KR100823476B1 - Plasma display device - Google Patents

Abstract

The present invention relates to a plasma display device for improving heat dissipation performance of a heat sink. The plasma display device according to an embodiment of the present invention includes a plasma display panel, a chassis base on which the plasma display panel is supported, and a plasma of the chassis base. A circuit board assembly mounted on an opposite side of the display panel, wherein circuit elements for driving the plasma display panel are provided on a printed circuit board, and a heat sink provided on one side of the circuit element and coupled to the printed circuit board, The heat sink includes a heat sink in contact with the circuit element, and a plurality of heat sink fins extending in a direction perpendicular to the heat sink, wherein at least some of the heat sink fins are connected to the heat sink along a length direction of the heat sink fins. Vertically cropped The surface area measured along the longitudinal direction of the heat radiation fin is formed larger than the cross-sectional area.

Heat sink, heat dissipation, efficiency, surface area

Description

Plasma display device {PLASMA DISPLAY DEVICE}

1 is a perspective view schematically showing a plasma display device according to a first embodiment of the present invention.

FIG. 2 is a perspective view separately showing a heat sink and a circuit element of the circuit board assembly shown in FIG. 1.

3 is a cross-sectional view taken along line III-III of FIG. 2.

4 is a front view of a heat sink according to a first embodiment of the present invention.

5 is a cross-sectional view of a heat sink according to a second embodiment of the present invention.

The present invention relates to a plasma display device, and more particularly, to a plasma display device for improving heat dissipation performance of a heat sink.

In general, a plasma display device is a device that displays an image on a plasma display panel (PDP) using plasma generated by gas discharge.

The plasma display device includes a plasma display panel, a chassis base on which the plasma display device is supported, and a circuit board assembly mounted on an opposite side of the plasma display panel of the chassis base.

In the plasma display panel, two glass substrates are attached face to face. And a discharge space is formed between two glass substrates mutually arrange | positioned, and gas discharge will generate | occur | produce. In addition, since heat is generated when the plasma display panel is driven, a heat conductive sheet is provided on the rear surface of the plasma display panel to dissipate the heat. The thermally conductive sheet quickly conducts and diffuses heat generated in the plasma display panel in the planar direction.

The chassis base may be formed of a metal material having strong mechanical rigidity to support the plasma display panel. In addition, a double-sided tape is interposed between the chassis base and the plasma display panel so that the chassis base and the plasma display panel are attached to each other.

The circuit board assembly is mounted via a set screw opposite the plasma display panel of the chassis base. That is, a plurality of bosses are formed on the opposite side of the chassis base of the plasma display panel, and the circuit board assembly is mounted to the boss through a set screw. In addition, the circuit board assembly is electrically connected to electrodes located inside the plasma display panel through a flexible printed circuit (FPC) and a connector.

The circuit board assembly is formed by coupling various types of circuit elements for driving a plasma display panel to a printed circuit board. Among these circuit elements, in a circuit element such as a field effect transistor (FET) or an insulated gate bipolar transistor (IGBT), high heat is generated during driving of the plasma display panel.

Therefore, a heat sink is provided on one side of the circuit element to dissipate the circuit element. That is, the heat sink is in contact with the flow of flowing air, and performs a function of releasing heat generated from the circuit elements into the atmosphere. Therefore, the larger the size of the heat sink, the more the heat dissipation performance of the heat sink can be improved. However, since the size of the printed circuit board on which the heat sink is mounted is limited, the size of the heat sink is also limited. Therefore, in the case of switching elements such as FETs or IGBTs that emit high heat while repeating on / off at a very high speed when driving a plasma display panel, a heat sink having improved heat dissipation performance in a limited space of a printed circuit board is required. do.

SUMMARY OF THE INVENTION An object of the present invention is to provide a plasma display device capable of improving the heat dissipation performance by increasing the surface area of a heat sink.

In order to achieve the above object, a plasma display device according to an embodiment of the present invention, the plasma display panel, the chassis base on which the plasma display panel is supported, the chassis base is mounted on the opposite side of the plasma display panel, the plasma display panel A circuit board assembly having circuit elements for driving the circuit board, the heat sink being provided on one side of the circuit element and coupled to the printed circuit board, wherein the heat sink is in contact with the circuit element. And a plurality of heat dissipation fins extending in a direction perpendicular to the heat dissipation plate,

At least some of the heat dissipation fins of the plurality of heat dissipation fins have a larger surface area measured along the length direction of the heat dissipation fins than the cross-sectional area cut perpendicular to the heat dissipation fins along the longitudinal direction of the heat dissipation fins.

A protrusion may be formed on a surface of the heat dissipation fin, and the surface of the heat dissipation fin may include a first surface and a second surface that are formed parallel to each other, and the protrusion may be formed on the second surface.

The cross section of the protrusion may be formed in a triangle or arc shape.

The protrusion may be formed along the longitudinal direction of the heat dissipation fin.

The heat dissipation fin may include a first heat dissipation fin extending in a first direction away from the circuit element, and a length measured in a direction perpendicular to the heat dissipation plate while extending in parallel with the first heat dissipation fin in the first direction. The second heat dissipation fin may be longer than the heat dissipation fin, and a third heat dissipation fin extending in a second direction opposite to the first direction at a position corresponding to the first heat dissipation fin.

In this case, the second heat dissipation fin is located closer to the printed circuit board than the first heat dissipation fin, and the maximum height of the second heat dissipation fin measured in the direction perpendicular to the printed circuit board is the direction perpendicular to the printed circuit board. It may be equal to the maximum height of the circuit element measured as.

The circuit device may include a FET or an IGBT.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like elements throughout the specification.

1 is a perspective view schematically showing a plasma display device according to a first embodiment of the present invention.

Referring to FIG. 1, a plasma display apparatus includes a plasma display panel 10 displaying an image using gas discharge, a chassis base 20 on which the plasma display panel 10 is supported, and a plasma display of the chassis base 20. A plurality of circuit board assemblies 22 are mounted opposite the panel 10.

The plasma display panel 10 has a structure in which the front substrate 11 and the rear substrate 12 are disposed to face each other. Discharge spaces divided into a plurality of partitions are formed between the front substrate 11 and the rear substrate 12, and address electrodes and display electrodes (pairs of sustain electrodes and scan electrodes formed to cross each other in the discharge space) are formed. The gas discharge occurs between). And, by such gas discharge, visible light is emitted from the discharge space toward the front substrate 11 to display an image.

The chassis base 20 is mounted on the rear substrate 12 side of the plasma display panel 10. The chassis base 20 supports the plasma display panel 10 and is formed of a material having high mechanical rigidity.

A heat radiation sheet 13 and a double-sided tape (not shown) are interposed between the rear surface of the plasma display panel 10 and the front surface of the chassis base 20. The heat dissipation sheet 13 conducts and diffuses heat generated in the plasma display panel 10 due to gas discharge in a plane direction (x-z plane direction). The heat dissipation sheet 13 may be formed of an acrylic heat dissipating material having excellent thermal conductivity, a graphite heat dissipating material, a metal heat dissipating material, or a carbon nanotube heat dissipating material.

In addition, since the double-sided tape adheres the plasma display panel 10 and the chassis base 20 to each other, the heat dissipation sheet 13 may be closely disposed on the rear surface of the plasma display panel 10 and the front surface of the chassis base 20. .

The circuit board assembly 22 is mounted opposite the plasma display panel 10 of the chassis base 20 and electrically connected to the plasma display panel 10. More specifically, the address electrode and the display electrode are electrically connected to the circuit board assembly 22 to control the gas discharge of the discharge cell.

This circuit board assembly 22 is mounted to a boss (not shown) of the chassis base 20 using a set screw 19. The circuit board assemblies 22 are functional blocks in an image processing / control board assembly 24, an address buffer board assembly 25, a scan drive board assembly 26, a maintenance drive board assembly 27, and a switching mode power supply. (Switching Mode Power Supply, SMPS) board assembly 28.

The image processing / control board assembly 24 receives an image signal from the outside to generate a control signal for driving the address electrode, the scan electrode, or the sustain electrode. The generated control signal is applied to the address buffer board assembly 25, the scan drive board assembly 26, or the sustain drive board assembly 27, respectively. The address buffer board assembly 25 generates an address pulse and applies it to the address electrode. The scan drive board assembly 26 generates a scan pulse and applies it to the scan electrode. The sustain drive board assembly 27 generates a sustain pulse and applies it to the sustain electrode. The SMPS board assembly 28 supplies the power required for driving the plasma display panel as a whole.

The circuit board assembly 22 is formed by mounting a plurality of circuit elements, such as FETs, IGBTs, and diodes, on a printed circuit board. Such circuit elements generate heat when the plasma display panel 10 is driven. In addition, high temperature stress is caused by heat emitted from the plasma display panel 10. Thus, a heat sink 30 is provided for heat dissipation of the circuit elements.

The heat sink 30 is attached to the circuit element to dissipate heat generated in the circuit element, thereby allowing the circuit element to continue to operate normally.

In FIG. 1, as an example, a FET 40 mounted on a printed circuit board of a sustain driving board assembly 27 and a scan driving board assembly 26, and a heat sink 30 attached to one side of the FET 40 are provided. Although shown, a heat sink may also be attached to a circuit element such as an IGBT. In addition, a heat sink may be attached to a circuit element mounted on a printed circuit board of a circuit board assembly 22 other than the sustain driving board assembly 27 and the scan driving board assembly 26.

Hereinafter, the present embodiment will be described in more detail with reference to the FET 40 mounted on the printed circuit board of the holding drive board assembly 27 and the heat sink 30 coupled to one side of the FET 40. do.

FIG. 2 is a perspective view separately showing a heat sink and a circuit element of the circuit board assembly shown in FIG. 1.

Referring to FIG. 2, a plurality of FETs 40 are mounted on a printed circuit board 27a of the sustain drive board assembly. A lead 42 is drawn out at one end of the FET 40, and the lead 42 is coupled to the through hole 43 formed in the printed circuit board 27a.

The heat sink 30 is coupled to one side of the FET 40. In this embodiment, the FET 40 is fastened to the heat sink 30 by the set screw 19. The heat sink 30 includes a heat sink 31 and a plurality of heat dissipation fins 32, and the heat sink 31 and the heat dissipation fins 32 may be integrally formed, or may be separately formed and then coupled to each other.

The heat sink 31 is a portion that is coupled to the FET 40, the heat radiation fin 32 is a portion that radiates heat transferred from the heat sink 31 through contact with air.

In general, the heat dissipation fin 32 may be arranged in a direction parallel to the printed circuit board 28a or in a direction crossing the printed circuit board 28a according to the circuit element. In this embodiment, since the FET 40 and the heat sink 31 are coupled in a direction perpendicular to the printed circuit board 28a, the heat dissipation fins 32 are arranged in parallel with the printed circuit board 28a. In addition, the heat radiation fins 32 are preferably formed in parallel with the air flow direction (z-axis direction in the drawing). As described above, since the heat dissipation fins 32 are formed parallel to the flow direction of the air, the heat dissipation fins 32 do not interfere with the flow of air, and thus the heat dissipation performance may be further improved.

In the present embodiment, the heat dissipation fin 32 includes a first heat dissipation fin 33, a second heat dissipation fin 34, and a third heat dissipation fin 35 extending in a vertical direction from the heat dissipation plate 31. The first heat dissipation fin 33 is formed to extend in a first direction (negative x-axis direction in the drawing) away from the FET 40, and the second heat dissipation fin 34 is formed along the first direction. Extending in parallel with each other, the length measured in the vertical direction from the heat dissipation plate 31 is longer than that of the first heat dissipation fin 33. In addition, the third heat dissipation fin 35 is formed to extend in a second direction (positive x-axis direction in the drawing) opposite to the extension direction of the first heat dissipation fin 33 at a position corresponding to the first heat dissipation fin 33. do. That is, the first heat dissipation fin 33 and the third heat dissipation fin 35 are formed to extend in opposite directions at the same position of the heat dissipation plate 31, and the second heat dissipation fin 34 is formed under the first heat dissipation fin 33. 1 is formed longer than the length of the heat radiation fin (33).

As described above, the length of the second heat dissipation fin 34 measured in the direction perpendicular to the heat dissipation plate 31 is longer than that of the first heat dissipation fin 33, thereby increasing the area of the second heat dissipation fin 34 in contact with air. The heat dissipation efficiency can be further improved. In addition, since a free space corresponding to the difference between the lengths of the first heat dissipation fin 33 and the second heat dissipation fin 34 is formed around the heat sink 30, space utilization may be further facilitated.

Meanwhile, a protrusion 36 may be formed on an opposite surface of the heat sink 30 to the printed circuit board 27a, and the protrusion 36 is inserted into a fastener 37 formed on the printed circuit board 27a. As a result, the heat sink 30 may be supported on the printed circuit board 27a. However, the heat sink 30 and the printed circuit board 27a may be coupled by another fastening means, such as a set screw (not shown).

In addition, an insulating member 50 is interposed between the heat sink 30 and the FET 40. That is, the insulating member 50 is interposed between the heat sink 31 and the FET 40 of the heat sink 30, and the FET 40 and the insulating member 50 are connected to the heat sink 30 by the set screw 19. ) Is combined. In this embodiment, the insulating member 50 is formed in a plate shape and interposed between the FET 40 and the heat sink 30, but may be formed to surround the FET 50 in a cap shape. In addition, the insulating member 50 may be made of various materials such as insulating pads and insulating paper, and is preferably formed larger than the size of the FET 40. That is, since the insulating member 50 is formed larger than the size of the FET 40, the insulating property between the FET 40 and the heat sink 30 is maintained, while the lead 42 and the heat sink of the FET 40 are maintained. Static electricity that may occur may be prevented to ensure stable operation of the FET 40.

3 is a cross-sectional view taken along line III-III of FIG. 2.

Referring to FIG. 3, the first heat dissipation fin 33 and the second heat dissipation fin 34 of the heat sink 30 extend in a direction opposite to the FET 40 of the heat sink 31 (negative x-axis direction in the drawing), Placed next to each other. In addition, the second heat dissipation fin 34 is disposed closer to the printed circuit board 28a than the first heat dissipation fin 33. That is, since the FET 40 is located below the heat sink 31, the second heat sink fin 34 is formed below the heat sink 31 to correspond to the FET 40.

Specifically, the maximum height between the printed circuit board 28a and the second heat dissipation fin 34 measured in the direction perpendicular to the printed circuit board is measured by H1 and the FET measured in the direction perpendicular to the printed circuit board 28a ( When the formation height of 40) is H2, H1 is formed to be substantially the same as H2. Due to this structure, the FET 40 is located closer to the second heat dissipation fin 34 than the first heat dissipation fin 33. In addition, since the length measured in the vertical direction from the heat sink 31 of the second heat dissipation fin 34 is longer than the length of the first heat dissipation fin 33, heat generated from the FET 40 dissipates more efficiently. Can be.

The heat dissipation fins 32 of at least a portion of the heat dissipation fins 32 have a length direction of the heat dissipation fins 32 longer than a cross-sectional area (xz plane in the drawing) cut perpendicular to the heat dissipation plate 31 along the longitudinal direction of the heat dissipation fins 32. The surface area measured accordingly is formed wider. For example, as shown in the present embodiment, the protrusions 33a and 34a are formed on the surfaces of the first heat dissipation fin 33 and the second heat dissipation fin 34. More specifically, the surface of the heat dissipation fin 32 includes a first surface 100 and a second surface 200 disposed in parallel with each other while being disposed perpendicular to the heat sink 31. Then, the protrusions 33a and 34a are formed to protrude from the second surface 200 in the direction perpendicular to the second surface 200 (y-axis direction in the drawing) while the cross-sectional shape forms a triangular shape. As such, since the protrusion is formed on the surface of the heat dissipation fin 32, the surface area of the heat dissipation fin 32 is increased, and thus the heat dissipation performance of the heat sink 30 may be further improved.

In the present embodiment, the protrusions 33a and 34a are formed on the surfaces of the first heat dissipation fin 33 and the second heat dissipation fin 34, but the protrusions may also be formed on the surface of the third heat dissipation fin 35. And, although the length of the second heat dissipation fin 34 is longer than the length of the first heat dissipation fin 33, the length of the second heat dissipation fin 34 may be formed to be the same as the length of the first heat dissipation fin 33, This also belongs to the scope of the present invention.

In addition, although the protrusions 33a and 34a are formed on the second surface 200 of the surface of the heat radiation fin 32 in the present embodiment, these protrusions 33a and 34a are formed on the first surface 100 of the heat radiation fin 32. It may be formed. As such, the protrusions 33a 34a are formed on any one surface of the first surface 100 and the second surface 200 of the heat dissipation fins 32, such that the heat dissipation fins are disposed adjacent to each other while increasing the surface area of the heat dissipation fins 32. A predetermined interval is maintained between the 32, so that air flows smoothly between these intervals, and the heat dissipation performance can be further improved.

On the other hand, the thickness of the heat sink 30 in the present embodiment is formed thicker than the heat sink thickness of the conventional heat sink. In this way, the thickness of the heat sink 30 is formed to be thicker, the strength of the heat sink 30 can be further improved, the surface area in contact with the air is increased, the heat dissipation performance can be improved.

4 is a front view of a heat sink according to a first embodiment of the present invention.

Referring to FIG. 4, the protrusions 33a and 34a according to the present exemplary embodiment are formed along the length direction (the z-axis direction of the drawing) of the first heat dissipation fin 33 and the second heat dissipation fin 34. However, the present invention is not limited thereto, and the protrusions 33a and 34a may be formed intermittently along the length direction of the first heat dissipation fin 33 and the second heat dissipation fin 34.

In addition, although the protrusions 33a and 34a are formed on the surfaces of the first heat dissipation fin 33 and the second heat dissipation fin 34 in the present embodiment, the recesses are formed on the surfaces of the first heat dissipation fin 33 and the second heat dissipation fin 34. Or irregularities may be formed, which is also within the scope of the present invention.

Hereinafter, various embodiments of the present invention will be described. Since the plasma display device according to each embodiment has the same or similar structure and operation as the plasma display device described in the first embodiment, detailed description thereof will be omitted.

5 is a cross-sectional view of a heat sink according to a second embodiment of the present invention.

Referring to FIG. 5, the heat sink 230 according to the second embodiment includes a heat sink 231 and a heat sink fin 232 like the first embodiment. However, compared with the first embodiment, the cross-sectional shape of the protrusion is formed differently. That is, in the present embodiment, the cross-sectional shapes of the protrusions 233a and 234a of the first heat dissipation fin 233 and the second heat dissipation fin 234 are formed in an arc shape. As such, since the cross section of the heat dissipation fin 232 is formed in an arc shape, the surface area in which the heat dissipation fin 232 is in contact with the air becomes wider, and the heat dissipation performance may be further improved.

In addition, in the first and second embodiments, the cross-sectional shape of the heat dissipation fins 232 is formed in a triangle or arc shape, but is not limited thereto, and various surface areas in contact with air may be formed. A heat sink fin having a cross-sectional shape may also be applied to the present invention.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, since the protrusion is formed on the heat sink fin of the heat sink, the surface area of the heat sink in contact with the air is increased, thereby improving heat dissipation performance of the heat sink.

In addition, by forming the heat sink width of the heat sink thick, heat dissipation performance and strength can be further improved.

Claims (10)

A plasma display panel; A chassis base on which the plasma display panel is supported; A circuit board assembly mounted on a side opposite to the plasma display panel of the chassis base and including circuit elements for driving the plasma display panel on a printed circuit board; And A heat sink provided at one side of the circuit element and coupled to the printed circuit board; The heat sink includes a heat sink in contact with the circuit element, and a plurality of heat sink fins extending in a direction perpendicular to the heat sink. At least some of the heat dissipation fins of the plurality of heat dissipation fins may have a larger surface area measured along the length direction of the heat dissipation fins than a cross-sectional area cut perpendicular to the heat dissipation fins along the longitudinal direction of the heat dissipation fins, The heat dissipation fins may include a first heat dissipation fin extending in a first direction away from the circuit element; A second heat dissipation fin extending in parallel with the first heat dissipation fin along the first direction and having a length measured in a direction perpendicular to the heat dissipation plate than the first heat dissipation fin; And a third heat dissipation fin extending in a second direction opposite to the first direction at a position corresponding to the first heat dissipation fin. The method of claim 1, And a protrusion formed on a surface of the heat dissipation fin. The method of claim 2, The surface of the heat sink fin includes a first surface and a second surface formed parallel to each other, And the protrusion is formed on the second surface.  The method of claim 2, And a cross section of the protrusion is formed in a triangle. The method of claim 2, The cross section of the protrusion is formed in an arc shape plasma display device. The method of claim 2, The protrusion is formed in the plasma display device extending in the longitudinal direction of the heat radiation fins. delete The method of claim 1, The second heat dissipation fin is positioned closer to the printed circuit board than the first heat dissipation fin. The method of claim 1, The maximum height of the second heat radiation fin measured in the direction perpendicular to the printed circuit board, And a maximum height of the circuit element measured in a direction perpendicular to the printed circuit board. The method of claim 1, The circuit device includes a FET or IGBT.

Images