JP2000068427A - Heat sink - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate fins having the same natural frequency to prevent resonance by forming continuously protrudent ribs at positions different in distance from a base on a plurality of fins. SOLUTION: A base 1 has a mounting face 2 for mounting electronic components such as semiconductor elements, etc., a plurality of fins 3 are projectively provided on the back side of the mounting face 2 and made of a metal material superior in thermal conductivity such as Al, etc., the heat generated from electronic components is conducted from the base 1 to the fins 3 and radiated from the (radiating) surface of each fin 3, and continuously protrudent ribs 4 are formed on the fins 3 at positions different in distance from the base 1. The natural frequencies of the fins 3 differ because of the positional difference of the ribs 4 on the fins 3 and hence the resonance frequencies at resonance differ, thereby preventing mutual resonances. This prevents the sound quality of a lovespeaker and reproduced sounds from deteriorating in audio apparatus, etc.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink. More specifically, the present invention relates to a heat sink used for cooling electronic components such as semiconductor elements.

[0002]

2. Description of the Related Art Heat sinks are used to cool heat generated from electronic components such as semiconductor elements. FIG.
1 is an external view of a conventional heat sink, (A) is a front view, and (B) is a perspective view. The heat sink is usually made of a metal material having excellent thermal conductivity such as aluminum. As shown in the figure, the base 11 has a mounting surface 12 for mounting electronic components (not shown) to be cooled. Are formed with a plurality of fins 13 projecting therefrom.
Heat generated from electronic components such as semiconductor elements is generated by the fins 1.
The heat is radiated from the surface of 3.

[0003]

However, since the fin has a natural frequency which is a constant frequency determined by physical properties such as length, elasticity, strength, and mass, a plurality of fins project from the base. When the heat sink formed and used is used for audio equipment or the like, the fins resonate and vibrate according to the frequency of sound or the like. In this case, if there are a plurality of fins having the same shape on the base as in the related art, the fins have the same natural frequency, and the fins resonate with each other like a tuning fork, generating a large resonance sound, and noise and noise are generated. Become. Further, once vibration takes place, it takes time to attenuate the fin vibration.
This impairs the sound quality of speakers and the like, and causes the reproduced sound to deteriorate.

[0004] In order to cope with such a point, it has been proposed that the heights of the fins are different from one another or that the natural frequencies of the fins are varied by changing the thicknesses of the fins. However, when the height of the fins is reduced, the heat radiation area is reduced, and when the thickness of the fins is increased, the fin interval is narrowed and the flow of air for heat radiation is hindered, and the heat radiation effect of the fins is reduced.

An object of the present invention is to provide a heat sink that does not have the same natural frequency and does not generate resonance between fins while maintaining a sufficient heat radiation effect.

[0006]

In order to achieve the above object, according to the present invention, there is provided an electronic component heat sink comprising a base and a plurality of fins projecting in parallel from the base. A continuous heat-dissipating rib formed at a position different in distance from the heat sink.

According to this configuration, since the ribs are formed at different positions of the fins, there is no fin having the same natural frequency, and the fins do not resonate with each other. Further, since the fin is reinforced by the rib, the vibration of the fin is suppressed.

In a preferred embodiment, the rib is
It is characterized by being extruded together with the base and the fin.

According to this structure, the rib can be formed together with the extrusion of the heat sink, so that the heat sink can be easily formed.

[0010]

FIG. 1 shows a heat sink according to an embodiment of the present invention, wherein (A) is a front view and (B) is a perspective view. The base 1 has a mounting surface 2 for mounting electronic components such as semiconductor elements, and a plurality of fins 3 protrude from the back surface of the mounting surface 2. These are made of a metal material having excellent thermal conductivity such as aluminum, and heat generated from the electronic components is conducted from the base 1 to the fins 3 and
The heat is radiated from the surface (heat radiating surface).

In the present embodiment, a continuous protruding rib 4 is formed on each fin 3 at a position different from the base 1. The natural frequency of the fin 3 differs depending on the position of the rib 4 on the fin 3. Therefore, the resonance frequency which is the frequency at the time of the resonance phenomenon is also different. Therefore becomes possible to prevent the resonance of each other, for example, f ₁ and f ₂ because more of f ₂ from f ₁ in FIG. 1 (A) is the resonance frequency is high does not resonate. As a result, when the heat sink according to the present invention is used for an audio device or the like, a large vibration sound due to resonance of a large number of fins is not generated, and the sound quality from a speaker or the like is not impaired.

Since the fins 3 are reinforced by the ribs 4, the vibration of the fins 3 itself can be suppressed. Further, since the ribs 4 are extruded together with the base 1 and the fins 3, the ribs 4 can be easily formed in manufacturing.

Further, since the ribs 4 are formed in the flow direction of the radiating air, the radiating efficiency does not decrease. According to the experiment, when the temperature of the heat sink of the present invention was compared with that of the conventional heat sink at 120 W, there was no difference in the heat radiation effect between the two.

[0014]

As described above, in the present invention, the ribs are formed at different positions of the fins, so that the fins having the same natural frequency can be eliminated without lowering the heat radiation effect, and the resonance is prevented. be able to. As a result, it is possible to prevent the deterioration of the sound quality of the speaker in the audio equipment and the like, and the deterioration of the reproduced sound.
Further, since the fin is reinforced by the rib, the vibration of the fin can be suppressed.

[Brief description of the drawings]

FIG. 1 shows a heat sink according to an embodiment of the present invention, wherein (A) is a front view and (B) is a perspective view.

FIG. 2 shows a conventional heat sink, in which (A) is a front view and (B) is a perspective view.

[Explanation of symbols]

 1: base, 2: mounting surface, 3: fin, 4: rib.

Claims (2)

[Claims] An electronic component heatsink comprising a base and a plurality of fins projecting in parallel from the base, wherein the plurality of fins are formed with continuous projecting ribs at different positions from the base. A heat sink, characterized in that: 2. The heat sink according to claim 1, wherein the rib is extruded together with the base and the fin.