KR100766901B1 - Plasma display device - Google Patents

Abstract

A plasma display device is provided to prevent erroneous discharge of discharge cells and to enhance reliability of a circuit element by removing potential heat between the circuit element and a heat-radiating plate. A plasma display device includes a plasma display panel, a chassis base, a plurality of driving boards, and a heat-radiating plate(51). The plasma display panel is used for displaying images by using gas discharge. The chassis base is coupled with the plasma display panel in order to support the plasma display panel. The driving boards are formed with substrates(63) and circuit elements(61) mounted on the substrates in order to apply driving signals to the plasma display panel. The heat-radiating plate is selectively installed at the circuit elements in order to dissipate the heat of the circuit elements. An opening(51b) is formed at the heat-radiating plate.

Description

Plasma display device {PLASMA DISPLAY DEVICE}

1 is a schematic exploded perspective view of a plasma display device according to an embodiment of the present invention.

2 is a schematic perspective view showing a state of a heat sink installed in a circuit element.

3 is a plan view of the heat sink shown in FIG. 2.

4 is a plan view of the heat sink for explaining the case where the opening portion is formed of a slit.

5 is a cross-sectional view taken along the line VV of FIG. 2.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display device, and more particularly, to a plasma display device for effectively cooling a circuit element.

The plasma display apparatus is an apparatus which displays an image using the plasma produced | generated by gas discharge.

The plasma display device is mounted on a plasma display panel (hereinafter referred to as a PDP), a chassis base supporting the PDP, and an opposite side of the PDP of the chassis base, and connected to the PDP through a flexible printed circuit (FPC) and a connector. A plurality of driving boards connected to a display electrode or an address electrode positioned therein are provided.

PDP has weak mechanical properties against impact because it adheres two glass substrates face to face and forms a discharge space therein. In order to compensate for this, the chassis base combined with the PDP is composed of a material having high mechanical strength, for example, cast iron, to compensate for the mechanical rigidity of the PDP.

In addition, driving boards are mounted to the rear of the chassis base, and the driving boards are constructed by installing various kinds of circuit elements on a board for logic processing. The driving boards apply a high voltage driving signal to the display electrode or the address electrode to generate a discharge in the PDP.

On the other hand, as PDPs become larger, the driving boards for driving them are becoming more complicated than ever before. According to such a requirement, circuit elements installed in the driving board are also mainly used to support the driving board by using devices that can simultaneously use the front and rear surfaces of the substrate, such as surface mounted devices (SMD).

The driving board according to the directization is a problem that a lot of heat is generated. The circuit elements directly connected to the driving board generate high heat in the driving board by converting a part of electrical energy into heat during its operation. The heat generated in this way degrades the reliability of the driving board, and does not transmit accurate signals to the discharge cells, causing mis-discharge.

SUMMARY OF THE INVENTION The present invention has been made to solve the problems as described above, and to provide a plasma display device of the present invention that effectively cools a circuit element installed in a driving board.

In order to achieve the above object, a plasma display device provided by the present invention includes a plasma display panel displaying an image by gas discharge, a chassis base coupled to and supporting the plasma display panel, a substrate, and circuit elements installed on the substrate. And a heat dissipation plate configured to apply a driving signal to the plasma display panel, and selectively installed on the circuit elements to dissipate heat of the circuit elements and having an opening.

Here, the present invention may further include a bonding material positioned between the heat sink and the circuit element to bond the heat sink and the circuit element, and the bonding material is preferably silicon.

The opening is formed of a slit or a hole. In addition, the opening is uniformly formed in a portion of the heat sink facing the circuit element.

The heat dissipation plate may include a body and heat dissipation fins protruding from the body and separated from each other by a predetermined distance, and the opening may be formed between the heat dissipation fins or intersect the heat dissipation fins.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

1 is a schematic exploded perspective view of a plasma display device according to an embodiment of the present invention.

Referring to this figure, the plasma display device of the present embodiment includes a plasma display panel (hereinafter referred to as a panel) 11 for displaying an image using gas discharge, a chassis base 17 attached to the rear surface of the panel 11, It includes drive boards 15 mounted to the rear of the chassis base 17 and electrically connected to the panel 11 to apply a drive signal.

A heat dissipation sheet 13 and a double-sided tape (not shown) may be further interposed between the rear surface of the panel 11 and the front surface of the chassis base 17.

The heat dissipation sheet 13 is interposed between the rear surface of the panel 11 and the front surface of the chassis base 17 to electrically conduct and diffuse heat generated in the panel 11 in the plane direction (x-y plane direction). The heat dissipation sheet 13 may be formed of an acrylic heat dissipation material having excellent thermal conductivity, a graphite heat dissipation material, a metal heat dissipation material, or a carbon nanotube heat dissipation material.

And, since the double-sided tape adheres the panel 11 and the chassis base 17 to each other, the heat dissipation sheet 13 can be arranged in close contact with the rear surface of the panel 11 and the front surface of the chassis base 17.

The panel 11 includes a front substrate 111 and a rear substrate 211 and partitions a space therebetween to form discharge cells. This discharge cell forms a sub pixel which is the minimum unit for displaying an image. The address electrode and the display electrode (pair of the sustain electrode and the scan electrode) intersect with the discharge cell, and an image is displayed by the gas discharge of the discharge cell.

Meanwhile, the address electrode and the display electrode are electrically connected to the driving boards 15 so that the gas discharge of the discharge cell is controlled.

The driving boards 15 are composed of a substrate 63 and circuit elements 61 installed on the substrate to form a circuit, and may be fixed to the boss of the chassis base 17 with screws 19. The substrate 63 is generally composed of a printed circuit board (PCB) printed with a circuit pattern. Meanwhile, in the drawings, only the substrate is selectively illustrated as the driving boards 15 by way of example.

In addition, the circuit element 61 provided on the substrate 63 is selectively configured to include a heat sink 51 to cool the heat generated during the operation process. In this case, a surface mounted device (SMD) may be preferably used as the circuit element 61 to directly drive the driving board.

The driving boards 15 include an image processing / control board 115, an address buffer board 215, a scan driving board 315, a sustain driving board 415, and a power board 515 as functional blocks.

The image processing / control board 115 receives an image signal from the outside to generate a control signal required to drive the address electrode, the sustain electrode, or the scan electrode, and thus the address buffer board 215 and the scan drive board 315 or the sustain electrode. It applies to the driving board 415, respectively.

The address buffer board 215 generates an address pulse and applies it to the address electrode. The scan driving board 315 generates a scan pulse or a sustain pulse and applies it to the scan electrode. The sustain drive board 415 generates a sustain pulse and applies it to the sustain electrode. The power board 515 supplies the power required for driving the plasma display device as a whole.

In addition, although not shown in the drawing, a front cabinet (not shown) is installed on the front side of the panel 11 and a back cover (not shown) is provided on the rear side of the chassis base 17 to form an appearance of the plasma display apparatus.

2 is a schematic perspective view showing a state of a heat sink installed in a circuit element. The heat sink 51 is demonstrated in detail with reference to this figure.

The heat dissipation plate 51 is composed of a body 51a and heat dissipation fins 51c provided on the body 51a. The body 51a has a flat bottom surface so as to be in surface contact with the circuit element 61, and heat dissipation fins 51c are installed on the rear surface opposite to the bottom surface. Since the heat dissipation plate 51 has a larger area in contact with the circuit element 61, the heat dissipation is better. Therefore, the body 51a is formed at least larger than the size of the circuit element.

The heat dissipation fins 51c are formed to extend perpendicular to the body 51a. The heat dissipation fins 51c widen the contact area with the air so that the heat dissipation plate 51 can be easily cooled. Therefore, it is preferable that a plurality of heat dissipation fins 51c are formed in the body 51a. At this time, the heat radiation fins 51c are formed while maintaining a constant distance from each other.

On the other hand, Figure 3 is a plan view of the heat sink 51 shown in Figure 2, it can be seen that the opening 51b is formed between the heat radiation fins (51c).

As shown, the opening 51b is disposed between the heat dissipation fins 51c, and FIG. 3 illustrates an example in which the opening 51b is formed as a hole. The opening part 51b is a structure which communicates the bottom surface of the body 51a, ie, the surface which contacts the circuit element 61, and the back surface on the opposite side.

Therefore, it may be formed as a slit (51d) (slit) instead of the hole as shown in Figure 4, in the relationship with the heat radiation fin (51c) can be arranged long in the cross direction, or not shown, but the slit (51d) is It may be located between the radiating fins (51c).

The opening 51b formed as described above serves as a passage communicating with the outside when a space is formed at a portion where the circuit element 61 and the heat sink 51 contact each other, or when an incomplete contact surface is formed to absorb latent heat hidden in the space. Make it easy to discharge to the outside.

The opening 51b is formed to have a uniform distribution in the portion of the body 51a that faces the circuit element 61. For example, in FIG. 3, the dotted line illustrates the area of the circuit element 61, and the openings 51b are arranged to have a uniform distribution within this area. By arranging the openings 51b in this way, the openings 51b are uniformly distributed over the entire circuit element, so that latent heat that is latent between the circuit element 61 and the heat sink 51 can be uniformly removed.

In this way, the heat sink 51 having the opening 51b is attached to the circuit element 61 through the bonding material 71.

5 is a cross-sectional view taken along the line VV of FIG. 2. As shown, the bonding material 71 is provided on the upper surface 61a of the circuit element 61. In this case, the bonding material may be a double-sided tape or adhesive, and silicon. Here, since silicone gels in a sol state, there exists an advantage that workability | operativity is easy.

After providing the bonding material 71 to the upper surface 61a of the circuit element 61 in this manner, the heat sink 51 is attached to the circuit element 61 so that the opening 51b faces the bonding material 71.

In this process, voids are generated between the circuit element 61 and the heat sink 51 by bubbles or foreign matter by the bonding material 71, but according to the present embodiment, these voids are caused by the opening 51b of the heat sink 51. Will reduce the occurrence of That is, when the heat sink 51 is attached to the bonding material 71, bubbles or voids are naturally removed while the bonding material 71 flows into the opening 51b.

In addition, when the opening 51b is formed corresponding to the space 81 formed between the bonding materials 71, the latent heat formed in the space 81 can be easily discharged through the opening 51b.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, it is possible to easily cool the circuit elements provided on the substrate to prevent erroneous discharge of the discharge cells. In addition, the opening of the heat sink has the effect of increasing the reliability of the circuit element by removing the latent heat between the circuit element and the heat sink.

Claims (10)

A plasma display panel which displays an image by gas discharge; A chassis base coupled to and supporting the plasma display panel; Driving boards comprising a substrate and circuit elements provided on the substrate to apply driving signals to the plasma display panel; And, A heat sink selectively installed in the circuit elements to dissipate heat of the circuit elements and having an opening; Plasma display device comprising a. The method of claim 1, And a bonding material positioned between the heat sink and the circuit element to bond the heat sink and the circuit element. The method of claim 2, The bonding material is a plasma display device. The method of claim 1, The circuit device is a plasma display device (Surface Mounted Device). The method of claim 1, And the opening is formed of a slit. The method of claim 1, And the opening is formed of a hole. The method of claim 1, And the opening is uniformly formed in a portion of the heat sink facing the circuit element. The method according to any one of claims 1 to 7, The heat sink is, And a heat dissipation fin protruding from the body and spaced apart from a neighbor by a predetermined distance. The method of claim 8, And the opening is formed in the body between the heat dissipation fins. The method of claim 8, The opening has a long shape in the direction crossing the radiating fin, the plasma display device formed on the body.

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