KR100989150B1 - 광산발생기를 포함하는 레지스트용 공중합체 및 그 제조 방법 - Google Patents
광산발생기를 포함하는 레지스트용 공중합체 및 그 제조 방법 Download PDFInfo
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- KR100989150B1 KR100989150B1 KR1020080080543A KR20080080543A KR100989150B1 KR 100989150 B1 KR100989150 B1 KR 100989150B1 KR 1020080080543 A KR1020080080543 A KR 1020080080543A KR 20080080543 A KR20080080543 A KR 20080080543A KR 100989150 B1 KR100989150 B1 KR 100989150B1
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
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- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1805—C5-(meth)acrylate, e.g. pentyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
- C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/38—Esters containing sulfur
- C08F220/382—Esters containing sulfur and containing oxygen, e.g. 2-sulfoethyl (meth)acrylate
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Abstract
Description
Claims (8)
- 하기 화학식 1 또는 화학식 2로 표시되는 광산발생기를 포함하는 레지스트용 공중합체:(1) (2)상기 식에서,R1과 R2는 각각 C1 ~ C6의 알킬카르보닐기, 알데히드기, 시아노기, 니트로기 및 페닐기 중에서 선택되고,R3는 C1 ~ C20의 직쇄상, 측쇄상 또는 고리형 알킬기이며,R4는 T-BOC 스타이렌기, 메톡시기, 메톡시에탄기, 메톡시프로판기, 프로필렌옥사이드기 중에서 선택되고,R5, R6, R7은 각각 수소원자 또는 C1 ~ C20의 직쇄상, 측쇄상 또는 고리형 알킬기이며,n은 0 ~ 20 의 정수이고, x+y+z=1이며, p+q=1이고, 0 < x ≤ 0.99, 0 < y ≤ 0.99, 0 < z ≤ 0.99, 0 < p ≤ 0.99, 0 < q ≤ 0.99이다.
- 제1항에 있어서, 상기 레지스트가 AFM 리소그래피용 레지스트 또는 포토레지스트 중 하나인 것을 특징으로 하는 공중합체.
- 하기 반응식 1에 따라 하기 화학식 (1)의 레지스트용 공중합체를 제조하는 방법:[반응식 1](1)상기 식에서,R1과 R2는 각각 C1 ~ C6의 알킬카르보닐기, 알데히드기, 시아노기, 니트로기 및 페닐기 중에서 선택되고,R3는 C1 ~ C20의 직쇄상, 측쇄상 또는 고리형 알킬기이며,R4는 T-BOC 스타이렌기, 메톡시기, 메톡시에탄기, 메톡시프로판기, 프로필렌옥사이드기 중에서 선택되고,R5, R6, R7은 각각 수소원자 또는 C1 ~ C20의 직쇄상, 측쇄상 또는 고리형 알킬기이며,n은 0 ~ 20 의 정수이고,x+y+z=1이며, 0 < x ≤ 0.99, 0 < y ≤ 0.99, 0 < z ≤ 0.99이다.
- 하기 반응식 2에 따라 하기 화학식 (2)의 레지스트용 공중합체를 제조하는 방법:[반응식 2](2)상기 식에서,R1과 R2는 각각 C1 ~ C6의 알킬카르보닐기, 알데히드기, 시아노기, 니트로기 및 페닐기 중에서 선택되고,R4는 T-BOC 스타이렌기, 메톡시기, 메톡시에탄기, 메톡시프로판기, 프로필렌옥사이드기 중에서 선택되고,R5, R6, R7은 각각 수소원자 또는 C1 ~ C20의 직쇄상, 측쇄상 또는 고리형 알킬기이며,n은 0 ~ 20 의 정수이고, p+q=1이며, 0 < p ≤ 0.99, 0 < q ≤ 0.99이다.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080080543A KR100989150B1 (ko) | 2008-08-18 | 2008-08-18 | 광산발생기를 포함하는 레지스트용 공중합체 및 그 제조 방법 |
US12/312,231 US8481663B2 (en) | 2008-08-18 | 2009-02-11 | Resist copolymers containing photoacid generators for lithographic applications and its method of preparation |
JP2010525772A JP5144762B2 (ja) | 2008-08-18 | 2009-02-11 | 光酸発生剤を含むレジスト用共重合体及びその製造方法 |
PCT/KR2009/000628 WO2010021442A1 (en) | 2008-08-18 | 2009-02-11 | Resist copolymers containing photoacid generators for lithographic applications and its method of preparation |
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KR1020080080543A KR100989150B1 (ko) | 2008-08-18 | 2008-08-18 | 광산발생기를 포함하는 레지스트용 공중합체 및 그 제조 방법 |
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KR20100021886A KR20100021886A (ko) | 2010-02-26 |
KR100989150B1 true KR100989150B1 (ko) | 2010-10-22 |
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KR1020080080543A KR100989150B1 (ko) | 2008-08-18 | 2008-08-18 | 광산발생기를 포함하는 레지스트용 공중합체 및 그 제조 방법 |
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US (1) | US8481663B2 (ko) |
JP (1) | JP5144762B2 (ko) |
KR (1) | KR100989150B1 (ko) |
WO (1) | WO2010021442A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101229960B1 (ko) | 2011-01-28 | 2013-02-06 | 한양대학교 산학협력단 | 광산발생제를 포함하는 테트라 폴리머 레지스트 및 이의 제조 방법 |
Families Citing this family (5)
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JP5788014B2 (ja) * | 2011-10-14 | 2015-09-30 | 三井化学株式会社 | 組成物及びそれからなる膜 |
JP5663526B2 (ja) * | 2012-06-06 | 2015-02-04 | 富士フイルム株式会社 | 化学増幅型レジスト組成物、並びに、それを用いたレジスト膜、マスクブランクス、及びレジストパターン形成方法 |
JP2014019741A (ja) * | 2012-07-13 | 2014-02-03 | Sumitomo Chemical Co Ltd | 樹脂の製造方法 |
US10242871B2 (en) * | 2014-10-21 | 2019-03-26 | Nissan Chemical Industries, Ltd. | Resist underlayer film-forming composition including a compound having an amino group protected with a tert-butoxycarbonyl group |
JP7004230B2 (ja) | 2018-10-31 | 2022-01-21 | エルジー・ケム・リミテッド | 光酸発生基を含む重合体 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH06228086A (ja) * | 1993-02-02 | 1994-08-16 | Sanshin Chem Ind Co Ltd | モノマーおよびその重合体 |
KR100570285B1 (ko) | 2004-02-03 | 2006-04-12 | 학교법인 한양학원 | 산화패턴용 공중합체 및 이를 이용한 산화패턴의 형성방법 |
KR100637450B1 (ko) * | 2005-02-16 | 2006-10-23 | 한양대학교 산학협력단 | 플루오로알킬술폰늄염의 광산발생기가 치환된 화합물과 이를 중합한 공중합체 |
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JPS5518673A (en) * | 1978-07-28 | 1980-02-08 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Ionized radiation sensitive negative type resist |
KR100230417B1 (ko) | 1997-04-10 | 1999-11-15 | 윤종용 | 실리콘을 함유하는 화학증폭형 레지스트 조성물 |
JP4218851B2 (ja) * | 1999-02-25 | 2009-02-04 | 大日本印刷株式会社 | カラーフィルタ保護膜形成用感光性樹脂組成物 |
JP2007086772A (ja) * | 2005-08-26 | 2007-04-05 | Toray Ind Inc | パターン形成方法、平面ディスプレイ用部材の製造方法ならびにプラズマディスプレイ用部材およびフィールドエミッションディスプレイ用部材。 |
JP4666163B2 (ja) * | 2006-03-17 | 2011-04-06 | Jsr株式会社 | 感放射線性樹脂組成物、スペーサーおよび液晶表示素子 |
KR100823471B1 (ko) | 2006-11-01 | 2008-04-21 | 한양대학교 산학협력단 | 플루오로알킬술폰늄염의 광산발생기가 측쇄에 도입된 호모폴리머 제조용 화합물의 제조방법 |
JP2009080161A (ja) * | 2007-09-25 | 2009-04-16 | Fujifilm Corp | 感光性組成物、該感光性組成物を用いたパターン形成方法及び該感光性組成物に於ける化合物 |
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- 2008-08-18 KR KR1020080080543A patent/KR100989150B1/ko active IP Right Grant
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- 2009-02-11 JP JP2010525772A patent/JP5144762B2/ja not_active Expired - Fee Related
- 2009-02-11 WO PCT/KR2009/000628 patent/WO2010021442A1/en active Application Filing
- 2009-02-11 US US12/312,231 patent/US8481663B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06228086A (ja) * | 1993-02-02 | 1994-08-16 | Sanshin Chem Ind Co Ltd | モノマーおよびその重合体 |
KR100570285B1 (ko) | 2004-02-03 | 2006-04-12 | 학교법인 한양학원 | 산화패턴용 공중합체 및 이를 이용한 산화패턴의 형성방법 |
KR100637450B1 (ko) * | 2005-02-16 | 2006-10-23 | 한양대학교 산학협력단 | 플루오로알킬술폰늄염의 광산발생기가 치환된 화합물과 이를 중합한 공중합체 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101229960B1 (ko) | 2011-01-28 | 2013-02-06 | 한양대학교 산학협력단 | 광산발생제를 포함하는 테트라 폴리머 레지스트 및 이의 제조 방법 |
Also Published As
Publication number | Publication date |
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KR20100021886A (ko) | 2010-02-26 |
US8481663B2 (en) | 2013-07-09 |
US20110098433A1 (en) | 2011-04-28 |
JP5144762B2 (ja) | 2013-02-13 |
WO2010021442A1 (en) | 2010-02-25 |
JP2010538155A (ja) | 2010-12-09 |
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