KR100804842B1 - 정전 척으로부터 제품을 디척킹하는 방법 및 장치 - Google Patents

정전 척으로부터 제품을 디척킹하는 방법 및 장치 Download PDF

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Publication number
KR100804842B1
KR100804842B1 KR1020010003202A KR20010003202A KR100804842B1 KR 100804842 B1 KR100804842 B1 KR 100804842B1 KR 1020010003202 A KR1020010003202 A KR 1020010003202A KR 20010003202 A KR20010003202 A KR 20010003202A KR 100804842 B1 KR100804842 B1 KR 100804842B1
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KR
South Korea
Prior art keywords
dechucking
electrostatic chuck
product
metric
signal
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Expired - Lifetime
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KR1020010003202A
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English (en)
Korean (ko)
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KR20010076392A (ko
Inventor
칼에프. 리서
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20010076392A publication Critical patent/KR20010076392A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • B23Q3/154—Stationary devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020010003202A 2000-01-21 2001-01-19 정전 척으로부터 제품을 디척킹하는 방법 및 장치 Expired - Lifetime KR100804842B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/489,458 US6307728B1 (en) 2000-01-21 2000-01-21 Method and apparatus for dechucking a workpiece from an electrostatic chuck
US09/489,458 2000-01-21

Publications (2)

Publication Number Publication Date
KR20010076392A KR20010076392A (ko) 2001-08-11
KR100804842B1 true KR100804842B1 (ko) 2008-02-20

Family

ID=23943944

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020010003202A Expired - Lifetime KR100804842B1 (ko) 2000-01-21 2001-01-19 정전 척으로부터 제품을 디척킹하는 방법 및 장치

Country Status (5)

Country Link
US (1) US6307728B1 (enExample)
EP (1) EP1118425A3 (enExample)
JP (1) JP2001298073A (enExample)
KR (1) KR100804842B1 (enExample)
TW (1) TW496809B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210144333A (ko) 2020-05-22 2021-11-30 세메스 주식회사 정전 척과 그 제조 방법 및 기판 처리 장치

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US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US7218503B2 (en) * 1998-09-30 2007-05-15 Lam Research Corporation Method of determining the correct average bias compensation voltage during a plasma process
US6403322B1 (en) * 2001-03-27 2002-06-11 Lam Research Corporation Acoustic detection of dechucking and apparatus therefor
US20040031699A1 (en) * 2002-08-19 2004-02-19 Applied Materials, Inc. Method for performing real time arcing detection
EP1475667A1 (en) 2003-05-09 2004-11-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1475670B1 (en) * 2003-05-09 2008-10-29 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7100954B2 (en) 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
KR100653707B1 (ko) 2004-10-21 2006-12-04 삼성전자주식회사 플라즈마 처리장치의 플라즈마 처리방법
US7292428B2 (en) * 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor
US7583491B2 (en) * 2006-05-18 2009-09-01 Varian Semiconductor Equipment Associates, Inc. Electrostatic chuck to limit particle deposits thereon
KR100690136B1 (ko) * 2006-05-29 2007-03-08 우범제 정전척의 잔류 전하 제거 장치 및 제거 방법
TWM320179U (en) * 2006-06-09 2007-10-01 Gudeng Prec Industral Co Ltd Gas filling equipment and filling chamber therein for photomask conveying box
KR101394337B1 (ko) * 2006-08-30 2014-05-13 엘아이지에이디피 주식회사 정전척
US20080108154A1 (en) * 2006-11-03 2008-05-08 Hyoung Kyu Son Apparatus and method for measuring chuck attachment force
US7385799B1 (en) * 2007-02-07 2008-06-10 Axcelis Technology, Inc. Offset phase operation on a multiphase AC electrostatic clamp
US8149562B2 (en) * 2007-03-09 2012-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. System for decharging a wafer or substrate after dechucking from an electrostatic chuck
US8313612B2 (en) * 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
CN101872733B (zh) * 2009-04-24 2012-06-27 中微半导体设备(上海)有限公司 感测和移除被加工半导体工艺件的残余电荷的系统和方法
SG178374A1 (en) * 2009-09-10 2012-03-29 Lam Res Corp Methods and arrangement for detecting a wafer-released event within a plasma processing chamber
US20110060442A1 (en) * 2009-09-10 2011-03-10 Valcore Jr John C Methods and arrangement for detecting a wafer-released event within a plasma processing chamber
US8797705B2 (en) * 2009-09-10 2014-08-05 Lam Research Corporation Methods and arrangement for plasma dechuck optimization based on coupling of plasma signaling to substrate position and potential
TWI493620B (zh) * 2010-06-29 2015-07-21 Global Unichip Corp 調整導線蝕刻機內的靜電吸盤電壓以釋放累積電荷
AU2012301936A1 (en) * 2011-08-30 2014-03-27 Watlow Electric Manufacturing Company System and method for controlling a thermal array
CN104037045B (zh) * 2013-03-04 2016-05-11 中微半导体设备(上海)有限公司 测试基片去夹持终点的方法
CN106796909A (zh) 2014-06-17 2017-05-31 瑞士艾发科技 具有射频分路的静电卡盘
US10024825B2 (en) * 2014-12-26 2018-07-17 Axcelis Technologies, Inc. Wafer clamp detection based on vibration or acoustic characteristic analysis
US11114327B2 (en) 2017-08-29 2021-09-07 Applied Materials, Inc. ESC substrate support with chucking force control
US10732615B2 (en) * 2017-10-30 2020-08-04 Varian Semiconductor Equipment Associates, Inc. System and method for minimizing backside workpiece damage
US10546731B1 (en) * 2018-10-05 2020-01-28 Applied Materials, Inc. Method, apparatus and system for wafer dechucking using dynamic voltage sweeping
WO2020126963A1 (en) * 2018-12-20 2020-06-25 Asml Netherlands B.V. Object table comprising an electrostatic clamp
JP7419288B2 (ja) * 2021-03-30 2024-01-22 キヤノントッキ株式会社 制御装置、成膜装置、制御方法、及び電子デバイスの製造方法
KR102677251B1 (ko) 2021-10-28 2024-06-20 세메스 주식회사 기판 테스트 장치 및 이를 이용하는 디척킹 포스 측정 방법

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210144333A (ko) 2020-05-22 2021-11-30 세메스 주식회사 정전 척과 그 제조 방법 및 기판 처리 장치

Also Published As

Publication number Publication date
US6307728B1 (en) 2001-10-23
EP1118425A3 (en) 2004-02-04
EP1118425A2 (en) 2001-07-25
JP2001298073A (ja) 2001-10-26
TW496809B (en) 2002-08-01
KR20010076392A (ko) 2001-08-11

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