KR100851169B1 - Duplexer package and method for manufacturing thereof - Google Patents

Abstract

The present invention provides a phase shifter and a duplexer chip package structure using the same, which can reduce the cost of package manufacture by making a phase shifter according to a process independently manufactured on a package, such as a saw duplexer chip, and then mounting the phase shifter on the package. The method is disclosed. The present invention discloses a phase shift circuit disposed to convert a phase of a signal on a ceramic substrate, an electrical contact for a signal input / output with terminals of the phase shift circuit, and disposed at edges of the ceramic substrate, respectively. It characterized in that it comprises a ground terminal.

In addition, according to another embodiment of the present invention, a method of manufacturing a phase converter includes: forming a via hole in an edge corner on a ceramic substrate; Applying a metal film on the ceramic substrate on which the via holes are formed; Patterning a metal film coated on the ceramic substrate to form a micro strip line, which is a phase shift element, and a ground terminal in the via hole; Characterized in that it comprises a.

Packages, Wires, Duplexers, Phase Shifters, SAW

Description

Duplexer package and its manufacturing method {DUPLEXER PACKAGE AND METHOD FOR MANUFACTURING THEREOF}

1 illustrates a duplexer chip structure according to the prior art.

2A to 2E illustrate a duplexer chip package manufacturing process according to the present invention.

3 shows the structure of a phase shifter according to the invention;

* Description of the symbols for the main parts of the drawings *

20: Uneven package 21: Internal ground terminal

23: External ground terminal 24: I / O terminal

25: phase shifter 26: ground terminal

27: saw duplexer chip 29: wire

30: cap

The present invention relates to a phase converter, a duplexer chip package structure using the same, and a method of manufacturing the same. More specifically, a phase converter capable of reducing a package manufacturing cost by manufacturing and mounting a phase converter independently of a chip package and a duplexer using the same A chip package structure and a method of manufacturing the same.

Background Art In recent years, with the development of mobile communication systems, mobile communication devices such as mobile phones and portable information terminals are rapidly spreading, and the demand for miniaturization and high performance of these devices has been required to reduce the size and performance of components used therein.

In addition, two types of wireless communication systems, analog and digital, are used in mobile telephones, and the frequencies used for wireless communication are in the 800 MHz to 1 GHz band and the 1.5 GHz to 2.0 GHz band.

In particular, SAW filters are widely used as band pass filters in communication devices and other electronic devices. SAW filters include a lateral SAW filter having two interdigital transducers (IDTs) arranged at a predetermined distance on a piezoelectric substrate, and a SAW resonator filter constituting a resonator on a piezoelectric substrate.

As SAW resonator filters, a single-sided reflection SAW resonator filter is known that uses shear horizontal surface acoustic waves such as love waves, Bleustein-Gulyaev-Shimuzu (BBS) waves, and other similar waves.

In recent years, with the miniaturization and high performance of communication devices, the SAW filter has been often adopted to transmit or receive only a certain band frequency of a signal when transmitting and receiving a signal, or to receive a signal of a certain frequency band when receiving a signal. Among them, in the case of RF filters, SAW resonator filters with good signal processing efficiency are widely used.

In the above-described saw-duplexer, a mobile communication device represented by a mobile phone is used as a filter for minimizing mutual interference to simultaneously transmit and receive a signal, and is composed of a transmission filter and a reception filter. Each filter is formed on the piezoelectric element such as LiNbO3 and the like to the input converter for converting the mechanical vibration to the mechanical vibration and an output converter for converting the mechanical vibration into an electrical signal and output to the load. In the input converter and the output converter, comb-shaped aluminum electrodes are formed to be spaced apart from each other by a predetermined distance.

In addition, the saw duplexer is manufactured in the form of an integrated package with circuit elements formed on a ceramic laminate substrate by a technique called low temperature co-fired ceramic (LTCC) having excellent high frequency performance. have.

Typical packages used for the packaging of SAW filters are alumina ceramics and HTCC packages manufactured at high temperatures using W and Mo as electrode materials. Complex devices such as duplexers or FEMs with SAW filters are incorporated due to the reduced electrical conductivity of the electrode materials. In the case of the passive element for the circuit can not be implemented in the form of a pattern inside the package, there are many difficulties in integration and miniaturization.

Therefore, when the LTCC is used, it is possible to use an electrode material having excellent electrical conductivity and to achieve integration and miniaturization since it is a co-fire process technology in which a metal and its ceramic substrate are simultaneously made at low temperature. Can be.                         

Glass-based or mixed ceramic-based substrates can be pressed and fired to metal-clad substrates at around 800 ~ 1000 ℃ and are well suited for high-frequency passive device fabrication.

In general, wireless communication systems such as CDMA and PCS include an antenna and a transceiver module for transmitting data signals or receiving data signals transmitted from the outside.

A duplexer and a saw filter for transmitting / receiving are disposed in the transmitting / receiving module to transmit a signal having a predetermined frequency to be transmitted to an antenna, or to transmit the signal having a predetermined frequency to be applied to a receiving module inside a communication system. The transmission module includes a power amplification unit for amplifying the transmission signal generated by the control of the communication system and amplifies the signal for transmission over a long distance.

Recently, a technology called low temperature co-fired ceramic (LTCC) has been developed to manufacture passive devices for high frequency communication.

When the LTCC is used, integration and miniaturization can be achieved because an electrode material having excellent electrical conductivity can be used and a co-fire process technology in which a metal and its ceramic substrate are simultaneously made at low temperature is applied. have.

Glass-based or mixed ceramic-based substrates can be pressed and fired to metal-clad substrates at around 800-1,000 ° C and are well suited for high-frequency passive device fabrication.

1 is a view showing a duplexer chip structure according to the prior art.                         

As shown in FIG. 1, the SAW duplexer 1, which is a surface acoustic wave element, is mounted on a concave-convex package 10 formed of a dielectric material such as ceramic by a general die bonding method to wire for electrical connection with the package. Bond

The concave-convex package 10 is usually manufactured by an LTCC process, and a phase shifter 3 is manufactured at the bottom of the concave-convex package 10 so that when the saw duplexer 1 transmits a transmission / reception signal, an interference phenomenon occurs. To prevent this from happening.

In addition, via holes are formed in both side walls of the uneven package 10, and conductive metal is filled in the via holes, thereby forming a top surface of the uneven package 10. It is made to be in electrical contact with the terminals of the phase converter 3 and the circuits, which are formed at.

The saw duplexer 1 is mounted inside the concave-convex package 10 in the form of a chip. The concave-convex package 10 is bonded by wires 5 for electrical connection with the phase converter 3 and the circuits. ) Is connected to the ground terminals.

Then, the saw duplexer (1) chip is mounted on the concave-convex package 10, and when the wire (5) bonding is finished, the saw duplexer chip (1) in the concave-convex package 10 by covering the cap (7). Encapsulation process is performed to block the external environment.

Ground terminals are formed on both side walls of the uneven package 10 for electrical coupling with an external PCB, and the ground terminals are provided with an internal circuit pattern and electrical contacts along via holes formed on both walls of the uneven package 10. The connection pattern is formed to allow.                         

However, as described above, the Saw duplexer chip package manufactured according to the LTCC manufacturing process has a disadvantage in that the manufacturing cost is high because all the circuit elements including the phase shifter are manufactured by the LTCC material except for the Saw duplexer chip.

The present invention provides a phase shifter, a duplexer package structure using the same, and a method of manufacturing the phase shifter, which are manufactured by integrating a phase shifter integrally manufactured in an SAW duplexer chip package manufactured by the LTCC method and mounted on the duplexer chip package. The purpose is to provide.

In order to achieve the above object, a phase converter according to the present invention,

A phase shift circuit disposed to convert a phase of a signal on a ceramic substrate;

And a ground terminal electrically contacted with the terminals of the phase shift circuit for signal input and output and disposed at edge edges of the ceramic substrate.

In addition, according to another embodiment of the present invention,

Forming via holes in edge edges on the ceramic substrate;

Applying a metal film on the ceramic substrate on which the via holes are formed; And

Patterning a metal film coated on the ceramic substrate to form a micro strip line, which is a phase conversion element, and a ground terminal in the via hole; Characterized in that it comprises a.

The ground terminal formed in the via hole and the input / output terminal of the micro strip line may be electrically contacted with each other.

And the duplexer package structure according to another embodiment of the present invention,

An uneven package having external circuit terminals and ground terminals for electrical contact disposed on both sides;

A phase converter mounted in a flip chip manner on the uneven grooves in the uneven package;

A semiconductor chip mounted on the phase converter; And

And a cap attached to seal the uneven package above the semiconductor chip from the outside.

The semiconductor chip may be a duplexer chip.

In addition, the duplexer package manufacturing method according to another embodiment of the present invention,

Providing a concave-convex package having external ground terminals formed at both sides for contact with the external PCB circuits;

Mounting a phase converter manufactured in a patterned shape on a ceramic in the concave-convex package by a flip chip method;

Mounting a semiconductor chip on a phase converter mounted inside the uneven package;

Connecting terminals of the semiconductor chip and the uneven package by wire bonding; And

And sealing the cap on the wire-bonded concave-convex package by the cap for sealing with the outside.

The phase converter and the semiconductor chip are electrically contacted, and the semiconductor chip is a duplexer chip.

According to the present invention, the SAW duplexer chip package manufactured by the conventional LTCC method is not manufactured integrally, but is manufactured on a separate ceramic substrate or on a Si or GaAs substrate by a semiconductor process, and then, such as HTCC. By mounting the SAW duplexer chip after mounting it in a low-cost package, manufacturing cost can be reduced compared to the duplexer package manufactured by the LTCC process.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A to 2E are views illustrating a duplexer chip package manufacturing process according to the present invention.

As shown in FIG. 2A, a phase converter that is manufactured to prevent interference of the saw duplexer is not integrally manufactured to the uneven package 20 manufactured according to the conventional LTCC process.

Independently patterning a circuit on a ceramic substrate or a semiconductor substrate is mounted on the uneven package 20 in the form of a chip. Therefore, the internal structure of the concave-convex package manufactured by the conventional LTCC process uses a concave-convex package manufactured by a low-cost HTCC process so that the phase shifter can be mounted as well as a groove in which the saw duplexer chip is mounted. One more groove is formed.

The circuit pattern and the input / output terminals 24 of the circuit pattern are formed on the groove where the phase converter is to be mounted so as to be electrically connected to the input / output terminals of the phase converter.

Then, as illustrated in FIG. 2B, a phase converter 25 having a phase conversion circuit independently formed on a ceramic substrate or a semiconductor substrate is mounted to be mounted on the uneven package 20 according to a flip chip method. The ground terminals 26 of the phase converter 25 are electrically contacted with the input / output terminals 24 of the circuit pattern formed on the grooves of the uneven package 20.

The phase shifter 25 is mounted using an anisotropic conductive paste (ACP) method in which an anisotropic conductive film in the form of flip chip bonding or a metal adhesive is formed by thermal bonding with a bump therebetween to electrically couple two terminals. The bonding speed is fast and mass production is easy.

As shown in FIG. 2C, the saw duplexer chip 27 is mounted in a stacked form with the phase converter 25 on the uneven package 20 in which the phase converter 25 is mounted. The ground terminal 26 of the 25 is formed by forming a via hole on the edge edge of the ceramic substrate, and filled with a conductive metal film, so that the ground terminals 26 and the terminals of the saw duplexer chip 27 are stacked on the phase converter 25. Contact is made.                     

Therefore, even when the saw duplexer chip 27 is mounted, the saw duplexer chip 27 is mounted on the ground terminal 26 on the phase converter 25 by a flip chip method.

As described above, when the saw duplexer chip 27 and the phase shifter 25 are mounted in the uneven package 20 in a stacked form, as illustrated in FIG. 2D, the terminals and the unevenness of the saw duplexer chip 27 are shown. Electrical contact is made by bonding the internal ground terminals 21 and the wire 29 of the mold package 20.

Then, as shown in FIG. 2E, when the bonding of the wire 29 is completed, the external phase seal 25 and the saw duplexer chip 27 mounted inside the uneven package 20 are sealed to the outside. Cover the cap 30.

Although not shown, 23 is an external ground terminal.

In general, when manufacturing a duplexer chip package by the LTCC process, it is necessary to use a gold, silver, and a low temperature firing ceramic substrate suitable for low temperature firing process, compared to HTCC (HTCC: High Temperature Co-fired Ceramic) process manufactured at high temperature. Cost.

Therefore, in the present invention, while using a low-cost HTCC package instead of the conventional LTCC manufacturing process, in order to reduce the duplexer chip package manufacturing cost, the phase converter, which was conventionally manufactured by the LTCC process, is manufactured by an externally independent manufacturing process. Then, by mounting it in the uneven package in the same manner as the saw duplexer chip mounting method, the manufacturing cost was reduced and the miniaturization was realized like the LTCC application method.

3 is a view showing the structure of a phase shifter according to the present invention.                     

As shown in FIG. 3, the ground terminals 26 and the phase conversion circuit 33 are disposed on the ceramic substrate as shown. The manufacture of the phase converter 25 does not manufacture the ceramic substrate integrally with the uneven package mounting the saw duplexer chip by the LTCC process, so that the ceramic substrate used in the HTCC process can be used, and the circuit pattern and the ground terminals are also used. Molybdenum and tungsten capable of high temperature firing can be used.

Although not clearly shown in the drawing, the ground terminals 26 disposed at the edge edges of the ceramic substrate 31 have a structure in which a conductive metal film is filled on via holes penetrating the ceramic substrate 31 through upper and lower portions thereof. have.

The phase shift circuit disposed in the center of the ceramic substrate 31 of the phase shifter 25 is a combined filter of an inductor and a capacitor by the micro strip line 33.

Although only a microstrip line 33 is shown in the drawing, a method of implementing inductance and capacitance may be performed by patterning an inductor, stacking ceramic substrates 31, manufacturing capacitors, and connecting the devices by via holes. Can be implemented.

The phase shifters 25 by the micro strip lines 33 are input / output terminals at edge edges of the rectangular ceramic substrate 31, respectively, and then ground terminals 26 for electrical connection with the saw duplexer chip terminals to be stacked. To form a via hole.

A metal film is coated and patterned on the ceramic substrate 31 on which the via holes are formed, and a micro strip line 33 is formed at the center thereof, and a conductive metal is filled on the via holes formed at the edge edges thereof, so that the input and output of the micro strip lines 33 are performed. A ground terminal 26 is formed which can be in contact with the terminal.

The ground terminal 26 is electrically connected to a circuit pattern formed in the uneven package, the terminal of the saw duplexer chip, and the micro strip line 33 so that interference does not occur when simultaneously processing a transmission / reception signal.

Therefore, in the present invention, when manufacturing the saw duplexer chip package by using an independently manufactured phase converter, instead of using an expensive LTCC package, using an inexpensive HTCC package or the like can reduce the manufacturing cost and LTCC package As in use, there is an advantage that the thin and thin can be reduced by applying the flip chip assembly method.

As described in detail above, in the duplexer package, the manufacturing cost of the package can be reduced by using a low-cost HTCC package instead of the LTCC package, and the phase converter is formed on a semiconductor substrate or a ceramic substrate according to an independent process and flipped. The chip bonding technique enables the light and small size of the duplexer package to be manufactured like the LTCC manufacturer.

The present invention is not limited to the above-described embodiments, and various changes can be made by those skilled in the art without departing from the gist of the present invention as claimed in the following claims.

Claims (8)

An uneven package having an uneven groove therein and including an inner uneven groove and a terminal formed on the outside thereof; A phase converter mounted on an uneven groove in the uneven package; A semiconductor chip mounted on the phase converter; And And a cap attached to seal the uneven package on the semiconductor chip from the outside. The method of claim 1, The phase converter includes a ceramic substrate including a phase shift circuit disposed at a central portion thereof; And a terminal disposed at an edge of the ceramic substrate and bonded to the terminal formed on the uneven groove in the uneven package by a flip chip method. The method of claim 1, The phase converter includes a stacked ceramic substrate, a micro strip line patterned at the center of the ceramic substrate, a capacitor formed by stacking the ceramic substrate, and a via hole connecting the micro strip line and the capacitor to a circuit. Duplexer package. The method of claim 1, The semiconductor chip comprises a duplexer chip. The method of claim 4, wherein The semiconductor chip is in electrical contact with the phase converter, the duplexer package is bonded with a wire to a terminal formed in the grooves of the inner concave-convex package. Providing a concave-convex groove formed therein, the concave-convex package having a terminal formed in the inner concave-convex groove and the outer surface; Mounting a phase shifter on an internal concave-convex groove of the concave-convex package; Mounting a semiconductor chip on the phase shifter mounted in the uneven groove inside the uneven package; Duplexer package manufacturing method comprising the step of encapsulating the upper portion of the uneven package by a cap for sealing with the outside. The method of claim 6, The semiconductor chip is a duplexer chip, and is electrically mounted on the phase shifter, the duplexer package manufacturing method of the wire bonded to the terminal formed in the recessed grooves of the uneven package. The method of claim 6, The uneven package is a duplexer package manufacturing method comprising a package manufactured by HTCC process.

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