KR100717795B1 - Plasma display device - Google Patents

Abstract

The plasma display device of the present invention includes a plasma display panel, a chassis base attached to a rear surface of the plasma display panel, a driving board mounted to the rear of the chassis base and electrically connected to the plasma display panel, and installed on the driving board. Circuit elements; And a heat sink for dissipating the circuit element, wherein the heat sink has a top plate and a first side plate and a second side plate extending from the top plate and facing each other, wherein the circuit element includes the first side plate. And a second side plate.

Plasma, heat dissipation, heat sink, PDP

Description

Plasma display device {PLASMA DISPLAY DEVICE}

1 is a schematic exploded perspective view of a plasma display device according to an exemplary embodiment of the present invention.

FIG. 2 is an enlarged perspective view of the heat sink shown in FIG. 1.

FIG. 2 is an enlarged view of the heat sink of the driving board of FIG. 1.

3 is a cross-sectional view taken along the line III-III of FIG. 2.

4 is a side view of a heat sink according to an embodiment of the present invention.

5 is a front view of a heat sink according to an embodiment of the present invention.

The present invention relates to a plasma display device, and more particularly, to a plasma display device having an improved heat sink for dissipating a circuit element.

In general, a plasma display device is a device that displays an image on a plasma display panel (PDP) using plasma generated by gas discharge.

The plasma display device includes a PDP, a chassis base supporting the PDP, and a display electrode (holding) which is mounted on the opposite side of the chassis base and positioned inside the PDP through a flexible printed circuit (FPC), a connector, or the like. Electrodes and scan electrodes) or a plurality of drive boards connected to the address electrodes.

The PDP has two glass substrates facing each other face to face and forms a discharge space therein, and thus has a weak mechanical rigidity against impact. Since the PDP generates heat during driving, the PDP is provided with a thermally conductive sheet on its rear surface. This thermally conductive sheet rapidly conducts and diffuses heat generated in the PDP in the planar direction.

The chassis base is formed of a metal material having high mechanical rigidity to support the PDP, and is attached to the PDP through a double-sided tape.

The chassis base mounts the drive boards behind it. These drive boards are mounted with set screws on a plurality of bosses formed on the back of the chassis base.

The driving boards are equipped with various kinds of circuit elements for logic processing. Among them, elements such as intellectual power module (IPM) and field effect transistor (FET) generate high heat during the driving process.

Therefore, the heat sink is used together with the circuit element to dissipate heat of the circuit element. Since the circuit element is attached to one surface of the heat sink, the heat sink takes up a lot of space on the driving board and thus reduces the directness. .

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display device having a heat sink improved to increase the directivity of the driving board.

In order to achieve the above object, the plasma display device provided by the present invention,

A plasma display panel, a chassis base attached to a rear surface of the plasma display panel, a driving board mounted to the rear of the chassis base and electrically connected to the plasma display panel, and a circuit element installed in the driving board; And a heat sink for dissipating the circuit element, wherein the heat sink has a top plate and a first side plate and a second side plate extending from the top plate and facing each other, wherein the circuit element includes the first side plate. And a second side plate.

In addition, it is preferable that at least two or more circuit elements are attached to each of the first side plate and the second side plate, and the first side plate and the second side plate are respectively coupled to the rear surfaces of the surfaces facing each other.

The heat sink may further include a plurality of heat sinks spaced apart from each other while connecting between the first side plate and the second side plate.

The first side plate and the second side plate and the circuit element are preferably in surface contact.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like elements throughout the specification.

1 is a schematic exploded perspective view of a plasma display device according to an exemplary embodiment of the present invention.

Referring to this figure, the plasma display device includes a PDP 11 for displaying an image using gas discharge, a chassis base 17 attached to the rear surface of the PDP 11, and a rear of the chassis base 17. Drive boards 15 mounted and electrically connected to the PDP 11.

A heat radiation sheet 13 and a double-sided tape (not shown) are interposed between the rear surface of the PDP 11 and the front surface of the chassis base 17.

The heat dissipation sheet 13 is interposed between the rear surface of the PDP 11 and the front surface of the chassis base 17, and conducts and diffuses heat generated in the PDP 11 due to gas discharge in a plane direction (x-y plane direction).

The heat dissipation sheet 13 may be formed of an acrylic heat dissipating material having excellent thermal conductivity, a graphite heat dissipating material, a metal heat dissipating material, or a carbon nanotube heat dissipating material.

Since the double-sided tape adheres the PDP 11 and the chassis base 17 to each other, the heat dissipation sheet 13 can be closely arranged on the rear surface of the PDP 11 and the front surface of the chassis base 17.

The PDP 11 has discharge cells along the intersections of the address electrodes and the display electrodes (a pair of sustain electrodes and scan electrodes), and images are displayed by gas discharge of the discharge cells.

Meanwhile, the address electrode and the display electrode are electrically connected to the driving boards 15 so that the gas discharge of the discharge cell is controlled.

These drive boards 15 are mounted with a set screw 19 to a boss (not shown) of the chassis base 17. These drive boards 15 include an image processing / control board 115, an address buffer board 215, a scan drive board 315, a sustain drive board 415, and a power board 515 as functional blocks. .

The image processing / control board 115 receives an image signal from the outside to generate a control signal required to drive the address electrode A, the sustain electrode X, or the scan electrode Y, and thus the address buffer board 215. And the scan driving board 315 or the sustain driving board 415, respectively. The address buffer board 215 generates an address pulse and applies it to the address electrode A. FIG. The scan driving board 315 generates a scan pulse or a sustain pulse and applies it to the scan electrode Y. The sustain driving board 415 generates a sustain pulse and applies it to the sustain electrode X. The power board 515 supplies the power required for driving the plasma display device as a whole.

FIG. 2 is an enlarged view of the heat sink in the driving board 15 of FIG. 1, FIG. 3 is a cross-sectional view taken along line III-III of FIG. 2, FIG. 4 is a side view of the heat sink, and FIG. 5 is Front view of a heat sink.

The heat sink of this embodiment will be described with reference to the drawings as follows.

The drive board 15 has circuit elements 21. These circuit elements 21 generate high heat during the driving process.

The heat sink 23 is attached to the circuit element 21 to dissipate heat generated in the circuit element 21. This heat dissipation action allows the circuit element 21 to continue its normal operation.

The circuit element 21 including the heat sink 23 includes a field effect transistor ("FET") and an intelligent power module ("IPM"). The heat sink 23 is attached to the side of the FET and the IPM is attached to the surface thereof. In the figure, the FET is illustrated as a circuit element.

The circuit elements 21 constitute a circuit with other circuit elements to perform a switching drive for selecting a discharge cell. At this time, the circuit element 21 generates high heat during signal processing.

The heat sink 23 of the present embodiment is coupled to the circuit element 21 to effectively dissipate the high heat generated by the circuit element 21, and also to increase the directivity of the driving board. Combined.

The heat sink 23 includes an upper plate 231 and a first side plate 233 and a second side plate 235 facing each other while the circuit elements 21 are attached to each other. In addition, a plurality of heat dissipation fins 237 are further included to increase an area for heat dissipation.

The first side plate 233 and the second side plate 235 face each other and are separated while forming a constant distance d. In addition, a plurality of heat sinks 237 are positioned between the first side plate 233 and the second side plate 235 to increase the heat dissipation area.

In more detail, the top plate 231 is formed in a rectangular shape in its plan view.

The first side plate 233 and the second side plate 235 extend in a direction orthogonal to the upper plate 231 to form sidewalls. In this case, the first side plate 233 and the second side plate 235 are perpendicular to the top plate 231, and face each other.

In addition, the first side plate 233 and the second side plate 235 has a rectangular planar shape having a sufficient height (h) and length (s) so that a plurality of circuit elements can be attached. In the figure, three FETs are attached to the side plates 233 and 235 as circuit elements.

In addition, a plurality of heat sinks 237 are formed between the first side plate 233 and the second side plate 235. The heat sinks 237 are separated from each other at a constant distance. The heat sink 237 acts to increase the heat dissipation area of the heat sink 21 so that the circuit element can be quickly cooled.

In addition, since the plurality of heat sinks 237 are formed apart from each other, a space is formed between the heat sinks 237. The convection of air into this space has the advantage of cooling the heat sinks.

The heat sink 237 has a rectangular planar shape.

In the heat sink 23 of the present embodiment configured as described above, circuit elements are attached to the first side plate 233 and the second side plate 235, respectively. As shown in FIG. 5, the circuit elements 21 are arranged in two rows and three rows. Attached in matrix form.

In more detail, the circuit elements 21 are coupled to the side plates 233 and 235 in a state where they are positioned to face each of the first side plate 233 and the second side plate 235. That is, the circuit element 21 and the side plates 233, 235 are in contact with each other in a state facing each other, in this state, the circuit element 21 is fixed to the side plates 233, 235 through screwing, respectively do. In this case, the circuit elements are respectively coupled to the opposite rear surfaces of the side plates 233 and 235, that is, the outer wall.

In this way, three circuit elements 21 are fixed to each of the first side plate 233 and the second side plate 235. Accordingly, the planar view in which the circuit element 21 is coupled to the side plates 233 and 235 forms a 3 × 2 matrix array as shown in FIG. 5.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, the heat sink has sidewalls facing each other, and at least two or more circuit elements are attached to each sidewall of each sidewall, thereby increasing the degree of integration of the circuit elements. Can be used. In addition, since the side walls are connected by a plurality of heat sinks, the heat dissipation area can be expanded to rapidly dissipate the circuit elements, and the hot heat sink can also be cooled quickly.

Claims (7)

A plasma display panel; A chassis base attached to a rear surface of the plasma display panel; A driving board mounted to the rear of the chassis base and electrically connected to the plasma display panel; A circuit element installed on the driving board; And, And a heat sink for radiating the circuit elements. The heat sink is, A top plate, a first side plate and a second side plate extending from the top plate and facing each other, and a plurality of heat sinks spaced apart from each other while connecting between the first side plate and the second side plate, And the circuit element is attached to each of the first side plate and the second side plate. The method of claim 1, And at least two circuit elements are attached to each of the first side plate and the second side plate. The method of claim 2, And the circuit elements are sequentially attached along the longitudinal direction of each of the first and second side plates. The method of claim 1, And the circuit elements are coupled to rear surfaces of surfaces where the first and second side plates face each other. delete The method of claim 1, And the circuit element is a field effect transistor. The method of claim 1, And the first and second side plates and the circuit element are in surface contact with each other.

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