KR100911263B1 - Method for manufacturing printed circuit board - Google Patents

Abstract

A printed circuit board manufacturing method is disclosed. Printed circuit board manufacturing method comprising the step of forming a rough surface on the surface of the insulating layer, forming a plating layer by plating on the rough surface and selectively etching the plating layer to form a circuit pattern, manufacturing cost and manufacturing process While reducing the size, it is possible to form a highly reliable fine circuit pattern by using a roughened surface having a uniform size and depth.

Harmonic, Printed Circuit Board, Press

Description

Printed circuit board manufacturing method {Method for manufacturing printed circuit board}

The present invention relates to a printed circuit board manufacturing method.

Recently, due to the high functionalization of electronic products, miniaturization of circuit patterns is required, and in order to form such fine circuit patterns, a subtractive method using copper foil laminates has been applied in build-up wiring boards. .

In the subtractive method, a printed circuit board is fabricated by forming an interconnect pattern through an etching process in which the position where the circuit pattern is to be formed on the entire copper-clad substrate is protected by an etching resist and other portions are removed with an etchant. It is a way. When using this method, several etching processes or etching processes using thin copper foil were essential to form fine circuit patterns. However, many etching processes resulted in higher manufacturing costs due to the higher cost of copper foil and the increased process.

That is, when a plating layer formed on the insulating layer is selectively etched by a photolithography method to implement a fine circuit pattern, the thick plating layer must be etched up to the insulating layer. However, it was difficult to form a fine circuit pattern on the insulating layer by etching to the adjacent circuit pattern in this process.

Therefore, in order to form a fine circuit pattern, it was necessary to make thickness of the plating layer thin. In the prior art, several half etching processes and thin copper foils were used to make the thickness of the plating layer thin. However, when the thickness of the plating layer is thin, the adhesion strength between the insulating layer and the plating layer decreases, so a method for increasing the adhesion strength was required.

The present invention provides a printed circuit board manufacturing method capable of forming a fine circuit pattern by laminating a plating layer having a thickness necessary for forming a fine circuit pattern on an insulating layer and selectively etching the same.

According to an aspect of the present invention, a printed circuit board manufacturing includes forming a rough surface on an insulating layer surface, forming a plating layer by plating on the rough surface, and selectively etching the plating layer to form a circuit pattern. A method is provided.

At this time, the step of forming the rough surface may include the step of laminating and compressing the concave-convex plate on the insulating layer so that the concave-convex surface of the concave-convex plate on which the concave-convex surface is formed, and the surface of the insulating layer and the step of curing the insulating layer. .

In addition, after the step of curing may further comprise the step of removing the uneven plate, the uneven surface may be formed of a nodule (nodule) of uniform size and may be formed of stainless steel.

The forming of the plating layer may include forming a seed layer by electroless plating; And electroplating the seed layer with an electrode, and may further include forming a via hole in the insulating layer before forming the plating layer.

The method may further include laminating an insulating layer on the circuit board before forming the roughened surface.

According to the method of manufacturing a printed circuit board according to the present invention, it is possible to form a fine circuit pattern with high reliability by forming a rough surface having a uniform size and depth while reducing the manufacturing cost and manufacturing process.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all transformations, equivalents, and substitutes included in the spirit and scope of the present invention. In the following description of the present invention, if it is determined that the detailed description of the related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flowchart illustrating a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention, and FIGS. 2 to 8 are cross-sectional views illustrating respective processes of the method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention.

1 to 8, the circuit board 100, the insulating layer 110, the uneven plate 120, the inner circuit 115, the via hole 130, and the etching resist layer 160 are etched. A resist layer, a seed layer 140, an electroplating layer 141, plating layers 150 and 150 ′, and a circuit pattern 170 are illustrated.

According to the present exemplary embodiment, after the uneven plate 120 is pressed on the surface of the insulating layer 110, the circuit layer 170 is selectively formed by selectively etching the plating layer 150 formed on the surface of the pressed insulating layer. Therefore, the adhesion between the surface of the insulating layer 110 and the surface of the circuit pattern 170 having increased surface roughness can be improved, and by forming a uniform rough surface, a uniform circuit pattern is formed through an etching process. A method for manufacturing a printed circuit board capable of improving reliability is provided.

Looking at the method of manufacturing a printed circuit board according to the present embodiment, first, the insulating layer 110 is laminated on the circuit board 100 (S110). The circuit board refers to a substrate on which a circuit is formed, and may be any one of a multilayer circuit board, a single layer circuit board, and a double-sided circuit board. That is, it is not limited to the kind as long as it is a board | substrate with a circuit. In the present embodiment, for convenience of description, as shown in FIG. 2, it will be described on the assumption that it is a double-sided circuit board on which the inner circuit 115 is formed.

Next, a roughened surface is formed on the surface of the insulating layer 110 (S120). As such, a roughening surface may be formed on the surface of the insulating layer 110 to increase surface roughness. Accordingly, the surface of the insulating layer 110 having an increased surface roughness may have a high adhesion with the plating layer 150, which will later form the fine circuit pattern 170, thereby making it easier to form the fine circuit pattern 170. To be.

That is, in order to form a fine circuit pattern 170, the thickness of the plating layer 150 should be thin, and if the thickness of the plating layer is thin, the adhesion strength between the insulating layer 110 and the plating layer 150 decreases, so as to increase the adhesion strength. The rough surface is formed on the insulating layer 110.

According to the present exemplary embodiment, the forming of the roughened surface on the surface of the insulating layer 110 (S120) may be largely divided into three steps.

As shown in FIG. 2, the uneven plate 120 is laminated on the surface of the insulating layer 110 so as to face the uneven surface of the uneven plate 120 on which the uneven surface is formed (S121). . 2 is an enlarged view of a portion of the insulating layer 110 and the uneven plate 120 in order to express the shape of the uneven plate 120 in detail. Be clear. Vacuum laminates can be used in such lamination and compression processes.

According to the present embodiment, the uneven plate 120 having the uneven surface may be formed of a nodule having a uniform size and depth. More specifically, the uneven plate 120 may be formed by electrolytic copper plating with a predetermined thickness on a plate formed of stainless steel, and then nodules the surface. In addition, the uneven plate 120 is replaceable, it is possible to easily remove the foreign matter through the desmear process. Therefore, a roughened surface in which a uniform and constant peel strength can be secured at all times can be obtained.

Next, the uneven plate 120 is stacked to cure the compressed insulating layer 110 (S122). After the curing process, the uneven plate 120 is removed from the insulating layer 110 (S123). Of course, after the uneven plate 120 is removed from the insulating layer 110 before curing, it is also possible to harden the insulating layer 110 from which the uneven plate 120 is removed.

Next, as shown in FIG. 3, a via hole 130 for electrical connection with the inner circuit 115 may be formed in the insulating layer 110 having the roughened surface (S130). In this case, the via hole 130 may be formed after the rough surface is formed on the surface of the insulating layer as described above, or the via hole 130 may be formed before the rough surface is formed. That is, before forming the plating layer 150, the via hole 130 only needs to be formed.

As such, according to the present exemplary embodiment, since the plating layer 150 having the required thickness is formed in the insulating layer 110, the via hole 130 may be directly processed before the plating layer 150 is formed, but the conventional copper foil laminate may be used. In order to manufacture the printed circuit board, a process of removing the copper foil at the formation position of the via hole 130 was required in order to form the via hole 130. However, in this embodiment, since the via hole 130 is formed before the plating layer 150 is formed, the process of removing the copper foil is omitted, thereby shortening the manufacturing process and reducing the manufacturing cost.

In addition, according to the present embodiment, the plating layer 150 may be directly formed on the surface of the insulating layer 110 on which the rough surface is formed, and thus the plating thickness is adjusted to have an appropriate etching thickness for forming the fine circuit pattern 170. Since this is possible, the process for reducing the etching thickness can be omitted.

Therefore, the printed circuit board manufacturing method according to the present embodiment can be reduced in manufacturing cost and process for the same reason as described above.

Next, the plating layer 150 is formed on the insulating layer 110 (S140). The forming of the plating layer 150 may be divided into a process of forming the seed layer 140 by electroless plating and a process of forming the electroplating layer 141 by electroplating. In the present specification, the plating layer 150 is a concept including both the seed layer 140 formed by electroless plating and the electroplating layer 141 formed by electroplating. Hereinafter, in the present specification, the plating layer 150 is clearly used in the same sense as described above.

As described above, since the plating layer 150 is formed on the insulating layer 110 on which the rough surface is formed by depositing and compressing the uneven plate 120, the adhesion is increased, and a fine circuit pattern 170 can be easily implemented later. .

First, as shown in FIG. 4, a seed layer 140 is formed on a rough surface through an electroless plating process (S141). After the seed layer 140 is formed, as shown in FIG. 5, the electroplating layer 141 is formed by electroplating the seed layer 140 as an electrode (S142). The electroplating layer 141 formed by electroplating later forms a circuit pattern 170. Next, the plating layer 150 is selectively etched to finally form the circuit pattern 170 (S132).

In order to form the circuit pattern 170 by selectively etching the plating layer 150, as shown in FIG. 6, the etching resist layer 160 is protected so that the plating layer 150 is protected from the etchant except for a region corresponding to the circuit pattern 170. Can be formed.

Then, after forming the etching resist layer 160 as shown in FIG. 7, a portion 150 ′ of the plating layer is etched and removed by the etching solution. At this time, since the rough surface is formed on the insulating layer 110 through the uneven plate 120 uniformly processed in size and depth as described above, a uniform circuit width can be obtained during the etching process, and residuals are completely removed. It becomes possible

Next, as shown in FIG. 8, the fine circuit pattern 170 may be formed by removing the etching resist layer 160.

As described above, the rough surface is formed on the surface of the insulating layer 110 by using the concave-convex plate 120 processed to a uniform size and depth, thereby reducing the manufacturing cost and the manufacturing process, while minimizing the reliability of the fine circuit pattern. Can be formed.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art to which the present invention pertains without departing from the spirit and scope of the present invention as set forth in the claims below It will be appreciated that modifications and variations can be made.

1 is a flow chart showing a printed circuit board manufacturing method according to an embodiment of the present invention.

2 to 8 are cross-sectional views showing each step of the method for manufacturing a printed circuit board according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: printed circuit board

110: insulation layer

120: uneven plate

150, 150 ': plating layer

160: etching resist layer

170: circuit pattern

Claims (7)

Stacking and compressing the uneven plate on the insulating layer such that the uneven surface of the uneven plate having the uneven surface is formed to face the uneven surface; Curing the insulating layer; Removing the uneven plate to form a rough surface on the surface of the insulating layer; Forming a plating layer on the rough surface by plating; And Selectively etching the plating layer to form a circuit pattern; The uneven plate is a stainless steel plate, and a printed circuit board manufacturing method comprising a copper nodule (copper nodule) formed in a uniform size on the stainless steel plate. delete delete delete The method of claim 1, Forming the plating layer is Forming a seed layer by electroless plating; And And electroplating the seed layer with an electrode. The method of claim 1, Before forming the plating layer The method of claim 1, further comprising forming a via hole in the insulating layer. The method of claim 1, Before the step of forming the rough surface The method of manufacturing a printed circuit board further comprising the step of laminating the insulating layer on the circuit board.

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