KR100637516B1 - Plasma display device - Google Patents

Abstract

The plasma display apparatus includes a plasma display panel, a chassis base for supporting the plasma display panel, first and second address buffer boards provided at opposite sides of the plasma display panel of the chassis base in diagonal directions, and the first address. A first driver IC package group connected to a buffer board and one address electrodes of the plasma display panel, connected to a first address electrode group drawn out to one side of the chassis base, and including a driver IC; A second driver IC package group connected to a second address electrode group drawn out to the opposite side of the first and second driver IC package groups including a driver IC, and covering the first and second driver IC package groups and mounted on the chassis base, respectively; 2 cover plate and the first and second driver IC package group The first and along a diagonal direction to the adjacent vacant space where the second cover plate is disposed and a heat sink is disposed, respectively.

Plasma, Display, PDP, TCP, Cover Plate, Heat Dissipation

Description

Plasma display device {PLASMA DISPLAY DEVICE}

1 is an exploded perspective view of a plasma display device according to a preferred embodiment of the present invention.

FIG. 2 is a perspective view showing the heat sink shown in FIG. 1. FIG.

FIG. 3 is a rear view of the chassis base shown in FIG. 2.

FIG. 4 is an enlarged view of a portion “A” of FIG. 2 enlarged.

FIG. 5 is a partially enlarged view illustrating an enlarged "B" portion of FIG. 2.

FIG. 6 (a) is a side view showing the arrangement of the second heat sink and the second cover plate shown in FIG. 2, and FIG. 6 (b) is a side view showing another embodiment of the heat sink shown in FIG. .

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to arrange a tape carrier package (hereinafter referred to as TCP) and a cover plate in an asymmetrical shape, and to provide a heat sink to efficiently eliminate high heat generated from a driver IC. The present invention relates to a plasma display device capable of dissipating heat.

In general, a plasma display device is an apparatus for displaying an image on a plasma display panel (PDP) using plasma generated by gas discharge.

Such a plasma display apparatus typically surrounds a PDP that implements an image, a chassis base that supports the PDP, a circuit board assembly installed on the chassis base to control the PDP, a PDP, the chassis base, and a circuit board assembly. It is made of a case forming the appearance of.

In the plasma display device having the above structure, the circuit board assembly is connected to the address electrode and the display electrode of the PDP through a flexible printed circuit (FPC) and a driver IC package. Thus, the circuit board assembly can control the PDP through this FPC and driver IC package.

At this time, the driver IC provided in the driver IC package applies an address pulse to the address electrode, and the driver IC repeatedly applies the address pulse to the corresponding address electrode within a short time to express the gray scale in the PDP. It generates high temperature heat and electromagnetic interference (EMI).

In particular, the PDP which draws out the address electrodes to one side and sequentially scans the address electrodes in the stretching direction of the plasma display panel generates high temperature heat in the driver IC provided in the driver IC package.

Therefore, a cover plate or heat sink may be provided to efficiently dissipate such high temperature heat.

However, such a PDP intensively arranges driver IC packages in a limited space, such as arranging driver IC packages in a row at the lower end of the chassis base. Therefore, since the heat generation amount of the driver IC package is superimposed, there is a limit in heat dissipation by the cover plate.

Accordingly, the present invention has been made to solve the above problems, and an object of the present invention is to improve the arrangement of the driver IC package and the cover plate to configure an asymmetrical shape, and to further provide a heat dissipation member to provide a driver IC package. The present invention provides a plasma display device capable of efficiently dissipating heat generated from a driver IC.

The present invention to achieve the above object is a plasma display panel; A chassis base for supporting the plasma display panel, first and second address buffer boards disposed on opposite sides of the plasma display panel of the chassis base in diagonal directions, the first address buffer board and one side address electrode of the plasma display panel; And a first driver IC package group connected to a first address electrode group drawn out to one side of the chassis base and including a driver IC, and a second address electrode group drawn out to the opposite side of the first address electrode group. A second driver IC package group connected to each other and having a driver IC, first and second cover plates covering each of the first and second driver IC package groups and mounted to the chassis base, and the first and second drivers. Diagonal lines in adjacent empty space where IC package group and first and second cover plates are arranged Provided are a plasma display device including heat sinks disposed along a direction.

Hereinafter, a plasma display device according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

As shown in Figs. 1 to 3, the plasma display apparatus proposed by the present invention includes a front and back cover (1, 2) for forming an appearance, a plasma display panel (hereinafter referred to as PDP) 3 for implementing an image, And a chassis base 5 supporting the PDP 3 and a circuit board assembly 9 provided on one side of the chassis base 5 to control the PDP 3.

In addition, the plasma display device includes a first and a second driver IC package group 10 arranged diagonally on one side of the chassis base 5 and connecting the circuit board assembly 9 and the PDP 3, respectively. 12 and a pair of cover plates 11 and 13 provided asymmetrically to the chassis base 5 to support the first and second driver IC package groups 10 and 12, respectively; Heat sinks 14 and 16 disposed at adjacent positions of the first and second driver IC package groups 10 and 12 and the cover plates 11 and 13 to dissipate heat.

In the plasma display device having such a structure, the circuit board assembly 9 is composed of a plurality of drive boards, and some drive boards are used to drive the first and second driver IC packages to drive the PDP 3. It is connected to the corresponding electrode of the PDP 3 by (10, 12), respectively.

Accordingly, the driver ICs 19, 27 (FIGS. 4 and 5) provided in the first and second address electrode groups 15 and 25 (FIGS. 4 and 5) are controlled by the control signal of the circuit board assembly 9. An image can be realized by selectively applying an address pulse to an address electrode of the PDP 3 and selecting a discharge cell of the PDP 3 by an address pulse applied to the address electrode and a scan pulse applied to the scan electrode.

In addition, since the high temperature heat is generated when the driver ICs 19 and 27 are driven, the first and second driver IC package groups 10 and 12 are used to efficiently dissipate the heat. The rear surface of the chassis base 5 is disposed asymmetrically with each other in a diagonal direction.

That is, the first driver IC package group 10 is disposed below the rear surface of the chassis base 5, and the second driver IC package group 12 is disposed above the rear surface of the chassis base 5.

Accordingly, the first and second drive IC package groups 10 and 12 are distributed in upper and lower portions of the chassis base 5, respectively, to secure a free space in the adjacent area, and thus heat generated can be radiated through the space. Since the heat sinks 14 and 16 are provided in the clearance, heat can be radiated more efficiently.

Since the first and second drive IC package groups 10 and 12 are disposed along the diagonal direction, the cover plates 11 and 13 corresponding to the first and second drive IC package groups 10 and 12, respectively, are disposed. Fig. 1 is composed of first and second cover plates 11 and 13.

The structure of the first and second drive IC package groups 10 and 12 and the first and second cover plates 11 and 13 will be described in more detail. As shown in FIG. The IC package group 10 includes a first address electrode group 15 connecting the address electrode of the PDP 3 to the first address buffer board 9e1 provided on one side of the chassis base 5, and the first address. The driver IC 19 is attached to the window region on the electrode group 15.

A reinforcing member 17 is disposed on the rear surface of the chassis base 5, and the first cover plate 11 is disposed at a predetermined distance from the reinforcing member 17.

Accordingly, the first cover plate 11 compresses the driver IC 19 to the reinforcing member 17 of the chassis base 5 and also contacts the driver IC 19 to be generated from the driver IC 19. Heat dissipation

As shown in FIG. 5, the second drive IC package group 12 has the same structure as the first drive IC package group 10, except that the second drive IC package group 12 is disposed in a diagonal direction.

That is, the first drive IC package group 10 includes a second address electrode group 25 connecting the upper portion of the second address buffer board 9e2 and the address electrode of the plasma display panel, and the second address electrode group ( And a driver IC 27 attached to the window area on 25).

In addition, a reinforcing member 31 is disposed above the rear surface of the chassis base 5, and a second cover plate 13 is disposed at a predetermined distance from the reinforcing member 31.

Accordingly, the second cover plate 13 compresses the driver IC 27 to the reinforcing member 31 of the chassis base 5 and also contacts the driver IC 27 to generate from the driver IC 27. Dissipate the heat.

On the other hand, as shown in Figures 1 to 3, the heat sinks 14 and 16 are disposed in a diagonal direction by being disposed in adjacent positions of the first and second cover plates 11 and 13, respectively, The heat emitted from the ICs 19 and 27 can be efficiently discharged.

In more detail, the heat sinks 14 and 16 are disposed on one side of the first heat sink 14 and the second cover plate 13 disposed on one side of the first cover plate 11. The second heat sink 16 is disposed in a diagonal direction with respect to the first heat sink 14.

Since the first and second heat sinks 14 and 16 have the same shape, the second heat sink 16 will be described below.

As shown in FIG. 6A, the second heat sink 16 includes a horizontal heat dissipation fin 32 seated on the chassis base 5 and a plurality of protrusions protruding from an upper surface of the horizontal heat dissipation fin 32. It consists of a vertical heat radiation fin (34).

The horizontal and vertical heat dissipation fins 32 and 34 are made of a material such as aluminum having high thermal conductivity. In addition, the plurality of vertical heat dissipation fins 34 may be spaced apart from each other at regular intervals to more efficiently dissipate heat.

Therefore, heat generated from the drive IC 27 may be transferred to the second heat sink 16 through the second cover plate 13 and discharged.

The first heat sink 14 also has a structure consisting of a horizontal heat sink fin and a vertical heat sink fin in the same manner as the second heat sink 16.

On the other hand, Fig. 6 (b) shows another preferred embodiment of such a heat sink. As shown, the heat sink 37 according to the present embodiment has a difference in that the heat sink 16 is disposed on the chassis base 5 in the reverse direction.

That is, the heat sink 37 includes a horizontal heat dissipation fin 38 having a predetermined length and a plurality of vertical heat dissipation fins 39 protruding downward on the bottom of the horizontal heat dissipation fin 38.

Accordingly, when the heat sink 37 is disposed on the chassis base 5, the bottom surfaces of the plurality of vertical heat sink fins 39 may contact the top surface of the chassis base 5 to dissipate heat.

As such, the heat sink according to the preferred embodiment of the present invention may be appropriately modified and applied.

As described above, in the plasma display apparatus according to the preferred embodiment of the present invention, the driver IC package group and the cover plate are formed in an asymmetrical structure by arranging the driver IC package group and the cover plate in the upper and lower portions of the chassis base at half length, respectively, so that the driver IC package group and the cover plate are not disposed. Through heat conduction and convection is made through the advantage that the heat dissipation efficiency can be improved.

In addition, the heat dissipation member may be further disposed in the side spaces of the driver IC package group and the cover plate, thereby further improving heat dissipation efficiency.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to

Claims (7)

A plasma display panel; A chassis base supporting the plasma display panel; First and second address buffer boards provided at opposite sides of the chassis base on the opposite side of the plasma display panel; A first driver IC package group connected to the first address buffer board and one side address electrodes of the plasma display panel and connected to a first address electrode group drawn out to one side of the chassis base and including a driver IC; A second driver IC package group connected to a second address electrode group drawn out to the opposite side of the first address electrode group and including a driver IC; First and second cover plates covering each of the first and second driver IC package groups and mounted to the chassis base; And And heat sinks disposed in diagonal directions in adjacent empty spaces in which the first and second driver IC package groups and the first and second cover plates are disposed. According to claim 1, The heat sink includes a first heat sink disposed on one side of the first cover plate, and a second heat sink disposed on one side of the second cover plate and disposed in a diagonal direction with respect to the first heat sink. Plasma display device. The method of claim 2, Each of the first and second heat sinks includes a horizontal heat dissipation fin mounted on the chassis base and a plurality of vertical heat dissipation fins protruding from an upper surface of the horizontal heat dissipation fin. The method of claim 2, And the first and second heat sinks include a plurality of vertical heat dissipation fins whose bottoms are in contact with the chassis base, and horizontal heat dissipation fins connecting upper portions of the plurality of vertical heat dissipation plates to each other. The method of claim 1, The first driver IC package group is disposed below the rear surface of the chassis base, and the second driver IC package group is disposed above the rear surface of the chassis base and disposed along a diagonal direction with respect to the first driver IC package group. . The method of claim 5, The first and second driver IC package groups include an address electrode group connecting an address electrode of the plasma display panel and an address buffer board provided at one side of the chassis base, and a driver IC attached to a window region on the address electrode group. Each plasma display device including a. According to claim 1, The pair of cover plates may be provided on a lower side of one side of the chassis base to support the first drive IC package group, and on the upper side of one side of the chassis base, and the second drive IC package group. Plasma display device comprising a second cover plate for supporting.

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