KR100894904B1 - 섬유 동도금방법 - Google Patents
섬유 동도금방법 Download PDFInfo
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- KR100894904B1 KR100894904B1 KR1020070075741A KR20070075741A KR100894904B1 KR 100894904 B1 KR100894904 B1 KR 100894904B1 KR 1020070075741 A KR1020070075741 A KR 1020070075741A KR 20070075741 A KR20070075741 A KR 20070075741A KR 100894904 B1 KR100894904 B1 KR 100894904B1
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- fiber
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- chloride
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2013—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by mechanical pretreatment, e.g. grinding, sanding
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
Claims (10)
- (a) 섬유를 에칭 용액에 침지하여 상기 섬유의 표면을 에칭하는 단계;(b) 상기 섬유를 제 1 산 용액에 침지하는 단계;(c) 상기 섬유를 촉매 용액에 침지하는 단계;(d) 상기 섬유를 제 2 산 용액에 침지하는 단계;(e) 상기 섬유를 5 내지 50g/ℓ의 에틸렌디니트릴로-테트라-2-프로판올(EDTP)과, 10 내지 20g/ℓ의 황산구리(Ⅱ) 5수화물 (CuSO4·5H2O)과, 5 내지 15g/ℓ의 수산화나트륨(NaOH)과, 2.5 내지 10g/ℓ의 포름알데히드(HCHO)와, 안정제를 포함하는 무전해 동도금액에 침지하여 상기 섬유의 표면에 금속층을 형성시키는 단계; 및(f) 상기 금속층이 형성된 섬유를 건조하는 단계;를 포함하며,상기 안정제는, 1 내지 100ppm의 2-2' 디피리딜(2-2' Dipyridyl)과, 10 내지 1000ppm의 페로시안화 칼륨(Potassium ferrocyanide)과, 1 내지 100ppm의 2-머캅토 벤조치아졸(2-Mercapto benzo thiazole)과, 1 내지 100ppm의 (티오) 우레아(Thio urea)를 포함하는 것을 특징으로 하는 섬유 동도금방법.
- 삭제
- 삭제
- 제 1항에 있어서,상기 무전해 동도금액은, 1 내지 50g/ℓ의 에틸렌디아민-테트라-아세트산(EDTA)을 더 포함하는 것을 특징으로 하는 섬유 동도금방법.
- 제 1항에 있어서,상기 (d)단계와 상기 (e)단계 사이에는,상기 섬유를 무전해 니켈 도금하여 상기 섬유에 니켈 도금층이 형성되도록 하는 단계를 더 포함하는 것을 특징으로 하는 섬유 동도금방법.
- 제 5항에 있어서,상기 니켈 도금층의 두께가 0.1 내지 0.4㎛가 되도록 무전해 니켈 도금하는 것을 특징으로 하는 섬유 동도금방법.
- 제 1항에 있어서,제 1,2 산 용액은 염산, 황산 수용액 중에서 선택된 하나인 것을 특징으로 하는 섬유 동도금방법.
- 제 1항에 있어서,상기 촉매 용액은 염화팔라듐, 황산팔라듐, 염화니켈, 염화아연, 염화은, 염화구리, 염화철, 염화주석, 염화안티몬 및 염화인듐으로 이루어진 군에서 선택된 적어도 하나의 금속물질을 산 용액에 용해시킨 것을 특징으로 하는 섬유 동도금방법.
- 삭제
- 삭제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020070075741A KR100894904B1 (ko) | 2007-07-27 | 2007-07-27 | 섬유 동도금방법 |
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KR1020070075741A KR100894904B1 (ko) | 2007-07-27 | 2007-07-27 | 섬유 동도금방법 |
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KR1020080126564A Division KR100915640B1 (ko) | 2008-12-12 | 2008-12-12 | 무전해 동도금액을 이용한 섬유의 도금방법 |
Publications (2)
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KR20090011795A KR20090011795A (ko) | 2009-02-02 |
KR100894904B1 true KR100894904B1 (ko) | 2009-04-30 |
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KR1020070075741A KR100894904B1 (ko) | 2007-07-27 | 2007-07-27 | 섬유 동도금방법 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101057024B1 (ko) | 2008-08-22 | 2011-08-16 | 김동현 | 전기도금법에 의한 전자파 차폐용 도전성 섬유의 제조방법 |
KR102146511B1 (ko) | 2020-05-18 | 2020-08-20 | 김출기 | 니켈 도금 방법 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101427309B1 (ko) * | 2013-03-25 | 2014-08-06 | 주식회사 불스원신소재 | 무전해 및 전해 도금의 연속 공정을 이용한 고전도성 탄소 섬유의 제조 방법 |
KR101604858B1 (ko) * | 2014-07-17 | 2016-03-21 | (주)크린앤사이언스 | 무전해 및 전해 도금의 연속 공정을 이용한 부직포의 도금방법 |
CN115011348B (zh) * | 2022-06-30 | 2023-12-29 | 湖北兴福电子材料股份有限公司 | 一种氮化铝蚀刻液及其应用 |
CN115450046B (zh) * | 2022-09-08 | 2024-04-02 | 青岛德冠超导材料制造有限公司 | 用于核辐射环境防护的聚对苯撑苯并二噁唑材料及其制备方法和用途 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020003436A (ko) * | 2000-07-03 | 2002-01-12 | 김선기 | 도전성 직물지의 제조방법 |
KR20020004826A (ko) * | 2000-06-29 | 2002-01-16 | 포만 제프리 엘 | 장벽층 위로 구리를 증착하는 방법 |
KR20050107995A (ko) * | 2004-05-11 | 2005-11-16 | 최철수 | 전도성섬유의 치환도금방법 |
KR100655727B1 (ko) * | 2006-06-29 | 2006-12-08 | 최철수 | 전자파 차폐를 위한 전도성 섬유의 제조방법 |
-
2007
- 2007-07-27 KR KR1020070075741A patent/KR100894904B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020004826A (ko) * | 2000-06-29 | 2002-01-16 | 포만 제프리 엘 | 장벽층 위로 구리를 증착하는 방법 |
KR20020003436A (ko) * | 2000-07-03 | 2002-01-12 | 김선기 | 도전성 직물지의 제조방법 |
KR20050107995A (ko) * | 2004-05-11 | 2005-11-16 | 최철수 | 전도성섬유의 치환도금방법 |
KR100655727B1 (ko) * | 2006-06-29 | 2006-12-08 | 최철수 | 전자파 차폐를 위한 전도성 섬유의 제조방법 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101057024B1 (ko) | 2008-08-22 | 2011-08-16 | 김동현 | 전기도금법에 의한 전자파 차폐용 도전성 섬유의 제조방법 |
KR102146511B1 (ko) | 2020-05-18 | 2020-08-20 | 김출기 | 니켈 도금 방법 |
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KR20090011795A (ko) | 2009-02-02 |
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