KR100941671B1 - Carrier board for handler in order to support testing an electric device and method of carrier board transference of handler - Google Patents

Abstract

The present invention relates to a carrier board for a handler for supporting electronic component inspection and a carrier board transfer method in the handler.

According to the present invention, the distance between the first group of electronic components loaded on the first stacking group and the second group of electronic components loaded on the second stacking group is arranged in parallel in a matrix form on the first interface board attached to a portion of the test head. The distance between the first stacking group and the second stacking group is equal to the gap between the first socket group and the second socket group arranged in parallel on the second interface board attached to the other part of the test head. Disclosed is a technology capable of reducing production costs by reducing overall configurations.

Handler, Modram, Module Handler, Test Tray

Description

Carrier board transfer method for handler to support electronic component inspection and carrier board transfer method {CARRIER BOARD FOR HANDLER IN ORDER TO SUPPORT TESTING AN ELECTRIC DEVICE AND METHOD OF CARRIER BOARD TRANSFERENCE OF HANDLER}

The present invention relates to a carrier board for a handler for supporting electronic component inspection and a carrier board transfer method in the handler.

There are many types of handlers for supporting electronic component inspection, including handlers for supporting inspection of semiconductor devices (hereinafter, referred to as 'semiconductor devices') and packaged modules. .

Modular ram is composed of an independent circuit by fixing a plurality of elements including a semiconductor element on a single substrate, the test of the modulm is more complicated than the semiconductor element.

However, the tester for testing the module and the tester for testing the semiconductor device are not separate from each other. That is, one tester can test both the module and the semiconductor device.

Therefore, when the electronic component to be tested is changed from a module RAM to a semiconductor device or from a semiconductor device to a module RAM, the interface board provided in the tester should be replaced.

The interface board is provided in the test head of the tester, and test sockets for electrically connecting the tester and the test target (electronic components such as a module or a semiconductor device to be tested) are arranged in an array form.

1 is a plan view of an interface board (DIB) used in a test of a semiconductor device.

In the interface board DIB provided in the test head TH, as shown in FIG. 1, test sockets DS having an M × N matrix form (16 × 16 matrix form in the drawing) are provided as an interface board DIB. It is arranged almost entirely over.

By the way, if you want to test the module RAM with a tester having the same processing capacity, as shown in Figure 2, 1xN matrix test sockets (MS) of the module ram test interface board is arranged over a certain area (MIB) should be replaced.

1 and 2, the length and number of test sockets (MS, hereinafter referred to as 'modular ram test sockets') provided in the module RAM test interface board MIB is the semiconductor board test interface board (DIB). It can be seen that it is provided with a smaller number than the test socket (DS, hereinafter referred to as 'test socket for semiconductor device') provided in the).

The reason why the length of the test socket MS for the module ram is longer than the length of the test socket DS for the semiconductor device is related to the shape of the module ram.

In addition, the number of test sockets (MS) for the module is less than the number of test sockets (DS) for the semiconductor device is provided because the test capacity of the tester is the same because the test of the module RAM is more complicated than the test of the semiconductor device do. Therefore, in the case of the test socket DS for the semiconductor device, the interface board DIB is almost filled, whereas in the case of the module test socket MS, the test socket DS is limited to a part of the interface board MIB.

And the continued development of tester technology is increasing the test capacity of the tester, as a result, as shown in Figures 3 and 4, two interface boards (DIB ₁ , DIB ₂ ) in one large test head (TH) / MIB ₁ , MIB ₂ ) has been developed and applied to increase the number of semiconductor devices or modules tested at one time.

For reference, the interface boards DIB ₁ and DIB ₂ provided in the test head TH of FIG. 3 are for testing semiconductor devices, and the interface boards MIB ₁ and MIB ₂ provided in the test head TH of FIG. For modular test

Referring to FIG. 4, in the case of the interface boards MIB ₁ and MIB _{2 for the} module ram, the first socket group MSG ₁ and the second socket group MSG ₂ may be adjacent to each other as much as possible. It can be seen that ₁ ) and the second socket group MSG ₂ are arranged to ensure a constant distance from each other so as not to be adjacent to each other. Here, the first socket group MSG ₁ is a 1 × M matrix (1 × 16 matrix in the drawing) on one side of the interface board MIB ₁ , the first interface board attached to a part of the test head. A plurality of test sockets (MS) provided are bundled together, and the second socket group (MSG ₂ ) refers to the other interface board (MIB ₂ )-the second interface board attached to the other part of the test head. It refers to a plurality of test sockets (MS) provided in an M matrix form (1 × 16 matrix form in the drawing).

4, the reason for disposing the first socket group MSG ₁ and the second socket group MSG ₂ is related to the wiring from the test socket MS to the test head. If the distance D ₁ between the first socket group MSG ₁ and the second socket group MSG ₂ is too narrow, as shown in FIG. 5, the wiring process of the adjacent area is difficult. As referred to in FIG. 6, when the distance D ₂ between the first socket group MSG ₁ and the second socket group MSG ₂ is large, the size of the handler increases in proportion to the gap. Accordingly, the first socket group MSG ₁ and the second socket group MSG ₂ are provided in the arrangement as shown in FIG. 4 in order to maintain the size of the handler while the wiring is relatively easy.

On the other hand, as is well known, the semiconductor element or the module is moved in a state loaded on a carrier board (also referred to as a 'test tray', 'modular carrier', etc.) circulating on a constant circulation path in the handler, It is electrically connected to the test sockets (DS, MS) when the board is in the test position on the circulation path. 7 (a) and 7 (b) are a carrier board (DCB) for loading semiconductor elements and a carrier board (MCB) for loading modules. For reference, there are a loading position for loading a semiconductor device or a module on a carrier board and an unloading position for unloading a semiconductor device or a module loaded on a carrier board.

Republic of Korea Patent Publication No. 1997-0706501 (Invention name: semiconductor device test device) and Republic of Korea Patent Application Publication No. 2000-0068397 (Invention name: semiconductor device test device and test tray used in the test device) to the handler Examples of the arrangement of the chambers, the loading device and the unloading devices provided and examples of the circulation path of the carrier board (defined as 'test tray' on the above-mentioned prior inventions) made on the arrangement are shown. In particular, the Republic of Korea Patent Publication No. 2000-0068397, as shown in Figure 3, when the two interface boards (DIB ₁ , DIB ₂ ) is provided a method of circulating the two carrier boards on the circulation path.

According to the cited invention, the conveying path for carrying in and taking out the carrier board to the test position is plural, or the conveying path of the carrier board reaching the unloading position from the loading position is plural.

By the way, it is currently applied to the product to carry the carrier board to the test position in the multi-path of the carrier path, but the carrier path of the carrier board to reach the unloading position from the loading position is applied to the product It is not becoming.

This is because the cited invention was developed to be applied to the test of the semiconductor device because the size of the handler becomes too large when the carrier path of the carrier board reaching the unloading position from the loading position is plural. Therefore, the handlers produced so far have a single carrier path of the carrier board reaching the unloading position from the loading position.

It is a first object of the present invention to provide a preferred technique for applying to a modulator handler with a plurality of carrier paths of the carrier board reaching the unloading position from the loading position while minimizing the size expansion of the handler.

A second object of the present invention is to provide a description of a carrier board that can be matched to two interface boards in one sheet.

Carrier board for handlers for supporting electronic component inspection according to the present invention for achieving the above object, a plurality of loading parts in the first loading group (되는) -first loading group arranged in a matrix form on one side Arranged in an N-by-N format; And a second stack group arranged in a matrix form on the other side, in which the plurality of load sections are arranged in an M × N format; And a distance between the first electronic component group loaded on the first loading group and the second electronic component group loading on the second loading group parallel to the first interface board attached to a portion of the test head in a matrix form. The distance between the first stacking group and the second stacking group is equal to the gap between the first socket group disposed and the second socket group disposed in parallel with the second interface board attached to the other part of the test head. It is characterized by being secured.

In addition, the carrier board transfer method in the handler according to the present invention for achieving the above object, while the carrier board is circulated on the circulation path leading to the loading / unloading position through the loading / unloading position and the test position, In the first section on the circulation path (the first section includes the test position and not the loading / unloading position), two carrier boards are arranged on a horizontal plane in a direction perpendicular to the transport path of the carrier board. Two carrier boards in a direction perpendicular to the transport path of the carrier board in a second section on the circulation path (the second section includes the loading / unloading position and the test position is not included). It is transported in a state arranged on the top, the distance between the two carrier boards arranged in parallel in the first section and the parallel arrangement in the second section The distance between the two carrier boards is also adjusted when being transported from the first section to the second section and when being transported from the second section to the first section so that the distance between the two carrier boards is different from each other. It is done.

A distance between two carrier boards arranged in parallel in the first section is greater than a distance between two carrier boards arranged in parallel in the second section.

A first electronic component group (a large number of electronic components maintain an M × N matrix arrangement) and a second electronic component group stacked in two carrier boards arranged in parallel in the first section, respectively; The first socket group in which the spacing between two electronic component groups (a large number of electronic components maintains an M × N matrix arrangement) is arranged in parallel in the test head in a matrix manner. The first section so as to be equal to an interval between the plurality of test sockets arranged in an M × N matrix form and the second socket group (in the second socket group, a plurality of test sockets arranged in an M × N matrix form). More specifically, the gap between the two carrier boards arranged in parallel is secured.

The first socket group is disposed in parallel to the first interface board attached to a part of the test head, and the second socket group is parallel to the second interface board attached to the other part of the test head in matrix form. It is even more specific to be arranged.

In addition, the carrier board transfer method in the handler according to the present invention for achieving the above object, while circulating the carrier board on the circulation path leading to the loading position through a loading position, an unloading position and a test position, the circulation path In the first section of the upper phase (the first section includes the test position, the loading position and the unloading position are not included), the two carrier boards are arranged on a horizontal plane in a direction perpendicular to the transport path of the carrier board. Two carrier boards on a horizontal plane in a direction perpendicular to the transport path of the carrier board in a second section on the circulation path (the second section includes the loading and unloading positions and the test position is not included). In the second section and the distance between the two carrier boards arranged in parallel in the first section The distance between the two carrier boards is also adjusted when transported from the first section to the second section and when transported from the second section to the first section so that the distance between the two carrier boards arranged in parallel is different. It is characterized by.

A distance between two carrier boards arranged in parallel in the first section is greater than a distance between two carrier boards arranged in parallel in the second section.

A first electronic component group (a large number of electronic components maintain an M × N matrix arrangement) and a second electronic component group stacked in two carrier boards arranged in parallel in the first section, respectively; The first socket group in which the spacing between two electronic component groups (a large number of electronic components maintains an M × N matrix arrangement) is arranged in parallel in the test head in a matrix manner. The first section so as to be equal to an interval between the plurality of test sockets arranged in an M × N matrix form and the second socket group (in the second socket group, a plurality of test sockets arranged in an M × N matrix form). More specifically, the gap between the two carrier boards arranged in parallel is secured.

The first socket group is disposed in parallel to the first interface board attached to a part of the test head, and the second socket group is parallel to the second interface board attached to the other part of the test head in matrix form. It is even more specific to be arranged.

According to the present invention as described above has the following effects.

First, it is possible to improve the loading speed because two carrier boards can be placed at the same time in loading / unloading position without excessively expanding the size of the handler, and it is good to be applied to the module handler.

Second, since one carrier board is matched to two interface boards, there is an effect of reducing the production cost of the handler according to the reduction of all components.

Hereinafter, with reference to the accompanying drawings for an embodiment according to the present invention as described above in more detail, overlapping description for the brevity of the description is omitted.

<Example of Transfer Method>

8 is a conceptual plan view of a modulator handler (MH) to which a carrier board transfer method according to an embodiment of the present invention is applied.

8, the loading / unloading unit 810, the first waiting unit 820, the soak chamber 830, the test chamber 840, and the desock chamber 850. , De-soak Chamber), the second standby unit 860 and comprises a plurality of carrier board (MCB).

The loading / unloading unit 810 loads the module ram into two carrier boards MCB in the loading / unloading position L / UP.

The first standby unit 820 is provided to wait before loading the completed carrier board (MCB) into the soak chamber 830.

The soak chamber 830 is provided to preheat or precool the module according to the test environmental conditions.

The test chamber 840 is provided to support a test of the module ram loaded on the carrier board MCB at the test position TP.

The desock chamber 850 is provided to heat or cool the heated / cooled modulators passing through the test chamber 840.

The second standby part 860 is provided to wait before the carrier board MCB taken out from the desock chamber 850 is transferred to the loading / unloading position L / UP.

The carrier board MCB has a plurality of mounting portions for loading semiconductor devices, and includes a loading / unloading position L / UP, a first standby position W ₁ , a soak chamber 830, a test position TP, a test Inside the chamber), the desock chamber 850, and the second standby position (W ₂ ) through the circulation path leading to the loading / unloading position (L / UP).

In addition, although a plurality of transfer devices are required for circulation of the carrier board MCB, descriptions of the transfer devices are already well known, and thus description thereof is omitted.

Modular handler (MH) to which the transfer method according to the present invention is applied equally to the loading position and the unloading position, but according to the implementation, as shown in Figure 9, the loading position in front of the soak chamber 930 The LP may be disposed, and the unloading position UP may be disposed in front of the desock chamber 950, and the loading and unloading may be implemented by separate loading and unloading devices, respectively. In this case, the carrier board MCB is circulated on the circulation path leading to the loading position LP through the loading position LP, the test position TP, and the unloading position UP.

8, the carrier boards MCB are arranged in the front-rear direction on the horizontal plane by two sheets at each position on the circulation path. After being taken out of the soak chamber 830 and passed through the test position TP to the desock chamber 850, the loading / unloading position L / UP is carried out at the first section and the second waiting position W ₂ . In the second section leading to the first standby position (W ₁ ), two carrier boards (MCB) are arranged in parallel in the direction perpendicular to the conveying direction, the transfer from the first standby position (W ₁ ) to the soak chamber (830) and In the transfer from the desock chamber 850 to the second standby position W ₂ , two carrier boards MCB are arranged in parallel in the same direction as the transfer direction.

Furthermore, the distance between the two carrier boards MCB arranged in parallel in the first section is a first module ram group MG ₁ , which is a bundle of module rams M loaded on the rear carrier board MCB in a 1 × 12 matrix form. ) And a distance D between the second module ram group MG ₂ , which is a bundle of the module rams M loaded on the front carrier board MCB in a 1 × 12 matrix form, is referred to in FIG. 4. It is equal to the distance D between the socket group MSG ₁ and the second socket group MSG ₂ . On the contrary, the distance between the two carrier boards MCB arranged in parallel in the second section is the distance d, d <D between the first module ram group MG ₁ and the second module ram group MG ₂ . It is made to become minimum in the range which MCB does not overlap with each other.

This arrangement of the carrier board (MCB) is to minimize the size in the front and rear direction of the module handler (MH) by minimizing the gap between the two carrier boards (MCB) arranged in parallel in the forward and backward direction in the second section, Minimizing the working distance for loading and unloading of the loading and unloading devices allows the loading and unloading to proceed at a higher speed.

Reference numeral TH, which is not described in FIG. 8, is a test head (only outlined) is coupled to the bottom of the test chamber 540.

Subsequently, referring to FIG. 8, the characteristics of the carrier board MCB transfer method made in the above-described module handler MH will be described in more detail.

When loading the module ram to the two carrier boards MCB in the loading / unloading position L / UP, the two carrier boards MCB are simultaneously transferred to the first standby position W ₁ .

The rear carrier board MCB in the first standby position W ₁ is transported to the rear of the soak chamber 830 and the front carrier board MCB is transported simultaneously and separately to the front of the soak chamber 830. do. In this transfer process, the distance between the two carrier boards (MCB) is adjusted so that the gap between the first module ram group (MG ₁ ) and the second module ram group (MG ₂ ) is widened from d to D in the soak chamber (830) To be deployed.

The two carrier boards MCB, which are preheated / precooled of the module ram loaded in the soak chamber 830, are simultaneously transferred to the test chamber 840 having the test position TP and are loaded in the test chamber 840. Carrier boards (MCB) of the two modules of the tested modules are completed is simultaneously transferred to the desock chamber (850).

The two carrier boards (MCB), in which the module loaded in the desock chamber 850 is de-heated / refrigerated, are transferred simultaneously from the desock chamber 850 to the second standby position W ₂ at the same time and individually. The distance between the first module ram group MG ₁ and the second module ram group MG ₂ is disposed at the second standby position 850 in a state where the distance from D to d is narrowed.

In addition, the two carrier boards MCB arranged in the second standby position 850 in a state where the space therebetween is narrowed are transferred to the loading / unloading position L / UP while maintaining the space.

Of course, in the loading / unloading position L / UP, the modules loaded on the carrier board MCB are unloaded by the unloading device.

As in the present embodiment, the plurality of carrier boards MCBs arranged in the second section may be related to the size of the handler constrained by the size of the module loading carrier boards MCB. That is, as can be clearly seen in Figs. 1 and 2, since the carrier board (MCB) on which the module is loaded is smaller than the carrier board (DCB) on which the semiconductor device is loaded, the module ram handler (MH) is a semiconductor device. That's because you have more time to expand the size than the test support handler.

However, according to the transfer method according to the present embodiment, two carrier boards MCB are transferred from the first standby position W ₁ to the soak chamber 830 or from the desock chamber 850 at the second standby position ( When transported to W ₂ ), the spacing between the carrier boards (MCB) must also be adjusted, so a mechanical configuration for spacing must be added.

In addition, in the soak chamber 830 or the desock chamber 850, two carrier boards MCB may be transferred in the vertical direction in order to ensure sufficient preheating / precooling time or defrosting / defrosting time. In this case, there is also a need for a mechanical configuration for elevating the two carrier boards (MCB) spaced apart from each other.

Therefore, the production cost of the modular handler (MH) is bound to be raised, in order to solve this problem, the carrier board described below will be developed.

<Example for Carrier Board>

10 is a plan view of a carrier board (CB) according to an embodiment of the present invention.

The carrier board CB is provided with a first stacking group LG ₁ and a second stacking group LG ₂ having a stacking unit L on which a module can be loaded in a 1 × 12 matrix form.

The gap between the first stacking group LG ₁ and the second stacking group LG ₂ is the first socket group MSG ₁ and the second socket group MSG ₂ arranged in parallel in a 1 × 12 matrix form in the test head. It is secured in the same manner as the spacing D between them. Of course, more specifically, the distance between the first module ram group and the second module ram group loaded on the first loading group LG ₁ and the second loading group LG ₂ is the first socket group MSG ₁ and the second. The same distance between the socket group MSG ₂ is secured.

According to such a carrier board (CB), as shown in Figure 11, through the loading / unloading position (L / UP) and the test position (TP), the carrier board leading back to the loading / unloading position (L / UP) Since the conveying method of (CB) (or the conveying board conveying from the loading position, the test position, and the unloading position to the loading position again) is simplified, the configuration of the mechanical parts is reduced accordingly.

For reference, in the case of the carrier board (CB) according to the present embodiment is illustrated for the module loading, the technical idea described in this embodiment may be applied to all the electronic component loading including the semiconductor device.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings. However, since the above-described embodiments have only been described with reference to preferred examples of the present invention, the present invention is limited to the above embodiments. It should not be understood that the scope of the present invention is to be understood by the claims and equivalent concepts described below.

1 is a plan view of an interface board for testing a semiconductor device.

2 is a plan view of an interface board for testing a module.

3 and 4 are reference views showing two interface boards provided in one test head.

5 and 6 are reference diagrams for explaining the reason for the provision of the interface board as shown in FIG.

7 is a plan view of the carrier board.

8 is a plan view of a module handler according to an embodiment of the present invention.

FIG. 9 is a plan view illustrating a module handler in which the module handler of FIG. 8 is applied.

10 is a plan view of a carrier board according to an embodiment of the present invention.

FIG. 11 is a reference view for explaining a method of transferring a carrier board made in the handler to which the carrier board of FIG. 10 is applied.

* Description of the code for the main parts of the drawings *

CB: Carrier Board

LG ₁ : first loading group

LG ₂ : 2nd loading group

L: loading part

Claims (6)

A first stack group (群) arranged in a matrix form on one side; And A second stacking group arranged in a matrix form on the other side; Including, In the first loading group and the second loading group, a plurality of loading parts are arranged in an M × N format. A first arrangement in which a gap between the first electronic component group loaded on the first loading group and the second electronic component group loading on the second loading group is arranged in a matrix form on a first interface board attached to a portion of the test head; The gap between the first stacking group and the second stacking group is secured so as to be equal to the gap between the socket group and the second socket group arranged in parallel on the second interface board attached to the other part of the test head. Characterized Carrier board for handlers to support electronic component inspection. The carrier board is circulated on a circulation path leading to the loading / unloading position through a loading / unloading position and a test position, In the first section including the test position on the circulation path in the direction perpendicular to the transport path of the carrier board two carrier boards are placed on a horizontal plane, In the second section including the loading / unloading position on the circulation path to convey the two carrier boards on a horizontal plane in a direction perpendicular to the transfer path of the carrier board, When the first section is transported to the second section and the second interval so that the distance between the two carrier boards arranged in parallel in the first section and the distance between the two carrier boards arranged in parallel in the second section are different from each other. When the two sections are transported to the first section, the distance between the two carrier board is also adjusted How to transport the carrier board in the handler. The carrier board is circulated on a circulation path leading to the loading position through a loading position, an unloading position and a test position, In the first section including the test position on the circulation path in the direction perpendicular to the transport path of the carrier board two carrier boards are placed on a horizontal plane, In the second section including the loading position and the unloading position on the circulation path to convey the two carrier boards on a horizontal plane in a direction perpendicular to the transfer path of the carrier board, When the first section is transported to the second section and the second interval so that the distance between the two carrier boards arranged in parallel in the first section and the distance between the two carrier boards arranged in parallel in the second section are different from each other. When the two sections are transported to the first section, the distance between the two carrier board is also adjusted How to transport the carrier board in the handler. The method according to claim 2 or 3, A distance between two carrier boards arranged in parallel in the first section is wider than an interval between two carrier boards arranged in parallel in the second section. How to transport the carrier board in the handler. The method of claim 4, wherein The first socket group and the second socket in which the distance between the first electronic component group and the second electronic component group loaded in a matrix form on two carrier boards arranged in parallel in the first section is arranged in a matrix form on the test head. The gap between the two carrier boards arranged in parallel in the first section is secured to be equal to the distance between the groups, Each of the first electronic component group and the second electronic component group has a plurality of electronic components arranged in an M × N matrix form. Each of the first socket group and the second socket group has a plurality of test sockets arranged in an M × N matrix. How to transport the carrier board in the handler. The method of claim 5, The first socket group is disposed in parallel to the first interface board attached to a part of the test head, and the second socket group is parallel to the second interface board attached to the other part of the test head in matrix form. Characterized in that How to transport the carrier board in the handler.

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