TWI389274B - Electronic apparatus - Google Patents
Electronic apparatus Download PDFInfo
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- TWI389274B TWI389274B TW95137079A TW95137079A TWI389274B TW I389274 B TWI389274 B TW I389274B TW 95137079 A TW95137079 A TW 95137079A TW 95137079 A TW95137079 A TW 95137079A TW I389274 B TWI389274 B TW I389274B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
本發明是有關於一種電子裝置，且特別是有關於一種體積較小且元件配置密度較高的電子裝置。The present invention relates to an electronic device, and more particularly to an electronic device having a small volume and a high component placement density.
為了因應電子產品輕薄短小、高頻化、模組化與多功能的趨勢，電子元組件相對地被要求整合性與積集度(integration)提高。因此，新世代高頻寬頻材料與元件技術將是未來技術關鍵。透過新構裝(package)材料的突破、新製程的開發及設計技術的整合，現今已達成系統化模組構裝(system in package，SIP)的層次。此外，進一步開發高頻晶片元件、整合型被動元件(integrated passice device，IPD)、微機電系統(micro－electro－mechanical system，MEMS)及奈米材料技術，以建立整合型模組技術並提昇高頻寬頻產品效能將是位來值得努力的方向。In response to the trend of thin, high-frequency, modular, and versatile electronic products, electronic components are relatively required to be integrated and integrated. Therefore, the new generation of high frequency broadband materials and component technology will be the key to future technology. Through the breakthrough of new package materials, the development of new processes and the integration of design techniques, a system in package (SIP) hierarchy has been achieved today. In addition, further development of high-frequency chip components, integrated passive devices (IPD), micro-electro-mechanical systems (MEMS) and nanomaterial technology to establish integrated module technology and improve high Bandwidth product performance will be a worthwhile direction.
請參考圖1，其繪示習知之一種電子裝置的立體示意圖。習知電子裝置100包括一基板(substrate)110、一基頻元件(base－band component，BB component)120、多個被動元件(passive device)130、一射頻元件(radio－frequency component，RF component)140、一天線(antenna)150與一通用串列匯流排埠(universal serial bus port，USB port)160。基頻元件120、這些被動元件130與射頻元件140皆是藉由表面黏著技術(surface mounting technology，SMT)而配置且電性連接於基板110上。習知電子裝置100可藉由天線150而與外界其他電子裝置(未繪示)進行無線通訊(wireless communication)。Please refer to FIG. 1 , which is a perspective view of a conventional electronic device. The conventional electronic device 100 includes a substrate 110, a base-band component (BB component) 120, a plurality of passive devices 130, and a radio-frequency component (RF component). 140, an antenna 150 and a universal serial bus port (USB port) 160. The baseband component 120, the passive component 130 and the RF component 140 are all configured by surface mounting technology (SMT) and electrically connected to the substrate 110. The conventional electronic device 100 can wirelessly communicate with other electronic devices (not shown) through the antenna 150.
然而，由於藉由表面黏著技術而配置於基板110上的基頻元件120、這些被動元件130與射頻元件140所需的接合面積(connection area)較大，通用串列匯流排埠150的成本較為昂貴且需固定規格的低電壓來驅動，並且這些被動元件130必須分別配置於基板110上以致於其製程較為繁瑣，因此習知電子元件100有其改進之必要。However, since the baseband component 120 disposed on the substrate 110 by the surface adhesion technology, the connection area required for the passive component 130 and the RF component 140 is large, the cost of the universal serial busbar 150 is relatively high. It is expensive and requires a fixed voltage of a low voltage to drive, and these passive components 130 must be disposed on the substrate 110, respectively, so that the process thereof is cumbersome, so that the conventional electronic component 100 has its necessity for improvement.
本發明之目的是提供一種電子裝置，其體積較小且其內部元件配置密度較高。It is an object of the present invention to provide an electronic device that is small in size and has a high internal component density.
為達上述或是其他目的，本發明提出一種電子裝置，其包括一基板、一基頻元件與一電子組裝體(electronic assembly)。基板具有彼此相對的一第一表面與一第二表面。基頻元件配置於第一表面且電性連接至基板。電子組裝體包括一整合型被動元件與一射頻元件。整合型被動元件配置於第二表面且電性連接至基板，而射頻元件配置於整合型被動元件上且電性連接至整合型被動元件。To achieve the above or other objects, the present invention provides an electronic device including a substrate, a baseband component, and an electronic assembly. The substrate has a first surface and a second surface opposite to each other. The baseband component is disposed on the first surface and electrically connected to the substrate. The electronic assembly includes an integrated passive component and a radio frequency component. The integrated passive component is disposed on the second surface and electrically connected to the substrate, and the RF component is disposed on the integrated passive component and electrically connected to the integrated passive component.
為達上述或是其他目的，本發明提出一種電子裝置，其包括一第一基板、一基頻元件、一射頻模組(RF module)以及至少一第一電性連接組件(electrical connection member)。其中基頻元件電性連接至第一基板上，而射頻模組經由這些第一電性連接組件而電性連接至第一基板。To achieve the above or other objects, the present invention provides an electronic device including a first substrate, a baseband component, an RF module, and at least one first electrical connection member. The baseband component is electrically connected to the first substrate, and the RF module is electrically connected to the first substrate via the first electrical connection components.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。The above and other objects, features and advantages of the present invention will become more <RTIgt;
請參考圖2A，其繪示本發明第一實施例之一種電子裝置的側視示意圖。第一實施例之電子裝置200包括一基板210、一基頻元件220與一電子組裝體230。基板210具有彼此相對的一第一表面212與一第二表面214。基頻元件220配置於第一表面212且電性連接至基板210。電子組裝體230包括一整合型被動元件232與一射頻元件234。整合型被動元件232配置於第二表面214且電性連接至基板210，而射頻元件234配置於整合型被動元件232上且電性連接至整合型被動元件232。此外，電子裝置200更包括一天線240，其電性連接至基板210或整合型被動元件232。Please refer to FIG. 2A, which is a side view of an electronic device according to a first embodiment of the present invention. The electronic device 200 of the first embodiment includes a substrate 210, a baseband component 220, and an electronic assembly 230. The substrate 210 has a first surface 212 and a second surface 214 opposite to each other. The baseband component 220 is disposed on the first surface 212 and electrically connected to the substrate 210. The electronic assembly 230 includes an integrated passive component 232 and a radio frequency component 234. The integrated passive component 232 is disposed on the second surface 214 and electrically connected to the substrate 210 , and the RF component 234 is disposed on the integrated passive component 232 and electrically connected to the integrated passive component 232 . In addition, the electronic device 200 further includes an antenna 240 electrically connected to the substrate 210 or the integrated passive component 232.
在此必須說明的是，基板210與基頻元件220構成(compose)一基頻模組，而由整合型被動元件232與射頻元件234所構成的電子組裝體230可視為一射頻模組。所謂整合型被動元件232是由數個被動元件(未繪示)整合成一個單獨功能的電子元件。電子裝置200的基本運作方式為，當天線240接收高頻訊號時，高頻訊號的某一頻帶訊號(band signal)經由整合型被動元件232的擷取與阻抗匹配(matching)後而傳輸給射頻元件234的低雜訊放大器(low noise amplifier，LNA)(未繪示)，之後再將此頻帶訊號傳輸給基頻元件220作進一步的訊號處理。反之，基頻元件220亦可將訊號傳輸給射頻元件234的功率放大器(power amplifier，PA)(未繪示)，之後所傳輸的訊號經由整合型被動元件232的阻抗匹配與過濾(filter)後而經由天線240傳輸出去。It should be noted that the substrate 210 and the baseband component 220 constitute a baseband module, and the electronic component 230 formed by the integrated passive component 232 and the RF component 234 can be regarded as a radio frequency module. The integrated passive component 232 is an electronic component that is integrated into a single function by a plurality of passive components (not shown). The basic operation mode of the electronic device 200 is that when the antenna 240 receives the high frequency signal, a certain band signal of the high frequency signal is transmitted to the radio frequency through the matching and impedance matching of the integrated passive component 232. A low noise amplifier (LNA) of component 234 (not shown) is then transmitted to baseband component 220 for further signal processing. On the contrary, the baseband component 220 can also transmit a signal to a power amplifier (PA) of the RF component 234 (not shown), and then the signal transmitted after the impedance matching and filtering of the integrated passive component 232 is performed. And transmitted through the antenna 240.
在第一實施例中，天線240可為晶片天線(chip antenna)，其可配置於整合型被動元件232上，但亦可配置於基板210上。必須說明的是，天線240亦可為F型線路天線(F－shaped circuit antenna)，其可由基板210或整合型被動元件232的某一線路層(wiring layer)(未繪示)的F型線路圖案(wiring pattern)所構成。不論天線240為晶片天線或F型線路天線，其即為一種內建式(built－in)天線。In the first embodiment, the antenna 240 may be a chip antenna, which may be disposed on the integrated passive component 232, but may also be disposed on the substrate 210. It should be noted that the antenna 240 may also be an F-shaped circuit antenna, which may be an F-type line of a wiring layer (not shown) of the substrate 210 or the integrated passive component 232. It is composed of a wiring pattern. Regardless of whether the antenna 240 is a wafer antenna or an F-type line antenna, it is a built-in antenna.
在第一實施例中，電子裝置200更包括一天線連接器(antenna connector)252、另一天線254與一膠體(encapsulant)260。天線連接器252設置於基板210上，但亦可設置於整合型被動元件232上。天線254為外接式天線，其可拆卸式地插入且固定於天線連接器252內並且電性連接天線連接器252。天線254與天線連接器252構成一通訊組件(communication component)250，且膠體260至少包覆電子組裝體230與基板210之部分第二表面214以暴露出天線連接器252。當電子裝置200之天線連接器252被插入外接式(external)天線254時，上述內建式天線240的功能可由外接式天線254所取代，以加強電子裝置200的傳輸與接收訊號的功能。當然，設計者亦可將兩種天線240、254設計為同時啟動，以達成多工的(multifunctional)傳輸與接收訊號的需求。In the first embodiment, the electronic device 200 further includes an antenna connector 252, another antenna 254, and an encapsulant 260. The antenna connector 252 is disposed on the substrate 210, but may be disposed on the integrated passive component 232. The antenna 254 is an external antenna that is detachably inserted and fixed in the antenna connector 252 and electrically connected to the antenna connector 252. The antenna 254 and the antenna connector 252 form a communication component 250, and the colloid 260 covers at least a portion of the second surface 214 of the electronic assembly 230 and the substrate 210 to expose the antenna connector 252. When the antenna connector 252 of the electronic device 200 is inserted into the external antenna 254, the function of the built-in antenna 240 can be replaced by the external antenna 254 to enhance the function of transmitting and receiving signals of the electronic device 200. Of course, the designer can also design both antennas 240, 254 to be activated simultaneously to achieve the need for multi-functional transmission and reception signals.
圖2B繪示本發明第一實施例之另一種電子裝置的側視示意圖。請參考圖2A與圖2B，在此必須強調的是，設計者亦可將電子裝置200’設計成不具有天線240與通訊組件250。因此，電子裝置200’的體積將可更小，且當電子裝置200’之基板210’電性連接至下一層級的電子裝置(未繪示)時，電子裝置200’可以下一層級之電子裝置上的其他天線作為傳輸與接收訊號的媒介。2B is a side view showing another electronic device according to the first embodiment of the present invention. Referring to FIG. 2A and FIG. 2B, it must be emphasized here that the designer can also design the electronic device 200' to have no antenna 240 and communication component 250. Therefore, the volume of the electronic device 200' can be smaller, and when the substrate 210' of the electronic device 200' is electrically connected to the electronic device (not shown) of the next level, the electronic device 200' can be the next level of the electronic device. The other antennas on the device act as a medium for transmitting and receiving signals.
請參考圖2A，第一實施例之電子裝置200更包括至少一被動元件(passive device)270與一記憶體元件(memory device)280。記憶體元件280可配置於基板210的第一表面212上，被動元件270則可配置於基板210的第二表面上214，且兩者皆電性連接至基板210。進言之，由圖2A的相對位置可知，記憶體元件280和基頻元件220可配置於基板210的一側上，而被動元件270、電子組裝體230(射頻模組)和通訊組件250可配置於基板210的另一側上。此外，基板210可具有至少一埋入式電子元件(embedded electronic element)216，其可為主動元件(active element)或被動元件(passive element)。在此必須說明的是，若設計者對於被動元件的數量要求增加但卻無法順利將此被動元件整合(integrate)至整合型被動元件232時，設計者可於基板210上配置上述被動元件270，或者可於基板210內部配置例如為被動元件的埋入式電子元件216以滿足其設計需求。另外，被動元件270亦可配置於整合型被動元件232上，端視設計者的需求而定，但是並未以圖面繪示。Referring to FIG. 2A , the electronic device 200 of the first embodiment further includes at least one passive device 270 and a memory device 280 . The memory component 280 can be disposed on the first surface 212 of the substrate 210, and the passive component 270 can be disposed on the second surface 214 of the substrate 210, and both are electrically connected to the substrate 210. In other words, from the relative position of FIG. 2A, the memory component 280 and the baseband component 220 can be disposed on one side of the substrate 210, and the passive component 270, the electronic assembly 230 (radio frequency module), and the communication component 250 can be configured. On the other side of the substrate 210. Additionally, substrate 210 can have at least one embedded electronic element 216, which can be an active element or a passive element. It should be noted that if the designer increases the number of passive components but cannot integrate the passive components into the integrated passive component 232, the designer can configure the passive component 270 on the substrate 210. Alternatively, a buried electronic component 216, such as a passive component, can be placed inside the substrate 210 to meet its design requirements. In addition, the passive component 270 can also be disposed on the integrated passive component 232, depending on the needs of the designer, but is not shown in the drawings.
請再參考圖2A，電子裝置200更包括多個電性連接組件292、多個電性連接組件294、多個電性連接組件296與多個電性連接組件298。基頻元件220藉由這些電性連接組件292電性連接至基板210，且整合型被動元件232藉由這些電性連接組件294電性連接至基板210。射頻元件234藉由這些電性連接組件296電性連接至整合型被動元件232，且基板210藉由這些電性連接組件298電性連接至下一層級的電子裝置(未繪示)。本實施例中，電性連接組件292可為焊接線(bonding wire)，亦即基頻元件220與基板210之間是藉由打線接合技術(wire bonding technology)而彼此電性連接，且電性連接組件294可為焊球(solder ball)，其材料可為錫、鉛或錫鉛合金。此外，電性連接組件296可為凸塊(bump)，其材料可為錫、鉛或錫鉛合金，亦即射頻元件234與整合型被動元件232之間是藉由覆晶接合技術(flip chip bonding technology)而彼此電性連接，而電性連接組件298可為焊球。就圖2A所繪示的相對位置而言，射頻元件234位於整合型被動元件232與基板210之間。Referring to FIG. 2A , the electronic device 200 further includes a plurality of electrical connection components 292 , a plurality of electrical connection components 294 , a plurality of electrical connection components 296 , and a plurality of electrical connection components 298 . The baseband component 220 is electrically connected to the substrate 210 by the electrical connection component 292, and the integrated passive component 232 is electrically connected to the substrate 210 by the electrical connection component 294. The RF component 234 is electrically connected to the integrated passive component 232 by the electrical connection component 296, and the substrate 210 is electrically connected to the next level of electronic devices (not shown) by the electrical connection component 298. In this embodiment, the electrical connection component 292 can be a bonding wire, that is, the groundband component 220 and the substrate 210 are electrically connected to each other by wire bonding technology, and the electrical property is electrically connected. The connection component 294 can be a solder ball, the material of which can be tin, lead or tin-lead alloy. In addition, the electrical connection component 296 can be a bump, the material of which can be tin, lead or tin-lead alloy, that is, between the radio frequency component 234 and the integrated passive component 232 by flip chip bonding technology (flip chip) The bonding technology is electrically connected to each other, and the electrical connection component 298 can be a solder ball. In terms of the relative position depicted in FIG. 2A, the RF component 234 is located between the integrated passive component 232 and the substrate 210.
必須說明的是，射頻元件234與整合型被動元件232之間可藉由表面黏著技術(surface mounting technology)而彼此電性連接，亦即兩者之間是藉由錫膏(solder paste)(未繪示)而彼此電性連接。此外，基頻元件220亦可藉由表面黏著技術而電性連接至基板210，但是並未以圖面繪示。It should be noted that the RF component 234 and the integrated passive component 232 can be electrically connected to each other by surface mounting technology, that is, by solder paste (not They are electrically connected to each other. In addition, the baseband component 220 can also be electrically connected to the substrate 210 by a surface adhesion technique, but is not shown in the drawings.
請參考圖3，其繪示本發明第二實施例之一種電子裝置的側視示意圖。第二實施例之電子裝置300與第一實施例之電子裝置200的主要不同之處在於，電性連接基頻元件320與基板310的這些電性連接組件392可為凸塊。Please refer to FIG. 3, which is a side view of an electronic device according to a second embodiment of the present invention. The main difference between the electronic device 300 of the second embodiment and the electronic device 200 of the first embodiment is that the electrical connection components 392 electrically connected to the baseband component 320 and the substrate 310 can be bumps.
請參考圖4與圖5，其分別繪示本發明第三實施例之一種電子裝置的側視示意圖與本發明第四實施例之一種電子裝置的側視示意圖。第三實施例之電子裝置400與上述實施例之電子裝置200、300的主要不同之處在於，電性連接整合型被動元件432與基板410的這些電性連接組件494可為凸塊，且外接式天線454與天線連接器452可配置於整合型被動元件432上，而內建式天線440可配置於基板410上。此外，就圖3所繪示的相對位置而言，整合型被動元件432是位於射頻元件434與基板410之間。另外，第四實施例之電子裝置500與第三實施例之電子裝置400的主要不同之處是和第二實施例之電子裝置300與第一實施例之電子裝置200的主要不同之處相似，故於此不再贅述。Please refer to FIG. 4 and FIG. 5 , which are respectively side views of an electronic device according to a third embodiment of the present invention and a side view of an electronic device according to a fourth embodiment of the present invention. The main difference between the electronic device 400 of the third embodiment and the electronic device 200, 300 of the above embodiment is that the electrical connection components 494 electrically connecting the integrated passive component 432 and the substrate 410 can be bumps and externally connected. The antenna 454 and the antenna connector 452 can be disposed on the integrated passive component 432, and the built-in antenna 440 can be disposed on the substrate 410. Moreover, with respect to the relative position depicted in FIG. 3, the integrated passive component 432 is located between the RF component 434 and the substrate 410. In addition, the main difference between the electronic device 500 of the fourth embodiment and the electronic device 400 of the third embodiment is that the main difference between the electronic device 300 of the second embodiment and the electronic device 200 of the first embodiment is similar. Therefore, it will not be repeated here.
請參考圖6與圖7，其分別繪示本發明第五實施例之一種電子裝置的側視示意圖與本發明第六實施例之一種電子裝置的側視示意圖。第五實施例之電子裝置600與上述實施例之電子裝置400、500的主要不同之處在於，電性連接射頻元件634與整合型被動元件632的這些電性連接組件696可為焊接線。此外，第六實施例之電子裝置700與第五實施例之電子裝置600的主要不同之處是和第四實施例之電子裝置500與第三實施例之電子裝置400的主要不同之處相似，故於此不再贅述。Please refer to FIG. 6 and FIG. 7 , which are respectively side views of an electronic device according to a fifth embodiment of the present invention and a side view of an electronic device according to a sixth embodiment of the present invention. The main difference between the electronic device 600 of the fifth embodiment and the electronic devices 400 and 500 of the above embodiment is that the electrical connection components 696 electrically connecting the radio frequency component 634 and the integrated passive component 632 can be solder wires. In addition, the main difference between the electronic device 700 of the sixth embodiment and the electronic device 600 of the fifth embodiment is similar to the main difference between the electronic device 500 of the fourth embodiment and the electronic device 400 of the third embodiment. Therefore, it will not be repeated here.
應注意的是，在前述的實施例中，整合型被動元件即將數個主動元件和數個被動元件，整合至一基板上，再利用被動元件生產技術，製造出具有特定功能之整合元件模組。除此，整合型被動元件亦可僅有至少一個被動元件，而無主動元件。整合型被動元件內亦可設置主動或被動元件以外的元件。進一步，製作整合型被動元件的方式至少包括低溫陶瓷共燒製程(Low Temperature Co－Fired Ceramics，LTCC)、薄膜技術(Thin Film Technology)、內嵌式製程(Embedded Passives)等等技術。It should be noted that in the foregoing embodiments, the integrated passive component integrates several active components and several passive components onto one substrate, and then uses passive component production technology to manufacture an integrated component module with specific functions. . In addition, the integrated passive component may have only at least one passive component and no active component. Components other than active or passive components can also be placed in the integrated passive component. Further, the method for fabricating the integrated passive component includes at least a technique of Low Temperature Co-Fired Ceramics (LTCC), Thin Film Technology, Embedded Passives, and the like.
綜上所述，本發明之電子裝置至少具有以下優點：一、由於本發明之電子裝置的這些元件可藉由表面黏著技術以外的電性連接技術而彼此接合，所以本發明之電子裝置的這些元件所需接合的面積較小，因此本發明之電子裝置的體積較小且元件配置密度可較高。In summary, the electronic device of the present invention has at least the following advantages: 1. Since the components of the electronic device of the present invention can be bonded to each other by electrical connection techniques other than surface bonding techniques, these electronic devices of the present invention The area required for bonding of the elements is small, and thus the electronic device of the present invention is small in size and high in component arrangement density.
二、由於本發明之電子裝置可藉由焊球而非通用串列匯流排埠而電性連接至下一層級的電子裝置，因此本發明之電子裝置所需的驅動電壓較為彈性且成本較低。2. Since the electronic device of the present invention can be electrically connected to the electronic device of the next level by solder balls instead of the universal serial bus bar, the driving voltage required by the electronic device of the present invention is relatively flexible and low in cost. .
三、由於本發明之電子裝置採用整合型被動元件，因此本發明之電子裝置所需組裝的元件數目可較少，且製造時間較短。3. Since the electronic device of the present invention employs an integrated passive component, the electronic device of the present invention requires fewer components to be assembled and has a shorter manufacturing time.
四、由於本發明之電子裝置可具有至少兩種天線，因此本發明之電子裝置具有更多的功能選擇性。4. Since the electronic device of the present invention can have at least two types of antennas, the electronic device of the present invention has more functional selectivity.
雖然本發明已以較佳實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.
100、200、200’、300、400、500、600、700．．．電子裝置100, 200, 200', 300, 400, 500, 600, 700. . . Electronic device
110、210、210’、310、410．．．基板110, 210, 210', 310, 410. . . Substrate
120、220、320．．．基頻元件120, 220, 320. . . Baseband component
130、270．．．被動元件130, 270. . . Passive component
140、234、434、634．．．射頻元件140, 234, 434, 634. . . Radio frequency component
150、240、254、440、454．．．天線150, 240, 254, 440, 454. . . antenna
160．．．通用串列匯流排埠160. . . Universal serial bus
212、214．．．表面212, 214. . . surface
216．．．埋入式電子元件216. . . Buried electronic component
230．．．電子組裝體230. . . Electronic assembly
232、432、632．．．整合型被動元件232, 432, 632. . . Integrated passive component
250．．．通訊組件250. . . Communication component
252、452．．．天線連接器252, 452. . . Antenna connector
260．．．膠體260. . . colloid
280．．．記憶體元件280. . . Memory component
292、294、296、298、392、494、696．．．電性連接組件292, 294, 296, 298, 392, 494, 696. . . Electrical connection component
圖1繪示習知之一種電子裝置的立體示意圖。FIG. 1 is a schematic perspective view of a conventional electronic device.
圖2A繪示本發明第一實施例之一種電子裝置的側視示意圖。2A is a side elevational view of an electronic device according to a first embodiment of the present invention.
圖2B繪示本發明第一實施例之另一種電子裝置的側視示意圖。2B is a side view showing another electronic device according to the first embodiment of the present invention.
圖3繪示本發明第二實施例之一種電子裝置的側視示意圖。3 is a side elevational view of an electronic device according to a second embodiment of the present invention.
圖4繪示本發明第三實施例之一種電子裝置的側視示意圖。4 is a side view showing an electronic device according to a third embodiment of the present invention.
圖5繪示本發明第四實施例之一種電子裝置的側視示意圖。FIG. 5 is a schematic side view of an electronic device according to a fourth embodiment of the present invention.
圖6繪示本發明第五實施例之一種電子裝置的側視示意圖。6 is a side view showing an electronic device according to a fifth embodiment of the present invention.
圖7繪示本發明第六實施例之一種電子裝置的側視示意圖。FIG. 7 is a side elevational view of an electronic device according to a sixth embodiment of the present invention.
200．．．電子裝置200. . . Electronic device
210．．．基板210. . . Substrate
212、214．．．表面212, 214. . . surface
216．．．埋入式電子元件216. . . Buried electronic component
220．．．基頻元件220. . . Baseband component
230．．．電子組裝體230. . . Electronic assembly
232．．．整合型被動元件232. . . Integrated passive component
234．．．射頻元件234. . . Radio frequency component
240、254．．．天線240, 254. . . antenna
250．．．通訊組件250. . . Communication component
252．．．天線連接器252. . . Antenna connector
260．．．膠體260. . . colloid
270．．．被動元件270. . . Passive component
280．．．記憶體元件280. . . Memory component
292、294、296、298．．．電性連接組件292, 294, 296, 298. . . Electrical connection component
Claims (34)
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