KR100816008B1 - 판형 피처리물의 회전처리장치 및 회전처리방법 - Google Patents
판형 피처리물의 회전처리장치 및 회전처리방법 Download PDFInfo
- Publication number
- KR100816008B1 KR100816008B1 KR1020010067001A KR20010067001A KR100816008B1 KR 100816008 B1 KR100816008 B1 KR 100816008B1 KR 1020010067001 A KR1020010067001 A KR 1020010067001A KR 20010067001 A KR20010067001 A KR 20010067001A KR 100816008 B1 KR100816008 B1 KR 100816008B1
- Authority
- KR
- South Korea
- Prior art keywords
- plate
- suction chuck
- liquid
- support mechanism
- support
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (3)
- 링 형상 컵 내에 흡인 척(chuck)을 배치하고, 이 흡인 척으로 판형 피처리물을 보유하고 회전시킴으로써, 판형 피처리물 표면에 공급한 액체를 판형 피처리물의 표면 전체에 미치도록 한 회전처리장치에 있어서, 상기 흡인 척보다도 바깥쪽 위치에, 그 흡인 척으로부터 돌출한 판형 피처리물의 단부 하면을 비회전시에 아래에서 지지하여 판형 피처리물의 수평도를 유지하는 동시에, 이 상태에서 판형 피처리물의 표면에 처리액을 공급할 수 있게 하는 지지기구를 구비하고, 이 지지기구는 상하방향의 실린더와, 이 실린더의 작동에 의해 승강 움직임을 하는 받침부로 이루어진 것을 특징으로 하는 판형 피처리물의 회전처리장치.
- 제 1 항에 있어서, 상기 판형 피처리물은 직사각형 유리기판이며, 상기 지지기구를, 상기 직사각형 유리기판의 네 귀퉁이를 아래쪽으로부터 지지하는 위치에 배치한 것을 특징으로 하는 판형 피처리물의 회전처리장치.
- 링 형상 컵 내에 배치되는 흡인 척 위에 판형 피처리물을 얹어 놓은 후 흡인 척을 하강시켜, 흡인 척의 바깥쪽에 배치한 지지기구의 승강 가능한 받침부에 의해, 흡인 척으로부터 돌출한 판형 피처리물의 단부 하면을 아래에서 지지함으로써, 판형 피처리물의 수평도를 유지한 상태에서 판형 피처리물의 표면에 액체를 공급하고, 이어서, 액체를 담은 판형 피처리물을 회전시키기 직전에 상기 받침부를 하강시켜 판형 피처리물의 하면으로부터 상기 받침부를 떨어지게 한 상태에서 흡인 척과 함께 판형 피처리물을 회전시켜, 판형 피처리물의 표면에 공급한 액체를 판형 피처리물의 표면 전체에 미치도록 한 것을 특징으로 하는 판형 피처리물의 회전처리방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010067001A KR100816008B1 (ko) | 2001-10-30 | 2001-10-30 | 판형 피처리물의 회전처리장치 및 회전처리방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010067001A KR100816008B1 (ko) | 2001-10-30 | 2001-10-30 | 판형 피처리물의 회전처리장치 및 회전처리방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030035090A KR20030035090A (ko) | 2003-05-09 |
KR100816008B1 true KR100816008B1 (ko) | 2008-03-24 |
Family
ID=37417372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010067001A KR100816008B1 (ko) | 2001-10-30 | 2001-10-30 | 판형 피처리물의 회전처리장치 및 회전처리방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100816008B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101401978B1 (ko) | 2013-04-10 | 2014-05-30 | (주)이노맥스 | 스핀 처리기용 챔버 승하강 장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09289151A (ja) * | 1996-04-23 | 1997-11-04 | Dainippon Screen Mfg Co Ltd | 処理液塗布装置 |
JPH10216606A (ja) * | 1997-02-06 | 1998-08-18 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置および基板回転保持装置ならびにその設計方法 |
KR19980064738A (ko) * | 1996-12-27 | 1998-10-07 | 히가시데쓰로 | 처리장치 및 처리방법 |
-
2001
- 2001-10-30 KR KR1020010067001A patent/KR100816008B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09289151A (ja) * | 1996-04-23 | 1997-11-04 | Dainippon Screen Mfg Co Ltd | 処理液塗布装置 |
KR19980064738A (ko) * | 1996-12-27 | 1998-10-07 | 히가시데쓰로 | 처리장치 및 처리방법 |
JPH10216606A (ja) * | 1997-02-06 | 1998-08-18 | Dainippon Screen Mfg Co Ltd | 回転式基板処理装置および基板回転保持装置ならびにその設計方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101401978B1 (ko) | 2013-04-10 | 2014-05-30 | (주)이노맥스 | 스핀 처리기용 챔버 승하강 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20030035090A (ko) | 2003-05-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101017654B1 (ko) | 기판 척킹 부재, 이를 갖는 기판 처리 장치 및 이를 이용한기판 처리 방법 | |
US9431276B2 (en) | Substrate processing apparatus and substrate processing method | |
KR100285524B1 (ko) | 도포액 도포방법 | |
US4655162A (en) | Semiconductor device manufacturing apparatus | |
JP4008935B2 (ja) | 基板表面処理装置 | |
US20080017222A1 (en) | Substrate processing apparatus and substrate processing method | |
KR101231749B1 (ko) | 기판의 스핀 처리 장치 | |
KR101377196B1 (ko) | 액처리 장치 | |
KR100902724B1 (ko) | 현상장치 | |
KR100816008B1 (ko) | 판형 피처리물의 회전처리장치 및 회전처리방법 | |
JP2000140505A (ja) | 脱気装置及び脱気方法 | |
KR101070576B1 (ko) | 다단식 처리장치 | |
JP3748028B2 (ja) | 基板処理装置 | |
JP3886326B2 (ja) | 板状被処理物の回転処理装置及び回転処理方法 | |
US20200176274A1 (en) | Substrate treatment method and substrate treatment device | |
JP2001212493A (ja) | スピン処理装置 | |
JPH0334207B2 (ko) | ||
KR100254291B1 (ko) | 회전컵식 액체공급장치 | |
KR19990045515A (ko) | 기판처리장치 | |
KR100187442B1 (ko) | 반도체 현상설비의 백린스 장치 | |
JPH1012540A (ja) | 処理装置 | |
JP2004056005A (ja) | 基板処理装置および基板処理方法 | |
JP2003045772A (ja) | スピン処理装置 | |
JP2000031004A (ja) | 基板処理装置 | |
JP2023016324A (ja) | 基板処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision | ||
AMND | Amendment | ||
B701 | Decision to grant | ||
GRNT | Written decision to grant | ||
G170 | Re-publication after modification of scope of protection [patent] | ||
FPAY | Annual fee payment |
Payment date: 20130227 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20140220 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20150224 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20160218 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20170220 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20180219 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20200218 Year of fee payment: 13 |