KR100817233B1 - 연마 패드 및 반도체 디바이스의 제조 방법 - Google Patents

연마 패드 및 반도체 디바이스의 제조 방법 Download PDF

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Publication number
KR100817233B1
KR100817233B1 KR1020067019174A KR20067019174A KR100817233B1 KR 100817233 B1 KR100817233 B1 KR 100817233B1 KR 1020067019174 A KR1020067019174 A KR 1020067019174A KR 20067019174 A KR20067019174 A KR 20067019174A KR 100817233 B1 KR100817233 B1 KR 100817233B1
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South Korea
Prior art keywords
polishing
region
polishing pad
light
light transmittance
Prior art date
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Expired - Fee Related
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KR1020067019174A
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English (en)
Korean (ko)
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KR20060118010A (ko
Inventor
데쓰오 시모무라
마사히코 나카모리
다카토시 야마다
가즈유키 오가와
아쓰시 가즈노
마사히로 와타나베
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도요 고무 고교 가부시키가이샤
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Priority claimed from JP2004069423A external-priority patent/JP4849587B2/ja
Priority claimed from JP2004069498A external-priority patent/JP4890744B2/ja
Application filed by 도요 고무 고교 가부시키가이샤 filed Critical 도요 고무 고교 가부시키가이샤
Publication of KR20060118010A publication Critical patent/KR20060118010A/ko
Application granted granted Critical
Publication of KR100817233B1 publication Critical patent/KR100817233B1/ko
Assigned to 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 reassignment 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 권리의 전부이전등록 Assignors: 도요 고무 고교 가부시키가이샤
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020067019174A 2004-03-11 2004-10-20 연마 패드 및 반도체 디바이스의 제조 방법 Expired - Fee Related KR100817233B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2004069423A JP4849587B2 (ja) 2003-03-11 2004-03-11 研磨パッドおよび半導体デバイスの製造方法
JP2004069498A JP4890744B2 (ja) 2003-03-11 2004-03-11 研磨パッドおよび半導体デバイスの製造方法
JPJP-P-2004-00069423 2004-03-11
JPJP-P-2004-00069498 2004-03-11

Publications (2)

Publication Number Publication Date
KR20060118010A KR20060118010A (ko) 2006-11-17
KR100817233B1 true KR100817233B1 (ko) 2008-03-27

Family

ID=34975856

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067019174A Expired - Fee Related KR100817233B1 (ko) 2004-03-11 2004-10-20 연마 패드 및 반도체 디바이스의 제조 방법

Country Status (5)

Country Link
US (1) US7731568B2 (https=)
KR (1) KR100817233B1 (https=)
CN (1) CN1926666A (https=)
TW (2) TW200530378A (https=)
WO (1) WO2005088690A1 (https=)

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KR101047933B1 (ko) * 2002-11-27 2011-07-11 도요 고무 고교 가부시키가이샤 연마 패드 및 반도체 장치의 제조 방법
SG160368A1 (en) * 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
WO2006123559A1 (ja) 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) * 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
CN102152233B (zh) * 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US20100009611A1 (en) * 2006-09-08 2010-01-14 Toyo Tire & Rubber Co., Ltd. Method for manufacturing a polishing pad
US8257153B2 (en) 2007-01-15 2012-09-04 Toyo Tire & Rubber Co., Ltd. Polishing pad and a method for manufacturing the same
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP4971028B2 (ja) * 2007-05-16 2012-07-11 東洋ゴム工業株式会社 研磨パッドの製造方法
CN101458445B (zh) * 2007-12-11 2012-04-25 中芯国际集成电路制造(上海)有限公司 一种用于探测刻蚀终点的装置及方法
TR201816001T4 (tr) * 2008-02-27 2018-11-21 Basf Se Bir plastik veya metal folyo içeren çok tabakalı bileşik malzemeler, üretimleri için yöntem ve kullanımları.
JP4593643B2 (ja) * 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
US8697239B2 (en) * 2009-07-24 2014-04-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multi-functional polishing pad
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
JP5620141B2 (ja) 2010-04-15 2014-11-05 東洋ゴム工業株式会社 研磨パッド
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US20110281510A1 (en) * 2010-05-12 2011-11-17 Applied Materials, Inc. Pad Window Insert
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
JP5389973B2 (ja) * 2012-04-11 2014-01-15 東洋ゴム工業株式会社 積層研磨パッド及びその製造方法
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9446497B2 (en) * 2013-03-07 2016-09-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad
US9108290B2 (en) * 2013-03-07 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
CN106046313A (zh) * 2016-06-03 2016-10-26 湖北鼎龙化学股份有限公司 一种化学机械抛光垫、缓冲层及其制备方法
KR101952361B1 (ko) 2017-07-04 2019-02-26 에스케이씨 주식회사 폴리우레탄 조성물 및 이로부터 얻어진 고내산성 다층 연마패드
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR102102973B1 (ko) 2017-11-14 2020-04-22 에스케이씨 주식회사 연마패드
WO2020050932A1 (en) 2018-09-04 2020-03-12 Applied Materials, Inc. Formulations for advanced polishing pads
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN117086736B (zh) * 2023-10-20 2023-12-26 南通南洋照明科技有限公司 一种led灯具制造的镜面抛光装置

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Also Published As

Publication number Publication date
TWI361217B (https=) 2012-04-01
TW201217415A (en) 2012-05-01
CN1926666A (zh) 2007-03-07
TWI450911B (zh) 2014-09-01
TW200530378A (en) 2005-09-16
WO2005088690A1 (ja) 2005-09-22
US20070190905A1 (en) 2007-08-16
KR20060118010A (ko) 2006-11-17
US7731568B2 (en) 2010-06-08

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