KR100551054B1 - Plasma display device - Google Patents

Abstract

The present invention is to provide a plasma display device for improving the heat radiation performance of the PDP.

Plasma display device according to the invention, the plasma display panel; Driving circuit boards controlling the plasma display panel; And a chassis to which the plasma display panel and the driving circuit boards are attached to both sides thereof, wherein the chassis forms a flow path of airflow formed by a temperature difference between the plasma display panel and the driving circuit boards.

Plasma Display, PDP, Chassis, Simny, Chimney, Natural Convection, SMD, DIP, HIC

Description

Plasma Display Device {PLASMA DISPLAY DEVICE}

1 is an exploded perspective view schematically showing a plasma display device according to the present invention.

FIG. 2 is a longitudinal sectional view of the first embodiment taken along line A-A with the plasma display device of FIG. 1 assembled;

3 is a cross-sectional view of the chassis for explaining the natural convection action generated in the chassis of the plasma display device according to the present invention.

4 is a longitudinal cross-sectional view of the second embodiment taken along the line A-A with the plasma display device of FIG. 1 assembled;

5 is a perspective view of a SMD type module applied to the first and second embodiments of FIGS. 2 and 4.

6 is a longitudinal cross-sectional view of the third embodiment taken along the line A-A with the plasma display device of FIG. 1 assembled;

7 is a longitudinal cross-sectional view of the fourth embodiment taken along the line A-A with the plasma display device of FIG. 1 assembled;

FIG. 8 is a perspective view of a DIP type module applied to the third and fourth embodiments of FIGS. 6 and 7.

9 is a longitudinal cross-sectional view of the fifth embodiment taken along line A-A with the plasma display device of FIG. 1 assembled;

FIG. 10 is a longitudinal sectional view of the sixth embodiment taken along line A-A with the plasma display device of FIG. 1 assembled;

FIG. 11 is a perspective view of an HIC type module applied to the fifth and sixth embodiments of FIGS. 9 and 10.

The present invention relates to a plasma display device, and more particularly, to a plasma display device having a heat dissipation structure suitable for an ultra-thin lightweight plasma display panel (PDP, hereinafter referred to as PDP).

As is known, a plasma display device is mounted on a PDP for generating a plasma by gas discharge and displaying an image on the PDP, a chassis base for supporting the PDP, and a PDP opposite to the PDP of the chassis base. And a driving circuit board connected to the discharge sustaining electrode and the address electrode located inside the PDP through a flexible printed circuit) and a connector.

In large terms, since the PDP is composed of two glass substrates, the mechanical rigidity is weak. For this reason, the chassis base made of metal with larger mechanical rigidity than glass is used so that PDP may maintain mechanically stable rigidity.

In addition to the function of maintaining the rigidity of the PDP as described above, the chassis base is referred to as the support function of the driving circuit board, the heat sink function of the PDP, and the electromagnetic interference (EMI). ) It is in charge of grounding function.

A PDP is attached to the front of the chassis base and a driving circuit board is mounted to the rear of the chassis base so that the chassis base achieves the above functions. Since this PDP is made of glass, it is difficult to process the screw holes in the PDP for screwing the chassis base and the double-sided tape is used to attach the PDP to the front of the chassis base. A boss is formed on the rear surface of the chassis base, and the driving circuit board is screwed to the boss.

As described above, US Pat. No. 5,971,566 may be used as a technique for attaching the PDP to the front surface of the chassis base. This technology transfers heat from the PDP to the chassis base through the heat conducting member between the PDP and the chassis base, and transfers heat generated from the driving circuit board to the chassis base to dissipate heat from the chassis base. It is configured to.

At this time, the heat dissipated passes through the driving circuit board and the back cover. Therefore, due to the complicated shape of the driving circuit board, the air flowing for heat dissipation is subject to severe flow resistance, and the flow rate is lowered. Due to the decrease in the flow rate of air, the heat radiation efficiency of the entire PDP apparatus is lowered.

The heat dissipation structure having such low efficiency cannot be applied optimally when the heat dissipation capacity inside the PDP is further lowered due to the ultra-light weight and light weight of the PDP, and it is not applicable to the PDP and the driving circuit board. Lowers the reliability of the temperature of the switching modules provided in.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a plasma display device for improving the heat dissipation performance of a PDP.

In addition, the present invention is to provide a plasma display device suitable for the heat dissipation structure of the PDP in which the heat dissipation capacity is lowered due to ultra-thin lightweight.

In order to achieve the above object, the plasma display device according to the present invention,

A plasma display panel;

Driving circuit boards controlling the plasma display panel; And

And a chassis to which the plasma display panel and the driving circuit boards are attached to both sides thereof,

The chassis forms a flow path of airflow formed by a temperature difference between the plasma display panel and the driving circuit boards.

In addition, the plasma display device according to the present invention,

A plasma display panel;

Driving circuit boards controlling the plasma display panel; And

And a chassis to which the plasma display panel and the driving circuit boards are attached to both sides thereof,

The chassis forms a flow path of airflow formed by a temperature difference between the plasma display panel and the driving circuit boards.

One side chassis of the flow passage is attached to the SMD type module is electrically connected to the drive circuit board.

In addition, the plasma display device according to the present invention,

A plasma display panel;

Driving circuit boards controlling the plasma display panel; And

And a chassis to which the plasma display panel and the driving circuit boards are attached to both sides thereof,

The chassis forms a flow path of airflow formed by a temperature difference between the plasma display panel and the driving circuit boards.

One side chassis of the flow passage is attached to the DIP type module is electrically connected to the drive circuit board.

In addition, the plasma display device according to the present invention,

A plasma display panel;

Driving circuit boards controlling the plasma display panel; And

And a chassis to which the plasma display panel and the driving circuit boards are attached to both sides thereof,

The chassis forms a flow path of airflow formed by a temperature difference between the plasma display panel and the driving circuit boards.

An HIC type module is attached to one chassis of the flow passage and electrically connected to the driving circuit board.

On the other hand, the flow passage is formed of a structure that generates natural convection. The flow passage is formed in the vertical direction in the chassis. The flow passage is formed inside or on one side of the chassis. The flow passage is preferably formed with a smooth surface to lower the flow resistance of the air flow. The flow passage is preferably formed at intervals of 5-20mm.

The chassis may be made of any one metal of aluminum, iron, and copper, or may be made of a conductive synthetic resin.

The chassis has a heat source having a temperature difference on both sides thereof.

The drive circuit board is mounted to one boss of the chassis, and electrically connects one or more modules directly to one side of the chassis.

The chassis forms a sequential heat dissipation structure of the plasma display panel, the chassis, the flow passage, the chassis, and the driving circuit board.

The chassis forms a sequential heat dissipation structure of the plasma display panel, the flow passage, the chassis, and the driving circuit board.

In addition, a thermally conductive member is provided between the plasma display panel and the chassis.

In addition, the SMD type module is formed on one side board, which side board is attached to one side of the chassis via a heat dissipation member and is electrically connected to the driving circuit board.

The DIP type module is formed in a heat sink and is electrically connected to a driving circuit board. The heat sink is attached to a side of the chassis through a heat dissipation material.

The HIC type module is formed in a heat sink and is electrically connected to a driving circuit board. The heat sink is attached to a plane of the chassis via a heat dissipation material on one side of the chassis.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is an exploded perspective view schematically showing a plasma display device according to the present invention.

Referring to the plasma display device with reference to the drawings, the plasma display device includes a PDP 11 for displaying an image by using gas discharge and heat generated on the back surface of the PDP 11 to generate heat. A configuration including a thermally conductive member 13 for conducting diffusion in a planar direction, a chassis 15 for supporting the PDP 11, and driving circuit boards 17 mounted on the chassis 15 to drive the PDP 11. Consists of

The PDP 11 is configured to display an image by using gas discharge. Since the present invention relates to the coupling relationship between the PDP 11 and other components, a detailed description of the PDP 11 is omitted here.

The thermally conductive member 13 is provided on the rear surface of the PDP 11 by conducting and dissipating heat generated by the PDP 11 causing gas discharge. The thermally conductive member 13 may be formed and attached to a heat radiation sheet as shown in FIG. 1. The sheet-shaped thermally conductive member 13 may be made of various materials, and may be selectively applied among an acrylic heat dissipating material, a graphite heat dissipating material, a metal heat dissipating material, and a carbon nanotube heat dissipating material. It is important that the heat conducting member 13 smoothly conducts heat conduction in the planar direction in the PDP 11. If such a function is possible, the heat conducting member 13 may be formed of two or more materials in one PDP 11.

In addition, the heat conducting member 13 may be a solid heat dissipating material for forming a heat dissipation sheet as described above, but may also be applied to the heat dissipating material that is hardened into a solid state as time passes in a liquid phase. The heat radiation material cured from the liquid phase to the solid phase has the advantages of handling the liquid phase, that is, the thermal conductive member 13 is formed on the PDP 11 by the coating process, and thus, the process of installing a separate thermal conductive member 13 is unnecessary. .

FIG. 2 is a longitudinal sectional view of the first embodiment taken along line A-A with the plasma display device of FIG. 1 assembled;

Referring to this figure, the chassis 15 is described. The chassis 15 is attached to the rear surface of the PDP 11 on one side thereof via the heat conducting member 13 as described above. The driving circuit boards 17 are mounted on the other side to support the driving circuit boards 17. That is, the chassis 15 has heat sources that cause temperature differences on both sides thereof. The PDP 11 corresponds to the high temperature side heat source and the driving circuit board 17 corresponds to the low temperature side heat source. In addition, in the present invention, the driving circuit board 17 is provided on the other side of the chassis 15 for driving the PDP 11, and generates various substrates, for example, a buffer substrate (not shown) and an SMPS (not shown). is defined to include such things as switching mode power supply.

In other words, the chassis 15 supports the PDP 11 on one side thereof and the driving circuit boards 17 on the other side thereof, thereby constructing and supporting the entire PDP device. In addition, the chassis 15 has a flow passage 19 for forming airflow by natural convection therebetween so as to effectively dissipate the PDP 11 and the driving circuit boards 17 provided on both sides.

3 is a cross-sectional view of the chassis for explaining the natural convection action generated in the chassis of the plasma display device according to the present invention.

Referring to this drawing, the natural convection action in the flow passage 19 will be described. The flow passage 19 forms airflow by the temperature difference between both sides generated between the PDP 11 and the driving circuit board 17. And a passage through which this air flow flows.

The PDP 11 side of the flow passage 19 acts as a high temperature heat source and the drive circuit board 17 side acts as a low temperature heat source, whereby air flow is formed in the flow passage 19. This air flow generates natural convection flowing upward from the lower side of the flow passage 19. Due to this natural convection, the velocity of the airflow is further increased in the flow passage 19. The increase in the airflow speed allows rapid heat dissipation of the chassis 15 forming the flow passage 19, and then the PDP 11 and the driving circuit board 17 attached to the chassis 15 are more effectively radiated. do.

As such, for effective heat dissipation by natural convection, the airflow should be smoothly flowed in the flow passage 19 with low flow resistance, and for this purpose, the inner surface of the flow passage 19 is preferably formed with a smooth surface. In addition, the flow passage 19 is preferably formed in the vertical direction in the chassis 15 for effective induction of natural convection. Of course, the flow passage 19 can be variously changed into a structure (not shown), etc. inclined to favor natural convection.

The flow passage 19 may be formed inside or on one side of the chassis 15 according to the shape of the chassis 15. In either case, the flow passage 19 is formed between the PDP 11 and the driving circuit board 17. 2 illustrates that the flow passage 19 is formed inside the chassis 15 formed as the front and the rear, and FIG. 4 shows the flow passage 19 at one side of the chassis 15 in which a part of the rear surface is removed. What was formed is illustrated.

Due to such structural differences in the chassis 15, one side of the chassis 15 may be attached to the front surface of the PDP 11 (see FIG. 2), and one side of the chassis 15 may be attached to the PDP. It may be attached to 11 and some surfaces (see Fig. 4).

As shown in FIG. 2, when one side of the chassis 15 is completely attached to the PDP 11, the PDP apparatus may include a PDP 11, a chassis 15, a flow passage 19, a chassis 15, and a driving circuit. When the sequential heat dissipation structure of the substrate 17 is formed, and one side of the chassis 15 is attached to the PDP 11 and some surfaces as shown in FIG. 4, the PDP 11, the flow passage 19, and the chassis (15) and the sequential heat dissipation structure of the drive circuit board 17 are formed.

The heat dissipation structure of FIG. 2 allows heat dissipation due to heat conduction and natural convection on the PDP 11 side, even though the speed of airflow is relatively slow compared to FIG. 4. The heat dissipation structure of FIG. 4 can be effectively dissipated when the airflow speed is high due to heat dissipation due to natural convection on the PDP 11 side.

Such a flow passage 19 speeds up the flow of airflow between the PDP 11 and the driving circuit board 17, and spaces the gap 5 so as to form a structure in which heat generated therefrom is quickly dissipated using natural convection. It is preferable to form -20mm.

When the distance between the flow passage 19 is less than 5 mm, the flow passage 19 has an excessively high air density due to high temperature expansion, which makes the air flow difficult, and when the distance exceeds 20 mm, the flow passage 19 ) The lack of the venturi tube effect formed between the outside and the inside weakens the air flow, which causes natural convection. In other words, the heat dissipation effect is reduced.

The chassis 15 forming the flow passage 19 may be made of a metal such as aluminum, iron, or copper, which is excellent in thermal conductivity for rapid thermal conductivity, and also reduces the weight of the entire device and is conductive for EMI grounding. It may be made of synthetic resin.

On the other hand, the driving circuit board 17 is mounted on the bosses 21 provided on one side of the chassis 15, and the circuit board 17 is provided with a number of modules 23 for driving the PDP (11). These modules 23 may be provided on the driving circuit board 17, but some modules 25 which generate high heat due to a switching action are directly attached to one side of the chassis 15 for rapid heat dissipation. It is preferable to be electrically connected to (17). The module 25 may be one or more, and may be mounted in various structures depending on the type.

When the module 25 is directly attached to the chassis 15 as described above, in addition to heat dissipation due to natural convection caused by the flow passage 19, the module 25 directly generates and conducts convection. The heat dissipation effect will be more.

Such a PDP device may be classified more specifically by the type of modules 25 directly attached to the chassis 15. 2, 4, and 5 apply a surface module device (SMD) type module 25a, and FIGS. 6, 7, and 8 show a dual in-line package (DIP) type module 25b. 9, 10, and 11 illustrate respective PDP devices to which a hybrid integrated circuit (HIC) type module 25c is applied.

5 is a perspective view of a SMD type module applied to the first and second embodiments of FIGS. 2 and 4.

The overall configuration and effect of the PDP device is described above, and therefore, description will be given focusing on the SMD type module 25a.

The SMD type module 25a is directly attached to one side of the chassis 15 forming the flow passage 19 and electrically connected to the driving circuit board 17. That is, the SMD type module 25a is formed on the side board 25aa, and the side board 25aa is attached to one side of the chassis 15 via the heat dissipation material 25ab, and the driving circuit board 17 is provided. Is electrically connected to the

In addition, it is preferable that the driving circuit board 17 further includes a vent 17a on the opposite side thereof in order to increase the heat radiation efficiency of the SMD type module 25a. Therefore, most of the heat generated by the SMD type module 25a is transferred to the chassis 15 through the side board 25aa and the heat dissipation material 25ab, and part of the heat is radiated through the vent 17a.

In addition, since the SMD type module 25a does not include a heat sink for heat dissipation, a thin structure is formed. This is more effective in pursuing ultra-thin, lightweight PDP devices.

As described above, the first and second embodiments form the flow passage 19 to effectively realize heat dissipation on the driving circuit board 17 side and the PDP 11 side, and generate particularly high heat. Is directly attached to the chassis 15 to further improve the heat dissipation effect.

6 and 7 are longitudinal cross-sectional views of third and fourth embodiments along line A-A with the plasma display device of FIG. 1 assembled;

Since the third and fourth embodiments are similar to the first and second configurations described above in their overall configuration and effect, the overall description is omitted here and the different parts will be compared.

SMD type module 25a is applied to the first and second embodiments, and DIP type module 25b is applied to the third and fourth embodiments.

The DIP type module 25b is directly attached to one side of the chassis 15 forming the flow passage 19 and electrically connected to the driving circuit board 17. That is, the DIP type module 25b is formed in the heat sink 25ba and electrically connected to the driving circuit board 17. The heat sink 25ba is provided with a heat dissipation material 25bb on one side of the chassis 15. It is attached laterally through.

Since the DIP type module 25b includes a heat sink 25ba for heat dissipation, the heat dissipation performance of the PDP device is improved as compared with the first and second embodiments.

As described above, the third and fourth embodiments form the flow passage 19 so as to effectively realize heat dissipation on the driving circuit board 17 side and the PDP 11 side, while generating particularly high heat. Is directly attached to the chassis 15 to further improve the heat dissipation effect.

6 and 7 are longitudinal cross-sectional views of third and fourth embodiments along line A-A with the plasma display device of FIG. 1 assembled;

Since the third and fourth embodiments are similar to the configurations of the first and second embodiments described above in their overall configuration and effect, the overall description is omitted here and the different parts are compared.

SMD type module 25a is applied to the first and second embodiments, and DIP type module 25b is applied to the third and fourth embodiments.

FIG. 8 is a perspective view of a DIP type module applied to the third and fourth embodiments of FIGS. 6 and 7.

The DIP type module 25b is directly attached to one side of the chassis 15 forming the flow passage 19 and electrically connected to the driving circuit board 17. That is, the DIP type module 25b is formed in the heat sink 25ba and electrically connected to the driving circuit board 17. The heat sink 25ba is provided with a heat dissipation material 25bb on one side of the chassis 15. Attached through.

Since the DIP type module 25b includes a heat sink 25ba for heat dissipation, the heat dissipation performance of the PDP device is improved as compared with the first and second embodiments.

As described above, the third and fourth embodiments form the flow passage 19 so as to effectively realize heat dissipation on the driving circuit board 17 side and the PDP 11 side, while generating particularly high heat. Is directly attached to the chassis 15 to further improve the heat dissipation effect.

9 and 10 are longitudinal cross-sectional views of fifth and sixth embodiments along the A-A line in the assembled plasma display device of FIG.

Since the fifth and sixth embodiments are similar to those of the first, second, third, and fourth embodiments described above in terms of their overall configuration and effects, the overall description thereof will be omitted here and the different parts will be described in detail. .

SMD type module 25a is applied to the first and second embodiments, DIP type module 25b is applied to the third and fourth embodiments, and HIC type module 25c is applied to the fifth and sixth embodiments. This applies.

FIG. 11 is a perspective view of an HIC type module applied to the fifth and sixth embodiments of FIGS. 9 and 10.

The HIC type module 25c is directly attached to one side of the chassis 15 forming the flow passage 19 and electrically connected to the driving circuit board 17. That is, the HIC type module 25c is formed in the heat sink 25ca and electrically connected to the driving circuit board 17. The heat sink 25ca is provided with a heat dissipating material 25cb on one side of the chassis 15. Attached in a plane through the interposition.

The HIC type module 25c is provided with a heat sink 25ca for heat dissipation separately, and since the heat sink 25ca is attached to the chassis 15 in a large area, the first, second, or third, third Compared to the fourth embodiment, the heat dissipation performance of the PDP device is improved.

Thus, in the fifth and sixth embodiments, the HIC type module 25c which generates particularly high heat while forming the flow passage 19 to effectively realize heat dissipation on the driving circuit board 17 side and the PDP 11 side. Is directly attached to the chassis 15 to further improve the heat dissipation effect.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the scope of the invention.

As described above, according to the plasma display device according to the present invention, by forming a flow passage of air flow in the chassis attaching the plasma display panel and the driving circuit boards on both sides, by causing a natural convection phenomenon by the temperature difference between the two, There is an effect of improving the heat radiation performance of the PDP and the driving circuit board. In addition, according to the present invention, there is an effect of further improving the heat dissipation performance by directly installing the SMD, DIP, and HIC type module in the chassis. In addition, since the SMD type module does not have a heat sink, it is advantageous for the ultra-light weight of the PDP device. The DIP type module directly transfers heat to the chassis through a heat sink, which is advantageous for heat dissipation of the PDP device. The HIC type module transfers heat directly to the chassis through a heat sink in a large area, which is more advantageous for heat dissipation of the PDP device.

Claims (18)

A plasma display panel; Driving circuit boards controlling the plasma display panel; And And a chassis to which the plasma display panel and the driving circuit boards are attached to both sides thereof, The chassis, One side to which the plasma display panel is attached; The other side to which the driving circuit boards are attached; The one side and the other side, A plasma display device for forming a flow passage of air flow at a predetermined interval between each other. The method of claim 1, The flow passage, By the temperature difference transmitted from the plasma display panel and the driving circuit board provided on both sides of the chassis, Plasma display device for forming natural convection. The method of claim 1, And the flow passage is formed in the chassis in a vertical direction. The method of claim 1, And the flow passage is formed inside or on one side of the chassis. The method of claim 1, And the flow passage has a smooth surface to lower the flow resistance of the air flow. The method of claim 1, And the flow passage is formed at intervals of 5-20 mm. The method of claim 1, And the chassis is made of any one of aluminum, iron, and copper, or is made of a conductive synthetic resin. The method of claim 1, The chassis, On one side thereof is provided a plasma display panel which is a high temperature heat source, Plasma display device having a drive circuit board that is a low temperature heat source on the other side. The method of claim 1, The driving circuit board is mounted to one boss of the chassis, At least one of the modules acting to drive the plasma display panel is mounted on a side board, The side board is attached to one side of the chassis, And the module is electrically connected to the driving circuit board through the side board. The method of claim 1, And the chassis forms a sequential heat dissipation structure of the plasma display panel, the chassis, the flow passage, the chassis, and the driving circuit board. The method of claim 1, And the chassis forms a sequential heat dissipation structure of the plasma display panel, the flow passage, the chassis, and the driving circuit board. The method of claim 1, A heat conduction member is provided between the plasma display panel and the chassis. The thermally conductive member is provided with any one of an acrylic heat dissipating material, a graphite heat dissipating material, a metal heat dissipating material, and a carbon nanotube heat dissipating material. The method of claim 9, The module is a plasma display device (SMD) type module. The method of claim 13, The SMD module is formed on a side board, The board is attached to one side of the chassis via a heat dissipation material, And a plasma display device electrically connected to the driving circuit board through the board. The method of claim 9, The module is a plasma in-line package (DIP) type module. The method of claim 15, The dual in-line package (DIP) type module, Formed in the heat sink and electrically connected to the driving circuit board, The heat sink is a plasma display device attached to one side of the chassis via a heat dissipating material. The method of claim 9, The module is a plasma integrated circuit (HIC) type module. The method of claim 17, The hybrid integrated circuit (HIC) type module, Formed in the heat sink and electrically connected to the driving circuit board, The heat sink is a plasma display device attached to one side of the chassis via a heat dissipating material.

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