KR20050098346A - Package for complex module and manufacture method - Google Patents

Abstract

The present invention provides a method of manufacturing a package of a composite module including a power amplifier, a duplexer, a transmission bandpass filter, a matching unit, and a lead, wherein the duplexer and the transmission bandpass filter are manufactured in one chip, and the manufactured A composite chip is attached to the lead, a cavity is formed on the package to attach the lead to which the composite chip is attached, a matching part and a power amplifier are mounted on the package, and a top surface of the package is molded. In addition, the marginal area to which the and peripheral circuits are settled increases, increasing design freedom within the same area and reducing costs by simultaneously manufacturing a PAM, a duplexer, and a filter.

Description

Package for complex module and manufacture method

The present invention is a composite module package for manufacturing a duplexer and a band pass filter in one chip to attach to the lead consisting of circuit elements and electrode pads using flip chip bonding, and to attach the lead with the composite chip to the package; It is about the manufacturing method.

In the information age, the use of mobile communication devices using high frequency circuits such as home wireless telephones and mobile communication terminals is increasing rapidly. Therefore, the components used in the high frequency circuit are accompanied by a lot of difficulties in design to effectively prevent crosstalk of the frequency and suppress harmonics.

In general, in a recent mobile communication system, a system for simultaneously serving two types of communication having different frequency bands, for example, a PCS method of 1.8 GHz band, a CDMA method of 800 MHz band, or 1.8 to 1.9 in a mobile communication system A system that provides two or more types of communication among the GSM method of the GHz band and the GSM method of the 900 MHz band has emerged.

In general, wireless communication systems such as CDMA and PCS include an antenna and a transceiver module for transmitting data signals or receiving data signals transmitted from the outside.

The transceiver module includes a duplexer having a built-in saw filter and transmits a signal of a predetermined frequency to be transmitted to an antenna, or passes through a signal of a predetermined frequency to be applied to a receiving module in a communication system. The transmission module includes a power amplification unit for amplifying the transmission signal generated by the control of the communication system and amplifies the signal for transmission over a long distance.

Recently, a technology called low temperature co-fired ceramic (LTCC) has been developed to manufacture passive devices for high frequency communication.

LTCC is usually manufactured by making a board as a substrate and coating a metal on the circuit, but this method has difficulty in integration and miniaturization.

Therefore, when the LTCC is used, since it is a co-fire process technology in which a metal and its ceramic substrate are simultaneously made at low temperature, integration and miniaturization can be achieved.

Glass-based or mixed ceramic-based substrates can be pressed and fired to metal-clad substrates at around 800-1,000 ° C and are well suited for high-frequency passive device fabrication.

Hereinafter, a CDMA composite module using the LTCC technology will be described with reference to the accompanying drawings.

1 is a block diagram illustrating a general CDMA composite module.

Referring to FIG. 1, the CDMA composite module includes a transmission band pass filter 100, a matching unit 110, a power amplifier 120, and a duplexer 130.

That is, the CDMA composite module includes an antenna (not shown) for transmitting and receiving a high frequency signal applied from the outside and a signal generated therein, and a duplexer for filtering only a predetermined frequency to transmit and receive high frequency signals from the antenna (not shown). 130 and a power amplifying unit 120 for amplifying a high frequency signal generated in a communication system including the transmitting and receiving module to a level required in a cell service area.

2 is a view showing a cross section of a conventional composite module, Figure 3a is a view showing a top surface of a conventional composite module, Figure 3b is a view showing a bottom surface of a conventional composite module.

2 and 3A, the composite module 200 is implemented by mounting a PAM 202, a duplexer 204, a transmission band pass filter 206, and a matching unit 208 on one plane on a substrate.

The PAM 202 is mounted to the top surface of the package by die bonding or wire bonding.

The duplexer 204 and transmit band pass filter 206 are SMT on the top surface of the package.

The matching unit 208 is configured to form a stripline inside the SMT on the upper surface of the package, or if the capacity of the capacitor is very large, and can be configured as a pattern inside the package, thereby reducing the use area and the number of parts. You can get it.

The bottom of the composite module configured as described above is as shown in FIG.

Referring to FIG. 3B, ground is formed on the bottom of the composite module.

However, there is a problem in that the PAM, the duplexer, the transmission band pass filter, and the matching circuit are limited to the size of the bar, which is implemented by being mounted on one plane on the substrate.

In addition, due to the increase in the number of circuit components, additional costs are generated when mounting the PCB and the process time increases, there is a problem of generating the cost as much.

Therefore, an object of the present invention is to reduce the manufacturing cost due to the ease of manufacturing the composite module by mounting the parts on the upper and lower surfaces of the package, as well as to increase the area to dissipate heat generated in the PAM through the free space for mounting The present invention provides a package for a composite module and a method of manufacturing the same, which can not only improve performance but also reduce the size of a product.

Another object of the present invention is to implement the duplexer and the transmission band pass filter on the same chip at the same time to assemble on the back of the package, or to make a separate chip at the same time as the back of the package in the cavity to achieve a dramatic reduction in material and process costs The present invention provides a package for a composite module and a method of manufacturing the same.

According to an aspect of the present invention to achieve the above object, in the method of manufacturing a package of a composite module including a power amplifier, a duplexer, a transmission band pass filter, a matching unit, a lead, the duplexer and the transmission band pass filter A single chip, attach the manufactured composite chip to the lead, form a cavity on the package, attach the lead to which the composite chip is attached, and attach a matching part and a power amplifier to the package. In addition, there is provided a method for producing a package for a composite module, characterized in that for molding the upper side package.

The composite chip has an electrode pad, and the lead has an electrode pad and an adhesive attachment region.

The composite chip is attached to the lead by flip chip bonding between the electrode pad of the composite chip and the electrode pad of the lead.

An adhesive is attached to the adhesive attaching region of the lid and attached to the package.

A power amplifier is attached to the lead, which is connected to the electrode pad in the package by wire bonding.

A via hole is formed in the package to dissipate heat generated in the PAM.

According to another aspect of the present invention, in a composite module including a power amplifier, a matching unit, a duplexer, a transmission band pass filter, and a lead, the composite chip having the duplexer and the transmission band pass filter as one chip is connected to the lead. A package for a composite module is mounted and attached to a cavity area of an upper portion of the package, and the power amplifier and the matching unit are mounted on the package upper surface.

The electrode pad of the composite chip and the electrode pad of the lead are connected to mount the compound chip to the lead.

The electrode pad of the lead on which the composite chip is mounted is connected to the electrode pad in the package by wire bonding.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 4a is a view showing a cross section of the composite module according to an embodiment of the present invention, Figure 4b is a view showing a top surface of the composite module according to a preferred embodiment of the present invention, Figure 5 is a preferred embodiment of the present invention 6A and 6B illustrate a lead according to an exemplary embodiment of the present invention, and FIG. 7 illustrates bonding of a chip and a lead according to an exemplary embodiment of the present invention.

4A and 4B, the composite module includes a transmission band pass filter 403, a matching unit 408, a power amplifier 402, a duplexer 405, and a lead 412.

The lead 412 on which the power amplifier 402, the matching unit 408, and the composite chip 404 are mounted is formed on an upper surface of the composite module.

The power amplifier 402 and the matching unit 408 are mounted on the upper surface of the package 400.

The transmission band pass filter 403 and the duplexer 405 are one chip and attached to the lead 412 and mounted in the package 400.

The state in which the duplexer 405 and the transmission band pass filter 403 are one-chip is shown in FIG. 5.

Referring to FIG. 5, in the composite chip 404, the duplexer 405 and the transmission band pass filter 403 are one-chip on the same plane. The composite chip 404 has an electrode pad 413 for performing flip chip bonding with the lead 412.

The fabricated composite chip 404 is flip chip bonded to a lead 412 as shown in FIGS. 6A and 6B. Referring to FIGS. 6A and 6B of the lid 412, the lower surface of the lid 412 includes a via hole 414a and an adhesive attaching region 411, and the upper surface of the lid 412 corresponds to the via hole 414a on the lower surface. There is an electrode pad 414b.

Flip chip bonding is performed on the composite chip 404 and the ceramic lead 412 as shown in FIG. 7.

Referring to FIG. 7, an electrode pad (bump ball) 413 of the composite chip 404 is connected to a via 414a of the lead 412. Then, the electrode pad 413 of the composite chip 404 and the via 414a of the lead 412 are connected so that the composite chip 404 and the lead 412 are electrically connected.

After connecting the composite chip 404 and the lead 412, an adhesive is applied to the adhesive attaching region 411 of the lead 412 and attached to the package 400.

In order to attach the lead 412 to which the composite chip 404 is attached to the package 400, a cavity is first created in a predetermined region on the package. Then, the lead 412 to which the composite chip 404 is attached is attached to the generated cavity area.

If the adhesive is attached to the package 400 and the lead 412 as described above, it is not necessary to manufacture a separate duplexer 405 and a filter, thereby reducing the manufacturing cost and advantageous in miniaturization. .

In addition, when the lead 412 and the chip 404 is bonded in the above manner, the package and the cavity for the composite module are formed to maintain the properties of the saw and enable hermetic sealing.

Since the electrode pad 413 in the composite chip 404 is connected to the electrode formed on the lead 412, the electrode pad 413 is connected to the electrode pad formed in the package 400 for the composite module by a wire bonding method, and thus the input / output and the outside of the PAM 402 are performed. Connection is possible with a terminal.

As described above, the composite module in which the lead 412 is attached to the package 400 is as shown in FIGS. 4A and 4B.

4A and 4B, the power amplification unit (PAM) 402 and the matching unit 408 are mounted on the upper surface of the package 400. At this time, since the power amplification unit 402 amplifies a small signal with high power in order to transmit a signal wirelessly through an antenna, it causes a lot of heat, and thus, a package for transmitting and dissipating heat to the ground plane. The via hole 410 is optimally produced inside and discharged to the bottom surface.

The transmission band pass filter 403 and the duplexer 404 are one-chip as shown in Figure 5 is attached to the lead 412 is mounted on the package 400.

The electrode 414 formed on the lead 412 and the electrode pad formed on the package 400 are connected by wire bonding.

According to another embodiment of the present invention, a matching element for a power amplifier such as a capacitor can be implemented inside a lead, which can also be connected to the power amplifier by wire bonding to improve performance and reduce the number of components to be mounted. Can be.

8A is a cross-sectional view of a molded upper surface of a package according to an exemplary embodiment of the present invention, and FIG. 8B is a view of a lower surface of a package according to an exemplary embodiment of the present invention.

Referring to FIG. 8A, a sealing process may be performed by molding or the like for protecting the components mounted on the package 400 formed as shown in FIG. 4A.

Then, the package of the composite module is completed.

8B, ground is formed on the bottom surface of the package.

In summary, the packaging method as described above increases the marginal area on which the power amplification unit and the peripheral circuits are seated, thereby increasing design freedom within the same area and reducing the cost by simultaneously manufacturing the power amplification unit, the duplexer, and the filter. It can work.

The present invention is not limited to the above embodiments, and many variations are possible by those skilled in the art within the spirit of the present invention.

As described above, according to the present invention, since the free area to which the PAM and the peripheral circuits are seated increases, not only the degree of freedom of design increases but also the PAM, the duplexer and the filter can be manufactured simultaneously, thereby achieving a cost reduction effect. The package for a module and its manufacturing method can be provided.

In addition, according to the present invention, the duplexer and the transmission band pass filter are simultaneously implemented on one and the same chip to be assembled on the back of the package, or a separate chip is fabricated and assembled on the back of the package at the same time to dramatically reduce material and process costs. The package for the composite module which can be obtained, and its manufacturing method can be provided.

1 is a block diagram showing a general CDMA composite module.

2 is a cross-sectional view of a conventional composite module.

Figure 3a is a view showing the top of a conventional composite module.

Figure 3b is a view showing the bottom of the conventional composite module.

Figure 4a is a cross-sectional view of a composite module according to an embodiment of the present invention.

Figure 4b is a view showing the top of the composite module according to an embodiment of the present invention.

5 is a view showing a one chip according to an embodiment of the present invention.

6a and 6b are views showing a lead according to an embodiment of the present invention,

7 is a view showing bonding of a chip and a lead according to an embodiment of the present invention.

8A is a cross-sectional view of a molded upper surface of a package according to an exemplary embodiment of the present invention.

8B illustrates a bottom view of a package according to one preferred embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100, 206, 403: transmission band pass filter 110, 208, 408: matching part

120, 202, 404: power amplifier 130, 204, 405: duplexer

410: beer hall 412: lead

Composite Chip: 404

Claims (12)

In the method of manufacturing a package of a composite module including a power amplifier, a duplexer, a transmission bandpass filter, a matching unit, a lead, Fabricating the duplexer and the transmit band pass filter into one chip; Attaching the manufactured composite chip to the lead; Attaching a lid to which the composite chip is attached by forming a cavity in an upper portion of the package; Mounting a matching part and a power amplifying part on the package; and Molding the package top surface Method for producing a package for a composite module comprising a. The method of claim 1, Electrode pad is present in the composite chip manufacturing method of a package for a composite module. The lead is a method for manufacturing a package for a composite module, characterized in that the electrode pad and the adhesive attachment region is present. The method according to claim 2 or 3, And the composite chip is attached to the lead by flip chip bonding between the electrode pad of the composite chip and the electrode pad of the lead. The method of claim 3, And attaching an adhesive to the adhesive attaching region of the lid and attaching the adhesive to the package. The method of claim 1, The power amplifier is a package manufacturing method for a composite module, characterized in that attached to the lead. The method of claim 1, The lead is a package manufacturing method for a composite module, characterized in that connected to the electrode pad in the package by wire bonding. The method of claim 1, And forming a via hole in the package to dissipate heat generated by the power amplifier. In the composite module including a power amplifier, a matching unit, a duplexer, a transmission band pass filter, a lead, A composite chip having the duplexer and the transmission band pass filter as one chip is mounted on the lead and attached to the cavity area of the package, and the power amplifier and the matching unit are mounted on the package upper surface. package. The method of claim 9, And connecting the electrode pad of the composite chip with the electrode pad of the lead to mount the composite chip on the lead. The method of claim 9, The electrode pad of the lead on which the composite chip is mounted is a package for a composite module, characterized in that connected to the electrode pad in the package by wire bonding. The method of claim 9, The power amplification unit package for a composite module, characterized in that mounted on the package by wire bonding.