KR100805138B1 - Rf 바이어스를 제어하는 플라즈마 처리 방법 및 장치 - Google Patents
Rf 바이어스를 제어하는 플라즈마 처리 방법 및 장치 Download PDFInfo
- Publication number
- KR100805138B1 KR100805138B1 KR1020017012439A KR20017012439A KR100805138B1 KR 100805138 B1 KR100805138 B1 KR 100805138B1 KR 1020017012439 A KR1020017012439 A KR 1020017012439A KR 20017012439 A KR20017012439 A KR 20017012439A KR 100805138 B1 KR100805138 B1 KR 100805138B1
- Authority
- KR
- South Korea
- Prior art keywords
- plasma
- impedance
- power
- alternating current
- source
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/38—Impedance-matching networks
- H03H7/40—Automatic matching of load impedance to source impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/281,808 US6265831B1 (en) | 1999-03-31 | 1999-03-31 | Plasma processing method and apparatus with control of rf bias |
US09/281,808 | 1999-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020013841A KR20020013841A (ko) | 2002-02-21 |
KR100805138B1 true KR100805138B1 (ko) | 2008-02-21 |
Family
ID=23078875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020017012439A KR100805138B1 (ko) | 1999-03-31 | 2000-02-10 | Rf 바이어스를 제어하는 플라즈마 처리 방법 및 장치 |
Country Status (7)
Cited By (1)
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---|---|---|---|---|
KR20150039125A (ko) * | 2013-10-01 | 2015-04-09 | 램 리써치 코포레이션 | 모델링, 피드백 및 임피던스 매칭을 사용하는 에칭 레이트 제어 |
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KR100857840B1 (ko) * | 2007-03-06 | 2008-09-10 | 성균관대학교산학협력단 | 고밀도 플라즈마 소스 및 그 제어방법 |
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US20090095714A1 (en) * | 2007-10-12 | 2009-04-16 | Tokyo Electron Limited | Method and system for low pressure plasma processing |
JP5268625B2 (ja) * | 2008-12-26 | 2013-08-21 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
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US9230779B2 (en) * | 2012-03-19 | 2016-01-05 | Lam Research Corporation | Methods and apparatus for correcting for non-uniformity in a plasma processing system |
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US10187032B2 (en) * | 2016-06-17 | 2019-01-22 | Lam Research Corporation | Combiner and distributor for adjusting impedances or power across multiple plasma processing stations |
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CN112424911B (zh) | 2019-06-20 | 2023-09-22 | 株式会社日立高新技术 | 等离子体处理装置以及等离子体处理方法 |
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KR0139402B1 (ko) * | 1992-06-25 | 1998-08-17 | 모리시타 요이찌 | 플라즈마발생방법 및 플라즈마발생장치 |
JPH10321598A (ja) * | 1997-05-15 | 1998-12-04 | Nec Kyushu Ltd | 半導体装置の製造装置 |
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JPS60126832A (ja) | 1983-12-14 | 1985-07-06 | Hitachi Ltd | ドライエツチング方法および装置 |
JPH01199430A (ja) * | 1988-02-04 | 1989-08-10 | Oki Electric Ind Co Ltd | ドライエッチング方法及びその装置 |
JPH03224226A (ja) * | 1989-10-18 | 1991-10-03 | Matsushita Electric Ind Co Ltd | プラズマ加工方法およびそれに用いる装置 |
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1999
- 1999-03-31 US US09/281,808 patent/US6265831B1/en not_active Expired - Lifetime
-
2000
- 2000-02-10 JP JP2000608403A patent/JP4601179B2/ja not_active Expired - Lifetime
- 2000-02-10 DE DE60034321T patent/DE60034321T2/de not_active Expired - Lifetime
- 2000-02-10 WO PCT/US2000/003313 patent/WO2000058992A1/en active IP Right Grant
- 2000-02-10 EP EP00910115A patent/EP1166322B1/en not_active Expired - Lifetime
- 2000-02-10 KR KR1020017012439A patent/KR100805138B1/ko active IP Right Grant
- 2000-03-31 TW TW089106066A patent/TW466535B/zh not_active IP Right Cessation
-
2010
- 2010-05-18 JP JP2010114452A patent/JP5334914B2/ja not_active Expired - Lifetime
Patent Citations (2)
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KR0139402B1 (ko) * | 1992-06-25 | 1998-08-17 | 모리시타 요이찌 | 플라즈마발생방법 및 플라즈마발생장치 |
JPH10321598A (ja) * | 1997-05-15 | 1998-12-04 | Nec Kyushu Ltd | 半導体装置の製造装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150039125A (ko) * | 2013-10-01 | 2015-04-09 | 램 리써치 코포레이션 | 모델링, 피드백 및 임피던스 매칭을 사용하는 에칭 레이트 제어 |
KR102313223B1 (ko) * | 2013-10-01 | 2021-10-15 | 램 리써치 코포레이션 | 모델링, 피드백 및 임피던스 매칭을 사용하는 에칭 레이트 제어 |
Also Published As
Publication number | Publication date |
---|---|
JP2010251768A (ja) | 2010-11-04 |
JP4601179B2 (ja) | 2010-12-22 |
WO2000058992A1 (en) | 2000-10-05 |
JP2002540615A (ja) | 2002-11-26 |
EP1166322B1 (en) | 2007-04-11 |
US6265831B1 (en) | 2001-07-24 |
EP1166322A1 (en) | 2002-01-02 |
DE60034321T2 (de) | 2007-08-30 |
TW466535B (en) | 2001-12-01 |
JP5334914B2 (ja) | 2013-11-06 |
KR20020013841A (ko) | 2002-02-21 |
DE60034321D1 (de) | 2007-05-24 |
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