KR100976194B1 - 매핑 센서 시스템 - Google Patents

매핑 센서 시스템 Download PDF

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Publication number
KR100976194B1
KR100976194B1 KR1020087007189A KR20087007189A KR100976194B1 KR 100976194 B1 KR100976194 B1 KR 100976194B1 KR 1020087007189 A KR1020087007189 A KR 1020087007189A KR 20087007189 A KR20087007189 A KR 20087007189A KR 100976194 B1 KR100976194 B1 KR 100976194B1
Authority
KR
South Korea
Prior art keywords
signal
sensor
mapping
detection
circuit
Prior art date
Application number
KR1020087007189A
Other languages
English (en)
Korean (ko)
Other versions
KR20080038249A (ko
Inventor
요시타네 사이토
켄지 니시키도
Original Assignee
애니와이어 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 애니와이어 가부시키가이샤 filed Critical 애니와이어 가부시키가이샤
Publication of KR20080038249A publication Critical patent/KR20080038249A/ko
Application granted granted Critical
Publication of KR100976194B1 publication Critical patent/KR100976194B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C15/00—Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path
    • G08C15/06—Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • B65G1/137—Storage devices mechanical with arrangements or automatic control means for selecting which articles are to be removed
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020087007189A 2005-08-25 2005-10-12 매핑 센서 시스템 KR100976194B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005274634A JP2007059856A (ja) 2005-08-25 2005-08-25 マッピングセンサシステム
JPJP-P-2005-00274634 2005-08-25

Publications (2)

Publication Number Publication Date
KR20080038249A KR20080038249A (ko) 2008-05-02
KR100976194B1 true KR100976194B1 (ko) 2010-08-17

Family

ID=37771333

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087007189A KR100976194B1 (ko) 2005-08-25 2005-10-12 매핑 센서 시스템

Country Status (5)

Country Link
JP (1) JP2007059856A (zh)
KR (1) KR100976194B1 (zh)
CN (1) CN101238498B (zh)
TW (1) TWI326117B (zh)
WO (1) WO2007023575A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101953118B (zh) * 2008-03-14 2014-08-27 株式会社恩尼怀尔 传送控制系统
US9308305B2 (en) * 2014-06-18 2016-04-12 Ch Biomedical (Usa) Inc. Implantable blood pump with integrated controller

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001222788A (ja) * 1999-10-29 2001-08-17 Omron Corp センサシステム
JP2004295276A (ja) * 2003-03-26 2004-10-21 Keyence Corp 連設型センサシステム、マスタユニット、センサユニット並びにセンサ中継ユニット
JP2005217440A (ja) 1998-03-26 2005-08-11 Tokyo Electron Ltd 基板処理装置
KR100642517B1 (ko) 2005-09-06 2006-11-03 삼성전자주식회사 이송로봇의 티칭장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0830654B2 (ja) * 1990-08-10 1996-03-27 三菱電機株式会社 位置測定器
JP3131750B2 (ja) * 1992-10-20 2001-02-05 東京エレクトロン株式会社 被処理体検出装置及び方法
US6528808B1 (en) * 1997-03-19 2003-03-04 Omron Corporation Transmitting photoelectric sensor array
DE60043884D1 (de) * 1999-10-25 2010-04-08 Omron Tateisi Electronics Co Angrenzend befestigbare messeinheit
DE10059815A1 (de) * 2000-12-01 2002-06-13 Grieshaber Vega Kg Elektronische Messvorrichtung zur Erfassung einer Prozessvariablen, insbesondere Radar- oder Ultraschall-Füllstandsmessvorrichtung und Verfahren zum Betreiben einer solchen Messvorrichtung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217440A (ja) 1998-03-26 2005-08-11 Tokyo Electron Ltd 基板処理装置
JP2001222788A (ja) * 1999-10-29 2001-08-17 Omron Corp センサシステム
JP2004295276A (ja) * 2003-03-26 2004-10-21 Keyence Corp 連設型センサシステム、マスタユニット、センサユニット並びにセンサ中継ユニット
KR100642517B1 (ko) 2005-09-06 2006-11-03 삼성전자주식회사 이송로봇의 티칭장치

Also Published As

Publication number Publication date
CN101238498A (zh) 2008-08-06
TWI326117B (en) 2010-06-11
WO2007023575A1 (ja) 2007-03-01
CN101238498B (zh) 2013-03-27
JP2007059856A (ja) 2007-03-08
KR20080038249A (ko) 2008-05-02
TW200709326A (en) 2007-03-01

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