KR100709243B1 - Plasma display device - Google Patents

Abstract

The present invention discloses a plasma display device capable of dissipating heat generated from a driving integrated circuit and increasing rigidity of a chassis base to increase reliability of a product. The plasma display apparatus of the present invention includes a plasma display panel, a chassis base on which the plasma display panel is supported, a heat dissipation plate provided on the chassis base, and circuits for driving the plasma display panel. It includes a circuit board and a driving integrated circuit installed in, and electrically connecting the plasma display panel and the circuit board, the connection member in close contact with the heat dissipation plate.

Plasma, Heat Dissipation, TCP, Heat Dissipation Fins, Chassis Base

Description

Plasma display device {PLASMA DISPLAY DEVICE}

1 is a perspective view showing a plasma display device for explaining an embodiment according to the present invention.

FIG. 2 is a cross-sectional view for describing a first exemplary embodiment in which the A-A portion of FIG. 1 is cut away.

3 is a view corresponding to FIG. 2 for describing a second embodiment according to the present invention.

The present invention relates to a plasma display device, and more particularly, to a plasma display device capable of rapidly dissipating high heat generated from a driving integrated circuit to the outside and increasing the rigidity of a chassis base to increase product reliability. will be.

In general, a plasma display device is an apparatus for displaying an image on a plasma display panel using a plasma generated by gas discharge. In such a plasma display device, an electrode printed on a plasma display panel is electrically connected to a driving circuit through a flexible printed circuit board (FPCB), and the flexible printed circuit board is connected to a pixel of the plasma display panel. A drive integrated circuit for applying an address voltage in accordance with a control signal of the drive circuit to selectively form a wall voltage is provided.

As such, a widely used voltage applying structure using a flexible printed circuit board and a driving integrated circuit includes a chip on board (COB) and a flexible printing on which a driving integrated circuit is mounted on a printed circuit board (PCB). There is a chip on film (COF) in which a driver IC is directly mounted on a circuit board. Recently, a small and inexpensive Tape Carrier Package (TCP) has been widely used.

In this electrical connection member, the driving integrated circuit applies an address pulse to the address electrode of the plasma display panel. The driving integrated circuit repeatedly applies an address pulse to a corresponding address electrode within a short time to express gray levels in the plasma display panel, thereby generating high temperature heat and electromagnetic waves when driving the plasma display.

Therefore, such a high temperature adversely affects the plasma display device, which may lower the reliability of the product.

Accordingly, the present invention has been proposed to solve the above problems, and an object of the present invention is to efficiently dissipate high temperature heat generated in a driving integrated circuit, and at the same time, increase the rigidity of the chassis base and of course protect the circuit board. To improve the reliability of the product and to provide a plasma display device that can reduce the defect rate.

In order to achieve the above object, the present invention provides a plasma display panel, a chassis base on which the plasma display panel is supported, a heat dissipation plate provided on the chassis base, and circuits for driving the plasma display panel. Provided is a plasma display device having a circuit board and a driving integrated circuit installed on the heat dissipation plate, and electrically connecting the plasma display panel and the circuit board, the connection member being in close contact with the heat dissipation plate.

The heat dissipation plate may include a first extension part disposed in close contact with the chassis base and the connection member, a second extension part bent and extended from the first extension part toward the plasma display panel, and the second extension part. A third extension part bent and extending in a direction parallel to the plasma display panel, a fourth extension part bent and extending in a direction parallel to the second extension part in the third extension part, and the fourth extension part And a fifth extension part that is bent and extended in a direction parallel to the plasma display panel.

A plurality of heat dissipation fins may be provided on the heat dissipation plate.

In detail, the fourth extension part may include a plurality of heat dissipation fins disposed in a direction parallel to the plasma display panel.

In addition, a plurality of heat dissipation fins disposed in a direction parallel to the second extension part may be provided in the fifth extension part.

The heat dissipation plate may be provided with a groove into which the circuit board is fitted, and the groove may be formed in the fourth extension part.

The fourth extension part may be formed to have a height higher than that of the circuit board with respect to the rear surface of the chassis base.

The heat dissipation plate may be formed of a conductive metal.

The circuit board may be coupled by a screw coupled to the heat dissipation plate.

The connection member may be formed by mounting the drive integrated circuit in the form of a tape carrier package on a flexible printed circuit board.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is an exploded perspective view illustrating an exploded view of a plasma display device for explaining an embodiment according to the present invention, and FIG. 2 is a cross-sectional view illustrating the first embodiment by cutting the A-A part of FIG. 1.

The plasma display apparatus may include a plasma display panel (PDP) for displaying an image using gas discharge, and a chassis base for supporting the plasma display panel 100 in parallel with the plasma display panel 100. And a front cover 300 and a rear cover 400 disposed on the front and rear surfaces of the plasma display panel 100 and the chassis base 200 and coupled thereto.

In addition, a plurality of circuit boards 500 provided with a driving circuit unit for driving the plasma display panel 100 are provided on one side (the surface facing the rear cover) of the chassis base 200.

In addition, a heat dissipation sheet 150 (shown in FIG. 2), which is a heat conductive member, is interposed between the plasma display panel 100 and the chassis base 200.

The back cover 400 is provided with a plurality of vent holes 410 on the back to allow air to pass through the inside and the outside. The vent holes 410 allow the heat generated inside the rear cover, such as a circuit driver, to be quickly discharged to the outside of the rear cover.

A heat dissipation plate 450 made of a conductive metal (eg, aluminum) is coupled to one surface of the chassis base 200. The circuit board 500 described above is coupled to one surface of the heat dissipation plate 450.

The circuit board 500 to be taken as an example in this embodiment is provided with elements that serve as logic buffers, which are disposed on one side of the chassis base 200, as can be seen from the drawing.

In addition, the circuit board 500 is electrically connected to the plasma display panel 100 so as to apply an electric driving signal generated from the circuit board 500 to the plasma display panel 100. Is connected.

In the present embodiment, the connection member 600 is made of a so-called TCP in which the driving integrated circuit 610 is coupled to the flexible printed circuit board 650 by a tape carrier package (TCP) method, but it is necessarily This is not limited to TCP and may be provided as a connecting member of another method such as COF.

The connection member 600 connects one end of the flexible printed circuit board 650 to the circuit board 500 through a connector (not shown), and connects the other end of the flexible printed circuit board 650 to the plasma. An anisotropic conductive film (ACF) (not shown) is connected to the pad portion 110 of an electrode (eg, an address electrode) provided in the display panel 100 to the circuit board 500 and the plasma display panel 100. Each is electrically connected.

Meanwhile, a cover plate 700 coupled to the chassis base 200 is coupled to the chassis base 200 while pressing the drive integrated circuit 610. The cover plate 700 not only serves to protect the connection member 600, but also serves to dissipate heat generated in the driving integrated circuit 610 in more detail in the connection member 600. .

For example, a plurality of the cover plates 700 may be arranged side by side along the lower edge portion of the chassis base 200. More specifically, the cover plate 700 may be arranged to be long as an integrated plate along the edge of the chassis base 200, and may be disposed in a separate form corresponding to each of the plurality of driving integrated circuits 610. Can be.

In the present embodiment, the heat dissipation plate 450, as shown in Figure 2, the flexible printed circuit board 65 of the connecting member 600 from the side side with respect to the cross section of the AA portion of Figure 1 And a first extension part 451 disposed in close contact with the chassis base 200, a second extension part 453 extending by bending the first extension part 451 toward the chassis base 200. The third extension part 453 is bent and disposed to be in close contact with each other in a direction parallel to the chassis base 200, and the third extension part 455 is in the rear cover 400 direction. A fourth extension part 457 that is bent and extended in a direction opposite to the plasma display panel, and a fifth extension part 459 that is bent and extended in a direction parallel to the chassis base 200. It is configured to include.

The fourth extension part 457 is provided with a plurality of heat dissipation fins 461 disposed along the direction parallel to the chassis base 200. In addition, the fifth extension part 459 is provided with a plurality of heat dissipation fins 463 disposed along a direction substantially perpendicular to the chassis base (direction toward the rear cover).

The heat dissipation plate 450 and the heat dissipation fins 461 and 463 not only dissipate heat from the driving integrated circuit 610 but also have a structure to reinforce the chassis base 200 to increase the rigidity of the chassis base 200. It can play a role.

The circuit board 500 is coupled to the heat dissipation plate 450 by screws 510 and 520. Since the heat dissipation plate 450 is made of a conductor, the heat dissipation plate 450 may also serve to ground the circuit board 500 to the chassis base 200.

Meanwhile, the fourth extension part 457 of the heat dissipation plate 450 has a height T1 higher than the height T2 of the circuit board 500 based on the rear surface of the chassis base 200. By covering the 500, it can play a role in preventing the circuit board 500 from being damaged by foreign matters falling from above when the product is erected through the transfer line in the manufacturing process of the product. That is, the heat dissipation plate 450 may also serve to protect the circuit board 500.

3 is a cross-sectional view illustrating a part corresponding to FIG. 2 to describe a second embodiment according to the present disclosure.

The second embodiment of the present invention describes only the differences from the description of the first embodiment, and the same parts as the above description of the first embodiment will be given the same reference numerals for convenience.

In the second embodiment of the present invention, one side of the circuit board 500 is coupled to the heat dissipation plate 450 by a screw 510, and the other side of the circuit board 500 forms a groove 465 in a portion of the heat dissipation plate 450. To be inserted into the groove 465 by a fitting coupling to maintain a fixed state.

The assembly structure of the circuit board 500 can reduce the number of components (screws for fixing) and has an advantage of increasing design freedom.

The structure of the heat dissipation plate 450 of the second embodiment of the present invention can have various effects, while being able to apply the present invention in accordance with the structural characteristics of the chassis base 200, thereby increasing design freedom. have.

In the plasma display device of the present invention configured as described above, when a control signal of a driving circuit provided on the circuit board 500 is applied to the connection member 600, the plasma display panel 100 is connected to the connection member 600. Supply a voltage for driving the.

In this action, the connection member 600 is capable of generating heat in the driving integrated circuit 610, the heat generated at this time is conducted to the cover plate 700 and the heat dissipation plate 450, Heat dissipation through.

That is, in the present invention, since the heat generated in the connection member 600 is further dissipated not only through the cover plate 700 but also through the heat dissipation plate 450, the heat dissipation effect can be doubled. At this time, since the heat dissipation plate 450 is further provided with heat dissipation fins 461 and 463, the heat dissipation effect performed to the heat dissipation plate 450 side can be further enhanced.

Therefore, the present invention can quickly dissipate high heat generated in the driving direct circuit 610, thereby preventing the temperature of the plasma display panel 100 from rising unnecessarily and degrading the quality of the product, thereby improving the reliability of the product. Will be.

Furthermore, since the heat dissipation plate 450 and the heat dissipation fins 461 and 463 have a structure for reinforcing the chassis base 200, the durability of the product may be increased by increasing the rigidity of the chassis base 200.

In the above, a preferred embodiment of the plasma display device according to the present invention has been described, but the present invention is not limited thereto, and various modifications can be made within the scope of the claims, the detailed description of the invention, and the accompanying drawings. This also belongs to the scope of the present invention.

As described above, the present invention has an effect of effectively dissipating heat generated from the connection member electrically connecting the circuit board and the plasma display panel to improve product reliability of the plasma display device.

In addition, the present invention is that the heat dissipation plate and the heat dissipation fins can also serve as a reinforcing member for the chassis base, thereby increasing the rigidity of the chassis base to prevent deformation of the chassis base due to external impact, thereby increasing durability. It also has an effect.

Claims (11)

A plasma display panel; A chassis base on which the plasma display panel is supported; A heat dissipation plate installed in the chassis base; A circuit board provided on the heat dissipation plate and having circuits for driving the plasma display panel; And And a connection member having a driving integrated circuit, the connection member being in close contact with the heat dissipation plate while electrically connecting the plasma display panel and the circuit board. The heat dissipation plate A first extension part disposed in close contact with the chassis base and the connection member; A second extension part bent and extending from the first extension part toward the plasma display panel; A third extension part bent and extending in a direction parallel to the plasma display panel in the second extension part; A fourth extension part bent and extending in a direction parallel to the second extension part in the third extension part; And A fifth extension part bent and extending in a direction parallel to the plasma display panel in the fourth extension part; Plasma display device comprising a. delete The method of claim 1, And a plurality of heat dissipation fins on the heat dissipation plate. The method of claim 1, And a plurality of heat dissipation fins disposed in a direction parallel to the plasma display panel. The method according to claim 1 or 4, And a plurality of heat dissipation fins disposed in a direction parallel to the second extension part. The method of claim 1, And a groove in which the circuit board is fitted to the heat dissipation plate. The method of claim 6, And the groove is formed in the fourth extension portion. The method of claim 1, And the fourth extension part has a height higher than that of the circuit board with respect to the rear surface of the chassis base. The method of claim 1, And the heat dissipation plate is formed of a conductive metal. The method of claim 1, And the circuit board is coupled by screws coupled to the heat dissipation plate. The method of claim 1, The connecting member And a driving integrated circuit mounted on a flexible printed circuit board in the form of a tape carrier package.

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