KR20050098344A - Package for complex module and manufacture method - Google Patents

Abstract

The present invention provides a composite module including a PAM, a duplexer, a transmission bandpass filter, and a matching unit, wherein the PAM, transmission bandpass filter, and matching unit are mounted on an upper surface of a package, and a cavity is formed below the package to form the cavity area. Since the duplexer is mounted on the product, it is possible to miniaturize the product and increase the design margin, thereby achieving high performance.

Description

Package for complex module and manufacture method

The present invention relates to a package for a composite module capable of mounting parts on both sides of the package, and a manufacturing method thereof.

In the information age, the use of mobile communication devices using high frequency circuits such as home wireless telephones and mobile communication terminals is increasing rapidly. Therefore, the components used in the high frequency circuit are accompanied by a lot of difficulties in design to effectively prevent crosstalk of the frequency and suppress harmonics.

In general, in a recent mobile communication system, a system for simultaneously serving two types of communication having different frequency bands, for example, a PCS method of 1.8 GHz band, a CDMA method of 800 MHz band, or 1.8 to 1.9 in a mobile communication system A system that provides two or more types of communication among the GSM method of the GHz band and the GSM method of the 900 MHz band has emerged.

In general, wireless communication systems such as CDMA and PCS include an antenna and a transceiver module for transmitting data signals or receiving data signals transmitted from the outside.

The transceiver module includes a duplexer having a built-in saw filter and transmits a signal of a predetermined frequency to be transmitted to an antenna, or passes through a signal of a predetermined frequency to be applied to a receiving module in a communication system. The transmission module includes a power amplification unit for amplifying the transmission signal generated by the control of the communication system and amplifies the signal for transmission over a long distance.

Recently, a technology called low temperature co-fired ceramic (LTCC) has been developed to manufacture passive devices for high frequency communication.

LTCC is usually manufactured by making a board as a substrate and coating a metal on the circuit, but this method has difficulty in integration and miniaturization.

Therefore, when the LTCC is used, since it is a co-fire process technology in which a metal and its ceramic substrate are simultaneously made at low temperature, integration and miniaturization can be achieved.

Glass-based or mixed ceramic-based substrates can be pressed and fired to metal-clad substrates at around 800-1,000 ° C and are well suited for high-frequency passive device fabrication.

Hereinafter, a CDMA composite module using the LTCC technology will be described with reference to the accompanying drawings.

1 is a block diagram illustrating a general CDMA composite module.

Referring to FIG. 1, the CDMA composite module includes a transmission band pass filter 100, a matching unit 110, a power amplifier 120, and a duplexer 130.

That is, the CDMA composite module includes an antenna (not shown) for transmitting and receiving a high frequency signal applied from the outside and a signal generated therein, and a duplexer for filtering only a predetermined frequency to transmit and receive high frequency signals from the antenna (not shown). 130 and a power amplifying unit 120 for amplifying a high frequency signal generated in a communication system including the transmitting and receiving module to a level required in a cell service area.

2 is a view showing a cross section of a conventional composite module, Figure 3a is a view showing a top surface of a conventional composite module, Figure 3b is a view showing a bottom surface of a conventional composite module.

2 and 3A, the composite module 200 is implemented by mounting a PAM 202, a duplexer 204, a transmission band pass filter 206, and a matching unit 208 on one plane on a substrate.

The PAM 202 is mounted to the top surface of the package by die bonding or wire bonding.

The duplexer 204 and transmit band pass filter 206 are SMT on the top surface of the package.

The matching unit 208 is configured to form a stripline inside the SMT on the upper surface of the package, or if the capacity of the capacitor is very large, and can be configured as a pattern inside the package, thereby reducing the use area and the number of parts. You can get it.

The bottom of the composite module configured as described above is as shown in FIG.

Referring to FIG. 3B, ground is formed on the bottom of the composite module.

However, there is a problem in that the PAM, the duplexer, the transmission band pass filter, and the matching circuit are limited to the size of the bar, which is implemented by being mounted on one plane on the substrate.

In addition, due to the increase in the number of circuit components, additional costs are generated when mounting the PCB and the process time increases, there is a problem of generating the cost as much.

Therefore, an object of the present invention is to reduce the manufacturing cost due to the ease of manufacturing the composite module by mounting the parts on the upper and lower surfaces of the package, as well as to increase the area to dissipate heat generated in the PAM through the free space for mounting The present invention provides a package for a composite module and a method of manufacturing the same, which can not only improve performance but also reduce the size of a product.

Another object of the present invention is to implement the duplexer and the transmission band pass filter on the same chip at the same time to assemble on the back of the package, or to make a separate chip at the same time as the back of the package in the cavity to achieve a dramatic reduction in material and process costs The present invention provides a package for a composite module and a method of manufacturing the same.

According to an aspect of the present invention to achieve the above object, in the composite module including a PAM, duplexer, transmission bandpass filter, matching unit, the PAM, transmission bandpass filter, matching unit is mounted on the upper surface of the package, Cavity is formed in the lower portion of the package is provided a package for a composite module, characterized in that the duplexer is mounted in the cavity area.

The duplexer forms a cavity by processing a predetermined area under the package, and mounts the cavity in the package by wire bonding.

A via hole is formed in the package to dissipate heat generated in the PAM.

The matching part is formed in a pattern and is formed in a stripline form in the package.

A lid is mounted in the cavity area in which the duplexer is mounted.

According to another aspect of the present invention, in the method for manufacturing a composite module including a PAM, a duplexer, a transmission bandpass filter, a matching unit, forming a cavity by processing a lower portion of the package, and wire bonding to the formed cavity Mounting the duplexer, mounting a lead in the formed cavity region, mounting a PAM, a transmission band pass filter, a matching unit on the upper part of the package, and molding the package upper surface. A manufacturing method is provided.

The lead protects the duplexer and electrically grounds to release heat generated by the PAM.

A via hole is formed in the package to dissipate heat generated in the PAM.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 4a is a cross-sectional view of a composite module according to a preferred embodiment of the present invention, Figure 4b is a view showing a top surface of the composite module according to a preferred embodiment of the present invention, Figure 4c is a preferred embodiment of the present invention 5A is a cross-sectional view of a final composite module according to one preferred embodiment of the present invention, and FIG. 5B is a final composite according to one preferred embodiment of the present invention. The figure which shows the bottom of a module.

Referring to FIG. 4A, in the composite module, a saw filter 402, a PAM 404, and a matching unit 408 are mounted on an upper surface of a substrate, and a duplexer 406 is mounted below the substrate.

The PAM 404 is mounted to the top surface of the package 400 by die bonding or wire bonding. The PAM 404 essentially generates a large amount of heat because it amplifies a small signal with high power in order to transmit a signal wirelessly through an antenna, and generates a lot of heat, and a via hole 410 inside the package to transmit and dissipate heat to the ground plane. ) And release to the bottom.

The duplexer 406 processes a predetermined area under the substrate to generate a cavity, and is then mounted in the cavity. The duplexer 406 is mounted in the cavity by wire bonding.

The saw filter 402 is SMT.

The matching unit 408 is SMT on the upper surface of the package 400 or if the capacity value of the capacitor is very large, if possible to form a pattern inside the package by forming a stripline shape inside to reduce the use area and the number of parts Can be reduced.

An upper surface of the composite module in which the saw filter 402, the PAM 404, and the matching unit 408 are mounted on the upper surface of the package 400 is illustrated in FIG. 4B.

Referring to FIG. 4B, a saw filter 402, a PAM 404, and a matching unit 408 exist on an upper surface of the package. At this time, the saw filter 402 is mounted on the upper surface by die bonding or wire bonding, the matching unit 404 and the saw filter 408 is SMT.

A bottom surface of the composite module in which the duplexer 406 is mounted in the cavity under the package is shown in FIG. 4C.

Referring to FIG. 4C, a cavity is present at a bottom surface of the package, and a duplexer 406 is connected to the package by wire bonding.

In order to protect the mounted duplexer 406, the lid 412 is mounted in the cavity area. Here, the lead 412 may be a conductor. The leads 412 are electrically grounded to improve electrical performance and act as a heat sink to dissipate the heat generated by the PAM 404.

The bottom surface of the composite module on which the lead 412 is mounted is shown in FIG. 5B.

When the lead 412 is mounted on the composite module, sealing or molding is performed with a metal cap or epoxy to finally protect the components mounted on the upper surface of the package 400. Then, as shown in Figure 5a.

The matching part 408, the PAM 404, and the saw filter 402 mounted on the upper surface of the substrate are protected by the metal cap 420 formed by the molding.

When the package structure, the duplexer, and the combined chip process of the filter are used, an additional space may be additionally disposed because the free space is extended, thereby achieving stabilization of performance.

The present invention is not limited to the above embodiments, and many variations are possible by those skilled in the art within the spirit of the present invention.

As described above, according to the present invention, when the composite module in the package form is used, both surfaces are used, thereby miniaturizing the product and increasing the design margin. Can be provided.

In addition, according to the present invention, since the heat dissipation electrode pad can be additionally inserted into the free area of the upper and lower portions of the package, it is possible to provide a package for a composite module and a method for producing the composite module which can obtain thermal stability due to favorable heat dissipation.

1 is a block diagram showing a general CDMA composite module.

2 is a cross-sectional view of a conventional composite module.

Figure 3a is a view showing the top of a conventional composite module.

Figure 3b is a view showing the bottom of the conventional composite module.

Figure 4a is a cross-sectional view of a composite module according to an embodiment of the present invention.

Figure 4b is a view showing the top of the composite module according to an embodiment of the present invention.

4C is a view of the bottom surface of the composite module before brazing the lid in accordance with one preferred embodiment of the present invention.

Figure 5a is a cross-sectional view of the final composite module according to an embodiment of the present invention.

Figure 5b is a view showing the bottom of the final composite module according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100, 206, 402: transmission band pass filter 110, 208, 408: matching part

120, 202, 404: power amplifier 130, 204, 406: duplexer

410: beer hall 412: lead

Claims (9)

In the composite module including a PAM, a duplexer, a transmission bandpass filter, a matching unit, The package of claim 1, wherein the PAM, a transmission band pass filter, and a matching unit are mounted on an upper surface of the package, and a cavity is formed below the package so that the duplexer is mounted in the cavity area. The method of claim 1, The duplexer forms a cavity by processing a predetermined area of the lower portion of the package, and the package for a composite module, characterized in that mounted in the formed cavity. The method according to claim 1 or 2, The duplexer package for a composite module, characterized in that mounted to the package by wire bonding. The method of claim 1, A package for a composite module, characterized in that a via hole is formed in the package to dissipate heat generated from the PAM. The method of claim 1, The matching unit is a package for a composite module, characterized in that formed in a pattern formed in a stripline form inside the package. The method of claim 1, And a lid is mounted in the cavity area in which the duplexer is mounted. In the method for manufacturing a composite module including a PAM, a duplexer, a transmission bandpass filter, a matching unit, Processing a lower predetermined area of the package to form a cavity; Mounting the duplexer to the formed cavity using wire bonding; Mounting a lead in the formed cavity region; Mounting a PAM, a transmission band pass filter, and a matching unit on the package; Molding the package upper surface Package manufacturing method for a composite module comprising a. The method of claim 7, wherein And said lid protects said duplexer and electrically forms a ground to dissipate heat generated in said PAM. The method of claim 7, wherein Forming a via hole in the package to dissipate the heat generated in the PAM package manufacturing method for a composite module.