JP2009004755A - トロイダルソースリアクタのための極めて均一なチャンバシーズニングプロセスにおけるプラズマ浸漬イオン注入 - Google Patents

トロイダルソースリアクタのための極めて均一なチャンバシーズニングプロセスにおけるプラズマ浸漬イオン注入 Download PDF

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Publication number
JP2009004755A
JP2009004755A JP2008127472A JP2008127472A JP2009004755A JP 2009004755 A JP2009004755 A JP 2009004755A JP 2008127472 A JP2008127472 A JP 2008127472A JP 2008127472 A JP2008127472 A JP 2008127472A JP 2009004755 A JP2009004755 A JP 2009004755A
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Japan
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gas
chamber
pedestal
wafer
silicon
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JP2008127472A
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Japanese (ja)
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JP2009004755A5 (enExample
Inventor
Shijian Li
リ シジアン
Lily L Pang
エル． パン リリー
Majeed A Foad
エー． フォアド マジード
Seon-Mee Cho
チョ セオン−メー
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2009004755A publication Critical patent/JP2009004755A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/223—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase
    • H01L21/2236—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a gaseous phase from or into a plasma phase
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32412—Plasma immersion ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
JP2008127472A 2007-05-15 2008-05-14 トロイダルソースリアクタのための極めて均一なチャンバシーズニングプロセスにおけるプラズマ浸漬イオン注入 Ceased JP2009004755A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/748,783 US7691755B2 (en) 2007-05-15 2007-05-15 Plasma immersion ion implantation with highly uniform chamber seasoning process for a toroidal source reactor

Publications (2)

Publication Number Publication Date
JP2009004755A true JP2009004755A (ja) 2009-01-08
JP2009004755A5 JP2009004755A5 (enExample) 2011-06-30

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JP2008127472A Ceased JP2009004755A (ja) 2007-05-15 2008-05-14 トロイダルソースリアクタのための極めて均一なチャンバシーズニングプロセスにおけるプラズマ浸漬イオン注入

Country Status (5)

Country Link
US (1) US7691755B2 (enExample)
JP (1) JP2009004755A (enExample)
KR (1) KR100993104B1 (enExample)
CN (1) CN101308784B (enExample)
TW (1) TW200915396A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011511473A (ja) * 2008-02-06 2011-04-07 アプライド マテリアルズ インコーポレイテッド チャンバ内面上に純粋またはほぼ純粋なシリコンのシーズニング層を用いるプラズマ浸漬イオン注入方法
KR20150127033A (ko) * 2013-03-12 2015-11-16 어플라이드 머티어리얼스, 인코포레이티드 방위각 및 방사상 분배 제어되는 다중-구역 가스 주입 조립체

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JPWO2008050596A1 (ja) * 2006-10-25 2010-02-25 パナソニック株式会社 プラズマドーピング方法及びプラズマドーピング装置
US8320191B2 (en) 2007-08-30 2012-11-27 Infineon Technologies Ag Memory cell arrangement, method for controlling a memory cell, memory array and electronic device
US8642128B2 (en) * 2009-04-20 2014-02-04 Applied Materials, Inc. Enhanced scavenging of residual fluorine radicals using silicon coating on process chamber walls
JP2011054376A (ja) 2009-09-01 2011-03-17 Ihi Corp Ｌｐｐ方式のｅｕｖ光源とその発生方法
KR101415886B1 (ko) 2009-09-01 2014-07-04 가부시키가이샤 아이에이치아이 플라즈마 광원
CN102296275B (zh) * 2010-06-25 2013-10-16 中国科学院微电子研究所 基片离子均匀注入的方法
US10658161B2 (en) * 2010-10-15 2020-05-19 Applied Materials, Inc. Method and apparatus for reducing particle defects in plasma etch chambers
US8309474B1 (en) * 2011-06-07 2012-11-13 Ultratech, Inc. Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication
US9302348B2 (en) 2011-06-07 2016-04-05 Ultratech Inc. Ultrafast laser annealing with reduced pattern density effects in integrated circuit fabrication
CN103165377B (zh) * 2011-12-12 2016-02-03 中国科学院微电子研究所 一种等离子体浸没注入电极结构
CN103915307B (zh) * 2012-12-31 2016-08-17 中微半导体设备(上海)有限公司 等离子体处理室及用于该等离子体处理室的气体注入装置
SG11201506564RA (en) * 2013-03-15 2015-09-29 Plasmability Llc Toroidal plasma processing apparatus
CN104576280B (zh) * 2013-10-23 2017-10-20 中微半导体设备(上海)有限公司 等离子体处理腔室及其去夹持装置和方法
CN104810238A (zh) * 2014-01-23 2015-07-29 北京北方微电子基地设备工艺研究中心有限责任公司 匀气结构及等离子体系统
JP6242288B2 (ja) * 2014-05-15 2017-12-06 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US9613819B2 (en) * 2014-06-06 2017-04-04 Taiwan Semiconductor Manufacturing Company, Ltd. Process chamber, method of preparing a process chamber, and method of operating a process chamber
CN105529237B (zh) * 2014-10-23 2018-05-01 中微半导体设备(上海)有限公司 气体导流环、气体供应装置及等离子体处理装置
US9828672B2 (en) 2015-03-26 2017-11-28 Lam Research Corporation Minimizing radical recombination using ALD silicon oxide surface coating with intermittent restoration plasma
US10023956B2 (en) * 2015-04-09 2018-07-17 Lam Research Corporation Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systems
CN114551206A (zh) * 2015-12-04 2022-05-27 应用材料公司 用以防止hdp-cvd腔室电弧放电的先进涂层方法及材料
JP6804280B2 (ja) * 2016-12-07 2020-12-23 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
US10211099B2 (en) 2016-12-19 2019-02-19 Lam Research Corporation Chamber conditioning for remote plasma process
JP6270191B1 (ja) * 2017-05-17 2018-01-31 日本新工芯技株式会社 保護材用リング
US20190051495A1 (en) * 2017-08-10 2019-02-14 Qiwei Liang Microwave Reactor For Deposition or Treatment of Carbon Compounds
US11761079B2 (en) 2017-12-07 2023-09-19 Lam Research Corporation Oxidation resistant protective layer in chamber conditioning
US10760158B2 (en) 2017-12-15 2020-09-01 Lam Research Corporation Ex situ coating of chamber components for semiconductor processing
KR20250110938A (ko) 2018-10-19 2025-07-21 램 리써치 코포레이션 반도체 프로세싱을 위한 챔버 컴포넌트들의 인 시츄 (in situ) 보호 코팅
WO2020101838A1 (en) * 2018-11-16 2020-05-22 Mattson Technology, Inc. Chamber seasoning to improve etch uniformity by reducing chemistry
CN112376029B (zh) * 2020-11-11 2022-10-21 北京北方华创微电子装备有限公司 等离子体浸没离子注入设备
CN114597145A (zh) * 2022-03-09 2022-06-07 盛吉盛半导体科技(北京)有限公司 一种硅反应装置

Citations (4)

* Cited by examiner, † Cited by third party
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JPH0922797A (ja) * 1994-07-18 1997-01-21 Applied Materials Inc ガスの添加、チャンバ直径の減少及びｒｆウエハペデスタル直径の減少によりプラズマ均一性が向上したプラズマリアクタ
US20020146512A1 (en) * 2001-02-08 2002-10-10 Applied Materials, Inc. Si seasoning to reduce particles, extend clean frequency, block mobile ions and increase chamber throughput
US20050191827A1 (en) * 2000-08-11 2005-09-01 Collins Kenneth S. Plasma immersion ion implantation process
WO2005114692A2 (en) * 2004-05-20 2005-12-01 Varian Semiconductor Equipment Associates, Inc. In-situ process chamber preparation methods for plasma ion implantation systems

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TW422892B (en) * 1997-03-27 2001-02-21 Applied Materials Inc Technique for improving chucking reproducibility
US6197123B1 (en) * 1997-12-18 2001-03-06 Texas Instruments Incorporated Method for cleaning a process chamber used for manufacturing substrates during nonproduction intervals
US7094670B2 (en) 2000-08-11 2006-08-22 Applied Materials, Inc. Plasma immersion ion implantation process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0922797A (ja) * 1994-07-18 1997-01-21 Applied Materials Inc ガスの添加、チャンバ直径の減少及びｒｆウエハペデスタル直径の減少によりプラズマ均一性が向上したプラズマリアクタ
US20050191827A1 (en) * 2000-08-11 2005-09-01 Collins Kenneth S. Plasma immersion ion implantation process
US20020146512A1 (en) * 2001-02-08 2002-10-10 Applied Materials, Inc. Si seasoning to reduce particles, extend clean frequency, block mobile ions and increase chamber throughput
WO2005114692A2 (en) * 2004-05-20 2005-12-01 Varian Semiconductor Equipment Associates, Inc. In-situ process chamber preparation methods for plasma ion implantation systems

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011511473A (ja) * 2008-02-06 2011-04-07 アプライド マテリアルズ インコーポレイテッド チャンバ内面上に純粋またはほぼ純粋なシリコンのシーズニング層を用いるプラズマ浸漬イオン注入方法
KR20150127033A (ko) * 2013-03-12 2015-11-16 어플라이드 머티어리얼스, 인코포레이티드 방위각 및 방사상 분배 제어되는 다중-구역 가스 주입 조립체
KR20180014258A (ko) * 2013-03-12 2018-02-07 어플라이드 머티어리얼스, 인코포레이티드 방위각 및 방사상 분배 제어되는 다중-구역 가스 주입 조립체
KR102104018B1 (ko) 2013-03-12 2020-04-23 어플라이드 머티어리얼스, 인코포레이티드 방위각 및 방사상 분배 제어되는 다중-구역 가스 주입 조립체
KR20200043538A (ko) * 2013-03-12 2020-04-27 어플라이드 머티어리얼스, 인코포레이티드 방위각 및 방사상 분배 제어되는 다중-구역 가스 주입 조립체
KR102152858B1 (ko) 2013-03-12 2020-09-07 어플라이드 머티어리얼스, 인코포레이티드 방위각 및 방사상 분배 제어되는 다중-구역 가스 주입 조립체
KR102176189B1 (ko) 2013-03-12 2020-11-09 어플라이드 머티어리얼스, 인코포레이티드 방위각 및 방사상 분배 제어되는 다중-구역 가스 주입 조립체

Also Published As

Publication number Publication date
US7691755B2 (en) 2010-04-06
US20080286982A1 (en) 2008-11-20
CN101308784B (zh) 2012-06-20
CN101308784A (zh) 2008-11-19
KR20080101740A (ko) 2008-11-21
KR100993104B1 (ko) 2010-11-08
TW200915396A (en) 2009-04-01

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