma
US10023956B2 (en) * 2015-04-09 2018-07-17 Lam Research Corporation Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systems
CN114551206A (zh) * 2015-12-04 2022-05-27 应用材料公司 用以防止hdp-cvd腔室电弧放电的先进涂层方法及材料
JP6804280B2 (ja) * 2016-12-07 2020-12-23 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US10211099B2 (en) 2016-12-19 2019-02-19 Lam Research Corporation Chamber conditioning for remote plasma process
JP6270191B1 (ja) * 2017-05-17 2018-01-31 日本新工芯技株式会社 保護材用リング
US20190051495A1 (en) * 2017-08-10 2019-02-14 Qiwei Liang Microwave Reactor For Deposition or Treatment of Carbon Compounds
US11761079B2 (en) 2017-12-07 2023-09-19 Lam Research Corporation Oxidation resistant protective layer in chamber conditioning
US10760158B2 (en) 2017-12-15 2020-09-01 Lam Research Corporation Ex situ coating of chamber components for semiconductor processing
KR20250110938A (ko) 2018-10-19 2025-07-21 램 리써치 코포레이션 반도체 프로세싱을 위한 챔버 컴포넌트들의 인 시츄 (in situ) 보호 코팅
WO2020101838A1 (en) * 2018-11-16 2020-05-22 Mattson Technology, Inc. Chamber seasoning to improve etch uniformity by reducing chemistry
CN112376029B (zh) * 2020-11-11 2022-10-21 北京北方华创微电子装备有限公司 等离子体浸没离子注入设备
CN114597145A (zh) * 2022-03-09 2022-06-07 盛吉盛半导体科技(北京)有限公司 一种硅反应装置

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US20050191827A1 (en) 2000-08-11 2005-09-01 Collins Kenneth S. Plasma immersion ion implantation process
US20050191830A1 (en) 2000-08-11 2005-09-01 Collins Kenneth S. Plasma immersion ion implantation process

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US5744049A (en) * 1994-07-18 1998-04-28 Applied Materials, Inc. Plasma reactor with enhanced plasma uniformity by gas addition, and method of using same
TW422892B (en) * 1997-03-27 2001-02-21 Applied Materials Inc Technique for improving chucking reproducibility
US6197123B1 (en) * 1997-12-18 2001-03-06 Texas Instruments Incorporated Method for cleaning a process chamber used for manufacturing substrates during nonproduction intervals
US6589868B2 (en) * 2001-02-08 2003-07-08 Applied Materials, Inc. Si seasoning to reduce particles, extend clean frequency, block mobile ions and increase chamber throughput
US20050260354A1 (en) * 2004-05-20 2005-11-24 Varian Semiconductor Equipment Associates, Inc. In-situ process chamber preparation methods for plasma ion implantation systems

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US20050191827A1 (en) 2000-08-11 2005-09-01 Collins Kenneth S. Plasma immersion ion implantation process
US20050191830A1 (en) 2000-08-11 2005-09-01 Collins Kenneth S. Plasma immersion ion implantation process

Also Published As

Publication number Publication date
US7691755B2 (en) 2010-04-06
US20080286982A1 (en) 2008-11-20
CN101308784B (zh) 2012-06-20
CN101308784A (zh) 2008-11-19
KR20080101740A (ko) 2008-11-21
TW200915396A (en) 2009-04-01
JP2009004755A (ja) 2009-01-08

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