KR101681192B1 - Transfer robot - Google Patents

Transfer robot Download PDF

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Publication number
KR101681192B1
KR101681192B1 KR1020150155241A KR20150155241A KR101681192B1 KR 101681192 B1 KR101681192 B1 KR 101681192B1 KR 1020150155241 A KR1020150155241 A KR 1020150155241A KR 20150155241 A KR20150155241 A KR 20150155241A KR 101681192 B1 KR101681192 B1 KR 101681192B1
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KR
South Korea
Prior art keywords
plate
hand
substrate
present
thermal expansion
Prior art date
Application number
KR1020150155241A
Other languages
Korean (ko)
Inventor
이봉문
Original Assignee
세메스 주식회사
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Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020150155241A priority Critical patent/KR101681192B1/en
Application granted granted Critical
Publication of KR101681192B1 publication Critical patent/KR101681192B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Abstract

The present invention provides a carrying robot. According to an aspect of the present invention, there is provided a transfer robot including: a hand for positioning a substrate; A drive shaft coupled to one end of the hand to move the hand; An arm connecting the drive shaft and the hand; And a driving unit for driving the driving shaft; The hand is provided such that a plurality of plates having different thermal expansion coefficients are stacked in the vertical direction.

Description

TRANSFER ROBOT}

The present invention relates to a carrier robot and a method for manufacturing a hand.

Various processes such as photolithography, etching, ashing, thin film deposition, and cleaning process are performed on the semiconductor device and the flat panel display panel. For these processes, the substrate must be returned to the chamber in which the process is performed.

1 is a view showing a general transporting robot when a substrate is loaded. One end of the hand 1 is coupled to the arm 2 and the arm 2 is coupled to the drive shaft 3 and provided in a cantilever fashion. When the substrate is placed on the hand 1, the end of the hand 1 is inclined downward due to the weight of the substrate. Therefore, the hand 1 and the substrate w can not maintain a horizontal state during substrate transportation. This makes it difficult to return the substrate to the correct position.

Further, when a plurality of hands are provided in the vertical direction, the upper and lower intervals between the hands must be widened in consideration of the tip of the hand being inclined. In this case, there is a problem that the size of the carrying robot becomes large.

The present invention is intended to provide a transport robot for transporting a substrate to an accurate position during transport of the substrate.

It is another object of the present invention to provide a hand manufacturing method which is not tilted when the substrate is transferred.

The objects of the present invention are not limited thereto, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

The present invention provides a carrying robot.

According to an embodiment of the present invention, there is provided an electronic device comprising: a hand for positioning a substrate; A drive shaft coupled to one end of the hand to move the hand; An arm connecting the drive shaft and the hand; And a driving unit for driving the driving shaft; The hand is provided such that a plurality of plates having different thermal expansion coefficients are stacked in the vertical direction.

According to one embodiment, the other end of the hand is provided as a free end.

According to one embodiment, the plurality of plates comprises: A first plate; And a second plate provided below the first plate, wherein the second plate has a larger thermal expansion coefficient than the first plate.

According to an embodiment, the hand is provided with an upward slope toward the other end such that the driving shaft and the hand form an acute angle.

According to an embodiment, the radius of curvature of the hand decreases from the one end to the other end.

According to an embodiment, the second plate is shorter than the first plate.

According to one embodiment, the first plate is an alloy of nickel, chromium and iron, an alloy of copper and zinc, or copper, and the second plate is an alloy or iron of iron and nickel.

According to an embodiment, a plurality of plates having different thermal expansion coefficients are stacked in the vertical direction to provide the hand.

According to an embodiment, the first plate and the second plate provided below the first plate are laminated to form the hand, wherein the coefficient of thermal expansion of the second plate is larger than the coefficient of thermal expansion of the first plate.

The present invention provides a hand manufacturing method.

According to an embodiment of the present invention, when the hand is mounted on the arm so that the other end of the hand is at the free end at the first temperature, the other end of the hand is offset by the self weight of the substrate, A first plate and a second plate having a thermal expansion coefficient higher than that of the first plate are stacked on the lower portion of the first plate at a second temperature to produce the hand, wherein the first temperature is higher than the second temperature.

According to an embodiment, the second plate is shorter than the first plate.

According to one embodiment, the first plate is an alloy of nickel, chromium and iron, an alloy of copper and zinc, or copper, and the second plate is an alloy or iron of iron and nickel.

According to the embodiment of the present invention, the substrate can be transported to the correct position when the substrate is transported.

In addition, according to the embodiment of the present invention, the hand can be prevented from tilting when the substrate is transferred.

The effects of the present invention are not limited to the above-mentioned effects, and the effects not mentioned can be clearly understood by those skilled in the art from the present specification and attached drawings.

1 is a view showing a tilting of a hand when a substrate is loaded on a hand of a carrier robot.
2 is a plan view schematically showing a substrate processing apparatus provided with a carrier robot according to an embodiment of the present invention.
3 is a view showing a carrying robot according to the first embodiment of the present invention.
4 is a view showing a carrying robot according to a second embodiment of the present invention.
5 to 8 are views sequentially showing changes of a hand when the substrate is loaded on the carrying robot according to the first embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited to the following embodiments. This embodiment is provided to more fully describe the present invention to those skilled in the art. The shape of the elements in the figures is therefore exaggerated to emphasize a clearer description.

Hereinafter, an example of the present invention will be described in detail with reference to FIGS.

2 is a plan view schematically showing a substrate processing apparatus 1 including the carrying robot 300 of the present invention.

Referring to FIG. 2, the substrate processing apparatus 1 includes an index module 100 and a process processing module 200. The index module 100 includes a load port 120 and a transfer frame 140. The load port 120, the transfer frame 140, and the process module 200 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the processing module 200 are arranged is referred to as a first direction 12. A direction perpendicular to the first direction 12 is referred to as a second direction 14 and a direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction (16).

The carrier 130 in which the substrate W is housed is placed in the load port 120. A plurality of load ports 120 are provided, and they are arranged in a line along the second direction 14. In FIG. 1, four load ports 120 are shown. However, the number of load ports 120 may increase or decrease depending on conditions such as process efficiency and footprint of the process processing module 200. A carrier (130) is provided with a slot (not shown) provided to support the edge of the substrate (W). A plurality of slots are provided in the third direction 16. The substrates W are positioned in the carrier 130 so as to be stacked in a state of being spaced from each other along the third direction 16. As the carrier 130, a front opening unified pod (FOUP) may be used.

The processing module 200 includes a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed such that its longitudinal direction is parallel to the first direction 12. Process chambers 260 are disposed on one side and the other side of the transfer chamber 240 along the second direction 14, respectively. The process chambers 260 located at one side of the transfer chamber 240 and the process chambers 260 located at the other side of the transfer chamber 240 are provided to be symmetrical with respect to the transfer chamber 240. Some of the process chambers 260 are disposed along the longitudinal direction of the transfer chamber 240. In addition, some of the process chambers 260 are stacked together. That is, at one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B (where A and B are each at least one natural number). Where A is the number of process chambers 260 provided in a row along the first direction 12 and B is the number of process chambers 260 provided in a row along the third direction 16. When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of 2 X 2 or 3 X 2. The number of process chambers 260 may increase or decrease. Unlike the above, the process chamber 260 may be provided only on one side of the transfer chamber 240. Also, unlike the above, the process chamber 260 may be provided as a single layer on one side and on both sides of the transfer chamber 240.

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides a space for the substrate W to stay before the transfer of the substrate W between the transfer chamber 240 and the transfer frame 140. [ The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed, and a plurality of slots (not shown) are provided to be spaced apart from each other in the third direction 16. The surface of the buffer unit 220 opposed to the transfer frame 140 and the surface of the transfer chamber 240 facing each other are opened.

The transfer frame 140 transfers the substrate W between the buffer unit 220 and the carrier 130 that is seated on the load port 120. The transfer frame 140 is provided with an index rail 142 and an index robot 144. The index rail 142 is provided so that its longitudinal direction is parallel to the second direction 14. The index robot 144 is installed on the index rail 142 and is linearly moved along the index rail 142 in the second direction 14. The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed so as to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. Also, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward relative to the body 144b. A plurality of index arms 144c are provided and each is provided to be individually driven. The index arms 144c are stacked in a state of being spaced apart from each other along the third direction 16. Some index arms 144c are used to transfer the substrate W from the processing module 200 to the carrier 130 while others are used to transfer the substrate W from the carrier 130 to the processing module 200. [ As shown in Fig. This can prevent the particles generated from the substrate W before the process processing from adhering to the substrate W after the process processing in the process of loading and unloading the substrate W by the index robot 144. [

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260. The transfer chamber 240 is provided with a guide rail 242 and a transfer robot 300. The guide rails 242 are arranged so that their longitudinal directions are parallel to the first direction 12.

In the process chamber 260, a substrate processing apparatus 280 for performing a cleaning process on the substrate W is provided. The substrate processing apparatus 280 provided in each of the process chambers 260 may have a different structure depending on the type of the cleaning process to be performed. Optionally, the substrate processing apparatus 280 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, and the substrate processing apparatuses 280 provided in the process chambers 260 belonging to the same group have the same structure and are provided in the process chambers 260 belonging to different groups The substrate processing apparatuses 280 may have different structures from each other. For example, if the process chambers 260 are divided into two groups, a first group of process chambers 260 is provided on one side of the transfer chamber 240 and a second group of process chambers 260 are provided on the other side of the transfer chamber 240 Process chambers 260 may be provided. Optionally, a first group of process chambers 260 may be provided on the lower layer and a second group of process chambers 260 may be provided on the upper and lower sides of the transfer chamber 240, respectively. The first group of process chambers 260 and the second group of process chambers 260 may be classified according to the type of the chemical used and the type of the cleaning method.

An example of the carrying robot according to the present invention will be described below. 3 is a view showing a first embodiment of the transportation robot 300. As shown in Fig.

The transport robot 300 transports the substrate to the process chamber 260. 2, the carrying robot 300 is installed on a guide rail 242 and is linearly moved along a first direction 12 on a guide rail 242. 2 and 3, the carrying robot 300 has a base 310, a driving shaft 320, a driving unit (not shown), an arm 340, and a hand 350. The base 310 is installed to be movable along the guide rail 242. The drive shaft 320 is coupled to the base 310. The drive shaft 320 is provided to be movable along the third direction 16 on the base 310. In addition, the drive shaft 320 is provided to be rotatable on the base 310. The driving unit (not shown) drives the driving shaft 320.

The arm 340 connects the drive shaft 320 and the hand 350. One end of the arm 340 is connected to the drive shaft 320 and the other end is connected to the hand 350.

The hand 350 is coupled to the arm 340 and is provided to be movable forward and backward relative to the drive shaft 320. One end of the hand 350 is coupled to the arm 340 and provided as a fixed end. The other end of the hand 350 is provided as a free end. Thus, the carrying robot 300 is provided in the form of a cantilever.

A plurality of hands 350 may be provided along the third direction 16 to be individually driven. The hands 350 may be arranged to be stacked apart from each other along the third direction 16.

The hand 350 is provided so that a plurality of plates are stacked in the vertical direction. Each plate can be provided so that the coefficients of thermal expansion are different from each other. As an example, each plate may be provided with a metal having a different thermal expansion coefficient.

The hand 350 may include a first plate 360 and a second plate 370. A second plate (370) is provided below the first plate (360). The coefficient of thermal expansion of the second plate 370 is provided to be larger than the coefficient of thermal expansion of the first plate 360. As an example, the first plate 360 may be provided with an alloy of nickel and chromium and iron. The first plate 360 may be provided with an alloy of copper and zinc. The first plate 360 may be provided with copper. The second plate 370 may be provided with an alloy of iron and nickel. The second plate 370 may be provided with iron.

Fig. 4 is a view showing the carrying robot 1300 according to the second embodiment of the present invention. The conveying robot 1300 according to the second embodiment is provided in the same manner as the first embodiment with the driving shaft 1320 and the arm 1340. The following description focuses on differences from the first embodiment.

The length of the second plate 1370 may be shorter than the length of the first plate 1360. The second embodiment is a case where the difference between the thermal expansion coefficients of the first plate 1360 and the second plate 1370 is larger than that of the first embodiment. That is, the degree of expansion of the second plate 370 is larger than that of the first plate 1360 in the first embodiment. In this way, the lengths of the first plate 1360 and the second plate 1370 can be set in consideration of the difference in thermal expansion coefficient between the plates.

A method of manufacturing the hand 350 of the transfer robot 300 according to the first embodiment of the present invention will be described below. The conveying robot 1300 according to the second embodiment is similar to the conveying robot 1300 of the first embodiment except that the length of the second plate 1370 in the hand 1350 is made shorter than the length of the first plate 1360 Hand 350. < / RTI >

The hand 350 is manufactured so that the other end of the hand 350 is free at the first temperature. Further, when the hand 350 is mounted on the arm 340, the other end of the hand 350 can be held horizontal by canceling the deformation caused by the weight of the board. The first temperature is the temperature at which the process proceeds. The first temperature may be room temperature.

Hand 350 is manufactured at a second temperature. The second temperature is a temperature lower than the first temperature. The hand 350 can stack a plurality of plates having different thermal expansion coefficients up and down. The plurality of plates to be stacked includes a first plate 360 and a second plate 370 provided below the first plate 360. The coefficient of thermal expansion of the second plate 370 is greater than the coefficient of thermal expansion of the first plate 360. [ A plurality of plates are laminated at a second temperature to produce horizontally. The second plate 370 having a larger thermal expansion coefficient expands more than the first plate 360 when the manufactured hand 350 is placed at the first temperature for the process. Due to the expansion of the second plate 370, the first plate 360 and the second plate 370 are bent upward.

The process of offsetting the tilting of the hand 350 will be described with reference to FIGS. 5 to 8. FIG. 5 to 8 are views sequentially showing changes of the hand 350 when the substrate is loaded on the carrying robot 300 according to the first embodiment.

Figure 5 shows a hand 350 made at a second temperature. When manufacturing the hand 350 at the second temperature, the hand 350 is stacked with the first plate 360 and the second plate 370 and kept horizontal.

6 shows the carrying robot 300 at the first temperature. The first temperature is higher than the second temperature. As described above, the first temperature may be room temperature. One end of the hand 350 is coupled to the arm 340 and the arm 340 is coupled to the drive shaft 320. [ The temperature rise from the second temperature to the first temperature causes the first plate 360 and the second plate 370 to expand. Since the second plate 370 has a thermal expansion coefficient larger than that of the first plate 360, the degree of expansion of the second plate 370 is large. Accordingly, the hand 350 is deformed upwardly inclined from one end coupled to the drive shaft 320 to the other end. That is, the first plate 360 and the second plate 370 are bent upwardly when they are at the second temperature. In addition, it can be bent into a shape in which the radius of curvature decreases from the fixed end to the free end.

7 shows the transport robot 300 when the substrate is placed on the hand 350 at the second temperature. When the substrate is placed on the hand 350 to transport the substrate at the second temperature, it is tilted downward by its own weight by the substrate. As a result, the hand 350 can be kept horizontal as a result. The thermal expansion coefficient and length of the first plate 360 and the second plate 370 can be appropriately adjusted in consideration of the size and weight of the substrate.

The foregoing detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and explain the preferred embodiments of the present invention, and the present invention may be used in various other combinations, modifications, and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, within the scope of the disclosure, and / or within the skill and knowledge of the art. The embodiments described herein are intended to illustrate the best mode for implementing the technical idea of the present invention and various modifications required for specific applications and uses of the present invention are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. It is also to be understood that the appended claims are intended to cover such other embodiments.

W: substrate 10: substrate processing equipment
300: conveying robot 320:
330: Driving unit 340:
350: Hand 360: First plate
370: second plate

Claims (12)

A transfer robot for transferring a substrate,
A hand for positioning a substrate;
A drive shaft coupled to one end of the hand to move the hand;
And an arm connecting the driving shaft and the hand,
The hand comprises:
A plurality of plates having different thermal expansion coefficients are stacked in the vertical direction,
The other end of the hand is provided as a free end,
Wherein the plurality of plates comprises:
A first plate;
And a second plate provided below the first plate,
Wherein the second plate has a larger thermal expansion coefficient than the first plate,
Wherein the first plate has a longer length than the second plate and the other end is longer than the second plate.
delete delete The method according to claim 1,
Wherein the hand is provided so as to be inclined upward from the one end to the other end.
5. The method of claim 4,
Wherein the radius of curvature of the hand decreases from the one end to the other end.
delete The method according to any one of claims 1, 4, and 5,
Wherein the first plate is an alloy of nickel, chromium and iron, an alloy of copper and zinc, or copper, and the second plate is an alloy or iron of iron and nickel.

delete delete delete delete delete
KR1020150155241A 2015-11-05 2015-11-05 Transfer robot KR101681192B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150155241A KR101681192B1 (en) 2015-11-05 2015-11-05 Transfer robot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150155241A KR101681192B1 (en) 2015-11-05 2015-11-05 Transfer robot

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020160117431A Division KR102030729B1 (en) 2016-09-12 2016-09-12 Method for manufacturing hand and method for treating substrate

Publications (1)

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KR101681192B1 true KR101681192B1 (en) 2016-12-01

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190002297A (en) * 2017-06-29 2019-01-08 니혼 덴산 산쿄 가부시키가이샤 Hand of industrial robot and industrial robot

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07156083A (en) * 1993-12-02 1995-06-20 Nikon Corp Microminiature gripper
KR19990047222A (en) * 1997-12-03 1999-07-05 윤종용 Tab tape with warpage protection
JP2006237256A (en) * 2005-02-24 2006-09-07 Ulvac Japan Ltd Circuit board transfer hand
KR20080108054A (en) * 2007-06-07 2008-12-11 고쿠리츠 다이가쿠 호진 도호쿠 다이가쿠 Substrate transporting unit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07156083A (en) * 1993-12-02 1995-06-20 Nikon Corp Microminiature gripper
KR19990047222A (en) * 1997-12-03 1999-07-05 윤종용 Tab tape with warpage protection
JP2006237256A (en) * 2005-02-24 2006-09-07 Ulvac Japan Ltd Circuit board transfer hand
KR20080108054A (en) * 2007-06-07 2008-12-11 고쿠리츠 다이가쿠 호진 도호쿠 다이가쿠 Substrate transporting unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190002297A (en) * 2017-06-29 2019-01-08 니혼 덴산 산쿄 가부시키가이샤 Hand of industrial robot and industrial robot
KR102071791B1 (en) 2017-06-29 2020-01-30 니혼 덴산 산쿄 가부시키가이샤 Hand of industrial robot and industrial robot

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